CN112679910A - Preparation method of modified epoxy composite material - Google Patents
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Abstract
The invention discloses a preparation method of a modified epoxy composite material. The epoxy group micron composite dielectric medium is taken as a preparation object, required micron particles are divided into three parts and added three times according to the flow, and physical quantities such as stirring time, air pressure and temperature in a flask and the like during sample preparation are strictly controlled. Compared with the method of adding the micron particles at one time, when the particles are the micron alumina particles and the mass fraction of the particles is 68.3%, the glass transition temperature of the prepared sample is improved by more than 10%. The invention can prepare the high-quality-fraction micron composite dielectric medium with excellent performance for laboratories in a short time, and can be popularized and applied to the preparation of thermosetting high-quality-fraction micron composite insulating materials in laboratories.
Description
Technical Field
The invention belongs to the technical field of high voltage and insulation, and particularly relates to a preparation method of a modified epoxy composite material.
Background
Epoxy resins have been widely used as insulators and supports for electrical equipment, such as gas-insulated switchgear (GIS), dry-type transformers, and reactors, due to their excellent electrical and mechanical properties and excellent chemical resistance. In order to further enhance the mechanical properties of epoxy, in an electric power system, a basin-type insulator is usually made of an epoxy resin/micron alumina composite material, wherein the mass fraction of alumina is close to 70%. In the industry, due to large output, mature process and complete equipment and facilities, the prepared epoxy group micron alumina composite material has high crosslinking degree and is reflected by higher glass transition temperature. At present, a great deal of scholars at home and abroad are dedicated to the research on epoxy-based composite insulating materials, but more researches are focused on epoxy-based nano composite materials or epoxy-based micro composite materials containing micro particles with the mass fraction of less than 20%. Due to special conditions of preparation environment, equipment, time cost and the like in a laboratory, the epoxy group micron composite dielectric with high mass fraction prepared at present has poor particle dispersibility, low crosslinking degree and low glass transition temperature, and the overall performance of the epoxy group micron composite dielectric is far away from that of an industrial practical production sample.
Disclosure of Invention
The invention mainly aims to provide a preparation method of a modified epoxy composite material, which aims to overcome the existing problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
a preparation method of a modified epoxy composite material comprises the following steps:
1) weighing micron alumina particles and baking for later use;
2) scrubbing the surface of the mould by absolute ethyl alcohol and deionized water in sequence, and then drying the mould;
3) after the mold is dried, taking out the mold, uniformly spraying a release agent on the surface of the mold, and then preheating;
4) heating the solid blocky epoxy resin to be in a liquid state at normal pressure, and then adding the solid blocky epoxy resin into a reaction container;
5) keeping the liquid epoxy temperature in the reaction container at 110-;
6) weighing the micron alumina particles prepared in the step 1), pouring the micron alumina particles into a reaction container, wherein the mass ratio of the added micron alumina particles to the epoxy resin in the reaction container is 99:100, and obtaining a mixture A;
7) keeping the temperature in the reaction vessel at 125 ℃ and the air pressure at less than 100Pa, the stirring speed at 220rad/min and stirring at a constant speed for 20min to completely degas the mixture A;
8) weighing the micron alumina particles prepared in the step 1), pouring the micron alumina particles into a reaction container, wherein the mass ratio of the added micron alumina particles to the epoxy resin in the reaction container is 99:100, and obtaining a mixture B;
9) keeping the temperature in the reaction vessel at 125 ℃ and the air pressure at less than 100Pa, the stirring speed at 220rad/min and stirring at a constant speed for 20min to completely degas the mixture B;
10) weighing the micron alumina particles prepared in the step 1), pouring the micron alumina particles into a reaction container, wherein the mass ratio of the added micron alumina particles to the epoxy resin in the reaction container is 99:100, and obtaining a mixture C;
11) keeping the temperature in the reaction vessel at 125 ℃ and the air pressure at less than 100Pa, the stirring speed at 220rad/min and stirring at a constant speed for 20min to completely degas the mixture C;
12) cooling the mixture C in the reaction vessel to 100 ℃, and then injecting a curing agent;
13) keeping the temperature in the reaction container at 100 ℃, stirring for 3min under normal pressure at the stirring speed of 150rad/min, and then keeping the air pressure in the reaction container at less than 100Pa, the temperature at 100 ℃, the stirring speed of 150rad/min and stirring for 10min at a constant speed;
14) pouring the product obtained in the step 13) onto the preheated mould in the step 3), and heating for curing, wherein the curing procedure is as follows: curing at 120 ℃ for 3h, then curing at 140 ℃ for 13h, then uniformly cooling to 30 ℃ within 4h, and finishing curing to obtain the epoxy/high-quality-fraction-micron composite material.
Further, the baking temperature in the step 1) is 50 ℃, and the time is more than 24 hours.
Further, the drying temperature in the step 2) is 50 ℃.
Further, the preheating temperature in the step 3) is 120 ℃, and the time is 2 hours.
Further, the heating temperature in the step 4) is 120 ℃, and the time is 40 min.
Further, the epoxy resin is Hensman Araldite CT 5531.
Further, the curing agent is Hensman Aradur HY 5533.
Further, the mass ratio of the curing agent to the epoxy resin in the step 12) is 38: 100.
Compared with the prior art, the invention has the following beneficial technical effects:
compared with a control group (micron alumina particles are added at one time), the process provided by the invention has the advantages that the sample preparation time is the same, the glass transition temperature of the prepared sample is improved by about 10%, and the epoxy-based micron composite sample produced by the process provided by the invention is proved to have higher epoxy molecule crosslinking degree.
In conclusion, the invention can obviously improve the glass transition temperature of the epoxy group micron composite sample and the crosslinking degree of the epoxy group micron composite sample without increasing the time for preparing the sample in a laboratory, and prepares the high-performance sample.
Drawings
FIG. 1 is a DSC test curve of an epoxy group micron composite material sample prepared by the process of the embodiment 1 of the invention, the test condition is a block sample with the mass of 5 plus or minus 0.5mg, the temperature range is 20-200 ℃, and the heating rate is 10 ℃/min;
FIG. 2 is a DSC curve of a comparative example, in which the test conditions are a bulk sample having a mass of 5. + -. 0.5mg, a temperature range of 20 to 200 ℃ and a temperature rise rate of 10 ℃/min.
Detailed Description
Embodiments of the invention are described in further detail below:
a method for preparing modified epoxy composite material uses epoxy micron alumina composite material as research object, when preparing sample in laboratory, the epoxy micron composite sample with higher glass transition temperature can be prepared by strictly controlling the temperature of mixture, vacuum degree in container, adding sequence of filler and stirring time, etc. with same time.
Specifically, the method comprises the following steps:
the raw materials comprise: 297g of micron alumina particles, and the mass ratio of epoxy resin to curing agent is 100: 38. By taking 297g of micron alumina, 100g of epoxy resin and 38g of curing agent as examples, a sample containing 68.3% of micron alumina particles by mass fraction is prepared, and the method comprises the following specific steps:
1) weighing 500g of micron alumina particles, and baking in a 50 ℃ oven for more than 24 hours;
2) scrubbing the surface of the mold by using absolute ethyl alcohol and deionized water in sequence, and then putting the mold into a 50 ℃ oven for drying;
3) after the mold is dried, taking out the mold, uniformly spraying a release agent on the surface of the mold, and then putting the mold into a 120 ℃ oven for preheating for 2 hours;
4) putting solid blocky epoxy resin into a beaker, putting the beaker into a 120 ℃ oven, heating the beaker for 40min under normal pressure until the solid blocky epoxy resin is liquid, and pouring 100g of epoxy resin into a three-neck flask;
5) opening the heating sleeve, the vacuum epitaxy and the stirring device, keeping the epoxy temperature in the three-neck flask at 115-;
6) weighing 99g of micron alumina particles, and pouring the particles into a three-neck flask by using a funnel to obtain a mixture A;
7) keeping the temperature in the three-mouth flask at 110-;
8) weighing 99g of micron alumina particles, and pouring the particles into a three-neck flask by using a funnel to obtain a mixture B;
9) keeping the temperature in the three-mouth flask at 110-;
10) weighing 99g of micron alumina particles, and pouring the particles into a three-neck flask by using a funnel to obtain a mixture C;
11) keeping the temperature in the three-mouth flask at 110-;
12) removing the heating sleeve, cooling the mixture C in the flask to 100 ℃, and injecting 38g of curing agent into the three-neck flask;
13) keeping the temperature in the flask at 100 ℃, stirring for 3min under normal pressure, and stirring rod rotation speed of 120-;
14) and (3) pouring the product obtained in the step (13) onto a preheated mould, putting the mould into an oven for curing, wherein the curing procedure is 120 ℃/3h, then 140 ℃/13h, then uniformly cooling to 30 ℃ within 4 hours, and finishing curing.
The present invention is described in further detail below with reference to examples:
example 1
The epoxy and epoxy group micron alumina composite material is prepared from the following raw materials: 297g of micron alumina particles, and the mass ratio of epoxy resin to curing agent is 100: 38. By taking 297g of micron alumina, 100g of epoxy resin and 38g of curing agent volume as an example, a sample containing 68.3% of micron alumina particles by mass fraction is prepared, and the method comprises the following specific steps:
1) weighing 500g of micron alumina particles, and baking in a 50 ℃ oven for more than 24 hours;
2) scrubbing the surface of the grinding tool by using absolute ethyl alcohol and deionized water in sequence, and then putting the mould into a 50 ℃ drying oven for drying;
3) after the mold is dried, taking out the mold, uniformly spraying a release agent on the surface of the mold, and then putting the mold into a 120 ℃ oven for preheating for 2 hours;
4) putting solid blocky epoxy resin into a beaker, putting the beaker into a 120 ℃ oven, heating the beaker for 35min under normal pressure until the solid blocky epoxy resin is liquid, and pouring 100g of epoxy resin into a three-neck flask;
5) opening the heating sleeve, the vacuum epitaxial device and the stirring device, keeping the temperature of the liquid epoxy in the three-neck flask at 120 ℃, the air pressure at less than 100Pa, the rotating speed of the stirring rod at 165rad/min, and stirring at a constant speed for 10 min;
6) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture A;
7) keeping the temperature in the three-mouth flask at 120 ℃, the air pressure at less than 100Pa and the rotating speed of the stirring rod at 200rad/min, and stirring at constant speed for 20min to ensure that the mixture A is degassed completely;
8) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture B;
9) keeping the temperature in the three-mouth flask at 120 ℃, the air pressure at less than 100Pa and the rotating speed of the stirring rod at 200rad/min, and stirring at a constant speed for 20min to ensure that the mixture B is degassed completely;
10) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture C;
11) keeping the temperature in the three-mouth flask at 120 ℃, the air pressure at less than 100Pa and the rotating speed of the stirring rod at 200rad/min, and stirring at a constant speed for 20min to ensure that the mixture C is degassed completely;
12) removing the heating sleeve, cooling the mixture C in the flask to 100 ℃, and injecting 38g of curing agent into the three-neck flask;
13) keeping the temperature in the flask at 100 ℃, stirring for 3min under normal pressure at a rotating speed of 135rad/min of a stirring rod, then opening the vacuum epitaxy, keeping the air pressure in the flask at less than 100Pa, keeping the temperature at 100 ℃, and stirring for 10min at a constant speed at a rotating speed of 165rad/min of the stirring rod;
14) pouring the product obtained in the step 13) onto a preheated mold, putting the mold into an oven for curing, wherein the curing procedure is 120 ℃/3h, then 140 ℃/13h, then uniformly cooling to 30 ℃ within 4 hours, and finishing curing.
Comparative example 1
1) Weighing 500g of micron alumina particles, and baking in a 50 ℃ oven for more than 24 hours;
2) scrubbing the surface of the grinding tool by using absolute ethyl alcohol and deionized water in sequence, and then putting the mould into a 50 ℃ drying oven for drying;
3) after the mold is dried, taking out the mold, uniformly spraying a release agent on the surface of the mold, and then putting the mold into a 120 ℃ oven for preheating for 2 hours;
4) putting solid blocky epoxy resin into a beaker, putting the beaker into a 120 ℃ oven, heating the beaker for 35min under normal pressure until the solid blocky epoxy resin is liquid, and pouring 100g of epoxy resin into a three-neck flask;
5) opening the heating sleeve, the vacuum epitaxial device and the stirring device, keeping the temperature of the liquid epoxy in the three-neck flask at 120 ℃, the air pressure at less than 100Pa, the rotating speed of the stirring rod at 165rad/min, and stirring at a constant speed for 10 min;
6) weighing 297g of micron alumina particles, adding 297g of alumina particles into a three-neck flask at one time, keeping the temperature in the flask at 120 ℃, the air pressure at less than 100Pa, keeping the rotating speed of a stirring rod at 200rad/min, and continuously stirring for 60 min;
7) removing the heating sleeve, cooling the mixture in the flask to 100 ℃, and injecting 38g of curing agent into the three-neck flask;
8) keeping the temperature in the flask at 100 ℃, stirring for 3min under normal pressure at a rotating speed of 135rad/min of a stirring rod, then opening the vacuum epitaxy, keeping the air pressure in the flask at less than 100Pa, keeping the temperature at 100 ℃, and stirring for 10min at a constant speed at a rotating speed of 165rad/min of the stirring rod;
9) pouring the mixture obtained in the step 8) onto a preheated mold, putting the mold into an oven for curing, wherein the curing procedure is 120 ℃/3h, then 140 ℃/13h, then uniformly cooling to 30 ℃ within 4 hours, and finishing curing.
Example 2
The epoxy and epoxy group micron alumina composite material is prepared from the following raw materials: 297g of micron alumina particles, and the mass ratio of epoxy resin to curing agent is 100: 38. By taking 297g of micron alumina, 100g of epoxy resin and 38g of curing agent volume as an example, a sample containing 68.3% of micron alumina particles by mass fraction is prepared, and the method comprises the following specific steps:
1) weighing 500g of micron alumina particles, and baking in a 50 ℃ oven for more than 24 hours;
2) scrubbing the surface of the grinding tool by using absolute ethyl alcohol and deionized water in sequence, and then putting the mould into a 50 ℃ drying oven for drying;
3) after the mold is dried, taking out the mold, uniformly spraying a release agent on the surface of the mold, and then putting the mold into a 120 ℃ oven for preheating for 2 hours;
4) putting solid blocky epoxy resin into a beaker, putting the beaker into a 120 ℃ oven, heating the beaker for 30min under normal pressure until the solid blocky epoxy resin is liquid, and pouring 100g of epoxy resin into a three-neck flask;
5) opening the heating sleeve, the vacuum epitaxial device and the stirring device, keeping the temperature of the liquid epoxy in the three-neck flask at 110 ℃, the air pressure at less than 100Pa, the rotating speed of the stirring rod at 150rad/min, and stirring at a constant speed for 10 min;
6) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture A;
7) keeping the temperature in the three-mouth flask at 110 ℃, the air pressure at less than 100Pa and the rotating speed of the stirring rod at 180rad/min, and stirring at constant speed for 20min to ensure that the mixture A is degassed completely;
8) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture B;
9) keeping the temperature in the three-mouth flask at 110 ℃, the air pressure at less than 100Pa and the rotating speed of the stirring rod at 180rad/min, and stirring at a constant speed for 20min to ensure that the mixture B is degassed completely;
10) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture C;
11) keeping the temperature in the three-mouth flask at 110 ℃, the air pressure at less than 100Pa and the rotating speed of the stirring rod at 180rad/min, and stirring at a constant speed for 20min to ensure that the mixture C is degassed completely;
12) removing the heating sleeve, cooling the mixture C in the flask to 100 ℃, and injecting 38g of curing agent into the three-neck flask;
13) keeping the temperature in the flask at 100 ℃, stirring for 3min under normal pressure at a stirring rod rotation speed of 120rad/min, then opening the vacuum epitaxy, keeping the air pressure in the flask at 100 ℃ and a stirring rod rotation speed of 150rad/min, and stirring for 10min at a constant speed;
14) pouring the product obtained in the step 13) onto a preheated mold, putting the mold into an oven for curing, wherein the curing procedure is 120 ℃/3h, then 140 ℃/13h, then uniformly cooling to 30 ℃ within 4 hours, and finishing curing.
Example 3
The epoxy and epoxy group micron alumina composite material is prepared from the following raw materials: 297g of micron alumina particles, and the mass ratio of epoxy resin to curing agent is 100: 38. By taking 297g of micron alumina, 100g of epoxy resin and 38g of curing agent volume as an example, a sample containing 68.3% of micron alumina particles by mass fraction is prepared, and the method comprises the following specific steps:
1) weighing 500g of micron alumina particles, and baking in a 50 ℃ oven for more than 24 hours;
2) scrubbing the surface of the grinding tool by using absolute ethyl alcohol and deionized water in sequence, and then putting the mould into a 50 ℃ drying oven for drying;
3) after the mold is dried, taking out the mold, uniformly spraying a release agent on the surface of the mold, and then putting the mold into a 120 ℃ oven for preheating for 2 hours;
4) putting solid blocky epoxy resin into a beaker, putting the beaker into a 120 ℃ oven, heating the beaker for 40min under normal pressure until the solid blocky epoxy resin is liquid, and pouring 100g of epoxy resin into a three-neck flask;
5) opening the heating sleeve, the vacuum epitaxial device and the stirring device, keeping the temperature of the liquid epoxy in the three-neck flask at 125 ℃, the air pressure at less than 100Pa, the rotating speed of the stirring rod at 180rad/min, and stirring at a constant speed for 10 min;
6) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture A;
7) keeping the temperature in the three-mouth flask at 125 ℃, the air pressure at less than 100Pa, the rotating speed of the stirring rod at 220rad/min, and stirring at constant speed for 20min to ensure that the mixture A is degassed completely;
8) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture B;
9) keeping the temperature in the three-mouth flask at 125 ℃, the air pressure at less than 100Pa and the rotating speed of the stirring rod at 220rad/min, and stirring at a constant speed for 20min to ensure that the mixture B is degassed completely;
10) weighing 99g of micron alumina particles, uniformly pouring the particles into a three-neck flask by using a funnel to obtain a mixture C;
11) keeping the temperature in the three-mouth flask at 125 ℃, the air pressure at less than 100Pa, the rotating speed of the stirring rod at 220rad/min, and stirring at constant speed for 20min to ensure that the mixture C is degassed completely;
12) removing the heating sleeve, cooling the mixture C in the flask to 100 ℃, and injecting 38g of curing agent into the three-neck flask;
13) keeping the temperature in the flask at 100 ℃, stirring for 3min under normal pressure at a stirring rod rotation speed of 150rad/min, then opening the vacuum epitaxy, keeping the air pressure in the flask at less than 100Pa, keeping the temperature at 100 ℃, and stirring for 10min at a uniform speed at a stirring rod rotation speed of 180 rad/min;
14) pouring the product obtained in the step 13) onto a preheated mold, putting the mold into an oven for curing, wherein the curing procedure is 120 ℃/3h, then 140 ℃/13h, then uniformly cooling to 30 ℃ within 4 hours, and finishing curing.
The glass transition temperature of the sample prepared in example 1 was measured using a differential scanning calorimetry test, and the sample was weighed as a block with a mass of 5 + -0.5 mg, a test temperature range of 30-200 deg.C and a temperature rise rate of 10 deg.C/min.
Table 1 shows the comparison of glass transition temperature of epoxy-based micro-scale samples prepared in example 1 of the present process with that of comparative example 1 prepared by adding all micro-scale particles at once and degassing and stirring for 1 h.
TABLE 1 comparison of glass transition temperatures of samples prepared in example 1 and comparative example 1
Compared with the comparative example, the process adds the microparticles in three batches during sample preparation, which is helpful for the sufficient dispersion of the microparticles in the epoxy resin, so that although the total sample preparation time is the same, in the process, the microparticles are uniformly dispersed, which is helpful for the cross-linking reaction of the curing agent and the epoxy molecules during the curing process, so that the glass transition temperature of the prepared sample is higher than that of the control group.
The invention can improve the glass transition temperature, the particle dispersibility and the crosslinking degree of the epoxy group micron composite sample prepared in a laboratory in the same sample preparation time.
Claims (8)
1. The preparation method of the modified epoxy composite material is characterized by comprising the following steps:
1) weighing micron alumina particles and baking for later use;
2) scrubbing the surface of the mould by absolute ethyl alcohol and deionized water in sequence, and then drying the mould;
3) after the mold is dried, taking out the mold, uniformly spraying a release agent on the surface of the mold, and then preheating;
4) heating the solid blocky epoxy resin to be in a liquid state at normal pressure, and then adding the solid blocky epoxy resin into a reaction container;
5) keeping the liquid epoxy temperature in the reaction container at 110-;
6) weighing the micron alumina particles prepared in the step 1), pouring the micron alumina particles into a reaction container, wherein the mass ratio of the added micron alumina particles to the epoxy resin in the reaction container is 99:100, and obtaining a mixture A;
7) keeping the temperature in the reaction vessel at 125 ℃ and the air pressure at less than 100Pa, the stirring speed at 220rad/min and stirring at a constant speed for 20min to completely degas the mixture A;
8) weighing the micron alumina particles prepared in the step 1), pouring the micron alumina particles into a reaction container, wherein the mass ratio of the added micron alumina particles to the epoxy resin in the reaction container is 99:100, and obtaining a mixture B;
9) keeping the temperature in the reaction vessel at 125 ℃ and the air pressure at less than 100Pa, the stirring speed at 220rad/min and stirring at a constant speed for 20min to completely degas the mixture B;
10) weighing the micron alumina particles prepared in the step 1), pouring the micron alumina particles into a reaction container, wherein the mass ratio of the added micron alumina particles to the epoxy resin in the reaction container is 99:100, and obtaining a mixture C;
11) keeping the temperature in the reaction vessel at 125 ℃ and the air pressure at less than 100Pa, the stirring speed at 220rad/min and stirring at a constant speed for 20min to completely degas the mixture C;
12) cooling the mixture C in the reaction vessel to 100 ℃, and then injecting a curing agent;
13) keeping the temperature in the reaction container at 100 ℃, stirring for 3min under normal pressure at the stirring speed of 150rad/min, and then keeping the air pressure in the reaction container at less than 100Pa, the temperature at 100 ℃, the stirring speed of 150rad/min and stirring for 10min at a constant speed;
14) pouring the product obtained in the step 13) onto the preheated mould in the step 3), and heating for curing, wherein the curing procedure is as follows: curing at 120 ℃ for 3h, then curing at 140 ℃ for 13h, then uniformly cooling to 30 ℃ within 4h, and finishing curing to obtain the epoxy/high-quality-fraction-micron composite material.
2. The method for preparing a modified epoxy composite material according to claim 1, wherein the baking temperature in step 1) is 50 ℃ and the baking time is more than 24 h.
3. The method for preparing a modified epoxy composite material according to claim 1, wherein the drying temperature in the step 2) is 50 ℃.
4. The method for preparing a modified epoxy composite material according to claim 1, wherein the preheating temperature in step 3) is 120 ℃ and the time is 2 hours.
5. The method for preparing a modified epoxy composite material according to claim 1, wherein the heating temperature in the step 4) is 120 ℃ and the heating time is 40 min.
6. The method of claim 1, wherein the epoxy resin is Hensman hanldite CT 5531.
7. The method for preparing a modified epoxy composite material according to claim 1, wherein the curing agent is Hensman Aradur HY 5533.
8. The method for preparing the modified epoxy composite material as claimed in claim 1, wherein the mass ratio of the curing agent to the epoxy resin in the step 12) is 38: 100.
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| CN115093676A (en) * | 2022-07-12 | 2022-09-23 | 广西电网有限责任公司电力科学研究院 | Method for improving crosslinking density of epoxy insulating material |
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| CN102532485A (en) * | 2012-01-06 | 2012-07-04 | 桂林理工大学 | High-heat conduction and high-toughness epoxy resin compound and preparation method thereof |
| KR20190027089A (en) * | 2017-09-06 | 2019-03-14 | 한국전기연구원 | Nanocomposite insulation materials with enhanced thermal conductivity by dispersion of inorganic nanoparticles and their manufacturing method |
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| CN115093676A (en) * | 2022-07-12 | 2022-09-23 | 广西电网有限责任公司电力科学研究院 | Method for improving crosslinking density of epoxy insulating material |
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