CN112670220A - Semiconductor wafer basket of flowers - Google Patents

Abstract

The invention provides a semiconductor wafer flower basket, which comprises a side plate, a bottom column and an end plate, wherein at least the inner side of the side plate is provided with a plurality of slots for placing wafers along the height direction of the side plate; the outer side surface of the side plate is arranged along the outer edge of the end plate; the bottom of the side plate is in seamless connection with one side edge of the bottom column adjacent to the side plate; the lower end face of the bottom column is connected with the lower end face of one of the end plates, and a clamping groove component is arranged on one side face of the end plate, which is far away from the slot; the other side surfaces of the end plate except the lower end surface are all arc surfaces; corners are arranged at the joints of the adjacent side surfaces of the end plates provided with the clamping groove components; the side surfaces of the two end plates close to one side of the bottom column have different structures. The invention is particularly suitable for bearing and placing large-size wafers, has simple structure, high strength and good stability, is convenient for carrying in the production process, and can be matched with a detection machine to ensure that the wafers are horizontally and stably placed on a detection table, thereby ensuring the safety of placing the wafers and reducing the fragment rate.

Description

Semiconductor wafer basket of flowers

Technical Field

The invention belongs to the technical field of semiconductors, and particularly relates to a semiconductor wafer flower basket.

Background

The existing semiconductor wafer is gradually increased from 6 inches and 8 inches to 12 inches and 18 inches, the increase of the diameter of the wafer causes the increase of the weight and the placement area of the wafer, a flower basket for bearing and placing the wafer is a main bearing device for ensuring the quality of the wafer, and plays an important role in the transportation and detection processes. The existing flower basket has limited bearing capacity, if the bearing capacity is only increased in volume, the batch bearing strength and the placing stability of the wafer cannot be ensured at all, and the weight of the existing flower basket is heavier, so that the quality of the wafer cannot be ensured due to the fact that waste materials are processed and quality accidents easily occur during transportation; in addition, in the process of production, circulation and transportation, all wafer baskets cannot be identified and distinguished, and the wafers in the same flower basket cannot be first-in first-out guaranteed, so that the wafer baskets are difficult to trace back. Meanwhile, the existing structure cannot be applied to a detection table for placement, the wafers are ensured to be firstly detected while being synchronously identified, and the universality is poor.

Disclosure of Invention

The invention provides a semiconductor wafer flower basket, which is particularly suitable for placing large-size wafers and solves the technical problems of low strength, poor stability, difficult tracing and poor universality of the conventional flower basket due to unreasonable structural design.

In order to solve the technical problems, the invention adopts the technical scheme that:

a semiconductor wafer flower basket comprises a side plate, a bottom column and an end plate,

at least a plurality of slots for placing wafers are arranged on the inner side of the side plate along the height direction of the side plate;

the outer side face of the side plate is arranged along the outer edge of the end plate;

the bottom of the side plate is in seamless connection with one side edge of the bottom column adjacent to the side plate;

the lower end face of the bottom column is connected with the lower end face of one of the end plates, and a clamping groove assembly is arranged on one side face, far away from the inserting groove, of the end plate;

the other side surfaces of the end plate except the lower end surface are arc surfaces;

corners are arranged at the connecting positions of the adjacent side surfaces of the end plates provided with the clamping groove assemblies;

the side surfaces of the two end plates close to one side of the bottom column have different structures.

Further, the cross section of the side plate is of an inner straight and outer curved structure;

the outer curved surface of the side plate is matched with the arc-shaped surface of the side edge of the end plate; the height of the side plate is lower than that of the side edge of the end face;

and the height of the side plate is greater than that of the slot.

Furthermore, the outer side surface of the side plate is provided with a plurality of reinforcing rib grooves which are crosswise arranged towards one side direction of the slot, and the outer edge shape of the reinforcing rib grooves which are arranged along the height of the side plate is the same as the outer side curved surface of the side plate.

Further, a bottom groove corresponding to the slot is also formed in one side, close to the wafer, of the bottom column;

the lower end face of the bottom column and the lower end face of the end plate, provided with the clamping groove assembly, are the same flat plane.

Furthermore, the end surfaces of the two bottom columns close to the clamping groove assembly are integrally connected with the lower end surface of the end plate;

keep away from two of draw-in groove subassembly the sill pillar terminal surface all sets up independently, and all is equipped with the recess that the opening set up outwards.

Further, other side surfaces of the end plate except the lower end surface are arc-shaped surfaces on the same circle, and all the arc-shaped surfaces are symmetrically arranged along a vertical central line;

in the end plate provided with the clamping groove assembly, the perimeter of the arc-shaped surface close to one side of the side plate is larger than the perimeter of the arc-shaped surface far away from one side of the bottom column, and the outer edge of the end plate is also provided with an equal-height outer edge which extends outwards.

Furthermore, in the end plate provided with the clamping groove assembly, the corner is of a right-angle structure or an acute-angle structure;

and a through round hole is arranged on the central line of the connecting rod;

the through round hole and the arc-shaped surface of the end plate are concentrically arranged, and the center of the through round hole is overlapped with the center of gravity of a figure formed by surrounding the clamping groove assembly.

Further, the card slot assembly comprises three card slots with V-shaped structures;

the two clamping grooves are obliquely arranged at the corner close to the upper end part of the end plate, and the tail parts of the two clamping grooves are arranged towards the center of the through round hole;

and the other clamping groove is positioned under the through round hole and is arranged along the height direction of the end plate.

Furthermore, two of the upper ends are arranged close to the outer side faces of the clamping grooves, retaining strips are symmetrically arranged on the outer side faces of the clamping grooves, the retaining strips are higher than the clamping grooves, and the height of the end plates is increased and the end plates are connected with the outer edges.

Furthermore, the outer side surface of the end plate without the clamping groove assembly is a flat surface, and two arc-shaped surfaces of the end plate close to one side of the side plate and the arc-shaped surface close to one side of the bottom column are integrally connected;

the arc-shaped surface far away from one side of the bottom column and the two arc-shaped surfaces close to one side of the side plate are provided with the corner.

The flower basket is particularly suitable for bearing and placing large-size wafers, has the advantages of simple structure, high strength and good stability, is convenient to carry and trace in the production process, ensures that all wafers are firstly-in-first-out and firstly-in-first-out, can be matched with a detection machine, has good universality, ensures that the wafers can be horizontally and stably placed on the detection table, ensures the safety of placing the wafers and reduces the fragment rate.

Drawings

FIG. 1 is a perspective view of a flower basket according to one embodiment of the present invention;

FIG. 2 is a perspective view of another angle of the flower basket according to one embodiment of the present invention;

FIG. 3 is a side view of a flower basket according to one embodiment of the present invention;

FIG. 4 is a top view of a flower basket according to one embodiment of the present invention;

FIG. 5 is a top view of a flower basket according to another embodiment of the present invention;

FIG. 6 is a bottom view of the flower basket according to one embodiment of the present invention;

FIG. 7 is a schematic structural view of a first end plate of an embodiment of the present invention;

FIG. 8 is a schematic structural diagram of a first part A of the card slot according to an embodiment of the present invention;

FIG. 9 is a schematic view of a portion B barrier according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a second end plate according to an embodiment of the invention.

In the figure:

10. side plate 11, slot 12 and reinforcing rib groove

20. Bottom pillar 21, bottom groove 22 and groove

30. End plate 31, end plate one 32 and end plate two

33. Corner 34, card slot assembly 341 and card slot I

342. The second clamping groove 343, the third clamping groove 35 and the through round hole

36. Barrier 361, flat strip 362 and flat strip

363. Connecting rib 37, outer edge 38 and groove

Detailed Description

The invention is described in detail below with reference to the figures and specific embodiments.

The present embodiment provides a semiconductor wafer flower basket, as shown in fig. 1 to 6, comprising side plates 10, bottom pillars 20 and end plates 30, which are disposed opposite to each other, wherein the two side plates 10 and the two bottom pillars 20 have the same structure, and the two end plates 30 have different structures, and comprise a first end plate 31 provided with a card slot assembly 34 and a second end plate 32 not provided with a card slot assembly 34. Specifically, at least, the inner side of the side plate 10 is provided with a plurality of slots 11 used for placing wafers along the height direction of the side plate, and the slots 11 are distributed in the width direction of the side plate 10, so that the length of the wafers matched with the slots 11 can be increased, the wafers are independently arranged in the slots 11 without adhesion, the wafers are full of the whole width size of the flower basket, the bearing placement amount of the flower basket space is utilized to the maximum extent, and the space utilization rate of the flower basket space is improved. The outer side wall surface of the side plate 10 is arranged along the outer edge of the end plate 30, is connected with the outer edge of the end plate 30 and has the same structure, and the connecting strength of the side plate 10 and the end plate 30 is improved; the bottom of the side plate 10 is connected with one side of the bottom column 20 adjacent to the side plate without a gap. The lower end of the bottom column 20 is integrally connected with the lower end face of one of the end plates 30, namely the first end plate 31, and a clamping groove assembly 34 is arranged on one side face of the first end plate 31 far away from the slot 11; the horizontal placement of the flower basket is facilitated, and the horizontal placement stability of the flower basket is improved. The other side surfaces of the two end plates 30 except the lower end surfaces are arc-shaped surfaces, corners 33 are arranged at the joints of the adjacent side surfaces in the first end plate 31, and the corners 33 are also arranged at the two sides of the side surface at the upper end in the first end plate 31, so that the arrangement of the arc-shaped surfaces is not only beneficial to the arrangement of the corners 33, but also can improve the strength of the end plates 30, avoid the stabbing on the bodies of operators and avoid safety accidents; is more beneficial to processing and production, and can also improve the appearance of the flower basket. Based on the characteristics of the wafer appearance and the limitation of the end plate 30 structure, for reducing the occupied area of the end plate 30 and the overall weight, the outer side face of the flower basket is not easy to be connected and arranged by adopting a conventional linear structure or a broken line structure, so that the outer side face structure which is provided with outward openings and is easy to be matched with the corners 33 is arranged at the joint by adopting a multi-group arc-shaped face end-to-end connection mode. A clamping groove assembly 34 for vertically placing and positioning the flower basket is arranged on one side surface, far away from the inserting groove 11, of one end plate 30, namely the clamping groove assembly 34 is arranged on the first end plate 31, and the clamping groove assembly 34 is not arranged on the second end plate 32; the arrangement of the clamping groove assembly 34 is more beneficial to the vertical arrangement of the flower basket, so that the wafer is horizontally arranged and is convenient to operate on a detection platform, and meanwhile, the arrangement of the clamping groove assembly 34 does not influence the whole bearing or carrying of the flower basket on the wafer; especially, the corner 33 with one side surface provided with the clamping groove assembly 34 is more beneficial to vertically placing and fixing the flower basket. Meanwhile, the two end plates 30 have different structures on the side surface close to the bottom pillar 20, and the structure of the lower end surface of the different end plate 30 provided with the slot assembly 34 is different, so that the structure of the corner 33 of the end plate one 31 close to the bottom pillar 20 is different from that of the corner 33 of the short plate 32 close to the bottom pillar 20; namely, the lower end face of the end plate one 31 provided with the clamping groove assembly 34 is a flat plane and is arranged in parallel with the lower end face of the bottom pillar 20, so that the placing stability of the end plate 30 is facilitated, the matching of the end plate and a detection platform is facilitated, the matching mode is simplified, and the matching time is saved; the lower end face of the second end plate 32 without the clamping groove assembly 34 is of an arc-shaped structure, and the lowest end of the second end plate is arranged in a suspended mode, so that the processing is simple and the first end plate 31 is easy to distinguish; meanwhile, the bottom column 20 and the second end plate 32 which are integrally connected can further improve the overall stability and connection strength of the flower basket, improve the bearing safety of the flower basket and ensure the quality of wafers in the carrying process.

Specifically, as shown in fig. 1 to 3, the cross section of the side plate 10 is an inner straight and outer curved structure, i.e., the inner side surface is a straight wall surface, and the outer side surface is a curved surface; preferably, the outer curved surface of the side plate 10 is matched with the side arc-shaped surface of the end plate 30 and is in seamless connection with the side of the bottom column 20, so that the matching area of the side plate 10 with the end plate 30 and the bottom column 20 is increased, the connection strength of the side plate is improved, and meanwhile, the placement safety of wafers is improved. The height of the side plate 10 is lower than the side height of the end face 30, so that the height of the side plate 10 is reduced as much as possible on the basis of ensuring the strength of the wafer which is stably placed in the slot 11 and connected with the end plate 30; preferably, the highest position of the side plate 10 is higher than the position of the center of the wafer and lower than the highest point of the wafer, which is beneficial to the stability of placing the wafer. Preferably, the slots 11 penetrate through the height setting of the side plate 10 and are smaller than the overall height of the side plate 10, that is, the slots 11 are not arranged at the arc-shaped section of the lower end of the side plate 10 close to the bottom pillar 20, because the thickness of the arc-shaped section of the lower end of the side plate 10 close to the bottom pillar 20 is thinner, and the supporting stress on the wafer is weaker here, the supporting strength of the slots 11 on the wafer is set to be the largest in the vertical side wall of the side plate 10, and under the condition that the placing stability of the wafer is ensured, the slots 11 do not need to be arranged at the arc-shaped section of the lower end of the side.

Further, two curb plates 10's structure is the same, for the intensity that improves curb plate 10, is equipped with a plurality of strengthening rib grooves 12 towards one side direction crossing arrangement of slot 11 at the lateral surface of curb plate 10, and strengthening rib grooves 12 are the recess of inside setting promptly, including a plurality of strengthening ribs along curb plate 10 length direction and a plurality of strengthening ribs that set up along its direction of height. Preferably, the reinforcing ribs horizontally arranged along the length of the side plate 10 and vertically arranged along the height of the side plate 10 are mutually connected in a cross mode and vertically arranged, so that the processing is easy, an operator can conveniently grab the side plate, the weight of the side plate 10 can be reduced, and the processing cost is saved. The outer edge shape of the reinforcing rib groove 12 arranged along the height of the side plate 10 is the same as the outer curved surface of the side plate 10, and the reinforcing rib groove is arranged close to the end plates 30 at two sides so as to improve the strength of the joint of the side plate 10 and the end plates 30. Straight or broken or curved connecting ribs can be added between adjacent reinforcing ribs or between the reinforcing ribs and the upper and lower end faces of the side plate 10 to further improve the overall strength of the side plate 10 and prevent the side plate 10 from deforming.

Further, as shown in fig. 4 to 5, in order to enhance the stability of the connection of the two side plates 10, enhance the strength of the entire flower basket, and protect the stability of the placement of the disks, in the present embodiment, two bottom posts 20 are provided. Further, as shown in fig. 4, the side plate 10 of the basket is only provided with the slot 11 for placing the wafer, and the bottom column 20 is not provided with any bottom slot 11, because the height of the bottom column 20 is lower than the lowest point of the lower end surface of the wafer, the wafer is erected in the slot 11, and the bottom column 20 is not required to be provided with the supporting bottom slot 21.

As shown in fig. 5, the upper end surface of the bottom pillar 20 is higher than the lowest point of the wafer, and a bottom groove 21 corresponding to the slot 11 is also formed on one side of the bottom pillar 20 close to the wafer; the structure of the slot 11 and the structure of the bottom slot 21 may be the same or different, but they are all necessarily arranged in one-to-one correspondence. Preferably, the cross section of the bottom pillar 20 is a U-shaped structure, and one side of the bottom pillar, which is close to the wafer, is a semicircular structure; the side of the bottom pillar 20 away from the wafer is a flat surface, and the lower end surface thereof is the same flat surface as the lower end surface of the end plate one 31 provided with the clamping groove assembly 34.

Further, as shown in fig. 1-2, the cross section of the bottom pillar 20 is a structure with an upper section being a semicircular arc and a lower section being a rectangle, and the lower bottom surface is a flat surface flush with the lower end surface of the first end plate 31. The end surfaces of the two bottom pillars 10 close to the clamping groove assembly 34 are integrally connected with the lower end surface of the end plate one 31, and the structure can ensure that the lower end surface of the end plate one 31 is a flat continuous plane. The terminal surface of keeping away from two foundation columns 10 of draw-in groove subassembly 34 all sets up independently, and all is equipped with the recess 22 that the opening set up outwards, and the lower terminal surface of this structure that sets up two 32 of cooperation end plates sets up for circular arc structure, and can not influence the whole level of piece basket and place.

Further, as shown in fig. 6, 7 and 10, the end plate 30 includes a first end plate 31 provided with a clamping groove assembly 34 and a second end plate 32 not provided with a clamping groove assembly 34, so as to facilitate the quick and stable fixing and placement of the flower basket on the detection table, and the flower basket can be precisely butted with the monitoring pressure sensing device on the detection table, so as to ensure the stability and consistency of the vertical placement of the flower basket; meanwhile, the bar codes can be marked in the second end plate 32 which is not provided with the clamping groove assembly 34, so that automatic identification can be realized in each production process, the arrangement of the wafer sequence can be distinguished by personnel, and the principle of advanced and advanced measurement of the wafer on the detection platform can be ensured. Regarding the structure of the outer shape plane of the first end plate 31 and the second end plate 32, the structure of the edge surface of the two adjacent to one side of the bottom pillar 20 is different, and the structures of the other three side surfaces are the same, that is, the side surfaces are all arc surfaces on the same circle, and all the arc surfaces are symmetrically arranged along the vertical central line.

As shown in fig. 6 to 7, the lower end face of the first end plate 31 is a plane flush with the lower end face of the bottom pillar 20, the lower end face is a dovetail structure with a narrow top and a wide bottom, the other three side faces are all arc faces on the same circle, and the position of the lower end face is lower than the lowest position of the circle where the arc faces are located, so that the height of the wafer basket is increased to improve the placing stability of the wafer, and meanwhile, the side area of the first end plate 31 is also increased to improve the matching area of the first end plate 31 on the detection platform and improve the placing stability. In the end plate one 31, the circumference of the arc-shaped surface on the side close to the side plate 10 is larger than that of the arc-shaped surface on the side far from the bottom pillar 20.

As shown in fig. 6, the outer edge of the first end plate 31 is further provided with an equal-height outer edge 37 extending outwards, that is, the equal-height outer edge extending towards the side far away from the clamping groove 11 is provided at the outer wall edge of the first end plate 31, which not only can be used for improving the strength of the end plate, but also is convenient for keeping the outer wall surface of the end plate in a flat state, and prevents the structures arranged on the outer side walls of the two end plates from being damaged or worn. The outer edge 37 is only matched with the upper end edge face and the lower end dovetail structure edge face, respectively comprises four corners 33, is connected with two symmetrically arranged barrier strips 36 arranged on the outer wall surface of the first end plate 31, and encloses a continuous closed area matched with the detection table, and the clamping groove assembly 34 is arranged in the closed area.

In end plate 31, all be equipped with corner 33 at the junction of four limit sides, the corner 33 of upper end face both sides is right angle type corner 33, and the corner 33 of lower bottom surface both sides is acute angle type corner 33, and the corner 33 of isostructure more is favorable to the solid stability of piece basket card. Two corners 33 near one side of the bottom pillar 20 are arranged next to the outer wall of the bottom pillar 20, preferably, the horizontal width between the two corners 33 near the opening side of the flower basket is larger than the horizontal width between the two corners 33 near one side of the bottom pillar 20; this is because the horizontal width between two corners 33 disposed at the upper end cannot be too narrow, which would otherwise affect the taking out or putting in of the wafer, and therefore, the width between the adjacent corners 33 at the upper and lower ends is selected to be a configuration with a wider upper part and a narrower lower part; and the height between the two corners 33 on both sides in the height direction of the end plate 30 is the same. No matter the corner 33 of the right-angle structure or the corner 33 of the acute-angle structure, the flower basket is easier to be fixedly placed and is easy to be taken out, meanwhile, the clamping component matched with the flower basket is easy to be arranged, and the flower basket is certainly convenient to process.

As shown in fig. 7, a through circular hole 35 is formed at the center line of the first end plate 31; the through round hole 35 and the arc-shaped surface of the first end plate 31 are concentrically arranged, and the center of the through round hole 35 is overlapped with the center of gravity of a figure surrounded by the connecting clamping groove assembly 34. The arrangement of the through circular hole 35 is beneficial to the matching of the sensing device on the detection table.

The clamping groove assembly 34 comprises three clamping grooves with V-shaped structures, namely a first clamping groove 341, a second clamping groove 342 and a third clamping groove 343, wherein the first clamping groove 341 and the second clamping groove 342 are obliquely arranged close to the upper end part, are respectively connected with the corner 33 of the right-angle structure, and are arranged in a manner of clinging to the inner side wall of the barrier strip 36, so that the position strength of the clamping groove is improved; the tail parts of the first clamping groove 341 and the second clamping groove 342 are arranged towards the center of the through round hole 35; the third clamping groove 343 is located right below the through circular hole 35 and is arranged along the height of the first end plate 31.

As shown in fig. 8, the first and second slots 341 and 342 have the same structure, and each include a V-shaped groove 3411, the head of the V-shaped groove 3411 is connected to the inner side surface surrounded by the corner 33 and the barrier strip 36 disposed in the first end plate 31, the tail of the V-shaped groove is a flat surface, and a long and flat pressure sensing surface 3412 is disposed on the outer side table surface of the V-shaped groove 3411, the pressure sensing surface 3412 can contact with a pressure sensing rod on the detection table, and the pressure sensing fits to enable the detection table to sense the existence of the flower basket; the V-shaped clamping groove is beneficial to positioning and matching when the flower basket is vertically arranged, so that the flower basket can be prevented from sliding or deviating, and meanwhile, the signal transmission of the pressure sensing rod in contact with the pressure sensing surface 3412 can be protected from being damaged.

In the structure of the third clamping groove 343, a V-shaped groove 3411 is also provided, and in order to improve the pressure-sensitive strength, pressure-sensitive surfaces 3412 are provided on both sides of the V-shaped groove 3411; meanwhile, a pressure-sensitive convex table surface is arranged between the through round hole 35 and the third clamping groove 343, a round table surface is arranged outside one side of the third clamping groove 343 and at a position close to the lower end surface, the height of the round table surface is consistent with that of the pressure-sensitive surface 3412, and the round table surface is in contact with a pressure-sensitive rod arranged on the detection table. A plurality of pressure sensing supporting points are arranged in the end plate 31 to ensure that the end plate 31 is in full contact with the detection platform, and the accuracy and consistency of wafer detection are ensured. And meanwhile, a long hole of a parallelogram structure is symmetrically arranged above the third clamping groove 343, a long round hole is arranged on one side close to the round table top, and the long hole and the long round hole are arranged by penetrating through the thickness of the first end plate 31, so that the purpose that an infrared measurement and control instrument placed on the detection table can penetrate through and monitor the wafer is achieved.

And the two sides of the first end plate 31 and the corners 33 close to the right-angle structure are provided with symmetrically arranged barrier strips 36, the height of each barrier strip 36 is higher than that of all the clamping grooves, and the barrier strips are arranged along the height of the first end plate 31 and connected with the outer edges 37. The two barrier strips 36 are connected with the upper outer edge 37 and the lower outer edge 37 to form a closed ring, the barrier strips 36 are arranged in parallel to the central line of the end plate I31, and the length of the barrier strips along the height of the end plate I31 is smaller than the height of the arc surface of the outer side surface of the barrier strips.

As shown in fig. 9, the barrier strip 36 has a T-shaped structure and includes a vertical strip 361 and a flat strip 362, wherein the vertical strip 361 is disposed perpendicular to the outer wall surface of the first end plate 31, and the flat strip 362 is disposed parallel to and facing outward from the outer wall surface of the first end plate 31. The height of the vertical strip 361 is slightly higher than that of the outer edge 37, so that the vertical strip 361 arranged on two sides is used as a plane for the end plate I31 to contact with the detection table, and meanwhile, the contact between the pressure sensing rod on the detection table and the clamping groove assembly 34 is not influenced. A plurality of parallel and uniformly arranged connecting ribs 363 are further arranged between the flat strip 362 and the first end plate 31, and the arrangement of the flat strip 362 connecting ribs 363 can improve the strength of the vertical strip 361 and ensure the supporting strength for vertically placing the flower basket.

As shown in fig. 10, the outer side surface of the second end plate 32 without the slot assembly 34 is a flat surface, the lower end surface thereof is an arc-shaped surface and is the same as the arc-shaped surface of the upper end surface thereof, the side surfaces of the left and right sides are also arc-shaped surfaces, the four arc-shaped surfaces are also arc-shaped surfaces on the same circle, and the two arc-shaped surfaces of the side plate close to the side plate 10 and the arc-shaped surface of the side column close to the side column 10 are integrally connected. In the second end plate 32, a corner 33 is also arranged at the joint of the arc-shaped surface on the side far away from the bottom column 20 and the two arc-shaped surfaces on the side close to the side plate 10, and the corner 33 is of a right-angle structure, and the positions of the corner 33 are corresponding to the two right-angle corners 33 on the middle upper surface of the first end plate 31 and are the same. The diameter of the circle where the arc surfaces of the first end plate 31 and the second end plate 32 are located is the same and the circle is arranged coaxially.

A groove 38 for marking and pasting a bar code is further arranged on the outer side wall surface of the second end plate 32, the groove 38 can be of a rectangular structure, an oval structure or a circular structure, or a structure with other shapes, and is mainly used for infrared scanning of the bar code pasted in the groove 38; the provision of the groove 38 structure protects the bar code from wear.

The flower basket arranged at the opening is beneficial to the taking and placing operation of the wafer, and can quickly evaporate water liquid on the surface of the wafer to dryness; the hollow matching between the bottom columns 20 is more beneficial to the circulation and the transportation of the flower basket in the production process, and the polished or cleaned wafer is also beneficial to the placing of the wafer in the flower basket with the structure, so that not only is the water easy to remove, but also the water in the flower basket is not easy to remain, and simultaneously, the water on the surface of the wafer can be volatilized quickly; while also reducing overall weight.

The end plate 30 arranged in an arc shape has high strength, is suitable for setting a fixed corner 33, and can reduce the occupied space of the whole flower basket and save processing materials.

The straight outer crooked structure in the cross section of curb plate 10 and the setting of outside strengthening rib groove 12 have not only improved slot 11's steadiness, but also improved curb plate 10 and end plate 30's joint strength, improve the bearing strength of basket of flowers, improve the security of its transportation, guarantee that the wafer can not appear rocking or the bonding piece, guarantee the wafer quality.

The end plate I31 and the end plate II 32 with different structures can be used for distinguishing the serial numbers of the flower basket and the end plate on which side the wafer is stored, and the first-in first-out detection can be carried out according to the first-in first-out principle of the wafer, so that the detection consistency is ensured; meanwhile, in the process of circulation and transportation, the placing consistency of all wafers can be ensured.

The flower basket is particularly suitable for bearing and placing large-size wafers, has the advantages of simple structure, high strength and good stability, is convenient to carry and trace in the production process, ensures that all wafers are firstly-in-first-out and firstly-in-first-out, can be matched with a detection machine, has good universality, ensures that the wafers can be horizontally and stably placed on the detection table, ensures the safety of placing the wafers and reduces the fragment rate.

The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims (10)

1. A semiconductor wafer flower basket comprises a side plate, a bottom column and an end plate, and is characterized in that,

at least a plurality of slots for placing wafers are arranged on the inner side of the side plate along the height direction of the side plate;

the outer side face of the side plate is arranged along the outer edge of the end plate;

the bottom of the side plate is in seamless connection with one side edge of the bottom column adjacent to the side plate;

the lower end face of the bottom column is connected with the lower end face of one of the end plates, and a clamping groove assembly is arranged on one side face, far away from the inserting groove, of the end plate;

the other side surfaces of the end plate except the lower end surface are arc surfaces;

corners are arranged at the connecting positions of the adjacent side surfaces of the end plates provided with the clamping groove assemblies;

the side surfaces of the two end plates close to one side of the bottom column have different structures.

2. The semiconductor wafer flower basket as recited in claim 1, wherein the side plates have a cross section of an inner straight and outer curved structure;

the outer curved surface of the side plate is matched with the arc-shaped surface of the side edge of the end plate; the height of the side plate is lower than that of the side edge of the end face;

and the height of the side plate is greater than that of the slot.

3. The semiconductor wafer flower basket as recited in claim 2, wherein the side plate has a plurality of reinforcement grooves formed on an outer surface thereof and intersecting with each other in a direction toward the insertion grooves, and an outer edge of the reinforcement groove along a height of the side plate has a same shape as an outer curved surface of the side plate.

4. The semiconductor wafer basket as recited in claim 2 or 3, wherein a bottom slot corresponding to the slot is also formed on the bottom pillar at a side close to the wafer;

the lower end face of the bottom column and the lower end face of the end plate, provided with the clamping groove assembly, are the same flat plane.

5. The semiconductor wafer flower basket as recited in claim 4, wherein end faces of the two bottom pillars adjacent to the slot assembly are integrally connected with a lower end face of the end plate;

keep away from two of draw-in groove subassembly the sill pillar terminal surface all sets up independently, and all is equipped with the recess that the opening set up outwards.

6. The semiconductor wafer basket according to any one of claims 1 to 3 and 5, wherein the other side surfaces of the end plates except the lower end surface are arc surfaces on the same circle, and all the arc surfaces are symmetrically arranged along the vertical central line;

in the end plate provided with the clamping groove assembly, the perimeter of the arc-shaped surface close to one side of the side plate is larger than the perimeter of the arc-shaped surface far away from one side of the bottom column, and the outer edge of the end plate is also provided with an equal-height outer edge which extends outwards.

7. The semiconductor wafer flower basket as recited in claim 6, wherein the corners in the end plate having the slot assembly are right-angled or acute-angled;

and a through round hole is arranged on the central line of the connecting rod;

the through round hole and the arc-shaped surface of the end plate are concentrically arranged, and the center of the through round hole is overlapped with the center of gravity of a figure formed by surrounding the clamping groove assembly.

8. The semiconductor wafer flower basket as recited in claim 7, wherein the card slot assembly comprises three card slots having a V-shaped configuration;

the two clamping grooves are obliquely arranged at the corner close to the upper end part of the end plate, and the tail parts of the two clamping grooves are arranged towards the center of the through round hole;

and the other clamping groove is positioned under the through round hole and is arranged along the height direction of the end plate.

9. The semiconductor wafer basket as recited in claim 7 or 8, wherein a pair of symmetrically disposed bars is further disposed on outer sides of the two slots adjacent to the upper end, the bars are higher than the slots and are disposed along the height of the end plate and connected to the outer rim.

10. The semiconductor wafer basket as recited in claim 9, wherein the outer side of the end plate without the slot assembly is a flat surface, and two arc surfaces of the flat surface adjacent to one side of the side plate are integrally connected with an arc surface adjacent to one side of the bottom pillar;

the arc-shaped surface far away from one side of the bottom column and the two arc-shaped surfaces close to one side of the side plate are provided with the corner.

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