CN112669707A - Display panel, flexible circuit board and display device - Google Patents
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- CN112669707A CN112669707A CN202011529702.0A CN202011529702A CN112669707A CN 112669707 A CN112669707 A CN 112669707A CN 202011529702 A CN202011529702 A CN 202011529702A CN 112669707 A CN112669707 A CN 112669707A
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Abstract
The embodiment of the invention discloses a display panel, a flexible circuit board and a display device. The display panel includes display area and non-display area, and non-display area includes the binding area, still includes: the first substrate base plate is provided with a plurality of pad structure groups positioned on one side of the first substrate base plate, the plurality of pad structure groups comprise a first pad structure group and a second pad structure group which are adjacent, and the first pad structure group is positioned on one side, away from the first substrate base plate, of the second pad structure group; the first insulating layer is located between the first pad structure group and the second pad structure group, the first pad structure group comprises a plurality of first pad structures, the second pad structure group comprises a plurality of second pad structures, and the first pad structures and the second pad structures are located in the binding area respectively. The technical scheme provided by the embodiment of the invention can increase the spatial distance of at least part of the pad structure, reduce the risk of water-oxygen corrosion of the pad structure and improve the integral water-oxygen corrosion resistance of the pad structure group in the binding region.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel, a flexible circuit board and a display device.
Background
With the development of display technology, organic light emitting display panels, liquid crystal display panels, and the like have become mainstream display panel types. The display panel generally includes a bonding region, the bonding region is provided with a plurality of pad structures, and the display panel receives signals required for normal operation of the display panel through the pad structures.
Currently, a plurality of pad structures in a display panel generally extend in a vertical direction and are arranged in a row in a horizontal direction. Because the display panel needs more kinds of signals for normal work, the two pad structures can receive signals with different potentials, and when a potential difference exists between the two pad structures which are close to each other, the two pad structures are easy to react with water and oxygen in the air in a high-temperature high-humidity environment, so that the pad structures are corroded.
Disclosure of Invention
The invention provides a display panel, a flexible circuit board and a display device, which are used for improving the integral water and oxygen corrosion resistance of a bonding pad structure group in a binding region.
In a first aspect, an embodiment of the present invention provides a display panel, including: the display panel comprises a display area and a non-display area, wherein the non-display area comprises a binding area, and the display panel further comprises:
the first substrate base plate is provided with a plurality of pad structure groups positioned on one side of the first substrate base plate, the plurality of pad structure groups comprise a first pad structure group and a second pad structure group which are adjacent, and the first pad structure group is positioned on one side, far away from the first substrate base plate, of the second pad structure group;
the first insulating layer is located between the first pad structure group and the second pad structure group, the first pad structure group comprises a plurality of first pad structures, the second pad structure group comprises a plurality of second pad structures, and the first pad structures and the second pad structures are respectively located in the binding area.
In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a flexible printed circuit, where the flexible printed circuit includes a bonding region, and further includes:
the second substrate base plate is positioned on a plurality of golden finger structure groups on one side of the second substrate base plate, the plurality of golden finger structure groups comprise a first golden finger structure group and a second golden finger structure group which are adjacent, and the first golden finger structure group is positioned on one side, far away from the second substrate base plate, of the second golden finger structure group;
the second insulating layer, the second insulating layer is located first golden finger structure group with between the second golden finger structure group, first golden finger structure group includes a plurality of first golden finger structures, second golden finger structure group includes a plurality of second golden finger structures, first golden finger structure with second golden finger structure is located respectively bind the district.
In a third aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, including the display panel of the first aspect and the flexible printed circuit board of the second aspect; the first substrate base plate and the second substrate base plate are arranged oppositely, and the pad structure group in the display panel and the golden finger structure group in the flexible circuit board are arranged in a binding mode.
According to the display panel provided by the embodiment of the invention, the plurality of pad structures in the binding region are divided into the plurality of pad structure groups, different pad structure groups are positioned on different layers, and the first insulating layer is arranged between two adjacent pad structure groups, so that the space distance between the pad structure groups positioned on different layers is increased, the risk of water-oxygen corrosion of the pad structures is favorably reduced, the problem that the pad structures in the prior art have high water-oxygen corrosion risk is solved, and the effect of improving the integral water-oxygen corrosion resistance of the pad structure groups in the binding region is realized.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a front view of the display panel shown in FIG. 1;
FIG. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 4 is a front view of the display panel shown in FIG. 3;
fig. 5 is a schematic structural diagram of a display panel provided in the related art;
FIG. 6 is a front view of the display panel shown in FIG. 5;
FIG. 7 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 8 is a front view of the display panel shown in FIG. 7;
FIG. 9 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 10 is a front view of the display panel shown in FIG. 9;
fig. 11 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 12 is a front view of the display panel shown in FIG. 11;
FIG. 13 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 14 is a front view of the display panel shown in FIG. 13;
FIG. 15 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 16 is a front view of the display panel shown in FIG. 15;
fig. 17 is a schematic structural diagram of another display panel according to an embodiment of the invention;
fig. 18 is a front view of the display panel shown in fig. 17;
fig. 19 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 20 is a front view of the display panel shown in FIG. 19;
FIG. 21 is a schematic structural diagram of another display panel provided in an embodiment of the invention;
FIG. 22 is a front view of the display panel shown in FIG. 21;
FIG. 23 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 24 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 25 is a schematic structural view of pad structure group distribution signal lines in the display panel shown in fig. 3;
fig. 26 is a schematic structural diagram of a flexible printed circuit according to an embodiment of the present invention;
fig. 27 is a front view of the flexible wiring board of fig. 26;
fig. 28 is a schematic structural diagram of another flexible printed circuit board according to an embodiment of the present invention;
fig. 29 is a front view of the flexible wiring board shown in fig. 28;
fig. 30 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In view of the problems mentioned in the background, an embodiment of the present invention provides a display panel, including a display area and a non-display area, where the non-display area includes a binding area, and further including: the first substrate base plate is provided with a plurality of pad structure groups positioned on one side of the first substrate base plate, the plurality of pad structure groups comprise a first pad structure group and a second pad structure group which are adjacent, and the first pad structure group is positioned on one side, away from the first substrate base plate, of the second pad structure group; the first insulating layer is located between the first pad structure group and the second pad structure group, the first pad structure group comprises a plurality of first pad structures, the second pad structure group comprises a plurality of second pad structures, and the first pad structures and the second pad structures are located in the binding area respectively.
Adopt above-mentioned technical scheme, a plurality of pad structures that will bind in the district divide into a plurality of pad structure groups, different pad structure groups are located different layers, and be provided with the first insulation layer between two adjacent pad structure groups for the spatial distance that is located between the pad structure group on different layers increases, be favorable to reducing the risk that the pad structure takes place the water oxygen corrosion, improve the problem that pad structure has high water oxygen corrosion risk among the prior art, realize improving the effect of the whole waterproof oxygen corrosion ability of binding the district inner pad structure group.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. It should be noted that the technical solutions provided by the embodiments of the present invention can be combined with each other without contradiction.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention. Fig. 2 is a front view of the display panel shown in fig. 1. Referring to fig. 1 and 2, the display panel includes a display area AA and a non-display area DA, the non-display area DA including a binding area BA, and further includes: the bonding pad structure comprises a first substrate base plate 10, a plurality of bonding pad structure groups 20 positioned on one side of the first substrate base plate 10, wherein the bonding pad structure groups 20 comprise a first bonding pad structure group 21 and a second bonding pad structure group 22 which are adjacent to each other, and the first bonding pad structure group 21 is positioned on one side, away from the first substrate base plate 10, of the second bonding pad structure group 22; the first insulating layer 30, the first insulating layer 30 is located between the first pad structure group 21 and the second pad structure group 22, the first pad structure group 21 includes a plurality of first pad structures 211, the second pad structure group 22 includes a plurality of second pad structures 221, and the first pad structures 211 and the second pad structures 221 are respectively located in the bonding area BA.
Specifically, the display panel may include an organic light emitting display panel, a liquid crystal display panel, or other types of display panels known to those skilled in the art, and is not limited herein. Specifically, the display area AA is used for displaying a to-be-displayed picture, and the non-display area DA does not display a picture. The pad structure group 20 of the bonding area BA may be subsequently bonded with a driver chip, a flexible printed circuit board, etc., which is not limited herein.
Specifically, the first substrate base plate 10 serves to protect and support a film layer formed thereon. The first substrate 10 may be a rigid substrate, for example, the material of the first substrate 10 is glass, and the first substrate 10 may also be a flexible substrate, for example, the material of the first substrate 10 may include one or more combinations of polyether sulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and polymer resin of cellulose acetate propionate. Here, the material of the first substrate 10 is not limited.
Specifically, fig. 1 and 2 only illustrate that the bonding area BA is provided with two pad structure groups 20, but the embodiment of the present invention is not limited thereto, and a person skilled in the art may set the number of pad structure groups 20 according to actual situations. It should be noted that the first pad structure group 21 and the second pad structure group 22 do not refer to any two pad structure groups 20 in the plurality of pad structure groups 20, and any two pad structure groups 20 in the plurality of pad structure groups 20 can be defined as the first pad structure group 21 and the second pad structure group 22 according to the positional relationship between the two pad structure groups 20 and the first substrate 10. For example, fig. 3 is a schematic structural diagram of another display panel provided in an embodiment of the present invention. Fig. 4 is a front view of the display panel shown in fig. 3. Referring to fig. 3 and 4, the bonding area BA is provided with three pad structure groups 20, and each pad structure group 20 includes a plurality of pad structures 201 therein. The three pad structure groups 20 are respectively a pad structure group 20A, a pad structure group 20B, and a pad structure group 20C, wherein the pad structure group 20A includes a pad structure 201A, the pad structure group 20B includes a pad structure 201B, the pad structure group 20C includes a pad structure 201C, a first insulating layer 30A is arranged between the pad structure group 20A and the pad structure group 20B at an interval, and a first insulating layer 30B is arranged between the pad structure group 20B and the pad structure group 20C at an interval. For the pad structure group 20A and the pad structure group 20B, the pad structure group 20A is a first pad structure group, and the pad structure group 20B is a second pad structure group. For the pad structure group 20B and the pad structure group 20C, the pad structure group 20B is a first pad structure group, and the pad structure group 20C is a second pad structure group. For the pad structure group 20A and the pad structure group 20C, the pad structure group 20A is a first pad structure group, and the pad structure group 20C is a second pad structure group.
Specifically, the pad structure 201 may be divided into a non-idle pad structure and an idle pad structure, where the non-idle pad structure is connected to other electronic components on the display panel through a routing wire (not shown in fig. 1 to 4) to transmit a signal received by the non-idle pad structure to the electronic components connected to the non-idle pad structure, so that the display panel normally operates, and the idle pad structure is not connected to other electronic components on the display panel. It should be noted that, which pad structures 201 in each pad structure group 20 are non-idle pad structures, and which pad structures 201 are idle pad structures, which can be set by a person skilled in the art according to practical situations, and is not limited herein.
It can be understood that, the pad structure 201 of the bonding area BA is divided into a plurality of pad structure groups 20 by the arrangement, each pad structure group 20 is located on a different layer, and a first insulating layer 30 is arranged between two adjacent pad structure groups 20 at an interval, so that the spatial distance between the pad structure groups 20 located on different layers is increased, and the risk of water-oxygen corrosion of the pad structure 201 is favorably reduced. In addition, compared with the arrangement of all the pad structures 201 in the same layer in the related art, the technical solution of the embodiment of the present invention is beneficial to increasing the distance between the adjacent pad structures 201 along the second direction X (i.e., the arrangement direction), so as to further reduce the risk of water-oxygen corrosion of the pad structures 201. Exemplarily, fig. 5 is a schematic structural diagram of a display panel provided in the related art. Fig. 6 is a front view of the display panel shown in fig. 5. Referring to fig. 5 and 6, each pad structure 201 is located in the bonding area BA and in the same layer. In the display panel shown in fig. 2 and 5, the width of the bonding area BA along the second direction X is the same, and the total number of the pad structures 201 is the same, in the display panel shown in fig. 2, the distance between two adjacent pad structures 201 along the second direction X is larger, so that the pad structures 201 are less prone to water-oxygen corrosion. It can also be understood that, when the distance between two adjacent pad structures 201 along the second direction X is the same in the display panels shown in fig. 2 and 5, the technical solution of the embodiment of the present invention is beneficial to reducing the width of the bonding area BA along the second direction X.
It should be noted that fig. 2 and fig. 4 only exemplarily show that no other film layer is disposed between the pad structure group 20 closest to the first substrate 10 and the first substrate 10, but the present invention is not limited thereto, and those skilled in the art may dispose the other film layer according to the actual film layer structure of the display panel.
According to the display panel provided by the embodiment of the invention, the plurality of pad structures 201 in the bonding area BA are divided into the plurality of pad structure groups 20, different pad structure groups 20 are positioned at different layers, and the first insulating layer 30 is arranged between two adjacent pad structure groups 20, so that the space distance between the pad structure groups 20 positioned at different layers is increased, the risk of water-oxygen corrosion of the pad structures 201 is favorably reduced, the problem that the pad structures 201 have high water-oxygen corrosion risk in the prior art is solved, and the effect of improving the integral water-oxygen corrosion resistance of the pad structure groups 20 in the bonding area BA is realized.
Fig. 7 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Fig. 8 is a front view of the display panel shown in fig. 7. With continued reference to fig. 1-4 and fig. 7 and 8, optionally, the first pad structures 211 and the second pad structures 221 extend along the first direction Y and are arranged along the second direction X, respectively; the end of the first pad structure 211 away from the display area AA is a first end of the first pad structure 211, and the end of the second pad structure 221 away from the display area AA is a first end of the second pad structure 221. Note that, in order to distinguish the first pad structure 211 from the second pad structure 221, the first pad structure 211 is filled with a diagonal pattern and the second pad structure 221 is filled with a dot pattern in fig. 7 and 8.
Specifically, the distances between the first ends of the first pad structures 211 and the first ends of the second pad structures 221 and the display area AA along the first direction Y may be set by those skilled in the art according to practical situations, and are not limited herein. Alternatively, as shown in fig. 1 and 3, in the first direction Y, the first end of the first pad structure 211 may be located between the first end of the second pad structure 221 and the display area AA; alternatively, as shown in fig. 7, in the first direction Y, the first end of the first pad structure 211 may be flush with the first end of the second pad structure 221; optionally, in the first direction Y, the first end of the second pad structure 221 may be located between the first end of the first pad structure 211 and the display area AA.
It can be understood that, when the first end of the first pad structure 211 is located between the first end of the second pad structure 221 and the display area AA, the portion of the second pad structure 221 for binding is not surrounded by the first insulating layer 30, which is convenient for each subsequent pad structure group 20 to bind with a pin of a driver chip or a gold finger on a flexible circuit board, and is beneficial to reducing the binding difficulty. When the first end of the first pad structure 211 and the first end of the second pad structure 221 are flush, the length of the bonding area BA along the first direction Y is favorably reduced, and thus a narrow frame is realized.
Specifically, there are various embodiments of the first pad structure group 21 and the second pad structure group 22, and a typical example will be described below, but the present application is not limited thereto. For convenience of illustration, the bonding area BA is provided with two pad structure groups 20 as an example.
With continued reference to fig. 1-4, 7, and 8, optionally, the first pad structure 211 and the second pad structure 221 do not overlap in a direction perpendicular to the plane of the first substrate board 10. Thus, no parasitic capacitance is formed between the first pad structure 211 and the second pad structure 221, which is beneficial to reducing the loss of signals on the pad structure 201.
Fig. 9 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Fig. 10 is a front view of the display panel shown in fig. 9. With continued reference to fig. 1-4, 9, and 10, optionally, one end of the second pad structure 221 near the display area AA is a second end of the second pad structure 221; in the first direction Y, the first pad structure 211 has a first end located between the display area AA and a second end of the second pad structure 221.
Specifically, the distance between the first end of the first pad structure and the second end of the second pad structure in the first direction Y may be set by a person skilled in the art according to practical situations, and is not limited herein. It can be understood that the smaller the distance between the first end of the first pad structure and the second end of the second pad structure, the smaller the length of the bonding area BA along the first direction Y, which is more beneficial for implementing a narrow bezel.
It can be understood that by disposing the first end of the first pad structure between the display area AA and the second end of the second pad structure, no parasitic capacitance is formed between the first pad structure 211 and the second pad structure 221, which is beneficial to reduce the loss of signals on the pad structure 201.
Fig. 11 is a schematic structural diagram of a display panel according to an embodiment of the present invention. Fig. 12 is a front view of the display panel shown in fig. 11. Fig. 13 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Fig. 14 is a front view of the display panel shown in fig. 13. Referring to fig. 11 to 14, alternatively, at least a partial number of the second pad structures 221 are located between two adjacent first pad structures 211 in a direction perpendicular to the plane of the first substrate base plate 10.
Specifically, along the second direction X, the distance between the orthographic projection of the second pad structure 221 on the first substrate 10 and the orthographic projection of the adjacent first pad structure 211 on the first substrate 10 can be set by one skilled in the art according to practical situations, and is not limited herein. It can be understood that, by arranging in the direction perpendicular to the plane of the first substrate base plate 10, there are at least a partial number of the second pad structures 221 located between two adjacent first pad structures 211, so that the first pad structures 211 and the second pad structures 221 are not only separated by a certain distance in the direction perpendicular to the first substrate base plate 10, but also have a certain distance in the second direction X, which is beneficial to further increasing the spatial distance between the first pad structure group 21 and the second pad structure group 22, and further reducing the risk of corrosion of the pad structures 201.
With continued reference to fig. 1-4 and fig. 9-14, optionally, the second pad structure 221 may be partially covered by the first insulating layer 30 (as shown in fig. 9 and 13), or may be entirely exposed outside the first insulating layer 30 (as shown in fig. 1, 3, and 11), which is not limited herein. Preferably, the second pad structure 221 is entirely exposed outside the first insulating layer 30, and thus, the area of the second pad structure 221 is the binding area thereof, which is beneficial to improving the binding performance of the second pad structure 221.
Fig. 15 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Fig. 16 is a front view of the display panel shown in fig. 15. Fig. 17 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Fig. 18 is a front view of the display panel shown in fig. 17. Fig. 19 is a schematic structural diagram of a display panel according to an embodiment of the present invention. Fig. 20 is a front view of the display panel shown in fig. 19. Referring to fig. 15 to 20, alternatively, the first pad structure 211 and the second pad structure 221 overlap each other in a direction perpendicular to the plane of the first substrate base plate 10.
Specifically, the overlapping area of the orthographic projection of the second pad structure 221 on the first substrate 10 and the orthographic projection of the adjacent first pad structure 211 on the first substrate 10 can be set by those skilled in the art according to practical situations, and is not limited herein. It is understood that the first pad structure 211 and the second pad structure 221 overlap each other by being disposed in a direction perpendicular to the plane of the first substrate base plate 10, so as to advantageously reduce the width of the bonding area BA in the second direction X.
Specifically, one end of the first pad structure 211 close to the display area AA is a second end of the first pad structure, one end of the second pad structure 221 close to the display area AA is a second end of the second pad structure, and distances between the second ends of the first and second pad structures and the display area AA along the first direction Y may be set by those skilled in the art according to actual situations, and are not limited herein. Alternatively, as shown in fig. 15, in the first direction Y, the first pad structure second end and the second pad structure second end are flush. Preferably, as shown in fig. 17 and 19, the second end of the second pad structure is located between the first end of the first pad structure and the display area AA in the first direction Y, so that the facing area between the first pad structure 211 and the second pad structure 221 can be reduced, and the parasitic capacitance between the first pad structure 211 and the second pad structure 221 can be reduced.
With continued reference to fig. 1, 3, 9, 15, and 17, optionally, the first pad structures 211 and the second pad structures 221 are disposed correspondingly, and the first pad structures 211 and the second pad structures 221 corresponding thereto are arranged along the first direction Y.
Specifically, the arrangement of the first pad structures 211 and the second pad structures 221 corresponding thereto along the first direction Y means that a line connecting the center of the orthographic projection of the first pad structures 211 on the first substrate 10 and the center of the orthographic projection of the second pad structures 221 corresponding thereto on the first substrate 10 is parallel to the first direction Y, or the centers of the orthographic projections coincide with each other. In this way, the width of the bonding area BA along the second direction X is advantageously reduced.
With continued reference to fig. 7, 11, 13, and 19, optionally, the first pad structures 211 and the second pad structures 221 are arranged in a staggered manner in the second direction X.
Specifically, the staggered arrangement of the first pad structures 211 and the second pad structures 221 in the second direction X means that the first pad structures 211 and the second pad structures 221 are correspondingly arranged, a connecting line of the center of the orthographic projection of the first pad structures 211 on the first substrate 10 and the center of the orthographic projection of the second pad structures 221 corresponding to the center of the orthographic projection on the first substrate 10 is not parallel to the first direction Y, and the centers of the orthographic projections do not coincide. Therefore, the space distance between the first pad structure group 21 and the second pad structure group 22 is increased, and the risk of corrosion of the pad structure 201 by water and oxygen is reduced.
Fig. 21 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Fig. 22 is a front view of the display panel shown in fig. 21. Referring to fig. 1, 3, 7, 9, 11, and 21, alternatively, the exposed area of the first pad structure 211 is the same as the exposed area of the second pad structure 221. Therefore, the bonding performance of each bonding pad structure 201 can be the same or similar, which is beneficial to reducing the bonding difficulty between the bonding pad structure 201 on the display panel and the pin of the driving chip or the golden finger structure 70 on the flexible circuit board, and reducing the bonding cost.
Specifically, the width of the exposed region of the first pad structure 211 along the second direction X and the width of the exposed region of the first pad structure 211 along the second direction X may be set by those skilled in the art according to practical situations, and are not limited herein. Alternatively, as shown in fig. 21, the width of the exposed region of the first pad structure 211 in the second direction X is different from the width of the exposed region of the first pad structure 211 in the second direction X. Preferably, the width of the exposed region of the first pad structure 211 along the second direction X is the same as the width of the exposed region of the first pad structure 211 along the second direction X, so that it is beneficial to reduce the width of the bonding area BA along the second direction X.
Optionally, the display panel further includes a plurality of array metal layers, and the adjacent array metal layers are insulated by using insulating layers; the first pad structure group 21 is disposed in the same layer as one of the plurality of array metal layers, and/or the second pad structure group 22 is disposed in the same layer as one of the plurality of array metal layers.
For example, fig. 23 is a schematic structural diagram of another display panel provided in the embodiment of the present invention. Referring to fig. 23, the display panel is a liquid crystal display panel, the multi-layer array metal layer 40 specifically includes a first metal layer 41 and a second metal layer 42, the first metal layer 41 includes a gate of a thin film transistor and a gate scan signal line, and the second metal layer 42 includes a source, a drain, and a data signal line of the thin film transistor, at this time, the second pad structure group 22 may be disposed on the same layer as the first metal layer 41, and the first pad structure group 21 may be disposed on the same layer as the second metal layer 42.
It should be noted that fig. 23 only illustrates some other film layers of the liquid crystal display panel, such as the pixel electrode layer 51, the common electrode layer 52, the liquid crystal layer 53, and the color filter substrate 54, but the invention is not limited thereto, and those skilled in the art may set the specific film layers included in the liquid crystal display panel according to actual situations.
For example, fig. 24 is a schematic structural diagram of another display panel provided in an embodiment of the present invention. Referring to fig. 24, the display panel is an organic light emitting display panel, the multi-layer array metal layer 40 specifically includes a first metal layer 41, a capacitor metal layer 43, a second metal layer 42, and a third metal layer 44, the first metal layer 41 includes a gate of a thin film transistor and a gate scan signal line, the capacitor metal layer 43 includes a capacitor plate, the second metal layer 42 includes a source, a drain, a data signal line, and a power signal line of the thin film transistor, and the third metal layer 44 includes a power signal line and a bending region connecting line. At this time, the second pad structure group 22 may be disposed on the same layer as the first metal layer 41, and meanwhile, the first pad structure group 21 may be disposed on the same layer as the capacitor metal layer 43, the second metal layer 42, or the third metal layer 44; alternatively, the second pad structure group 22 may be disposed on the same layer as the capacitor metal layer 43, and meanwhile, the first pad structure group 21 may be disposed on the same layer as the second metal layer 42 or the third metal layer 44; alternatively, the second pad structure group 22 may be disposed on the same layer as the second metal layer 42, and the first pad structure group 21 may be disposed on the same layer as the third metal layer 44.
It should be noted that fig. 24 only illustrates some other film layers of the organic light emitting display panel, for example, the anode layer 55, the pixel defining layer 56, the light emitting layer 57, and the cathode layer 58, but the embodiment of the present invention is not limited thereto, and a person skilled in the art may set the specific film layers included in the display panel according to practical situations.
Specifically, there are various specific embodiments of what signals are transmitted on each pad structure 201, and a typical example is described below, but the present application is not limited thereto.
Alternatively, there is at least one second pad structure 221 and one first pad structure 211 most adjacent thereto, to which signal lines having different potentials are connected, respectively. In this way, although there is a potential difference between the signal transmitted through the second pad structure 221 and the signal transmitted through the first pad structure 211 closest to the second pad structure, the spatial distance between the first pad structure 211 and the second pad structure 221 is large, and the problem of water-oxygen corrosion is not easily caused.
Optionally, the display panel further includes a plurality of level signal lines, and the level signal lines include a first power signal line, a second power signal line, a first level signal line, and a second level signal line; the voltage transmitted on the first power signal line is greater than the voltage transmitted on the second power signal line; the first power signal line and the second power signal line are electrically connected to different pad structure groups 20; the voltage transmitted on the first level signal line is greater than the voltage transmitted on the second level signal line; the first level signal line and the second level signal line are electrically connected to different pad structure groups 20.
Illustratively, fig. 25 is a schematic structural diagram of the distribution signal lines of the pad structure group 20 in the display panel shown in fig. 3. Referring to fig. 25, a PVDD signal may be transmitted on the first power signal line, and a PVEE signal may be transmitted on the second power signal line. The first level signal line may transmit a VGH signal, and the second level signal line may transmit a VGL signal or a Vref signal.
It can be understood that the first power signal line transmits the first power signal, the first power signal line transmits the second power signal, the potential difference between the first power signal and the second power signal is usually large, and the first power signal line and the second power signal line with large potential difference are dispersedly connected to different pad structure groups 20, so that the spatial distance between the pad structure 201 transmitting the first power signal and the pad structure 201 transmitting the second power signal can be increased, and the risk of water-oxygen corrosion of the pad structure 201 transmitting the first power signal and the pad structure 201 transmitting the second power signal under a high-temperature and high-humidity environment can be reduced. The same applies to the first level signal line and the second level signal line, and details thereof are not repeated here.
Optionally, the display panel further includes a plurality of level signal lines, and the level signal lines include a first power signal line, a second power signal line, a first level signal line, and a second level signal line; the display panel also comprises a plurality of alternating current signal lines, wherein the alternating current signal lines comprise scanning signal lines, clock signal lines and starting signal lines; the ac signal lines and the level signal lines are electrically connected to different pad structure groups 20.
For example, with continued reference to fig. 25, the SCAN signal lines may include a first SCAN signal line on which the SCAN signal is transmitted and a second SCAN signal line on which the EMIT signal is transmitted. The clock signal lines may include a first clock signal line for transmitting a CK1 clock signal, a second clock signal line for transmitting an XCK1 clock signal, a third clock signal line for transmitting a CK2 clock signal, and a fourth clock signal line for transmitting an XCK2 clock signal. The enable signal lines may include a first enable signal line for transmitting the STV1 signal and a second enable signal line for transmitting the STV2 signal. The ac signal line is electrically connected to the pad structure 201B in the pad structure group 20B, a part of the level signal line is electrically connected to the pad structure 201A in the pad structure group 20A, and the other part of the level signal line is electrically connected to the pad structure 201C in the pad structure group 2020C.
It can be understood that, an alternating current signal is transmitted on the alternating current signal line, the potential of the alternating current signal is constantly changed, so that there always exist some time periods between the alternating current signal and the level signal, and in this time period, the potential difference between the alternating current signal line and the level signal line is large, and by electrically connecting the alternating current signal line and the level signal line with different pad structure groups 20, the spatial distance between the pad structure 201 for transmitting the alternating current signal and the pad structure 201 for transmitting the level signal can be increased, and the risk of water-oxygen corrosion of the two in a high-temperature and high-humidity environment is reduced.
Optionally, the display panel further includes a plurality of data signal lines, and the number difference of the data signal lines electrically connected to each pad structure group 20 is within a preset difference.
Specifically, the data signal lines may be relatively uniformly divided into a plurality of data signal line groups, and the number of the data signal line groups corresponds to the pad structure groups 20 one by one, so that all the data signal lines may be dispersedly connected to the pad structures 201 of each pad structure group 20. It should be noted that the specific value of the preset difference can be set by a person skilled in the art according to practical situations, and is not limited herein.
Illustratively, the display panel includes a first DATA signal line for transmitting DATA1, a second DATA signal line for transmitting DATA2, a third DATA signal line for transmitting DATA3, a fourth DATA signal line for transmitting DATA4, a fifth DATA signal line for transmitting DATA5, and a sixth DATA signal line for transmitting DATA 6. The third data signal line and the fourth data signal line are connected to the pad structure 201A in the pad structure group 20A; the second data signal line and the fifth data signal line are connected to the pad structure 201B in the pad structure group 20B; the first data signal line and the sixth data signal line are connected to the pad structure 201C in the pad structure group 20C.
It can be understood that, the higher the resolution of the display panel, the greater the number of the display area AA sub-pixels, and accordingly, the more the data signal lines for providing the data voltage signals to the sub-pixels, the more the data signal lines are connected to the pad structures 201 of the pad structure groups 20, compared with the case where the data signal lines are respectively connected to the pad structures 201 in the same pad structure group 20, the more the data signal lines are connected to the pad structures 201 of the pad structure groups 20 in a distributed manner, which is beneficial to reducing the width of the bonding area BA in the horizontal direction.
Optionally, at least two pad structures 201 exist, the two pad structures 201 belong to the same pad structure group 20 and are respectively connected to signal lines with different potentials, and at least one idle pad structure is arranged between the two pad structures 201.
Illustratively, with continued reference to fig. 25, one idle pad structure is spaced between the pad structure 201 for transmitting the Verf signal and the pad structure 201 for transmitting the DATA3 signal, and one idle pad structure is spaced between the pad structure 201 for transmitting the PVEE signal and the pad structure 201 for transmitting the DATA4 signal.
It can be understood that, when there are more idle pad structures in the bonding area BA pad structures 201, the idle pad structures are separated by two pad structures 201 transmitting different potentials, so that the spatial distance between the two pad structures 201 can be increased, and the risk of corrosion of the pad structures 201 by water and oxygen is reduced.
Based on the same inventive concept, the embodiment of the invention also provides a flexible circuit board. Fig. 26 is a schematic structural diagram of a flexible printed circuit according to an embodiment of the present invention. Fig. 27 is a front view of the flexible wiring board shown in fig. 26. Referring to fig. 26 and 27, the flexible wiring board includes a circuit setting area XA and a bonding area BA, and further includes: the second substrate base plate 60 is provided with a plurality of golden finger structure groups 70 positioned on one side of the second substrate base plate 60, the plurality of golden finger structure groups 70 comprise a first golden finger structure group 71 and a second golden finger structure group 72 which are adjacent, and the first golden finger structure group 71 is positioned on one side of the second golden finger structure group 72 far away from the second substrate base plate 60; the second insulating layer 80, the second insulating layer 80 is located between the first gold finger structure group 71 and the second gold finger structure group 72, the first gold finger structure group 71 includes a plurality of first gold finger structures 711, the second gold finger structure group 72 includes a plurality of second gold finger structures 721, and the first gold finger structures 711 and the second gold finger structures 721 are located in the bonding area BA, respectively.
Specifically, fig. 26 and 27 only illustrate that the binding area BA is provided with two gold finger structure groups 70, but the embodiment of the present invention is not limited thereto, and a person skilled in the art may set the number of gold finger structure groups 70 according to actual situations. It should be noted that the first gold finger structure group 71 and the second gold finger structure group 72 are not specifically defined as two gold finger structure groups 70 of the plurality of gold finger structure groups 70, and any two gold finger structure groups 70 of the plurality of gold finger structure groups 70 can be defined as the first gold finger structure group 71 and the second gold finger structure group 72 according to the positional relationship between the two gold finger structure groups 70 and the second substrate 20. Exemplarily, fig. 28 is a schematic structural diagram of another flexible printed circuit provided in an embodiment of the present invention. Fig. 29 is a front view of the flexible wiring board shown in fig. 28. Referring to fig. 28 and 29, the bonding area BA is provided with three gold finger structure groups 70, and each gold finger structure group 70 includes a plurality of gold finger structures 701 therein. The three gold finger structure groups 70 are a gold finger structure group 70A, a gold finger structure group 70B, and a gold finger structure group 70C, respectively, wherein the gold finger structure group 70A includes a gold finger structure 701A, the gold finger structure group 70B includes a gold finger structure 701B, the gold finger structure group 70C includes a gold finger structure 701C, a second insulating layer 80A is provided between the gold finger structure group 70A and the gold finger structure group 70B, and a second insulating layer 80B is provided between the gold finger structure group 70B and the gold finger structure group 70C. For the gold finger structure group 70A and the gold finger structure group 70B, the gold finger structure group 70A is a first gold finger structure group 71, and the gold finger structure group 70B is a second gold finger structure group 72. For the gold finger structure group 70B and the gold finger structure group 70C, the gold finger structure group 70B is a first gold finger structure group 71, and the gold finger structure group 70C is a second gold finger structure group 72. For the gold finger structure group 70A and the gold finger structure group 70C, the gold finger structure group 70A is a first gold finger structure group 71, and the gold finger structure group 70C is a second gold finger structure group 72.
Optionally, the first gold finger structures 711 and the second gold finger structures 721 are respectively arranged along the first direction Y and the second direction X; the end of the first gold finger structure 711 away from the circuit layout area XA is a first end of the first gold finger structure, and the end of the second gold finger structure 721 away from the circuit layout area XA is a first end of the second gold finger structure.
Optionally, in the first direction Y, the first end of the first gold finger structure is located between the first end of the second gold finger structure and the circuit arrangement area XA. Optionally, in the first direction Y, the first end of the first gold finger structure and the first end of the second gold finger structure are flush. Optionally, in the first direction Y, the first end of the second gold finger structure is located between the first end of the first gold finger structure and the circuit arrangement area XA. It can be understood that, when the first end of the first gold finger structure is located between the first end of the second gold finger structure and the circuit arrangement area XA, the portion of the second gold finger structure 721 for binding is not surrounded by the second insulating layer 80, which is convenient for each subsequent gold finger structure group 70 to bind with the pad structure group on the display panel, and is beneficial to reducing the binding difficulty. When the first end of the first golden finger structure and the first end of the second golden finger structure are level, the length of the binding area BA along the first direction Y is favorably reduced, and then the narrow frame is realized.
Optionally, the first gold finger structure 711 and the second gold finger structure 721 do not overlap in a direction perpendicular to the plane of the second substrate base plate 60.
Optionally, one end of the second gold finger structure 721 close to the circuit arrangement area XA is a second end of the second gold finger structure; in the first direction Y, the first end of the first gold finger structure is located between the circuit arrangement area XA and the second end of the second gold finger structure.
Optionally, the second gold finger structure 721 may be partially covered by the second insulating layer 80, or may be entirely exposed outside the second insulating layer 80, which is not limited herein. Preferably, the second gold finger structure 721 is entirely exposed outside the second insulating layer 80, so that the area of the second gold finger structure 721 is the binding area thereof, which is beneficial to improving the binding performance of the second gold finger structure 721.
Optionally, at least a partial number of the second gold finger structures 721 exist between two adjacent first gold finger structures 711 in a direction perpendicular to the plane of the second substrate base 60.
Optionally, the first gold finger structure 711 and the second gold finger structure 721 are overlapped with each other in a direction perpendicular to the plane of the second substrate base 60.
Optionally, one end of the second gold finger structure 721 close to the circuit arrangement area XA is a second end of the second gold finger structure; in the first direction Y, the second end of the second gold finger structure is located between the first end of the first gold finger structure and the circuit arrangement area XA.
Optionally, the first gold finger structure 711 and the second gold finger structure 721 are disposed correspondingly, and the first gold finger structure 711 and the second gold finger structure 721 corresponding thereto are arranged along the first direction Y. The meaning of the first and second gold finger structures 711 and 721 "arranged along the first direction Y" is the same as that of the first and second pad structures "arranged along the first direction Y", and is not described herein again.
Optionally, the first gold finger structures 711 and the second gold finger structures 721 are arranged in a staggered manner in the second direction X. The first gold finger structure 711 and the second gold finger structure 721 are arranged in a "staggered manner" and have the same meaning as the first pad structure and the second pad structure, and are not described herein again.
Optionally, the exposed area of the first gold finger structure 711 is the same as the exposed area of the second gold finger structure 721.
Optionally, the width of the exposed region of the first gold finger structure 711 along the second direction X is the same as the width of the exposed region of the first gold finger structure 711 along the second direction X.
Optionally, at least one second gold finger structure 721 and the nearest first gold finger structure 711 are present, and are respectively connected to signal lines with different potentials.
Based on the above inventive concept, the embodiment of the invention also provides a display device. The display device comprises the display panel and the flexible circuit board; the first substrate base plate and the second substrate base plate are arranged oppositely, and the pad structure group in the display panel and the golden finger structure group 70 in the flexible circuit board are arranged in a binding mode. Therefore, the display device has the advantages of the display panel provided by the embodiment of the invention, and the same points can be understood by referring to the above description, which is not repeated herein.
For example, fig. 30 is a schematic structural diagram of a display device according to an embodiment of the present invention. As shown in fig. 30, the display device provided in the embodiment of the present invention includes the display panel provided in the embodiment of the present invention and a flexible wiring board. The pad structure group in the display panel and the gold finger structure group 70 in the flexible printed circuit board are correspondingly arranged, wherein the pad structure group with the farther distance from the first substrate 10 is bound to the gold finger structure group 70 with the closer distance from the second substrate 60, for example, the first pad structure 211 and the second gold finger structure 721 shown in fig. 30 are bound, and the second pad structure 221 and the first gold finger structure 711 are bound. The display device can be exemplified by any electronic equipment with a display function, such as a touch display screen, a mobile phone, a tablet computer, a notebook computer or a television.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (18)
1. A display panel comprising a display area and a non-display area, the non-display area comprising a binding area, the display panel further comprising:
the first substrate base plate is provided with a plurality of pad structure groups positioned on one side of the first substrate base plate, the plurality of pad structure groups comprise a first pad structure group and a second pad structure group which are adjacent, and the first pad structure group is positioned on one side, far away from the first substrate base plate, of the second pad structure group;
the first insulating layer is located between the first pad structure group and the second pad structure group, the first pad structure group comprises a plurality of first pad structures, the second pad structure group comprises a plurality of second pad structures, and the first pad structures and the second pad structures are respectively located in the binding area.
2. The display panel according to claim 1,
the first pad structures and the second pad structures extend along a first direction and are arranged along a second direction respectively;
the end of the first bonding pad structure, which is far away from the display area, is a first end of the first bonding pad structure, and the end of the second bonding pad structure, which is far away from the display area, is a first end of the second bonding pad structure; in the first direction, the first pad structure first end is located between the second pad structure first end and the display area.
3. The display panel according to claim 2,
in the direction perpendicular to the plane of the first substrate base plate, the first pad structure and the second pad structure are not overlapped.
4. The display panel according to claim 3,
one end of the second bonding pad structure close to the display area is a second end of the second bonding pad structure; in the first direction, the first pad structure first end is located between the display area and the second pad structure second end.
5. The display panel according to claim 3,
in the direction perpendicular to the plane of the first substrate base plate, at least a partial number of the second bonding pad structures are positioned between two adjacent first bonding pad structures.
6. The display panel according to claim 2,
in a direction perpendicular to the plane of the first substrate base plate, the first pad structure and the second pad structure are overlapped with each other.
7. The display panel according to claim 6,
one end of the second bonding pad structure close to the display area is a second end of the second bonding pad structure; in the first direction, the second pad structure second end is located between the first pad structure first end and the display area.
8. The display panel according to claim 2,
the first pad structure and the second pad structure are arranged correspondingly, and the first pad structure and the second pad structure corresponding to the first pad structure are arranged along the first direction.
9. The display panel according to claim 2,
the first pad structure and the second pad structure are arranged in a staggered mode in the second direction.
10. The display panel according to claim 2,
the exposed area of the first pad structure is the same as the exposed area of the second pad structure.
11. The display panel according to claim 10,
the width of the exposed region of the first pad structure along the second direction is the same as the width of the exposed region of the first pad structure along the second direction.
12. The display panel according to claim 1, wherein the display panel further comprises a plurality of array metal layers, and the adjacent array metal layers are insulated by using an insulating layer; the first pad structure group and one of the multiple array metal layers are arranged on the same layer, and/or the second pad structure group and one of the multiple array metal layers are arranged on the same layer.
13. The display panel according to claim 1, wherein there is at least one of the second pad structures and one of the first pad structures nearest thereto, to which signal lines having different potentials are connected, respectively.
14. The display panel according to claim 1,
the display panel further includes a plurality of level signal lines including a first power supply signal line, a second power supply signal line, a first level signal line, and a second level signal line;
the voltage transmitted on the first power supply signal line is greater than the voltage transmitted on the second power supply signal line; the first power signal line and the second power signal line are electrically connected to different ones of the pad structure groups;
the voltage transmitted on the first level signal line is greater than the voltage transmitted on the second level signal line; the first level signal line and the second level signal line are electrically connected to different ones of the pad structure groups.
15. The display panel according to claim 1,
the display panel further includes a plurality of level signal lines including a first power supply signal line, a second power supply signal line, a first level signal line, and a second level signal line;
the display panel also comprises a plurality of alternating current signal lines, wherein the alternating current signal lines comprise scanning signal lines, clock signal lines and starting signal lines;
the alternating current signal line and the level signal line are electrically connected with different pad structure groups.
16. The display panel according to claim 1,
the display panel further comprises a plurality of data signal lines, and the number difference of the data signal lines electrically connected with the pad structure groups is within a preset difference value.
17. The utility model provides a flexible line way board, flexible line way board includes the binding region, its characterized in that still includes:
the second substrate base plate is positioned on a plurality of golden finger structure groups on one side of the second substrate base plate, the plurality of golden finger structure groups comprise a first golden finger structure group and a second golden finger structure group which are adjacent, and the first golden finger structure group is positioned on one side, far away from the second substrate base plate, of the second golden finger structure group;
the second insulating layer, the second insulating layer is located first golden finger structure group with between the second golden finger structure group, first golden finger structure group includes a plurality of first golden finger structures, second golden finger structure group includes a plurality of second golden finger structures, first golden finger structure with second golden finger structure is located respectively bind the district.
18. A display device comprising the display panel according to any one of claims 1 to 16 and the flexible wiring board according to claim 17;
the first substrate base plate and the second substrate base plate are arranged oppositely, and the pad structure group in the display panel and the golden finger structure group in the flexible circuit board are arranged in a binding mode.
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| CN113473696A (en) * | 2021-06-30 | 2021-10-01 | 昆山工研院新型平板显示技术中心有限公司 | Display module and display device |
| CN113675221A (en) * | 2021-08-18 | 2021-11-19 | 惠科股份有限公司 | Display panel driving device, driving circuit and display device |
| CN113838378A (en) * | 2021-09-15 | 2021-12-24 | 昆山国显光电有限公司 | Display module and display device |
| CN114863819A (en) * | 2022-05-16 | 2022-08-05 | 广州华星光电半导体显示技术有限公司 | Display panel and display device |
| CN114863819B (en) * | 2022-05-16 | 2024-04-05 | 广州华星光电半导体显示技术有限公司 | Display panel and display device |
| CN115035797A (en) * | 2022-06-21 | 2022-09-09 | 合肥维信诺科技有限公司 | Display module and display device |
| CN115035797B (en) * | 2022-06-21 | 2024-05-28 | 合肥维信诺科技有限公司 | Display module and display device |
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|---|---|
| CN112669707B (en) | 2023-05-12 |
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