CN112662319A - Sealant with good wettability for electronic equipment and preparation method thereof - Google Patents
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- CN112662319A CN112662319A CN202011534815.XA CN202011534815A CN112662319A CN 112662319 A CN112662319 A CN 112662319A CN 202011534815 A CN202011534815 A CN 202011534815A CN 112662319 A CN112662319 A CN 112662319A
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Abstract
The invention belongs to the technical field of sealants, and particularly relates to a sealant with good wettability for electronic equipment and a preparation method thereof. A sealant with good wettability for electronic equipment is prepared from the following raw materials in parts by weight: 80-120 parts of high polymer resin, 1-10 parts of filler and 1-10 parts of auxiliary agent. The sealant with good wettability for the electronic equipment, which is prepared by the invention, has good wettability and can show more excellent sealing performance on the electronic equipment; the sealant with good wettability for electronic equipment prepared by the invention effectively controls the system viscosity in the synthesis process, and avoids the problem of difficult coating due to excessive viscosity.
Description
Technical Field
The invention belongs to the technical field of sealants, and particularly relates to a sealant with good wettability for electronic equipment and a preparation method thereof.
Background
In the world, the times call for environment-friendly life to pursue environment protection, so that the environment protection is an important sign of social development progress and is an important condition for human survival. With the progress of society and the rapid development of electronic products, researchers are also dedicated to producing electronic product adhesives with environment-friendly raw materials and excellent performance.
Due to the particularity of electronic products and electronic equipment, the required performance of the sealant for the products is further improved. In particular, waterproof and insulating properties of such sealants are required. With the further expansion of the application of the sealant in the field of electronic devices, for example, the use of special parts such as earphones, USB data line interfaces, circuit boards of precise electronic instruments and the like of mobile phones, the wettability of the sealant needs to be further improved. Therefore, the production of a sealant with good wetting property becomes an important research in the current electronic industry.
Chinese patent CN102516928B discloses a silicone sealant for electronic products and a preparation and use method thereof, and the disclosed patent emphasizes how to improve the heat-conducting property of the sealant for electronic products and does not propose how to improve the wettability of the sealant. Therefore, the applicant has made a great deal of creative research and attempts to develop a sealant with good wettability for electronic equipment.
Disclosure of Invention
In order to solve the technical problems, the first aspect of the invention provides a sealant with good wettability for electronic equipment, which comprises the following raw materials in parts by weight: 80-120 parts of high polymer resin, 1-10 parts of filler and 1-10 parts of auxiliary agent.
In a preferred embodiment, the polymer resin is at least one selected from the group consisting of silicone resin, polyurethane resin, and acrylic resin.
As a preferable technical scheme, the polysiloxane resin is selected from at least one of phenyl trimethicone, poly (dimethyl-methylphenyl) siloxane, hydroxyl-terminated polydimethylsiloxane and amino-terminated polydimethylsiloxane.
As a preferable technical scheme, the viscosity of the hydroxyl-terminated polydimethylsiloxane at 25 ℃ is 10000-80000 cs.
As a preferred technical scheme, the filler is selected from at least one of fumed silica, bentonite, nano barium sulfate and mica powder.
As a preferable technical scheme, the particle size of the fumed silica is 15-30 nm.
As a preferable technical scheme, the weight ratio of the fumed silica to the mica powder is 1: 0.5 to 0.8.
As a preferable technical scheme, the auxiliary agent is at least one selected from silane coupling agent, cross-linking agent, catalyst and defoaming agent.
As a preferable technical scheme, the preparation raw material also comprises at least one of an acrylate compound, an epoxy compound and a hydroxyl compound.
The second aspect of the invention provides a preparation method of a sealant with good wettability for electronic equipment, which comprises the following steps:
and adding the high molecular resin, the filler, the auxiliary agent and the acrylate compound into a stirrer, mixing and stirring at the stirring speed of 600-1500 rpm for 30-90 min to obtain the acrylic resin.
Has the advantages that: the sealant with good wettability for the electronic equipment provided by the invention has the following advantages:
1. the sealant with good wettability for the electronic equipment, which is prepared by the invention, has good wettability and can show more excellent sealing performance on the electronic equipment;
2. the electronic equipment prepared by the invention improves the tensile property of the material by using the sealant with good wettability, and shows more excellent sealing effect in sealing the electronic equipment;
3. the sealant with good wettability for electronic equipment prepared by the invention effectively controls the system viscosity in the synthesis process, and avoids the problem of difficult coating due to excessive viscosity.
Detailed Description
The invention will be further understood by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. To the extent that a definition of a particular term disclosed in the prior art is inconsistent with any definitions provided herein, the definition of the term provided herein controls.
As used herein, a feature that does not define a singular or plural form is also intended to include a plural form of the feature unless the context clearly indicates otherwise. It will be further understood that the term "prepared from …," as used herein, is synonymous with "comprising," including, "comprising," "having," "including," and/or "containing," when used in this specification means that the recited composition, step, method, article, or device is present, but does not preclude the presence or addition of one or more other compositions, steps, methods, articles, or devices. Furthermore, the use of "preferred," "preferably," "more preferred," etc., when describing embodiments of the present application, is meant to refer to embodiments of the invention that may provide certain benefits, under certain circumstances. However, other embodiments may be preferred, under the same or other circumstances. In addition, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
In order to solve the technical problems, the first aspect of the invention provides a sealant with good wettability for electronic equipment, which comprises the following preparation raw materials in parts by weight: 80-120 parts of high polymer resin, 1-10 parts of filler and 1-10 parts of auxiliary agent.
In some preferred embodiments, the polymer resin is at least one selected from the group consisting of silicone resin, polyurethane resin, and acrylic resin.
In some preferred embodiments, the polymeric resin is selected from silicone resins.
In some preferred embodiments, the silicone resin is selected from at least one of phenyl trimethicone, poly (dimethyl-methylphenyl) siloxane, hydroxyl terminated polydimethylsiloxane, and amino terminated polydimethylsiloxane.
Preferably, the polysiloxane resin is selected from hydroxyl-terminated polydimethylsiloxanes.
In some preferred embodiments, the hydroxyl-terminated polydimethylsiloxane has a viscosity of 10000 to 80000cs at 25 ℃.
Hydroxyl terminated polydimethylsiloxanes, available from Rahel environmental protection technology, Inc. of Wuxi.
In some preferred embodiments, the filler is selected from at least one of fumed silica, bentonite, nano barium sulfate and mica powder.
In some preferred embodiments, the fumed silica has a particle size of 15-30 nm.
Fumed silica, available from Jiu Peng, Zhejiang, New materials Co.
In some preferred embodiments, the weight ratio of fumed silica to mica powder is 1: 0.5 to 0.8.
In some preferred embodiments, the auxiliary agent is selected from at least one of a silane coupling agent, a crosslinking agent, a catalyst, and an antifoaming agent.
In some preferred embodiments, the adjuvant is selected from the group consisting of silane coupling agents and crosslinking agents.
In some preferred embodiments, the silane coupling agent is selected from the group consisting of 3-glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane.
In some preferred embodiments, the weight ratio of the 3-glycidoxypropyltrimethoxysilane to the gamma-methacryloxypropyltrimethoxysilane is 0.1 to 0.7: 1.
in some preferred embodiments, the crosslinking agent is benzoyl peroxide.
In some preferred embodiments, the preparation raw material further comprises at least one of an acrylate compound, an epoxy compound, and a hydroxyl compound.
Preferably, the preparation raw material also comprises an acrylate compound.
In some preferred embodiments, the acrylate compound is selected from methyl methacrylate.
In the application, through the mixed reaction between the hydroxyl-terminated polydimethylsiloxane, the methyl methacrylate, the fumed silica, the mica powder, the 3-glycidoxypropyltrimethoxysilane and the gamma-methacryloxypropyltrimethoxysilane, the intermolecular formation of a cross-linked structure can be promoted by the initiation of the benzoyl peroxide, and the fumed silica and the mica powder in the system are doped in a specific proportion, so that the siloxane can be inserted between the sheet structures of the mica powder, the tensile property of the sealant is improved, and meanwhile, the sealant prepared by the method has better wettability and better sealing property when being used in electronic equipment. In addition, the applicant unexpectedly finds that the white carbon black, the 3-glycidyl ether oxypropyl trimethoxy silane and the gamma-methacryloxypropyl trimethoxy silane with the particle size of 15-30nm are selected, so that the compatibility of the whole system is improved, the surface tension of the prepared sealant can be further reduced, and the wettability of the sealant is further improved.
The second aspect of the invention provides a preparation method of a sealant with good wettability for electronic equipment, which comprises the following steps:
and adding the high molecular resin, the filler, the auxiliary agent and the acrylate compound into a stirrer, mixing and stirring at the stirring speed of 600-1500 rpm for 30-90 min to obtain the acrylic resin.
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
Example 1
A sealant with good wettability for electronic equipment is prepared from the following raw materials in parts by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 8 parts of filler, 3.5 parts of assistant and 3 parts of methyl methacrylate.
Hydroxyl terminated polydimethylsiloxane, with a 25 ℃ viscosity of 30000cs, was purchased from Richel environmental protection technologies, Inc., tin-free.
The filler is fumed silica and mica powder; the weight ratio of the fumed silica to the mica powder is 1: 0.6.
fumed silica with particle size of 15-30nm, and is available from Jiupeng New materials Co., Ltd in Zhejiang province; mica powder, purchased from baofeng mica processing ltd, lingshou county.
The assistant is 3 parts of silane coupling agent and 0.5 part of benzoyl peroxide.
The silane coupling agent is 3-glycidyl ether oxypropyl trimethoxysilane or gamma-methacryloxypropyl trimethoxysilane, and the weight ratio is 0.5: 1.
a preparation method of a sealant with good wettability for electronic equipment comprises the following steps:
adding the polymer resin, the filler, the auxiliary agent and the methyl methacrylate into a stirrer, mixing and stirring at the stirring speed of 1200rpm for 45min to obtain the high-molecular-weight polyurethane.
Example 2
A sealant with good wettability for electronic equipment is prepared from the following raw materials in parts by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 6 parts of filler, 3.5 parts of assistant and 3 parts of methyl methacrylate.
The specific embodiment is the same as example 1, but different from example 1 in that fumed silica is 3 parts.
A method for preparing a sealant having good wettability for electronic devices, according to example 1.
Example 3
A sealant with good wettability for electronic equipment is prepared from the following raw materials in parts by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 12 parts of filler, 3.5 parts of assistant and 3 parts of methyl methacrylate.
The specific embodiment is the same as example 1, but is different from example 1 in that 9 parts of fumed silica is used.
A method for preparing a sealant having good wettability for electronic devices, according to example 1.
Example 4
A sealant with good wettability for electronic equipment is prepared from the following raw materials in parts by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 8 parts of filler, 3.5 parts of assistant and 3 parts of methyl methacrylate.
The specific embodiment is the same as example 1, but is different from example 1 in that mica powder is not contained in the filler.
A method for preparing a sealant having good wettability for electronic devices, according to example 1.
Example 5
A sealant with good wettability for electronic equipment is prepared from the following raw materials in parts by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 8 parts of filler, 3.5 parts of assistant and 3 parts of methyl methacrylate.
The specific embodiment is the same as example 1, but different from example 1 in that the silane coupling agent is gamma-methacryloxypropyltrimethoxysilane.
A method for preparing a sealant having good wettability for electronic devices, according to example 1.
Example 6
A sealant with good wettability for electronic equipment is prepared from the following raw materials in parts by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 8 parts of filler, 3.5 parts of assistant and 3 parts of methyl methacrylate.
The specific implementation mode is the same as that of the embodiment 1, and the difference from the embodiment 1 is that the silane coupling agent is 3-glycidoxypropyltrimethoxysilane or gamma-methacryloxypropyltrimethoxysilane, and the weight ratio is 1: 1.
a method for preparing a sealant having good wettability for electronic devices, according to example 1.
Example 7
A sealant with good wettability for electronic equipment is prepared from the following raw materials in parts by weight: 100 parts of hydroxyl-terminated polydimethylsiloxane, 8 parts of filler, 3.5 parts of assistant and 3 parts of methyl methacrylate.
The specific implementation mode is the same as that of the embodiment 1, and the difference from the embodiment 1 is that the silane coupling agent is 3-glycidoxypropyltrimethoxysilane or gamma-methacryloxypropyltrimethoxysilane, and the weight ratio is 1: 0.5.
a method for preparing a sealant having good wettability for electronic devices, according to example 1.
Example 8
The specific implementation mode of the sealant with good wettability for the electronic equipment is the same as that in example 1, and the sealant is different from the embodiment 1 in that the particle size of fumed silica is 7-40 nm, and is purchased from Weifang Sanjia chemical industry Co., Ltd.
Testing the performance;
1. and (3) testing the wetting property: the sealants prepared in examples 1 to 8 were used for wettability tests, and the test method was to drop the sealant (1g) prepared in this application on glass cleaned with alkali, and after 10 minutes, the diameter of the drop peeled off with inorganic alkali was measured, and it was specified that the wetting property was excellent with the drop diameter > 1 mm; droplet diameters between 1 and 0.5mm (border values included) are good; the drop diameters < 0.5mm are the difference and the test results are tabulated below.
2. And (3) testing tensile property: the sealants prepared in examples 1 to 8 were used for tensile property tests, the test methods were referred to GB/T528-.
Finally, it should be understood that the above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any modification, equivalent replacement, or improvement made within the protection principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The sealant with good wettability for the electronic equipment is characterized by comprising the following preparation raw materials in parts by weight: 80-120 parts of high polymer resin, 1-10 parts of filler and 1-10 parts of auxiliary agent.
2. The sealant with good wettability for electronic devices according to claim 1, wherein said polymeric resin is at least one selected from the group consisting of silicone resin, polyurethane resin, and acrylic resin.
3. The sealant with good wettability for electronic devices according to claim 2, wherein said silicone resin is at least one selected from the group consisting of phenyl trimethicone, poly (dimethyl-methylphenyl) siloxane, hydroxyl-terminated polydimethylsiloxane, and amino-terminated polydimethylsiloxane.
4. The sealant with good wettability for electronic equipment according to claim 3, wherein the hydroxyl-terminated polydimethylsiloxane has a viscosity of 10000 to 80000cs at 25 ℃.
5. The sealant with good wettability for electronic equipment according to claim 1, wherein the filler is at least one selected from fumed silica, bentonite, nano barium sulfate and mica powder.
6. The sealant with good wettability for electronic equipment according to claim 5, wherein the fumed silica has a particle size of 15-30 nm.
7. The sealant with good wettability for electronic equipment according to claim 5, wherein the weight ratio of fumed silica to mica powder is 1: 0.5 to 0.8.
8. The sealant with good wettability for electronic devices according to claim 1, wherein the auxiliary agent is at least one selected from a silane coupling agent, a crosslinking agent, a catalyst, and an antifoaming agent.
9. The sealant with good wettability for electronic devices according to claim 1, wherein the raw material for preparation further comprises at least one of an acrylate compound, an epoxy compound, and a hydroxyl compound.
10. The preparation method of the sealant with good wettability for the electronic equipment according to claim 9, comprising the following steps:
and adding the high molecular resin, the filler, the auxiliary agent and the acrylate compound into a stirrer, mixing and stirring at the stirring speed of 600-1500 rpm for 30-90 min to obtain the acrylic resin.
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