CN112657871A - Wafer sorting equipment and wafer sorting method - Google Patents
Wafer sorting equipment and wafer sorting method Download PDFInfo
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- CN112657871A CN112657871A CN202011559683.6A CN202011559683A CN112657871A CN 112657871 A CN112657871 A CN 112657871A CN 202011559683 A CN202011559683 A CN 202011559683A CN 112657871 A CN112657871 A CN 112657871A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000009826 distribution Methods 0.000 claims abstract description 28
- 238000007664 blowing Methods 0.000 claims abstract description 20
- 238000001914 filtration Methods 0.000 claims abstract description 15
- 238000000926 separation method Methods 0.000 claims abstract description 3
- 230000001105 regulatory effect Effects 0.000 claims description 32
- 230000001276 controlling effect Effects 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 abstract description 9
- 239000012535 impurity Substances 0.000 abstract description 8
- 238000007599 discharging Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 46
- 230000003749 cleanliness Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The present disclosure provides a wafer sorting apparatus and a wafer sorting method, the wafer sorting apparatus including: the separation chamber comprises at least one feeding port and at least two discharging ports; the filtering and blowing unit is arranged at the top of the sorting chamber; the air return channel is arranged at the bottom of the sorting chamber; the mechanical arm is arranged inside the sorting chamber and used for moving the wafer; the air flow adjusting unit is arranged in the sorting chamber and used for adjusting the air flow in the current sorting chamber; the acquisition unit is used for acquiring the current airflow distribution state in the sorting chamber; and the control unit is connected with the acquisition unit and the air flow regulation unit and is used for controlling the working state of the air flow regulation unit according to the current air flow distribution state. The wafer sorting equipment and the wafer sorting method can locally regulate and control the vortex in the sorting chamber, and avoid the problem of particle impurity pollution caused by the change of the turbulence degree.
Description
Technical Field
The invention relates to the field of semiconductor production and manufacturing, in particular to wafer sorting equipment and a wafer sorting method.
Background
With the rapid development of semiconductors, the cleanliness requirement of wafers is higher and higher, and the cleanliness of wafer sorting equipment (Shipping Compiler) is particularly important as sorting equipment before the wafers are shipped. Some wafers that are originally OK (qualified) may be contaminated by the wafer sorting equipment.
In the related art, in order to solve the above problems, a wafer sorting apparatus employs a fixed robot and only moves a robot arm, but when the robot arm frequently moves, a vortex is still generated, and if the vortex is not controlled, the turbulence of a flow field is increased, which further affects smooth discharge of particulate impurities (particles), and finally results in reduction of cleanliness.
Disclosure of Invention
The embodiment of the disclosure provides wafer sorting equipment and a wafer sorting method, which can locally regulate and control vortex in a sorting chamber, control the turbulence degree in a reasonable interval, and avoid the problem of particle impurity pollution caused by the deterioration of the turbulence degree.
The technical scheme provided by the embodiment of the disclosure is as follows:
a wafer sorting apparatus comprising:
a sorting chamber comprising at least one feed port and at least two feed ports;
the filtering and blowing unit is arranged at the top of the sorting chamber and used for supplying air into the sorting chamber from top to bottom;
the air return channel is arranged at the bottom of the sorting chamber;
the mechanical arm is arranged inside the sorting chamber and used for moving the wafer;
the air flow adjusting unit is arranged in the sorting chamber and used for adjusting the air flow in the current sorting chamber;
the acquisition unit is used for acquiring the current airflow distribution state in the sorting chamber;
and the control unit is connected with the acquisition unit and the air flow regulation unit and is used for controlling the working state of the air flow regulation unit according to the current air flow distribution state.
Exemplarily, the wind flow adjusting unit includes:
the flow regulating valve is arranged at the top of the sorting chamber and used for regulating the blowing flow of the filtering blowing unit;
and/or the presence of a gas in the gas,
and the porous plate combined structure is arranged at the bottom of the sorting chamber, is positioned above the air inlet of the return air channel and is used for controlling the air inlet flow entering the return air channel.
Illustratively, the multi-layer orifice plate combined structure comprises a plurality of layers of orifice plates which are stacked together, each layer of orifice plate is provided with a plurality of openings distributed in an array, and the multi-layer orifice plates can be relatively translated in a first direction parallel to the orifice plates so as to change the overlapping area of the multi-layer orifice plates and change the opening ratio of the multi-layer orifice plate combined structure.
For example, the aperture ratio of at least one of the plurality of layers of aperture plates is different from the aperture ratio of another layer of aperture plate.
Exemplarily, the perforated plate integrated configuration still includes the frame, the frame centers on the setting all around of multilayer orifice plate, the relative both sides of each layer of orifice plate with through can be in between the frame the flexible spare that stretches out and draws back in the first direction is connected, the control unit is used for controlling the flexible spare is in the first direction is flexible, in order to adjust the aperture ratio of perforated plate integrated configuration.
Illustratively, the telescoping member comprises a telescoping spring.
For example, the obtaining unit includes a plurality of sensors disposed at the bottom of the sorting chamber, and the sensors are distributed on a moving track of the robot arm and configured to acquire moving speed information of the robot arm, gas pressure information inside the sorting chamber, and position information of the robot arm.
A wafer sorting method for use in the wafer sorting apparatus as described above, the method comprising:
acquiring a current airflow state in the sorting chamber through the acquisition unit;
and controlling the air flow regulating unit according to the current air flow state to regulate the air flow in the current sorting chamber.
Illustratively, applied to the wafer sorting apparatus as described above, the method specifically includes:
acquiring moving speed information of the mechanical arm, gas pressure information inside the sorting chamber and position information of the mechanical arm through a sensor;
the control unit acquires a current airflow distribution state in the sorting chamber according to the moving speed information of the mechanical arm, the gas pressure information in the sorting chamber and the position information of the mechanical arm, wherein the current airflow distribution state comprises the turbulence degree in the current chamber;
and adjusting the opening degree of the flow regulating valve and/or the opening ratio of the porous plate combined structure according to the current gas flow distribution state.
Illustratively, the adjusting the opening degree of the flow regulating valve and/or the opening ratio of the porous plate combined structure according to the current gas flow distribution state specifically includes:
automatically adjusting the opening of a flow regulating valve above the vortex generating position according to the current airflow distribution state, so that the opening of the flow regulating valve is increased to increase the air supply speed; and/or automatically adjusting the opening ratio of the perforated plate combined structure below the vortex generation position according to the current airflow distribution state so as to increase the opening ratio of the perforated plate combined structure;
when the sensor collects that the mechanical arm stops moving, the control unit controls the opening of the flow regulating valve to be an initial opening and/or controls the opening rate of the porous plate combined structure to be an initial opening rate according to the current stop position information of the mechanical arm and the gas pressure information in the separation chamber.
The beneficial effects brought by the embodiment of the disclosure are as follows:
according to the wafer sorting equipment and the wafer sorting method provided by the embodiment of the disclosure, the filtering and blowing unit is arranged at the top of the sorting cavity, the return air channel is arranged at the bottom of the sorting cavity, the acquiring unit for acquiring the current airflow state of the sorting cavity and the air flow adjusting unit for adjusting the air flow in the current sorting cavity are arranged, so that the air flow in the sorting cavity can be adjusted according to the vortex state generated in the current cavity, the vortex in the sorting cavity is locally regulated, the turbulence is controlled in a reasonable interval, and the problem of particle impurity pollution caused by the fact that the turbulence is poor is avoided.
Drawings
Fig. 1 is a top view of a wafer sorting apparatus according to an embodiment of the present disclosure;
fig. 2 shows a side view of a configuration of a wafer sorting apparatus provided in an embodiment of the present disclosure;
FIG. 3 is a schematic diagram illustrating a first layer of perforated plates in a multi-plate assembly of a wafer sorting apparatus according to an embodiment of the disclosure;
FIG. 4 is a schematic diagram illustrating a second layer of perforated plates in a multi-plate assembly for a wafer sorting apparatus according to an embodiment of the disclosure;
FIG. 5 is a schematic structural view of a multi-well plate assembly in a wafer sorting apparatus according to an embodiment of the present disclosure;
FIG. 6 is a schematic view of a multi-well plate assembly in a wafer sorting apparatus according to an embodiment of the present disclosure;
fig. 7 is a schematic structural view illustrating another combination of the multi-plate combination structure in the wafer sorting apparatus according to the embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Before the detailed description of the wafer sorting apparatus and the wafer sorting method according to the embodiments of the present disclosure, the following description of the related art is necessary:
in the related art, the wafer sorting apparatus has a main structure as follows: the sorting equipment comprises a sorting chamber, wherein an Aligner (calibrator) unit is arranged at one end of the sorting chamber, a Load port (feeding port) and an Unload port (discharging port) of a wafer are respectively arranged at the front side and the rear side of the sorting chamber, and a robot and a mechanical arm are arranged in the sorting chamber and used for grabbing and transferring the wafer. The cleanliness levels in the sorting chambers of the whole equipment are the same, the conventional wafer sorting equipment for 12-inch wafers is generally provided with 8-10 Port openings (upper and lower material openings), and the equipment space is large; an EFU unit (filtering and blowing unit) is arranged above the sorting chamber, and airflow is uniformly and stably blown from top to bottom under a static condition.
In the related art, in order to solve the above problems, a wafer sorting apparatus employs a fixed robot and only moves a robot arm, but when the robot arm frequently moves, a vortex is still generated, and if the vortex is not controlled, the turbulence of a flow field is increased, which further affects smooth discharge of particulate impurities (particles), and finally results in reduction of cleanliness.
Therefore, the technical problems to be solved by the current wafer sorting equipment are as follows: in each moving process of the mechanical arm, the wind of the EFU unit is always ensured to blow from top to bottom, and the wind speed is kept stable; and solves the problem of particle impurities (particles) caused by eddy current generated in each moving process of the mechanical arm.
In view of the above problems, the embodiments of the present disclosure provide a wafer sorting apparatus and a wafer sorting method, which can locally regulate and control the eddy current in a sorting chamber, and control the turbulence degree in a reasonable interval in a short time, thereby avoiding the problem of particle impurity pollution caused by the deterioration of the turbulence degree.
As shown in fig. 1 and fig. 2, a wafer sorting apparatus provided by an embodiment of the present disclosure includes a sorting chamber 100, a filtering and blowing unit (EFU) 200, a return air channel 300, a robot arm 400, an air flow adjusting unit, an acquiring unit, and a control unit, where the sorting chamber 100 includes at least one feeding port 110 and at least two discharging ports 120; the filtration blower unit (EFU) 200 is disposed at the top of the sorting chamber 100, and is used for blowing air into the sorting chamber 100 from top to bottom; the return air channel 300 is arranged at the bottom of the sorting chamber 100, and the airflow blown out by the filtering and blowing unit 200 enters the sorting chamber 100 and then enters the return air channel 300; the robot arm 400 is disposed inside the sorting chamber 100, and is configured to grab and move the wafer from the loading port 110 to the unloading port 120; the air flow adjusting unit is arranged in the sorting chamber 100 and is used for adjusting the air flow in the current sorting chamber 100; the acquiring unit is used for acquiring the current airflow distribution state in the sorting chamber 100; the control unit is connected with the acquisition unit and the air flow regulation unit and is used for controlling the working state of the air flow regulation unit according to the current air flow distribution state.
The wafer sorting equipment provided by the embodiment of the disclosure sets the filtering and blowing unit 200 at the top of the sorting chamber 100, sets the return air channel 300 at the bottom, sets the acquiring unit for acquiring the current airflow state of the sorting chamber 100, and sets the airflow adjusting unit for adjusting the airflow in the current sorting chamber 100, so that the airflow in the sorting chamber 100 can be adjusted according to the vortex state generated in the current chamber, the vortex in the sorting chamber 100 can be locally regulated, the turbulence is controlled in a reasonable interval, and the problem of particle impurity pollution caused by the deterioration of the turbulence is avoided.
It should be noted that, in the above-mentioned solution, the isolating door is provided at the loading port 110, and after the wafer is placed in the loading port 110, the isolating door can be opened, and a wafer is removed from the wafer storage box at the loading port 110 by the robot 400 for picking up the wafer and moved to the inside of the sorting chamber 100, and then the isolating door is closed.
In some exemplary embodiments of the present disclosure, as shown in fig. 1 and 2, the wind flow adjusting unit includes:
a flow regulating valve 210 provided at the top of the sorting chamber 100 for regulating the blowing flow rate of the filtering blowing unit 200; and/or a porous plate assembly 500 disposed at the bottom of the sorting chamber 100 and above the air inlet of the return air channel 300 for controlling the flow of the air entering the return air channel 300.
In the above solution, the flow regulating valve 210 is arranged at the top of the sorting chamber 100, and the air blown by the filtering and blowing unit 200 will enter the sorting chamber 100 after passing through the flow regulating valve 210, so that the blowing flow of the filtering and blowing unit 200 can be controlled by the change of the opening degree of the flow regulating valve 210; the porous plate assembly 500 is disposed at the bottom of the sorting chamber 100 and above the air inlet of the return air channel 300, so that the air inlet flow of the air inlet channel can be controlled by changing the opening ratio of the porous plate assembly 500.
For example, after the airflow distribution state of the sorting chamber 100 is obtained, the opening degree of the flow regulating valve 210 above the local vortex flow is controlled to perform automatic adjustment, so that the opening degree of the flow regulating valve 210 is increased to increase the air supply speed, and further increase the dissipation of the vortex flow below the flow regulating valve 210; the aperture opening ratio of the perforated plate composite structure 500 below the position where the vortex is generated can be automatically adjusted according to the current airflow distribution state to increase the aperture opening ratio of the perforated plate composite structure 500, thereby accelerating the dissipation of the vortex above the perforated plate composite structure 500.
In some exemplary embodiments, as shown in fig. 3 to 7, the multi-well plate assembly 500 includes stacked multi-well plates, each of the multi-well plates has a plurality of openings distributed in an array, and the multi-well plates can be relatively translated in a first direction parallel to the multi-well plates to change an overlapping area of the multi-well plates and to change an aperture ratio of the multi-well plate assembly 500.
In the above solution, the multi-layer perforated plate assembly 500 includes a plurality of layers of perforated plates, the plurality of layers of perforated plates are stacked together, and when the plurality of layers of perforated plates are transversely and relatively translated in a first direction parallel to the perforated plates, the overlapping area of the openings of the perforated plates may be changed, so that the aperture ratio of the whole multi-layer perforated plate assembly 500 is changed.
In some exemplary embodiments, at least one of the plurality of layers of orifice plates has an opening ratio different from an opening ratio of another layer of orifice plate. For example, the porous plate combination 500 includes two layers of porous plates, the first layer 510a of the porous plate combination shown in fig. 3 has an aperture ratio of 50%, and the second layer 510b of the porous plate combination shown in fig. 4 has an aperture ratio of 20%; fig. 5 shows an overlapped state of the first-layer perforated plate 510a and the second-layer perforated plate 510b, which may be overlapped to form the perforated plate assembly 500 having an aperture ratio of 30%.
In some exemplary embodiments, as shown in fig. 6 and 7, the multi-perforated plate assembly 500 further includes a frame 520, the frame 520 is disposed around the plurality of layers of perforated plates, opposite sides of each layer of perforated plates are connected to the frame 520 by a telescopic member 530 capable of being extended and retracted in the first direction, and the control unit is configured to control the telescopic member 530 to be extended and retracted in the first direction so as to adjust the aperture ratio of the multi-perforated plate assembly 500.
In the above solution, the telescopic length of the telescopic member 530 may be adjusted to control at least one layer of the perforated plates to move laterally in the first direction, so as to realize the overlapping of the plurality of layers of the perforated plates with different aperture ratios, thereby changing the aperture ratio of the perforated plate combination structure 500. Fig. 6 is a schematic diagram showing a structure of a perforated plate assembly in one state, and fig. 7 is a schematic diagram showing a structure of a perforated plate assembly in another state, in which the aperture ratio of the perforated plate assembly is different.
It is understood that, in practical applications, the relative translation of the multi-layer orifice plate may be achieved in other manners, and is not limited herein.
Further, illustratively, the telescoping member 530 includes a telescoping spring. For example, the extension and retraction lengths of the extension and retraction springs on opposite sides of the orifice plate may be controlled by magnetic attraction to move the orifice plate.
It should be noted that, in practical applications, the specific structure of the telescopic member 530 is not limited to this, and for example, the telescopic member may also be a telescopic rod, such as a pneumatic or hydraulic telescopic rod.
In addition, in some exemplary embodiments of the present disclosure, the acquiring unit includes a plurality of sensors disposed at the bottom of the sorting chamber 100, and the plurality of sensors are distributed on a moving track of the robot 400 and are used for acquiring moving speed information of the robot 400, gas pressure information inside the sorting chamber 100, and position information of the robot 400.
In the above solution, the plurality of sensors 600 are disposed on the moving track of the robot 400, the sensors 600 have a function of recording the moving speed and the moving position of the robot 400, and a function of recording the gas pressure in the analysis chamber, when the robot 400 moves to the position of each sensor 600 according to the set moving speed, the sensors 600 will obtain the gas pressure data of the sorting chamber 100, the moving speed data of the robot 400, the position data of the robot 400, and the like, and feed back the data to the control unit (e.g., a computer), the control unit will fit the turbulence of the corresponding flow field under the group of data, that is, obtain the current gas flow distribution state, and then according to the fitting result of the turbulence, the control unit will automatically adjust the opening of the flow regulating valve 210 above the vortex generating position, so as to increase the opening of the flow regulating valve 210, the air supply speed is increased, and the dissipation of the lower eddy is accelerated; the control unit can also adjust the combination mode of the perforated plate combination structure 500 below the vortex generation position, so that the opening rate is increased, and the dissipation of the vortex above is accelerated; when the robot 400 stops moving, the control unit also restores the opening degree of the gas flow rate adjusting valve 210 to the initial state and simultaneously adjusts the bottom porous plate back to the initial opening rate state according to the stop position of the robot 400 and the current gas pressure in the sorting chamber 100.
The embodiment of the present disclosure further provides a wafer sorting method, which is used for the wafer sorting device provided in the embodiment of the present disclosure, and the method includes:
step S01, acquiring, by the acquiring unit, a current airflow state in the sorting chamber 100;
and step S02, controlling the air flow rate adjusting unit according to the current air flow state, and adjusting the air flow rate in the current sorting chamber 100.
Illustratively, in the method, the step S01 specifically includes:
collecting moving speed information of the robot 400, gas pressure information inside the sorting chamber 100, and position information of the robot 400 through a sensor 600;
the control unit obtains a current airflow distribution state in the sorting chamber 100 according to the moving speed information of the mechanical arm 400, the gas pressure information in the sorting chamber 100 and the position information of the mechanical arm 400, wherein the current airflow distribution state comprises the turbulence degree in the current chamber;
step S02 specifically includes: the opening degree of the flow rate adjustment valve 210 and/or the opening ratio of the porous plate composite structure 500 is adjusted according to the current gas flow distribution state.
Illustratively, step S02 specifically includes:
automatically adjusting the opening of the flow regulating valve 210 above the vortex generating position according to the current airflow distribution state, so that the opening of the flow regulating valve 210 is increased to increase the air supply speed; and/or automatically adjusting the opening ratio of the perforated plate combination structure 500 below the vortex generation position according to the current gas flow distribution state to increase the opening ratio of the perforated plate combination structure 500;
when the sensor 600 collects the information that the robot 400 stops moving, the control unit controls the opening of the flow rate adjusting valve 210 to be an initial opening and/or controls the opening rate of the porous plate combination structure 500 to be an initial opening rate according to the information of the current stop position of the robot 400 and the information of the gas pressure in the sorting chamber 100.
The following points need to be explained: (1) the drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to the common design. (2) For purposes of clarity, the thickness of layers or regions in the figures used to describe embodiments of the present disclosure are exaggerated or reduced, i.e., the figures are not drawn on a true scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present. (3) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.
The above is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and the scope of the present disclosure should be determined by the scope of the claims.
Claims (10)
1. A wafer sorting apparatus, comprising:
a sorting chamber comprising at least one feed port and at least two feed ports;
the filtering and blowing unit is arranged at the top of the sorting chamber and used for supplying air into the sorting chamber from top to bottom;
the air return channel is arranged at the bottom of the sorting chamber;
the mechanical arm is arranged inside the sorting chamber and used for moving the wafer;
the air flow adjusting unit is arranged in the sorting chamber and used for adjusting the air flow in the current sorting chamber;
the acquisition unit is used for acquiring the current airflow distribution state in the sorting chamber;
and the control unit is connected with the acquisition unit and the air flow regulation unit and is used for controlling the working state of the air flow regulation unit according to the current air flow distribution state.
2. The wafer sorting apparatus of claim 1,
the air flow adjusting unit includes:
the flow regulating valve is arranged at the top of the sorting chamber and used for regulating the blowing flow of the filtering blowing unit;
and/or the presence of a gas in the gas,
and the porous plate combined structure is arranged at the bottom of the sorting chamber, is positioned above the air inlet of the return air channel and is used for controlling the air inlet flow entering the return air channel.
3. The wafer sorting apparatus of claim 2,
the perforated plate composite structure comprises a plurality of stacked perforated plates, a plurality of holes are distributed in an array mode on each perforated plate, the perforated plates can translate relatively in the first direction parallel to the perforated plates, the overlapping area of the perforated plates is changed, and the opening rate of the perforated plate composite structure is changed.
4. The wafer sorting apparatus of claim 3,
the opening rate of at least one layer of the multi-layer pore plates is different from that of the other layer of the pore plates.
5. The wafer sorting apparatus of claim 3,
the perforated plate composite structure further comprises a frame, the frame surrounds the periphery of the multiple layers of perforated plates, two opposite sides of each layer of perforated plates are connected with the frame through telescopic pieces capable of stretching in the first direction, and the control unit is used for controlling the telescopic pieces to stretch in the first direction so as to adjust the aperture opening ratio of the perforated plate composite structure.
6. The wafer sorting apparatus of claim 5,
the telescoping member comprises a telescoping spring.
7. The wafer sorting apparatus of claim 2,
the acquisition unit comprises a plurality of sensors arranged at the bottom of the sorting chamber, and the sensors are distributed on a mechanical arm moving track and used for acquiring moving speed information of the mechanical arm, gas pressure information inside the sorting chamber and position information of the mechanical arm.
8. A wafer sorting method for use in the wafer sorting apparatus as recited in any one of claims 1 to 7, the method comprising:
acquiring a current airflow state in the sorting chamber through the acquisition unit;
and controlling the air flow regulating unit according to the current air flow state to regulate the air flow in the current sorting chamber.
9. The wafer sorting method according to claim 8, wherein the air flow rate adjusting unit includes:
the flow regulating valve is arranged at the top of the sorting chamber and used for regulating the blowing flow of the filtering blowing unit; and/or the porous plate combined structure is arranged at the bottom of the sorting chamber, is positioned above the air inlet of the return air channel and is used for controlling the air inlet flow entering the return air channel;
the acquisition unit comprises a plurality of sensors arranged at the bottom of the sorting chamber, and the sensors are distributed on a mechanical arm moving track and used for acquiring moving speed information of the mechanical arm, gas pressure information inside the sorting chamber and position information of the mechanical arm;
the method specifically comprises the following steps:
acquiring moving speed information of the mechanical arm, gas pressure information inside the sorting chamber and position information of the mechanical arm through a sensor;
the control unit acquires a current airflow distribution state in the sorting chamber according to the moving speed information of the mechanical arm, the gas pressure information in the sorting chamber and the position information of the mechanical arm, wherein the current airflow distribution state comprises the turbulence degree in the current chamber;
and adjusting the opening degree of the flow regulating valve and/or the opening ratio of the porous plate combined structure according to the current gas flow distribution state.
10. The wafer sorting method according to claim 9,
the adjusting the opening degree of the flow regulating valve and/or the opening ratio of the porous plate combined structure according to the current gas flow distribution state specifically comprises:
automatically adjusting the opening of a flow regulating valve above the vortex generating position according to the current airflow distribution state, so that the opening of the flow regulating valve is increased to increase the air supply speed; and/or automatically adjusting the opening ratio of the perforated plate combined structure below the vortex generation position according to the current airflow distribution state so as to increase the opening ratio of the perforated plate combined structure;
when the sensor collects that the mechanical arm stops moving, the control unit controls the opening of the flow regulating valve to be an initial opening and/or controls the opening rate of the porous plate combined structure to be an initial opening rate according to the current stop position information of the mechanical arm and the gas pressure information in the separation chamber.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113426714A (en) * | 2021-06-23 | 2021-09-24 | 深圳新益昌科技股份有限公司 | Wafer searching method and device, electronic equipment and computer readable storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113426714A (en) * | 2021-06-23 | 2021-09-24 | 深圳新益昌科技股份有限公司 | Wafer searching method and device, electronic equipment and computer readable storage medium |
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