Disclosure of Invention
In view of the above, it is desirable to provide an earphone.
An earphone comprising a housing and a mouthpiece, the housing comprising:
the support frame is of a hollowed-out structure and internally accommodates part of electronic elements of the earphone; and
and the elastic sleeve wraps the supporting frame, and the hardness of the supporting frame is greater than that of the elastic sleeve.
In one embodiment, the supporting frame is hollowed out at a position where the supporting frame is abutted against the ears, and the thickness of the elastic sleeve at the hollowed-out position of the supporting frame is larger than the thickness of the elastic sleeve at the non-hollowed-out position of the supporting frame.
In one embodiment, the hollowed-out area of the supporting frame at the position where the supporting frame is abutted against the ears is larger than the hollowed-out area of the other positions.
In one embodiment, the elastic sleeve is thickened and raised towards the direction of the supporting frame at the hollowed-out position, and a cavity is formed between the elastic sleeve and the supporting frame.
In one embodiment, a speaker is disposed within the mouthpiece.
An earphone comprising a housing and a mouthpiece, the housing comprising:
the support frame is of a hollowed-out structure and internally accommodates part of electronic elements of the earphone; and
the elastic sleeve wraps the supporting frame, and the thickness of the elastic sleeve at the hollowed-out position is larger than that of the elastic sleeve at the non-hollowed-out position.
In one embodiment, the elastic sleeve is thickened and raised in the direction of the hollow part towards the supporting frame.
In one embodiment, the portion of the support frame abutting against the ear is hollowed out.
In one embodiment, the thickness of the elastic sleeve at the position where the supporting frame is abutted against the ear is larger than the thickness of the elastic sleeve at other positions.
In one embodiment, a speaker is disposed within the mouthpiece.
The beneficial effects are that: the earphone shell in the embodiment of the application is soft and has good elasticity;
when the shell directly abuts against the ears, the abutting parts elastically deform, so that wearing comfort is improved;
the shell of earphone is soft and elasticity is good, soft comfortable feel when getting and putting the earphone, because the shell of earphone is soft and elasticity is good, once the earphone drops, the earphone has good shock attenuation effect, protects the inside component of earphone.
Detailed Description
In order that the application may be understood more fully, the application will be described with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
As shown in fig. 1, fig. 1 is a schematic structural diagram of an earphone in one embodiment, and the earphone shown in fig. 1 is an in-ear earphone, where the earphone includes a housing 100 and an earplug 110, and the earplug 110 is used for being inserted into an ear canal. Fig. 2 is a schematic structural diagram of the earphone shown in fig. 1 when worn in the ear 130, as shown in fig. 2, a portion of the housing 100 is placed in the concha chamber 120 when the earphone is worn, so that the housing 100 will directly collide with the ear 130, for example, the positions A, B and C in fig. 2 are the collision parts of the housing 100 against the ear 130. The shell 100 in the embodiment of the application is soft and has good elasticity, and when the shell 100 directly abuts against the ear 130, the abutting part is elastically deformed, so that the wearing comfort is improved.
In one embodiment, a headset is provided that includes a housing 100 and a mouthpiece coupled to the housing, a speaker 221 may be disposed within the mouthpiece, for example, the housing 100 may be supported within an ear, and the mouthpiece may extend into an ear canal. In some embodiments, the earplug 110 described above may be mounted on a mouthpiece.
The following embodiments will be described by taking an earphone of the external shape shown in fig. 1 as an example, and the earphone in fig. 1 is a full in-ear earphone. It will be appreciated that the headset may also be a semi-in-ear headset, or even a headset. For some earphones in which the shell 100 is not in direct contact with the ears 130, the shell 100 of the earphone in the application is soft and elastic, and the earphone is soft and comfortable to handle when being taken and put, and once the earphone falls down, the earphone has good damping effect and protects elements in the earphone because the shell 100 of the earphone is soft and elastic.
In one embodiment, as shown in fig. 3, fig. 3 is a perspective view of an earphone in one embodiment. The earphone includes a housing 100, the housing 100 including a support frame 200 and an elastic sleeve 210, the support frame 200 being supported as a skeleton, the elastic sleeve 210 wrapping the support frame 200. For example, the supporting frame 200 may be a hollow structure, and the supporting frame 200 accommodates a portion of the electronic components 220 of the earphone. The elastic sleeve 210 wraps the supporting frame 200, and the hardness of the supporting frame 200 is greater than that of the elastic sleeve 210, so that the supporting strength of the supporting frame 210 is higher, the elastic sleeve 210 has good elasticity at the position of the hollow structure, and wearing comfort is improved. Preferably, the portion of the support frame 200 abutting against the ear 130 is hollowed out, so as to improve the elastic deformation capability of the elastic sleeve 210, so that the earphone can be worn for a long time and comfortably. The support frame 200 encloses a receiving cavity for receiving a portion of the electronics 220 of the headset. Wherein the electronic component 220 comprises, for example, a battery of a headset, a circuit board, etc. The electronic component 220 may further include a speaker 221, a portion of the speaker 221 being disposed within the housing cavity, and a portion of the speaker 221 extending out of the housing cavity. Or the speaker 221 may be completely accommodated in the accommodating chamber, in which case the mouthpiece has a channel extending into the accommodating chamber for guiding out the sound emitted from the speaker 221. For example, the thickness of the elastic sleeve 210 at the hollowed-out portion of the support frame 200 is greater than the thickness of the elastic sleeve 210 at the non-hollowed-out portion of the support frame 200, so that the elasticity of the elastic sleeve 210 at the hollowed-out portion of the support frame 200 can be improved, and wearing comfort can be improved.
In one embodiment, the support frame 200 may be made of a rigid plastic, or of a silicone or of a metallic material. Since the support frame 200 plays a supporting role as a skeleton, the support frame 200 needs to have a certain strength, and when the support frame 200 is made of a hard plastic and a metal material, the support frame 200 has a good supporting strength. When the support frame 200 is made of silica gel, the support frame 200 may be appropriately thickened so that the support frame 200 has a good support strength and the support frame 200 itself has a good elasticity. The supporting frame 200 serves as a supporting portion of the entire housing 100 for protecting the electronic components 220 inside the earphone and providing a more stable environment for storing the electronic components 220. The supporting frame 200 is provided with a hollow part 202, and the hollow part 202 is communicated with the inner space and the outer space of the accommodating cavity. That is, the support frame 200 is not a closed structure as a whole, and the hollowed-out portion 202 of the support frame 200 makes the support frame 200 resemble a net-like structure as a whole.
The elastic sleeve 210 is wrapped outside the supporting frame 200 with a similar net structure, and the elastic sleeve 210 can be made of elastic rubber such as silica gel. For example, the elastic sleeve 210 has a solid structure as a whole, that is, the elastic sleeve 210 has no structure similar to the hollowed-out portion 202 on the supporting frame 200, so that the elastic sleeve 210 can well wrap the supporting frame 200 inside, and can prevent water dust and the like from entering the inside of the earphone. The elastic sleeve 210 can be provided with vent holes at proper positions to balance the air pressure inside and outside the earphone so as to ensure the normal sound production of the earphone. In some embodiments, if the earphone is a sleeping earphone, the earphone may not be provided with a vent hole.
Wherein the hardness of the support frame 200 is greater than that of the elastic sleeve 210. The support frame 200 serves as a support for the skeleton. Because the elastic sleeve 210 is of an elastic structure, the elastic sleeve 210 has better elasticity as a whole, and the elastic sleeve 210 corresponds to the hollowed-out part 202 of the supporting frame 200, and is not supported by the supporting frame 200, so that the elastic performance of the part is better, and the earphone shell 100 has better elasticity as a whole and has certain supporting strength. Further, since the elasticity of the earphone housing 100 is better, it is not necessary to further wrap a silicone sleeve outside, so that the earphone structure is compact. As shown in fig. 2, wearing comfort is not degraded due to an increase in the area of the earphone even though the entire earphone is worn in the concha chamber 120.
In one embodiment, as shown in fig. 2, when the headset is worn in the ear 130, the headset housing 100 has portions, such as A, B and C, that can interfere with the ear 130. In designing the earphone, the shape of the ear 130 of a part of the person can be obtained by using research means, and the approximate position of the shell 100 of the earphone against the ear 130 can be determined according to the shape of the ear 130. For example, in fig. 2, three positions A, B and C are determined as the portions where the earphone collides with the ear 130 in design, and in order to make the colliding portions have better elasticity, the corresponding positions in fig. 3, a, B and C are combined with the hollowed-out portion 202 of the support frame 200. Furthermore, after the earphone is worn on the ear 130, the parts A, B and C correspond to the hollowed-out parts 202 of the supporting frame 200, so that the elastic sleeves 210 at the parts A, B and C can be elastically deformed more easily, so that the part of the earphone housing 100 abutting against the ear 130 has better elasticity, and the wearing comfort is improved.
In one embodiment, the thickness of the elastic sleeve 210 corresponding to the hollowed-out portion 202 is greater than the thickness of the elastic sleeve 210 not corresponding to the hollowed-out portion 202. That is, the thickness of the elastic sleeve 210 is not uniform. For example, as shown in fig. 3, the position of the elastic sleeve 210 corresponding to the hollowed-out portion 202 may be the position t1 in fig. 3, and the position of the elastic sleeve 210 not corresponding to the hollowed-out portion 202 may be the position t2 in fig. 3, that is, the thickness of the elastic sleeve 210 at t1 is greater than the thickness of the elastic sleeve 210 at t2, so that the earphone has a better elastic effect at t 1. For example, the thickness of the elastic sleeve 210 of the earphone is greater at the position where the elastic sleeve 210 is abutted against the ear than at the position where the elastic sleeve 210 is not abutted against the ear. In some embodiments, the elastic sleeve 210 is thickened and raised towards the interior of the hollow portion 202, and a cavity is formed between the elastic sleeve 210 and the supporting frame 200, and the cavity forms a buffer layer, so as to improve wearing comfort. Alternatively, the elastic sleeve 210 is thickened and raised toward the direction of the supporting frame 200 at the hollowed-out portion of the supporting frame 200, so that the outer portion of the elastic sleeve 210 presents a smooth and complete appearance. Preferably, the thickness of the elastic sleeve 210 corresponding to the hollowed-out part is 3 mm-5 mm, and the thickness of the elastic sleeve 210 not corresponding to the hollowed-out part 202 is 0.8 mm-1.2 mm.
Preferably, the hollowed-out area of the portion of the supporting frame 200 abutting against the ear 130 is larger than that of other portions, so as to increase the elastic deformation range of the elastic sleeve 210 and improve wearing comfort. In some embodiments, the area of the hollowed-out portion 202 may be designed according to the need, for example, at the positions A, B and C where better elasticity is needed, the area of the hollowed-out portion 202 may be designed to be larger, so that the elastic sleeve 210 can be elastically deformed more easily at the corresponding position of the hollowed-out portion 202, and for the portion of the housing 100 that does not need to collide with the ear 130, the area of the hollowed-out portion 202 may be designed to be smaller, thereby improving the supporting strength of the housing 100 and improving the structural strength of the earphone. That is, the housing 100 has a contact portion for contacting the ear 130, and A, B and C are contact portions for the in-ear earphone shown in fig. 2. The abutting portion corresponds to the hollowed-out portion 202 of the supporting frame 200, that is, the abutting portion is not supported by the skeleton portion of the supporting frame 200. The area of the hollowed-out portion 202 corresponding to the abutting portion is larger than the area of the hollowed-out portion 202 at other positions of the supporting frame 200. As shown in fig. 3, specifically, the area of the hollowed-out portion 202 may be defined in such a manner that, since the hollowed-out portion 202 may have a structure similar to a hole, the hole has an inner diameter, and the largest pore diameter in the hollowed-out portion 202 is defined as a largest hollowed-out length L, for example, if the hollowed-out portion 202 is elliptical, the largest hollowed-out length L is the major axis of the ellipse. As shown in FIG. 3, the maximum hollowed-out length L is schematically shown, and L is 4-6 mm.
In one embodiment, as shown in fig. 3, the housing 100 of the headset includes a first portion 101 and a second portion 102, wherein the first portion 101 and the second portion 102 are disposed opposite, the second portion 102 is on substantially the same side as the earplug 110, the first portion 101 is disposed on an opposite side of the second portion 102, and as shown in fig. 2, the second portion 102 is adjacent to the side of the ear canal when the headset is worn on the ear 130, the first portion 101 is directed outwardly of the ear 130. That is, the first portion 101 can interfere with the ear 130, so that the first portion 101 requires better elasticity for more comfort. Fig. 4 is a schematic structural diagram of a support frame 200 in an embodiment, where the support frame 200 may be in a partially wrapped structure, and where the object to be wrapped is an electronic component 220 of a headset. The support frame 200 is generally located at the first portion 101 of the headset. That is, the accommodating cavity surrounded by the support frame 200 has an opening 201, the opening 201 is located at the second portion 102 side, and the electronic component 220 of the earphone can protrude from the opening 201. The supporting frame 200 is disposed on the first portion 101 of the housing 100, and the second portion 102 of the housing 100 is not provided with a hollow structure, that is, the second portion 102 is a solid structure, and the earphone has a higher structural strength on the side of the solid structure, so as to better protect the electronic components 220 inside, and has a better elasticity on the side of the first portion 101 with the supporting frame 200.
Of course, in some embodiments, the support frame 200 may also be a fully wrapped structure, i.e. the first portion 101 and the second portion 102 of the earphone are both provided with the support frame 200.
In one embodiment, the support frame 200 is disposed on the surface of the elastic sleeve 210, and in particular, as shown in fig. 3, the support frame 200 is disposed on the inner surface of the elastic sleeve 210, that is, the elastic sleeve 210 wraps the support frame 200. As shown in fig. 1, the support frame 200 is not visible on the exterior of the earphone, i.e., the surface of the exterior of the earphone is a smooth and flat elastic sleeve 210. In one embodiment, the support frame 200 may be disposed within an elastic member. For example, the elastic sleeve 210 may include two layers with an interlayer formed therebetween, and the support frame 200 is disposed in the interlayer. For the hollowed-out portion 202 of the support frame 200, two layers of the elastic sleeve 210 can be separated to form an air layer, so that the elasticity of the elastic sleeve 210 is further improved, and the shock absorption effect of the earphone is improved.
In one embodiment, the elastic sleeve 210 is integrally formed with the supporting frame 200, and the elastic sleeve 210 is not detachable from the supporting frame, so that the connection strength between the elastic sleeve 210 and the supporting frame 200 is improved, and the damage of the internal components is prevented. For example, the elastic cover 210 may be integrally formed with the support frame 200 by injection molding.
For another example, the supporting frame 200 and the elastic sleeve 210 may not be fixed, that is, the supporting frame 200 and the elastic sleeve 210 are detachably connected, and the elastic sleeve 210 is wrapped outside the supporting frame 200 by the elastic force of the elastic sleeve 210.
In one embodiment, the headset may also be a wireless headset or a wired headset. The headphones may also be semi-in-ear headphones or even headphones. For the headset, the housing 100 of the headset may have no portion that interferes with the ears 130, and when the headset also adopts the housing 100 in the above embodiment, the housing 100 of the headset is better in softness, better in grip, and has better shock-absorbing and anti-falling performance.
In one embodiment, as shown in fig. 5, a support frame 200 of another structure is provided in fig. 5, and as shown in fig. 3 and 5, a hollowed-out portion 202 is provided on the support frame 200, and the size and shape of the hollowed-out portion 202 are not limited to the structure in the embodiment shown in fig. 3 and 5, and some conventional modifications of the support frame 200 and the hollowed-out portion 202 thereof should also be included in the protection scope of the claims of the present application.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.