CN112652430B - Vacuum insulator with microarray structure on surface and preparation method thereof - Google Patents
Vacuum insulator with microarray structure on surface and preparation method thereof Download PDFInfo
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Abstract
The invention belongs to the technical field of vacuum high-voltage insulation, and relates to a vacuum insulator with a microarray structure on the surface and a preparation method thereof. The surface of the insulator is of an array micro-cavity structure, a vertical thin-wall structure is arranged between adjacent cavities, and the thin wall and the cavities are combined to form a hexagonal honeycomb structure, a square honeycomb structure, a triangular honeycomb structure and a round hole honeycomb structure. Due to the thinner cavity walls, the entire web is occupied for the most part by the cavities. The insulator can be etched by adopting a laser micro-etching method, a cavity structure with a corresponding shape is etched on the surface of the insulator, and a certain thin-wall structure is reserved among the array cavities, so that the insulator with the honeycomb micro-array on the surface is finally obtained. The insulator has 80-100% raised vacuum edge pressure strength and may be used in vacuum high voltage insulating device and other high voltage insulating device.
Description
Technical Field
The invention belongs to the technical field of vacuum high-voltage insulation, and relates to an insulator with high vacuum surface flashover performance and a preparation method thereof.
Background
Vacuum surface flashover is a breakdown discharge phenomenon occurring along the insulator and vacuum interface, and the breakdown voltage is much lower than that of the vacuum and insulator. Due to the phenomenon, when the insulator is applied to a vacuum high-voltage device, discharge breakdown occurs when a lower voltage is applied, so that the voltage failure is caused, and the voltage strength of the whole vacuum insulation system is seriously reduced [1] . Meanwhile, researches show that the along-surface flashover compressive strength of a unit distance is reduced along with the increase of the length of the insulator, which means that the method for improving the compressive strength of the insulator by increasing the length of the insulator is not ideal, and the volume of an insulation system is huge [2] 。
In order to improve the vacuum surface flashover voltage of the insulator, researchers have conducted a great deal of exploration on the generation mechanism of the surface flashover, and it is generally believed that the insulator surface flashover originates from three binding points of a cathode to emit electrons, the electrons stimulate the surface of the insulator to adsorb gas to desorb through the development of secondary electron multiplication, and finally flashover discharge occurs in a gas layer of the surface desorption. According to the flashover development mechanism, the multiplication of secondary electrons on the surface of the insulator is an important process in the flashover development, and researchers provide a large number of surface modification methods for inhibiting the development of the process. Such as surface roughening [3] Surface grooving [4] Surface plasma treatment [5] Surface fluorination [6] And the flashover voltage of the insulator is improved to a certain extent.
The inventors found in the previous studies that the insulator surface micro-groove structure can effectively suppress the secondary electron emission [7] And the flashover voltage of the insulator along the surface is improved. The suppression effect of the microgrooves is influenced by the ratio of the included angle of the microgrooves to the surface area of the insulator occupied by the microgrooves, but is limited by the structural characteristics of the microgrooves, and the two parameters cannot be optimized to the utmost extent, so that the use effect is influenced to a certain extent.
Reference to the literature
[1]Miller H C.Flashover of insulators in vacuum:the last twenty years[J].IEEE Transactions on Dielectrics&Electrical Insulation.2016,22(6):3641-3657.
[2]Shengtao Li,Yongjie Nie and Daomin Min et al.,"Research Progress on Vacuum Surface Flashover of Solid Dielectrics,"Transactions of China Electrotechnical Society 32(8),1-9(2017).
[3]O.Yamamoto,T.Takuma and M.Fukuda et al.,"Improving withstand voltage by roughening the surface of an insulating spacer used in vacuum,"IEEE Transactions on Dielectrics&Electrical Insulation 10(4),550-556(2003).
[4]Libing Cai,Jianguo Wang and Guoxin Cheng et al.,"Simulation of multipactor on the rectangular grooved dielectric surface,"PHYS PLASMAS 22(11),2120(2015).
[5]Tao Shao,Wenjin Yang and Cheng Zhang et al.,"Enhanced surface flashover strength in vacuum of polymethylmethacrylate by surface modification using atmospheric-pressure dielectric barrier discharge,"APPL PHYS LETT 105(7),71607(2014).
[6]E.Kuffel,S.Grzybowski and R.B.Ugarte,"Flashover across polyethylene and tetrafluoroethylene surfaces in vacuum under direct,alternating and surge voltages of various waveshapes,"Journal of Physics D Applied Physics 5(3),575-579(2002).
[7] Liu Wen Yuan, Huo Yangkun, Cochangfeng, Chenchanghua, Cai Libing, Sunjun and Tangjun Pinna, an insulator with a hole microgroove surface texture and a preparation method thereof [ p ] Chinese patent ZL201611237411.8.
Disclosure of Invention
The invention aims to further effectively improve the vacuum surface flashover voltage of the insulator.
In order to achieve the above purpose, the technical scheme provided by the invention is as follows:
the utility model provides a surface has vacuum insulator of microarray structure, includes the insulator body, the insulator body is compact insulating material, its special character lies in: the effective working area of the surface of the insulator body is in a micro-cavity array structure which is tightly arranged, adjacent micro-cavities are separated by thin walls, the caliber of each micro-cavity unit is 100-1000 micrometers, and the ratio of the caliber of each micro-cavity unit to the thickness of each thin wall is not less than 5: 1.
Taking a cylindrical insulator body as an example, the effective working area is a cylindrical surface. Of course, the surface of the insulator body can be designed into the micro-cavity array structure.
The array of the micro-cavity array structure mainly emphasizes the rule of surface morphology, namely a honeycomb-like surface structure is formed; the three-dimensional shapes and sizes of all microcavity units are preferably identical.
Preferably, each thin wall is a vertical thin wall and is perpendicular to the surface of the insulator body.
Preferably, the inner bottom surface of the microcavity unit is in a planar form.
Preferably, the shape of the microcavity unit is regular hexagon, square, regular triangle or circle.
Preferably, the depth of the microcavity unit is 100-1000 μm.
Preferably, the thickness of the thin wall is 5-200 μm, and the ratio of the caliber of the micro-cavity unit to the thickness of the thin wall is 5: 1-10: 1.
Optionally, the vacuum insulator is made of organic glass, cross-linked polystyrene, epoxy resin, nylon, polyimide, ceramic or quartz.
A method for preparing the vacuum insulator with the microarray structure on the surface comprises the following steps:
1) preparing insulators with corresponding sizes in a machining mode according to the geometric structure and the size of the required insulators;
2) according to the shape of the micro cavity to be prepared, etching a corresponding micro cavity array on the surface of the insulator obtained by machining in a laser etching mode, controlling the depth of the micro cavity through the frequency of laser action, and forming a thin wall in an un-etched area between adjacent micro cavities;
3) and cleaning the insulator with the etched surface by using deionized water, and drying to obtain the insulator product with the similar honeycomb microarray structure on the surface.
Wherein, in the step 2), the laser can select CO 2 Infrared lasers, fiber lasers or ultraviolet lasers.
In addition, in the step 2), the laser etching mode can be replaced by a precision machining mode.
According to the invention, the quasi-honeycomb micro-array structure is constructed on the surface of the insulating material, and the suppression of secondary electron emission on the surface of the insulator can be realized from different directions, so that the flashover voltage of the insulator along the surface is effectively improved. The method has the following beneficial effects:
1. in the array microstructure, the whole insulator surface is divided into cavities of an array through thin walls, the vertical thin walls are perpendicular to the direction of an electric field, and the electric field has no upward component on the surface, which means that no driving force for driving electrons to upwards leave the cavities exists, and the electrons are difficult to escape from the cavities once entering the cavities; meanwhile, because the size of the cavity is small, electrons cannot obtain enough energy in an electric field to excite secondary electron emission; the development that this structure can the efficient suppression flashover has been decided to two characteristics, can promote insulator edgewise compressive strength by a wide margin.
2. The honeycomb-shaped micro-array structure provided by the invention is actually a thin-wall cavity structure, compared with other micro-structures constructed on the surface of the insulator, the cavity occupation ratio is large, the inhibition efficiency on surface movement electrons of the insulator is high during the flashover development, and the improvement effect on along-plane voltage resistance is better.
3. The insulator surface microarray structure is prepared by a laser micromachining method, the method is simple, the precision is high, and the consistency of the array structure can be realized; the uniform structure can reduce the electric field strengthening points of the insulator and inhibit the generation of partial micro discharge.
4. The insulator prepared based on the honeycomb microarray structure and the preparation method thereof provided by the invention is integrally of a homogeneous structure, so that the mechanical strength of the insulator can be ensured, and the application range of the insulator can be enlarged; if the integrated homogeneous structure is made of ceramic materials, the integrated homogeneous structure can endure higher temperature; and the later high-temperature baking degassing and sealing packaging have higher applicability.
Drawings
FIG. 1 is a schematic view of a honeycomb microarray structure; wherein, (a) is hexagonal honeycomb microarray, (b) is regular triangular honeycomb microarray, (c) is square honeycomb microarray, and (d) is round hole honeycomb microarray.
FIG. 2 is a schematic representation of the inhibition of flashover development process by honeycomb microarrays.
Fig. 3 is a schematic flow chart of a preparation method of the honeycomb microstructure array insulator.
Detailed Description
The present invention will be further described in detail by way of examples with reference to the accompanying drawings.
As shown in figure 1, the effective working area on the surface of the insulator body is in a micro-cavity array structure which is tightly arranged, adjacent micro-cavities are separated by thin walls, the caliber of each micro-cavity unit is 100-1000 micrometers, and the ratio of the caliber of the micro-cavity unit to the thickness of the thin wall is not less than 5: 1. Taking a cylindrical insulator body as an example, the effective working area is a cylindrical surface. Of course, the surface of the insulator body can be designed into the micro-cavity array structure. The array of the micro-cavity array structure mainly emphasizes the rule of surface morphology, namely a honeycomb-like surface structure is formed; the three-dimensional shapes and sizes of all microcavity units are preferably identical.
The shape of the cavity can be hexagonal, square, triangular, circular and the like, the periphery of the cavity is of a vertical thin-wall structure, in practical application, reasonable close packing can be carried out according to the shape of the cavity, and the corresponding cavity and the thin wall are combined to form a hexagonal honeycomb microarray, a square honeycomb microarray, a triangular honeycomb microarray and a round hole honeycomb microarray respectively.
The microarray structure divides the whole insulator surface into a plurality of cavities in an array through thin walls, and the cavity walls are thin, so that most of the area of the whole breadth is occupied by the cavities. When the insulator with the structure is used in vacuum, because the area ratio of the cavity is large, in the flashover development process, most electrons can be incident into the cavity (shown in figure 2), and the insulator is limited by the narrow space of the cavity, the incident electrons can not obtain energy to carry out effective secondary electron multiplication and can not effectively escape from the cavity, so that the process of flashover development is effectively blocked, and the flashover voltage of the insulator is greatly improved.
The periphery of the cavity is of a vertical thin-wall structure, and the thickness of the thin wall is the same under the general condition, but not limited to the complete same, and the thin wall can be adjusted according to the structure of the cavity.
The size parameters of the thin wall and the cavity suggest: the thin wall thickness is 5-200 μm, and the size of the cavity is 100-1000 μm.
The material of the cellular microarray insulator can be organic glass, crosslinked polystyrene, epoxy resin, nylon, polyimide, ceramic, quartz and other insulating materials.
The preparation flow of the honeycomb microarray structure is shown in fig. 3, and the method is as follows:
1) preparing insulators with corresponding sizes by a mechanical processing mode according to the geometric structure and the size of the required insulator;
2) etching an array cavity on the surface of the machined insulator in a laser etching mode according to the shape of the cavity to be prepared, wherein thin walls are formed in the un-etched areas among the cavities;
3) and cleaning the insulator with the etching residues by using deionized water, and drying to obtain an insulator sample piece with a honeycomb microarray structure on the surface.
The type of laser used for laser etching is determined by the type of insulating material and the size of etching cavity, and CO can be selected 2 Infrared lasers, fiber lasers, ultraviolet lasers, etc., and other means, such as machining, may also be selected.
Example 1
(1) Polyimide (PEI) is selected as an experimental material, and the insulator with the thickness of 5mm and the diameter of 30mm is processed by a machining mode.
(2) Etching a hexagonal honeycomb structure on the surface of the machined insulator by using an ultraviolet laser (with the wavelength of 355nm) in a rotary etching mode, wherein the diameter of an inscribed circle of a hexagonal cavity is 100 mu m, and the thickness of a thin wall is 10 mu m;
(3) and (3) cleaning the prepared hexagonal honeycomb microarray insulator by using deionized water, removing surface residues, and drying in an oven at 80 ℃ to obtain an insulator sample, which is marked as a honeycomb microarray insulator 1.
Example 2
(1) Alumina ceramic (95 porcelain) is selected as an experimental material, and an insulator with the thickness of 10mm and the diameter of 30mm is prepared by using a pre-forming and sintering mode.
(2) Etching a square honeycomb structure on the surface of the insulator by a fiber laser (with the wavelength of 1.064 mu m) in a rotary etching mode, wherein the side length of a square cavity is 300 mu m, and the thickness of a thin wall is 50 mu m;
(3) and (3) cleaning the prepared square honeycomb microarray insulator by using deionized water, removing surface residues, and drying in an oven at 120 ℃ to obtain an insulator sample, which is marked as a honeycomb microarray insulator 2.
Example 3
(1) Organic glass (PMMA) is selected as an insulating material, and the cylindrical insulator with the overall appearance of 5mm in thickness and 30mm in diameter is processed in a machining mode.
(2) By using CO 2 A laser (with the wavelength of 10.64 mu m) is used for constructing a triangular honeycomb structure on the surface of the machined insulator in a rotary etching mode, wherein the side length of a triangular cavity is 1000 mu m, and the wall thickness is 200 mu m;
(3) and cleaning the prepared composite structure insulator by using deionized water, removing surface residues, and drying in an oven at 60 ℃ to obtain an insulator sample, which is marked as a honeycomb microarray insulator 3.
The cellular microarray insulators prepared in examples 1 to 3 and the cylindrical samples corresponding to the insulating materials were subjected to a vacuum flashover voltage test on a vacuum pulse surface flashover test bench having a pulse width of 500 ns. The flashover voltage test results are shown in table 1.
Table 1: flashover voltage comparison table for conventional columnar insulator and honeycomb micro-array insulator
It can be seen that the vacuum flashover voltage of the insulator with the surface honeycomb microarray structure is improved by 80-100% compared with that of a corresponding columnar insulator, which shows that the vacuum surface flashover voltage of the insulator can be effectively improved by the microarray structure.
Claims (8)
1. The utility model provides a surface has vacuum insulator of microarray structure, includes the insulator body, the insulator body is compact insulating material, its characterized in that: the effective working area of the surface of the insulator body is in a micro-cavity array structure which is tightly arranged, adjacent micro-cavities are separated by thin walls, the caliber of each micro-cavity unit is 100-1000 micrometers, and the ratio of the caliber of each micro-cavity unit to the thickness of each thin wall is not less than 5: 1; each thin wall is a vertical thin wall and is vertical to the surface of the insulator body; the shape of the micro-cavity unit is regular hexagon, square or regular triangle.
2. The vacuum insulator with the microarray structure on the surface according to claim 1, wherein: the inner bottom surface of the micro-cavity unit is in a plane form.
3. The vacuum insulator with the microarray structure on the surface according to claim 1, wherein: the depth of the micro-cavity unit is 100-1000 μm.
4. The vacuum insulator with the microarray structure on the surface according to claim 1, wherein: the thickness of the thin wall is 5-200 microns, and the ratio of the aperture of the micro-cavity unit to the thickness of the thin wall is 5: 1-10: 1.
5. The vacuum insulator with the microarray structure on the surface according to claim 1, wherein: the vacuum insulator is made of organic glass, crosslinked polystyrene, epoxy resin, nylon, polyimide, ceramic or quartz.
6. A method for preparing a vacuum insulator with a microarray structure on the surface according to claim 1, comprising the following steps:
1) preparing insulators with corresponding sizes in a machining mode according to the geometric structure and the size of the required insulators;
2) according to the shape of the micro cavity to be prepared, etching a corresponding micro cavity array on the surface of the insulator obtained by machining in a laser etching mode, controlling the depth of the micro cavity through the frequency of laser action, and forming a thin wall in an un-etched area between adjacent micro cavities;
3) and cleaning the insulator with the etched surface by using deionized water, and drying to obtain the insulator product with the similar honeycomb microarray structure on the surface.
7. The method of claim 6, wherein: in step 2), the laser selects CO 2 Infrared lasers, fiber lasers or ultraviolet lasers.
8. The method of claim 7, wherein: in the step 2), the laser etching mode is replaced by a precision machining mode.
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| CN106782932B (en) * | 2016-12-28 | 2019-06-07 | 西北核技术研究所 | High gradient surface micro-strip insulator and preparation method thereof |
| CN106601388B (en) * | 2016-12-28 | 2018-10-26 | 西北核技术研究所 | A kind of insulator and preparation method thereof with hole microflute textured surfaces |
| CN111180144A (en) * | 2020-01-03 | 2020-05-19 | 西北核技术研究院 | Vacuum insulator with secondary microstructure on surface and preparation method thereof |
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| CN101777615A (en) * | 2010-01-13 | 2010-07-14 | 南京大学 | Method for preparing GaN substrate with porous surface and GaN substrate prepared by using the method |
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