CN112635425A - High-density TOP structure LED frame and cutting wheel - Google Patents
High-density TOP structure LED frame and cutting wheel Download PDFInfo
- Publication number
- CN112635425A CN112635425A CN202011446259.0A CN202011446259A CN112635425A CN 112635425 A CN112635425 A CN 112635425A CN 202011446259 A CN202011446259 A CN 202011446259A CN 112635425 A CN112635425 A CN 112635425A
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- led
- frame
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- cutting
- supports
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- 239000002184 metal Substances 0.000 claims abstract description 52
- 239000004033 plastic Substances 0.000 claims abstract description 25
- 238000001125 extrusion Methods 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims abstract description 7
- 238000003491 array Methods 0.000 claims abstract description 3
- 238000004080 punching Methods 0.000 claims abstract description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 4
- 239000002991 molded plastic Substances 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 description 13
- 239000000047 product Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a high-density TOP structure LED frame and a cutting wheel, and relates to the technical field of LED processing; the LED support structure comprises an LED metal frame, wherein a plurality of metal support functional areas in arrays are formed on the LED metal frame in a punching mode, a plurality of LED supports are formed on the metal support functional areas in an injection molding mode, two adjacent rows of LED supports are connected through metal support bars in a supporting mode, and two adjacent rows of LED supports are connected through injection-molded plastic supports; the plastic support body is suspended in the functional area of the metal support; the cutting wheel for the LED frame comprises a cutting knife wheel body, wherein a plurality of cutting blades corresponding to the plastic support body are arranged on the cutting knife wheel body, and extrusion elastic sheets are arranged on two sides of each cutting blade; by the invention, the arrangement density of the LED frame can be improved, and the problem of plastic defect of the LED bracket body caused by the traditional extruding dislocation stripping mode of stripping is solved.
Description
Technical Field
The invention relates to the technical field of LED processing, in particular to a high-density TOP structure LED frame and a cutting wheel.
Background
As shown in fig. 1-4, the conventional TOP LED support is formed by supporting all rows and columns of the periphery of each LED support body with metal frame support bars, such as the transverse metal support bar 06 and the longitudinal metal support bar 07 in fig. 1; when single LED is stripped after the LED is packaged, the transverse metal support bar 06 is extruded by the staggered upper and lower knife wheels to form staggered deformation, and the staggered deformation is changed from plane processing into side-to-side separation, so that the metal support bar is separated from the plastic body to be stripped to form a single LED. Due to the limitation of a staggered extrusion material stripping mode, the periphery of each LED support body needs to be supported by a metal frame, the metal frame needs a certain width size, the minimum width size can not be less than 0.6mm, and otherwise, the peeling is difficult or unsmooth due to the problem of the positioning accuracy of the cutter wheel.
Disclosure of Invention
The invention overcomes the defects of the prior art, and provides the high-density TOP structure LED frame and the cutting wheel so as to improve the arrangement density of the LED frame and improve the packaging efficiency; solve the incomplete problem of LED support body plastic that traditional extrusion dislocation shell the material mode and lead to simultaneously.
In order to achieve the above object, the present invention is achieved by the following technical solutions.
The high-density TOP structure LED frame comprises an LED metal frame, wherein a plurality of metal support functional areas in arrays are formed on the LED metal frame in a punching mode, a plurality of LED supports are formed on the metal support functional areas in an injection molding mode, two adjacent lines of LED supports are connected through metal support bars in a supporting mode, and two adjacent lines of LED supports are connected through injection-molded plastic supports; the plastic support body is suspended in the metal support functional area.
Furthermore, adjacent pins of two adjacent rows of LED supports are connected.
Furthermore, positioning holes are formed in the middle and two edge portions of the LED metal frame.
Furthermore, the height of the plastic support body suspended in the metal support functional area is larger than 0.05 mm.
The utility model provides a be used for LED frame's cutting wheel, includes cutting break bar body, be provided with a plurality of cutting blades corresponding with the plastic supporter on the cutting break bar body, cutting blade's both sides are provided with the extrusion shell fragment, be provided with the protruding cylinder corresponding with the locating hole on the cutting break bar body.
Furthermore, the head of the protruding cylinder is provided with a chamfer angle.
Further, the cutting knife flywheel body and the cutting blade adopt a gear transmission principle, and the rotating speed of the cutting blade is 5-20 times of that of the cutting knife flywheel body.
Compared with the prior art, the invention has the following beneficial effects:
the invention can improve the arrangement density of the LED frames, and particularly can greatly improve the arrangement density of the LED supports after the transverse supporting bodies are omitted because the transverse supporting bodies are more in number and the area occupation ratio of the metal frames is large in the aspect of ultra-small LED packaging for display application, thereby greatly improving the packaging efficiency and reducing the LED packaging cost. The plastic defect problem of the LED support body caused by the traditional extruding dislocation stripping mode of stripping materials can be avoided, and the failure risk caused by stress on the LED support body is reduced.
Drawings
In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the following drawings are taken for illustration:
fig. 1 is a schematic structural diagram of a conventional TOP-structured LED support metal material.
Fig. 2 is a schematic structural diagram of a conventional metal material injection molded semi-finished product.
Fig. 3 is a schematic structural diagram of the packaged whole LED with frame in fig. 2.
Fig. 4 is a structural diagram of a metal frame after stripping of the LED package product in fig. 3.
FIG. 5 is a schematic structural diagram of a metal part of an LED frame with a TOP structure according to the present invention.
FIG. 6 is a schematic view of a metal material injection molded semi-finished product according to the present invention.
FIG. 7 is a schematic structural diagram of the whole LED bracket after the LED bracket pins are cut off and bent to wrap the pins.
FIG. 8 is an enlarged view of the plastic support of the present invention.
Fig. 9 is a schematic view of a finished product after the LED frame is packaged.
Fig. 10 is a structural view of a metal frame after stripping of a finished LED package of the present invention.
Fig. 11 is a schematic structural view of the cutting wheel of the present invention.
In the figure, 02-a lower edge positioning hole, 03-a middle positioning hole, 04-an upper edge positioning hole, 05-a metal functional area, 06-a transverse metal support strip, 07-a longitudinal metal support strip, 08-an injection molding LED support body, 09-an LED packaging finished product, 10-an empty frame after LED stripping, 11-an LED frame metal part, 16-a plastic support body and 21-a suspension distance;
30-cutting knife flywheel body, 31-cutting blade, 32-convex cylinder and 35-extrusion elastic sheet.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail with reference to the embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. The technical solution of the present invention is described in detail below with reference to the embodiments and the drawings, but the scope of protection is not limited thereto.
As shown in fig. 5-7, the TOP-structured high-density LED support comprises a metal sheet, an LED frame metal part 11 is formed on the metal sheet by stamping or etching, a plurality of metal functional regions 05 arranged in a matrix are formed on the LED frame metal part 11 by stamping or etching, a row of LED supports are formed by injection molding in each metal functional region 05, two adjacent rows of LED supports are connected by a longitudinal metal support strip 07, four injection-molded LED support bodies 08 are arranged in each row of LED supports, and two adjacent injection-molded LED support bodies 08 are connected by a plastic support 16; according to the LED frame metal part 11, the transverse metal supporting strips 06 on the LED frame metal part with the traditional TOP structure are removed and replaced by the plastic supporting bodies 16, as shown in figure 8, the transverse supporting of each injection-molded LED support body 08 adopts the plastic supporting bodies 16 formed in one step in an injection molding process to support each other, and the suspension distance 21 between each plastic supporting body 16 and the surface of the metal functional area 05 is at least larger than 0.05 mm.
After the support is packaged, the LED packaged finished product 09 is peeled off by using a special cutting and stripping manner (see fig. 9 and 10). The cutting device adopted by the material stripping mode has a specially designed cutting wheel, as shown in fig. 11, the cutting wheel comprises a cutting knife wheel body 30, a plurality of groups of cutting blades 31 corresponding to the plastic support body 16 are arranged on the cutting knife wheel body 30, extrusion elastic sheets 35 are arranged on two sides of each cutting blade 31, and protruding cylinders 32 corresponding to the lower edge positioning holes 02, the middle positioning holes 03 and the upper edge positioning holes 04 are arranged on the cutting knife wheel body 30.
The head of the raised cylinder 32 is chamfered to facilitate rapid introduction into the bracket positioning hole. When the cutter wheel rotates, the cutting cutter wheel body 30 drives the convex column 32 to match with the corresponding positioning hole of the bracket during cutting and stripping, and the bracket is driven to move forward. Meanwhile, by using the principle that clocks are coaxial and different in speed, the rotating speed of the cutting blade 31 of the cutting knife flywheel is about 5-20 times of that of the knife flywheel body, and the rotating speed of the cutting blade can be adjusted by replacing and adjusting the internal gear, so that a proper cutting effect is achieved. When the flywheel rotates, the support is driven to advance according to a stable position, the plastic support body 16 at the bottom of each LED packaging finished product 09 is cut and separated by the cutting blade rotating at a high speed, the hanging distance 21 between the plastic support body 16 and the surface of the metal functional area 05 can ensure that the blade cannot cut the metal part of the LED frame, each LED packaging finished product 09 is hung and peeled off, and the longitudinal metal support strip 07 is cut and bent when the support wraps the foot. For the large transverse rib close to the positioning hole of the LED frame metal part 11, the LED packaging finished product 09 of each row is clamped on the large transverse rib at one side, the other side of the LED packaging finished product is cut off, and the LED packaging finished product 09 close to the large transverse rib is extruded and peeled off by arranging the extrusion elastic sheet 35 after cutting. The cut and peeled product is shown in fig. 10, and the cut of the plastic support 16 remained after cutting does not affect the use of the product. Plastic scraps are easy to generate after cutting, and the scraps are thoroughly separated from the LED finished product in a screen mesh and vacuum mode.
The invention can improve the arrangement density of the LED frames, and particularly in the aspect of ultra-small LED packaging for display application, the transverse supporting bodies are more in quantity and large in area occupation ratio, so that the packaging efficiency can be greatly improved and the LED packaging cost can be reduced after the transverse supporting bodies are omitted. The plastic defect problem of the LED support body caused by the traditional extruding dislocation stripping mode of stripping materials can be avoided, and the failure risk caused by stress on the LED support body is reduced.
While the invention has been described in detail with reference to specific preferred embodiments thereof, it will be understood by those skilled in the art that the invention is not limited thereto, and various changes and modifications can be made without departing from the scope of the invention.
Claims (7)
1. The high-density TOP structure LED frame is characterized by comprising an LED metal frame, wherein a plurality of metal support functional areas in arrays are formed on the LED metal frame in a punching mode, a plurality of LED supports are formed on the metal support functional areas in an injection molding mode, two adjacent rows of LED supports are connected through metal support bars in a supporting mode, and two adjacent rows of LED supports are connected through plastic supports in an injection molding mode; the plastic support body is suspended in the metal support functional area.
2. The high-density TOP-structured LED frame of claim 1, wherein adjacent legs of two adjacent rows of LED supports are connected.
3. The high-density TOP structure LED frame of claim 1 wherein the LED metal frame has locating holes in the middle and both edge portions.
4. The high-density TOP structure LED frame of claim 1, wherein the plastic support is suspended from the metal frame functional region to form a suspended section with a height > 0.05 mm.
5. The cutting wheel for the LED frame according to claim 3, comprising a cutting wheel body, wherein the cutting wheel body is provided with a plurality of cutting blades corresponding to the plastic support body, two sides of each cutting blade are provided with extrusion elastic sheets, and the cutting wheel body is provided with raised cylinders corresponding to the positioning holes.
6. The cutoff wheel for LED frame according to claim 5, wherein the head of the raised cylinder is provided with a chamfer.
7. The cutting wheel for the LED frame as claimed in claim 5, wherein the cutting wheel body and the cutting blade adopt a gear transmission principle, and the rotation speed of the cutting blade is 5-20 times that of the cutting wheel body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011446259.0A CN112635425A (en) | 2020-12-11 | 2020-12-11 | High-density TOP structure LED frame and cutting wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011446259.0A CN112635425A (en) | 2020-12-11 | 2020-12-11 | High-density TOP structure LED frame and cutting wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112635425A true CN112635425A (en) | 2021-04-09 |
Family
ID=75310194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011446259.0A Pending CN112635425A (en) | 2020-12-11 | 2020-12-11 | High-density TOP structure LED frame and cutting wheel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112635425A (en) |
-
2020
- 2020-12-11 CN CN202011446259.0A patent/CN112635425A/en active Pending
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