CN112635379A - Positioning device for power supply chip processing and use method thereof - Google Patents

Positioning device for power supply chip processing and use method thereof Download PDF

Info

Publication number
CN112635379A
CN112635379A CN202011416766.XA CN202011416766A CN112635379A CN 112635379 A CN112635379 A CN 112635379A CN 202011416766 A CN202011416766 A CN 202011416766A CN 112635379 A CN112635379 A CN 112635379A
Authority
CN
China
Prior art keywords
plate
processing
clamping
chip
supporting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202011416766.XA
Other languages
Chinese (zh)
Other versions
CN112635379B (en
Inventor
吴毅起
龙伟才
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGZHOU REACH MICRO-ELECTRONICS TECHNOLOGY CO LTD
Original Assignee
GUANGZHOU REACH MICRO-ELECTRONICS TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GUANGZHOU REACH MICRO-ELECTRONICS TECHNOLOGY CO LTD filed Critical GUANGZHOU REACH MICRO-ELECTRONICS TECHNOLOGY CO LTD
Priority to CN202011416766.XA priority Critical patent/CN112635379B/en
Publication of CN112635379A publication Critical patent/CN112635379A/en
Application granted granted Critical
Publication of CN112635379B publication Critical patent/CN112635379B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Abstract

The invention relates to and provides a positioning device for processing a power supply chip and a using method thereof, wherein the positioning device comprises a workbench, and the workbench is provided with: the movable supporting plate can transversely and longitudinally move on the workbench, at least one clamping notch for placing a power supply chip is formed in the movable supporting plate, and a fixed clamping device and a movable clamping device are respectively arranged on two sides of the clamping notch; the movable clamping device slides transversely along the clamping groove opening to clamp the power chip between the fixed clamping device and the movable clamping device; the movable clamping device comprises a pressing device, and the pressing device presses the power supply chip downwards; the processing device is arranged above the movable supporting plate through a support on the workbench and comprises a processing head arranged below, and the processing head processes the power chip fixed on the movable supporting plate. The positioning device for processing the power chip and the using method thereof have high stability and high flexibility.

Description

Positioning device for power supply chip processing and use method thereof
Technical Field
The invention relates to the field of positioning devices for power chip processing, in particular to a positioning device for power chip processing and a using method thereof.
Background
The DC power supply chip is a component that must be used in an electronic product, and if a switching DC power supply or a linear power supply must be used in a device using a commercial power, the switching power supply chip or the voltage stabilizing chip needs to be used: as in devices that use battery power, battery management chips and voltage management chips must be used. Some power chips are dual-in-line chips, and some are surface mount packages, wherein the HIP630x series chips are more classical power management chips, the switching frequency is as high as 80KHz, and the power management chip has the characteristics of large power supply, small ripple, small internal resistance and the like, and can precisely adjust the power supply voltage of a CPU. A power management Integrated Circuit (IC) is a chip that is responsible for the conversion, distribution, detection, and other power management of electrical energy in a system of electronic devices. It is primarily responsible for converting source voltage and current into a power source that can be used by a load, such as a microprocessor, sensor, etc.
At present, the power chip application market is very extensive, uses various types of power chip in the electronic product equipment, adds man-hour to power chip, needs earlier fix a position fixed power chip's position, then carries out various processing operations, but current device is when processing operation to power chip, and the flexibility is relatively poor, often can not be stable fix a position to power chip, leads to having some deviation to power chip processing operation, influences the quality of product processing.
Disclosure of Invention
In order to overcome the problems, the invention provides a positioning device for processing a power chip with high stability and high flexibility and a using method thereof.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a positioner is used in power chip processing, includes the workstation, be provided with on the workstation:
the movable supporting plate can transversely and longitudinally move on the workbench, at least one clamping notch for placing a power supply chip is formed in the movable supporting plate, and a fixed clamping device and a movable clamping device are respectively arranged on two sides of the clamping notch; the movable clamping device slides transversely along the clamping groove opening to clamp the power chip between the fixed clamping device and the movable clamping device; the movable clamping device comprises a pressing device, and the pressing device presses the power supply chip downwards;
the processing device is arranged above the movable supporting plate through a support on the workbench and comprises a processing head arranged below, and the processing head processes the power chip fixed on the movable supporting plate.
Preferably, the movable clamping device further comprises a pushing plate, a plurality of pushing blocks and a second telescopic device, and a telescopic rod of the second telescopic device is connected with the rear end face of the pushing plate; the pushing blocks are arranged on the front end face of the pushing plate, the number of the pushing blocks corresponds to that of the clamping notches, and each pushing block is located in each clamping notch; the push plate upper portion utensil bend forward and form the platform, the push down device is including installing in at least one third telescoping device on push plate upper portion, third telescoping device below is provided with depression bar and rubber block, the telescopic link of third telescoping device penetrates the platform of push plate, compression linkage in the bottom of the telescopic link of the device that contracts, the rubber block sets up in the bottom of depression bar.
Preferably, the rear end of the movable supporting plate is provided with a fixed block, the second telescopic device is installed at the rear side of the fixed block, and the fixed block is also provided with at least one sliding rod; the sliding rod is movably inserted on the fixed block, and the end part of the sliding rod is fixedly connected with the pushing plate.
Preferably, the fixed clamping device comprises a front end baffle arranged on the movable supporting plate, a top plate arranged on the baffle and a clamping plate arranged below the top plate; at least one movable column is arranged on the lower side of the clamping plate and is inserted into the movable supporting plate, a reset spring is sleeved on the outer edge of the movable column, and a rubber pad is arranged at the upper end of the clamping plate.
Preferably, the workbench is further provided with a pair of sliding block support plates, a threaded rod and at least two guide posts are arranged between the two sliding block support plates, and one sliding block support plate is provided with a motor for driving the threaded rod to rotate; the bottom of the movable supporting plate is provided with a threaded sleeve matched and screwed with the threaded rod, and the bottom of the movable supporting plate is provided with a sliding sleeve matched with the guide post.
Preferably, the two sides of the workbench are provided with a longitudinal sliding groove and a first telescopic device, the longitudinal sliding groove and the first telescopic device are respectively provided with a sliding block support plate, and the first telescopic device pushes the sliding block support plate to move in the longitudinal sliding groove.
Preferably, the number of the clamping notches is four, and the number of the push blocks is four.
Preferably, the number of the third telescopic devices is five, and the third telescopic devices and the push blocks are alternately arranged.
The invention also provides a positioning method for processing the power supply chip, which comprises the following steps: 1) placing a power supply chip to be processed into a clamping notch on the movable supporting plate;
2) the power chip extrudes the rubber pad and the clamping plate to move through the matching of the reset spring and the movable column in the notch, so that one side of the power chip is positioned and clamped, then the second telescopic device is controlled to push the pushing plate to move, so that the pushing plate drives the pushing block to move, the power chip is contacted through the pushing block, and the power chip stops moving after being contacted;
3) the third telescopic device is controlled to push the pressing rod to move downwards, so that the pressing rod drives the rubber block to tightly press and fix the power supply chip, and the power supply chip is positioned on the movable supporting plate by matching with the extrusion limit of the reset spring, the clamping plate and the rubber pad on the power supply chip;
4) the first telescopic device is controlled to enable the sliding block support plate to slide on the inner side of the sliding groove, so that the movable support plate moves, and then the starting motor rotates to drive the threaded rod to rotate, so that the threaded sleeve and the sliding sleeve slide along the guide post, the movable support plate moves, and the movable support plate is positioned and fixed;
5) the processing head is enabled to process the power chip by controlling the processing device, the processing is completed, the third expansion device, the second expansion device and the first expansion device are controlled to reset, the processed power chip is taken out, and the power chip is continuously operated in a circulating mode to process the power chip.
The invention has the beneficial effects that: a positioning device for processing a power chip and a using method thereof. Has the following beneficial effects:
1. this positioner for power chip processing and application method thereof uses through the cooperation of mounting bracket, first telescoping device, slider mounting panel, motor, threaded rod, sliding sleeve, guide post and activity layer board for processingequipment carries out the regulation of position in the horizontal direction to power chip when processing the operation to power chip, thereby can carry out the centre gripping to it according to the size of chip, improves the flexibility of power chip location, increases the stability to power chip location.
2. This positioner is used in power chip processing and application method thereof uses through the cooperation of fixed block, second telescoping device, slurcam, third telescoping device, depression bar, block rubber, ejector pad, activity post, reset spring, joint board, rubber pad and roof, carries out stable fixed to power chip for power chip can accurate mobile location, and the rubber pad has avoided the condition that the chip was by splint fish tail, improves the precision to power chip processing operation, improves the quality of product processing.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic view of an overall structure of a positioning device for processing a power chip according to the present invention;
FIG. 2 is a second schematic view of the overall structure of the positioning device for processing a power chip according to the present invention;
FIG. 3 is a schematic front view of a positioning device for processing a power chip according to the present invention;
FIG. 4 is a schematic structural view of a movable clamping device of the positioning device for processing a power chip according to the present invention;
fig. 5 is a schematic structural view of a fixing and clamping device of the positioning device for processing the power chip.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
Example 1
As shown in fig. 1-5, a positioning device for power chip processing comprises a supporting plate 1, a supporting leg 28 is fixedly installed at the bottom of the supporting plate 1, a fixing plate 2 is fixedly installed on the upper surface of the supporting plate 1, a sliding groove 29 is formed in the surface of the fixing plate 2, a sliding block support plate 6 is slidably connected inside the sliding groove 29, a pushing device is arranged on the upper surface of the supporting plate 1, a fixing frame 9 is fixedly installed on the upper surface of the supporting plate 1, a processing device 10 is fixedly installed on the upper surface of the fixing frame 9, a processing head 11 is arranged at the bottom end of the processing device 10, a guide post 7 is fixedly installed on one side of the sliding block support plate 6, a sliding sleeve 17 is slidably connected to the outer side of the guide post 7, a movable supporting plate 8 is fixedly installed at the top of the pushing plate 18, a fixing device is arranged on the upper surface, and the outside screw thread of threaded rod 16 has cup jointed the thread bush, and the thread bush top is connected with movable layer board 8, and movable layer board 8's upper surface is provided with latch device.
In this embodiment, it rotates to drive threaded rod 16 through starter motor 3 and rotates, thereby slide along guide post 7 through thread bush and sliding sleeve 17, make activity layer board 8 remove, it is fixed to advance line location to activity layer board 8, make processing head 11 carry out the processing operation to power chip through control processingequipment 10, make processingequipment when power chip processing operation, carry out the regulation of position on the horizontal direction to power chip, thereby can carry out the centre gripping to it according to the size of chip, the flexibility of power chip location is improved, the stability of power chip location is increased.
Specifically, thrust unit includes first thrust unit and second thrust unit, and first thrust unit is the same with second thrust unit structure, and sets up the surface at backup pad 1 with processingequipment 10 symmetry, through the cooperation that sets up first thrust unit and second thrust unit, carries out the regulation of position on the horizontal direction to power chip to can carry out the centre gripping to it according to the size of chip, improve the flexibility of power chip location.
Specifically, first promotion unit includes mounting bracket 4, the last fixed surface of mounting bracket 4 installs first telescoping device 5, the one end and the slider mounting panel 6 fixed connection of first telescoping device 5, through the cooperation that sets up mounting bracket 4 and first telescoping device 5 and slider mounting panel 6, make slider mounting panel 6 go on sliding in spout 29 inboard through controlling first telescoping device 5, make activity layer board 8 remove, then rotate through starter motor 3 and drive threaded rod 16 and rotate, thereby slide along guide post 7 through thread bush and sliding sleeve 17, make activity layer board 8 remove, carry out the regulation of position in the horizontal direction to power chip, the flexibility of power chip location is improved, increase the stability to power chip location.
Specifically, fixing device includes fixed block 12, one side fixed mounting of fixed block 12 has second telescoping device 13, the one end fixed mounting of second telescoping device 13 has catch plate 18, one side fixed mounting of catch plate 18 has ejector pad 21, through the cooperation that sets up second telescoping device 13 and ejector pad 18 and ejector pad 21, promote the ejector pad 18 through controlling second telescoping device 13 and remove, make catch plate 18 drive ejector pad 21 remove, contact power chip through ejector pad 21, stop motion after the contact, nimble positioning control power chip.
Concretely, the last fixed surface of slurcam 18 installs third telescoping device 15, the one end fixed mounting of third telescoping device 15 has depression bar 19, depression bar 19's lower surface is equipped with rubber block 20, through the cooperation that sets up slurcam 18 and third telescoping device 15 and depression bar 19 and rubber block 20, promote depression bar 19 through controlling third telescoping device 15 and move down, it is fixed to make depression bar 19 drive rubber block 20 compress tightly power chip, carry out stable fixed to power chip, improve the precision to power chip processing operation, improve the quality of product processing, it is fixed to carry out stable to power chip, make the mobile location that power chip can be accurate, the rubber pad has avoided the chip by the condition of splint fish tail, improve the precision to power chip processing operation, improve the quality of product processing.
Specifically, latch device includes baffle 22, one side fixed mounting of baffle 22 has roof 23, the last fixed surface of activity layer board 8 installs movable post 24, the outside of activity post 24 is equipped with reset spring 25, the top fixed mounting of activity post 24 has joint board 26, joint board 26's upper surface is equipped with rubber pad 27, cooperation through setting up baffle 22 and roof 23 and activity post 24 and reset spring 25, cross intraoral reset spring 25 and the cooperation of activity post 24, make power chip extrusion rubber pad 27 and joint board 26 remove, it is tight to make power chip one side fix a position tightly, carry out stable fixed to power chip, make power chip can accurate mobile location, the rubber pad has avoided the condition that the chip was by the splint fish tail, improve the precision to power chip processing operation.
Example 2
A use method of a positioning device for processing a power chip comprises the following steps: the power chip to be processed is placed in a clamping notch 81 on a movable supporting plate 8, the power chip extrudes a rubber gasket 27 and a clamping plate 26 to move through the matching of a reset spring 25 in the notch and a movable column 24, so that one side of the power chip is positioned and clamped, then a pushing plate 18 is pushed to move through controlling a second telescopic device 13, so that the pushing plate 18 drives a pushing block 21 to move, the power chip is contacted through the pushing block 21, the movement is stopped after the contact, then a pressing rod 19 is pushed to move downwards through controlling a third telescopic device 15, so that the pressing rod 19 drives a rubber block 20 to compress and fix the power chip, the reset spring 25, the clamping plate 26 and the rubber gasket 27 are matched to limit the extrusion of the power chip, so that the power chip is positioned on the movable supporting plate 8, and then a sliding block supporting plate 6 slides on the inner side of a sliding groove 29 through controlling a first telescopic device 5, make movable supporting plate 8 remove, then rotate through starter motor 3 and drive threaded rod 16 and rotate, thereby slide along guide post 7 through thread bush and sliding sleeve 17, make movable supporting plate 8 remove, fix a position movable supporting plate 8 fixed, make processing head 11 carry out the processing operation to power chip through control processingequipment 10, the processing is accomplished, reset through control third telescoping device 15 and second telescoping device 13 and first telescoping device 5, take out the power chip after the processing, continue cycle operation, carry out the processing operation to power chip.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (9)

1. The utility model provides a positioner is used in power chip processing, includes workstation (1), its characterized in that, be provided with on the workstation:
the movable supporting plate (8) can transversely and longitudinally move on the workbench (1), at least one clamping notch (81) for placing a power supply chip is formed in the movable supporting plate (8), and a fixed clamping device and a movable clamping device are respectively arranged on two sides of the clamping notch (81); the movable clamping device slides transversely along the clamping groove opening (81) to clamp the power chip between the fixed clamping device and the movable clamping device; the movable clamping device comprises a pressing device, and the pressing device presses the power supply chip downwards;
the processing device is characterized in that the processing device (10) is arranged above the movable supporting plate (8) through a support (9) on the workbench (1) and comprises a processing head (11) arranged below, and the processing head (11) processes a power supply chip fixed on the movable supporting plate (8).
2. The positioning device for processing the power chip as claimed in claim 1, wherein: the movable clamping device also comprises a push plate (18), a plurality of push blocks (21) and a second telescopic device (13), wherein a telescopic rod of the second telescopic device (13) is connected with the rear end face of the push plate (18); the pushing blocks (21) are arranged on the front end face of the pushing plate (18), the number of the pushing blocks (21) corresponds to that of the clamping notches (81), and each pushing block is respectively positioned in each clamping notch (81); the device is characterized in that the upper part of the pushing plate (18) is bent forwards to form a platform, the pushing device comprises at least one third telescopic device (15) arranged on the upper part of the pushing plate (18), a pressing rod (19) and a rubber block (20) are arranged below the third telescopic device (15), a telescopic rod of the third telescopic device (15) penetrates into the platform of the pushing plate (18), the pressing rod (19) is connected to the bottom of a telescopic rod of the telescopic device (15), and the rubber block (20) is arranged at the bottom of the pressing rod (19).
3. The positioning device for processing the power chip as claimed in claim 2, wherein: a fixed block (12) is arranged at the rear end of the movable supporting plate (8), a second telescopic device (13) is arranged at the rear side of the fixed block (12), and at least one sliding rod (14) is further arranged on the fixed block (12); the sliding rod (14) is movably inserted on the fixed block (12), and the end part of the sliding rod (14) is fixedly connected with the pushing plate (18).
4. The positioning device for processing the power chip as claimed in claim 3, wherein: the fixed clamping device comprises a baffle plate (22) arranged at the front end part of the movable supporting plate (8), a top plate (23) arranged on the baffle plate (22) and a clamping plate (26) arranged below the top plate (23); at least one movable column (24) is arranged on the lower side of the clamping plate (26), the movable column (24) penetrates through the movable supporting plate (8), a return spring (25) is sleeved on the outer edge of the movable column (24), and a rubber pad (27) is arranged at the upper end of the clamping plate (26).
5. The positioning device for processing the power chip as claimed in claim 4, wherein: the workbench (1) is also provided with a pair of sliding block support plates (6), a threaded rod (16) and at least two guide posts (7) are arranged between the two sliding block support plates (6), and one sliding block support plate (6) is provided with a motor (3) for driving the threaded rod (16) to rotate; the bottom of the movable supporting plate (8) is provided with a threaded sleeve matched and screwed with the threaded rod (16), and the bottom of the movable supporting plate (8) is provided with a sliding sleeve (17) matched with the guide post (7).
6. The positioning device for processing the power chip as claimed in claim 5, wherein: the two sides of the workbench (1) are provided with a longitudinal sliding groove (29) for respectively installing the sliding block support plate (6) and a first telescopic device, and the first telescopic device pushes the sliding block support plate (6) to move in the longitudinal sliding groove (29).
7. The positioning device for processing the power chip as claimed in claim 6, wherein: the number of the clamping notches (81) is four, and the number of the push blocks (21) is four.
8. The positioning device for processing the power chip as claimed in claim 7, wherein: the number of the third telescopic devices (15) is five, and the five third telescopic devices and the push blocks (21) are alternately arranged.
9. The use method of the positioning device for processing the power chip as claimed in any one of claims 1 to 8, characterized by comprising the following steps: 1) placing a power chip to be processed into a clamping notch (81) on a movable supporting plate (8);
2) the power chip extrudes the rubber pad (27) and the clamping plate (26) to move through the matching of the reset spring (25) and the movable column (24) in the notch, so that one side of the power chip is positioned and clamped, then the second telescopic device (13) is controlled to push the pushing plate (18) to move, so that the pushing plate (18) drives the pushing block (21) to move, the power chip is contacted through the pushing block (21), and the motion is stopped after the contact;
3) the third telescopic device (15) is controlled to push the pressure lever (19) to move downwards, so that the pressure lever (19) drives the rubber block (20) to compress and fix the power supply chip, and the power supply chip is positioned on the movable supporting plate (8) by matching with extrusion limitation of the reset spring (25), the clamping plate (26) and the rubber pad (27) on the power supply chip;
4) the first telescopic device (5) is controlled to enable the sliding block support plate (6) to slide on the inner side of the sliding groove (29), so that the movable supporting plate (8) moves, then the starting motor (3) rotates to drive the threaded rod (16) to rotate, and the threaded sleeve and the sliding sleeve (17) slide along the guide post (7), so that the movable supporting plate (8) moves, and the movable supporting plate (8) is positioned and fixed;
5) and (3) controlling the processing device (10) to enable the processing head (11) to process the power supply chip, completing the processing, resetting by controlling the third expansion device (15), the second expansion device (13) and the first expansion device (5), taking out the processed power supply chip, continuing to perform circulating operation, and performing processing operation on the power supply chip.
CN202011416766.XA 2020-12-07 2020-12-07 Positioning device for power supply chip processing and use method thereof Active CN112635379B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011416766.XA CN112635379B (en) 2020-12-07 2020-12-07 Positioning device for power supply chip processing and use method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011416766.XA CN112635379B (en) 2020-12-07 2020-12-07 Positioning device for power supply chip processing and use method thereof

Publications (2)

Publication Number Publication Date
CN112635379A true CN112635379A (en) 2021-04-09
CN112635379B CN112635379B (en) 2023-03-31

Family

ID=75308425

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011416766.XA Active CN112635379B (en) 2020-12-07 2020-12-07 Positioning device for power supply chip processing and use method thereof

Country Status (1)

Country Link
CN (1) CN112635379B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113671345A (en) * 2021-08-18 2021-11-19 贺莉军 Factory detection device based on nfc chip and detection method thereof
CN113671345B (en) * 2021-08-18 2024-05-14 东莞市惠海半导体有限公司 Factory detection device based on nfc chip and detection method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5201451A (en) * 1987-03-11 1993-04-13 International Business Machines Corp. Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US8365611B1 (en) * 2009-11-30 2013-02-05 Amkor Technology, Inc. Bend test method and apparatus for flip chip devices
CN108766921A (en) * 2018-06-14 2018-11-06 广州明森科技股份有限公司 A kind of pinpoint burning chip localization method and burning device
CN110299312A (en) * 2019-07-04 2019-10-01 深圳市诺泰自动化设备有限公司 A kind of rotary type tower bonder
CN210866146U (en) * 2019-10-28 2020-06-26 苏州芯海半导体科技有限公司 Compatible chip positioning groove for chip positioning
CN111653507A (en) * 2020-06-16 2020-09-11 中山绿威科技有限公司 Chip positioning device and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5201451A (en) * 1987-03-11 1993-04-13 International Business Machines Corp. Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US8365611B1 (en) * 2009-11-30 2013-02-05 Amkor Technology, Inc. Bend test method and apparatus for flip chip devices
CN108766921A (en) * 2018-06-14 2018-11-06 广州明森科技股份有限公司 A kind of pinpoint burning chip localization method and burning device
CN110299312A (en) * 2019-07-04 2019-10-01 深圳市诺泰自动化设备有限公司 A kind of rotary type tower bonder
CN210866146U (en) * 2019-10-28 2020-06-26 苏州芯海半导体科技有限公司 Compatible chip positioning groove for chip positioning
CN111653507A (en) * 2020-06-16 2020-09-11 中山绿威科技有限公司 Chip positioning device and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113671345A (en) * 2021-08-18 2021-11-19 贺莉军 Factory detection device based on nfc chip and detection method thereof
CN113671345B (en) * 2021-08-18 2024-05-14 东莞市惠海半导体有限公司 Factory detection device based on nfc chip and detection method thereof

Also Published As

Publication number Publication date
CN112635379B (en) 2023-03-31

Similar Documents

Publication Publication Date Title
CN218470900U (en) Diode withstand voltage detection device
CN112635379B (en) Positioning device for power supply chip processing and use method thereof
CN205702764U (en) A kind of accurate Double-head bonding machine
CN213905304U (en) Positioner is used in power chip processing
CN218946211U (en) Chip bent pin flattening device
CN110808399B (en) Assembly fixture for cooling water pipe of battery module
CN211360454U (en) Pin shaping equipment
CN212399324U (en) Fastening mechanism for manufacturing switching power supply
CN114755565A (en) Test structure and test method for reliability analysis in integrated circuit
CN210501485U (en) Be applied to screw hot melting device of plastics pipe fitting
CN208841222U (en) A kind of automobile injection moulded fittings processing and positioning device
CN217314274U (en) Light focusing and glass bottom plate assembling clamp suitable for athermal AWG chip
CN212397743U (en) Power electrode automatic molding device
CN217319363U (en) Pressing device
CN219698029U (en) Self-alignment positioning device
CN216502050U (en) Cutting forming device is used in electronic equipment processing of high accuracy
CN220307709U (en) Positioning mechanism for chip mounter
CN219235951U (en) IGBT copper bar transfer platform
CN216326238U (en) Automatic assembly device for semiconductor module
CN219981160U (en) Auxiliary frame plate for flexible circuit board production
CN220739986U (en) Assembling jig for semiconductor device
CN216818919U (en) Positioning jig for connector machining and assembling
CN213184298U (en) Low-voltage high-power planar voltage-stabilizing triode
CN216872059U (en) Electricity core location shaping device
CN217719515U (en) Semiconductor discrete device bonding machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant