CN112633166A - Ultrasonic fingerprint identification module, display module and electronic equipment - Google Patents
Ultrasonic fingerprint identification module, display module and electronic equipment Download PDFInfo
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- CN112633166A CN112633166A CN202011536373.2A CN202011536373A CN112633166A CN 112633166 A CN112633166 A CN 112633166A CN 202011536373 A CN202011536373 A CN 202011536373A CN 112633166 A CN112633166 A CN 112633166A
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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Abstract
The invention provides an ultrasonic fingerprint identification module, a display module and electronic equipment, wherein the ultrasonic fingerprint identification module comprises a substrate and an ultrasonic pixel array positioned on the substrate, and the ultrasonic pixel array comprises a plurality of ultrasonic pixel units which are arranged in an array; the ultrasonic pixel unit comprises a circuit structure and an ultrasonic structure which are sequentially positioned on the substrate; the circuit structure is electrically connected with the ultrasonic structure; the ultrasonic pixel unit further comprises an ultrasonic shielding layer, and the ultrasonic shielding layer is located between the ultrasonic structure and the substrate, so that the interference of devices and signals below the ultrasonic structure on ultrasonic signals in the ultrasonic structure can be shielded. And, because the supersound shielding layer is located between supersound structure and the substrate, the supersound shielding layer is located inside the rete stacked structure of ultrasonic fingerprint identification module promptly, consequently, not only shields the effect better, makes the structure of ultrasonic fingerprint identification module more frivolous moreover, more does benefit to the wide application in the display module assembly.
Description
Technical Field
The invention relates to the technical field of display, in particular to an ultrasonic fingerprint identification module, a display module and electronic equipment.
Background
The ultrasonic fingerprint identification module is because of having the light source that need not the display, the ultrasonic wave penetrability is strong, do not receive advantages such as external light influences, security height and anti-soil ability reinforce, and more extensively uses in the display module assembly. However, how to further improve the anti-interference performance of the ultrasonic fingerprint identification module is one of the problems that needs to be solved by those skilled in the art.
Disclosure of Invention
In view of this, the present invention provides an ultrasonic fingerprint identification module, a display module, and an electronic device, so as to improve the anti-interference performance of the ultrasonic fingerprint identification module.
In order to achieve the purpose, the invention provides the following technical scheme:
an ultrasonic fingerprint identification module comprises a substrate and an ultrasonic pixel array positioned on the substrate, wherein the ultrasonic pixel array comprises a plurality of ultrasonic pixel units arranged in an array;
the ultrasonic pixel unit comprises a circuit structure and an ultrasonic structure which are sequentially positioned on the substrate; the circuit structure is electrically connected with the ultrasonic structure;
the ultrasound pixel cell further comprises an ultrasound shielding layer located between the ultrasound structure and the substrate.
A display module comprises a display panel and an ultrasonic fingerprint identification module;
the ultrasonic fingerprint identification module is the ultrasonic fingerprint identification module as described in any one of the above items;
the display panel includes relative demonstration side and non-demonstration side, ultrasonic fingerprint identification module is located display panel's non-demonstration side, just ultrasonic fingerprint identification module's supersound structure orientation display panel sets up.
An electronic device comprises the display module.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
according to the ultrasonic fingerprint identification module, the display module and the electronic equipment, the ultrasonic pixel unit comprises the ultrasonic shielding layer, and the ultrasonic shielding layer is located between the ultrasonic structure and the substrate, so that interference of devices, signals and the like below the ultrasonic structure on ultrasonic signals in the ultrasonic structure can be shielded.
And, because the supersound shielding layer is located between supersound structure and the substrate, the supersound shielding layer is located inside the rete stacked structure of ultrasonic fingerprint identification module promptly, consequently, not only shields the effect better, makes the structure of ultrasonic fingerprint identification module more frivolous moreover, more does benefit to the wide application in the display module assembly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic perspective view of an ultrasonic fingerprint identification module according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the ultrasonic fingerprint recognition module shown in FIG. 1 along a cutting line AA';
fig. 3 is a schematic cross-sectional view of an ultrasonic fingerprint identification module according to another embodiment of the present invention;
fig. 4 is a schematic diagram of a propagation path of an ultrasonic wave in an ultrasonic shielding layer 203 having a plurality of holes according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view illustrating an ultrasonic fingerprint identification module according to another embodiment of the present invention;
fig. 6 is a schematic cross-sectional view illustrating an ultrasonic fingerprint identification module according to another embodiment of the present invention;
fig. 7 is a schematic cross-sectional view illustrating an ultrasonic fingerprint identification module according to another embodiment of the present invention;
fig. 8 is a schematic cross-sectional view illustrating an ultrasonic fingerprint recognition module according to another embodiment of the present invention;
fig. 9 is a schematic cross-sectional view of an ultrasonic fingerprint identification module according to another embodiment of the present invention;
fig. 10 is a schematic cross-sectional view illustrating an ultrasonic fingerprint recognition module according to another embodiment of the present invention;
fig. 11 is a schematic cross-sectional view illustrating an ultrasonic fingerprint recognition module according to another embodiment of the present invention;
FIG. 12 is a schematic diagram illustrating a top-down structure of an ultrasound pixel array according to an embodiment of the present invention;
fig. 13 is a schematic cross-sectional view illustrating a display module according to an embodiment of the invention;
fig. 14 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the above is the core idea of the present invention, and the above objects, features and advantages of the present invention can be more clearly understood. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides an ultrasonic fingerprint identification module, as shown in fig. 1 and fig. 2, fig. 1 is a schematic view of a three-dimensional structure of the ultrasonic fingerprint identification module provided in an embodiment of the present invention, and fig. 2 is a schematic view of a cross-sectional structure of the ultrasonic fingerprint identification module shown in fig. 1 along a cutting line AA', the ultrasonic fingerprint identification module includes a substrate 1 and an ultrasonic pixel array 2 located on the substrate 1, and the ultrasonic pixel array 2 includes a plurality of ultrasonic pixel units 20 arranged in an array. Of course, the ultrasonic fingerprint identification module provided in the embodiment of the present invention further includes a package layer 3 located on the surface of the ultrasonic pixel array 2, and so on, which are not described herein again.
In the embodiment of the present invention, as shown in fig. 2, the ultrasound pixel unit 20 includes a circuit structure 201 and an ultrasound structure 202 sequentially located on the substrate 1, and the circuit structure 201 is electrically connected to the ultrasound structure 202. The circuit structure 201 is configured to input a driving signal to the ultrasonic structure 202, and receive an induction signal output by the ultrasonic structure 202, so as to perform fingerprint identification according to the induction signal; the ultrasonic structure 202 is configured to convert the driving signal into an ultrasonic signal and radiate the ultrasonic signal after receiving the driving signal, convert the ultrasonic signal into an induction signal after receiving the ultrasonic signal reflected by the finger, and transmit the induction signal to the circuit structure 201.
In some embodiments of the present invention, as shown in fig. 2, the ultrasound structure 202 includes a first electrode 2021, a second electrode 2022 and an ultrasound transceiver layer 2023 located between the second electrode 2022 and the first electrode 2021, which are sequentially located on the substrate 1, wherein the first electrodes 2021 of different ultrasound pixel units 20 are not connected, and the second electrodes of different ultrasound pixel units 20 are connected, so that the ultrasound transceiver layer 2023 is driven to emit ultrasound signals with different parameters by different voltage differences between the second electrode 2022 and the first electrode 2021. The ultrasonic transceiver layer 2023 can convert the electrical signal into an ultrasonic signal, and can convert the ultrasonic signal reflected by the finger into an electrical signal, and transmit the electrical signal to the external circuit through the circuit structure 201, so that the external circuit can identify the fingerprint of the finger.
In some embodiments of the present invention, as shown in fig. 2, the circuit structure 201 includes a thin film transistor T including a gate electrode T1, a source electrode T2, a drain electrode T3, and an active layer T4, and of course, a gate insulating layer between the gate electrode T1 and the active layer T4, an interlayer insulating layer between the gate electrode T1 and the source and drain electrodes T2 and T3, and the like.
The source T2 and the drain T3 are located in the same layer. The gate T1 and the source T2 are connected to an external circuit, which controls on and off of the thin film transistor T by inputting a control signal to the gate T1, inputs a driving signal to the source T2, and transmits the driving signal of the source T2 to the drain T3 via the thin film transistor T that is on. The drain T3 is connected to the corresponding first electrode 2021 to charge the first electrode 2021 by transmitting a driving signal to the first electrode 2021, so that the first electrode 2021 has a certain voltage. Of course, the present invention is not limited thereto, and in other embodiments, the circuit structure 201 may further include a plurality of thin film transistors or other devices, which are not described herein again.
In an embodiment of the present invention, as shown in fig. 2, the ultrasound pixel unit 20 further comprises an ultrasound shielding layer 203, and the ultrasound shielding layer 203 is located between the ultrasound structure 202 and the substrate 1. Therefore, the ultrasonic shielding layer 203 can shield the ultrasonic wave signal in the ultrasonic structure 202 from the devices and signals below the ultrasonic structure 202, and enhance the signal-to-noise ratio of the ultrasonic wave signal.
And, because supersound shielding layer 203 is located between supersound structure 202 and the substrate 1, ultrasonic shielding layer 203 is located inside the rete stacked structure of ultrasonic fingerprint identification module promptly, consequently, not only shielding effect is better, makes the structure of ultrasonic fingerprint identification module lighter and thinner moreover, more does benefit to the wide application in the display module assembly.
In some embodiments of the present invention, the ultrasound shielding layer 203 is an ultrasound absorption shielding layer having a porous structure. As shown in fig. 3, fig. 3 is a schematic cross-sectional view of an ultrasonic fingerprint identification module according to another embodiment of the present invention, in which the ultrasonic shielding layer 203 has a plurality of holes 2030, and the holes 2030 has a gas such as air therein. The size and shape of the holes 2030 are not limited to those shown in the drawings. It should be noted that the ultrasound shielding layer 203 in the embodiment of the present invention is not limited to the material having the holes, and other materials capable of absorbing or shielding the sound waves are within the protection scope of the present invention.
As shown in fig. 4, fig. 4 is a schematic diagram of a propagation path of an ultrasonic wave provided by an embodiment of the present invention in an ultrasonic shielding layer 203 having a plurality of holes, and as can be seen from the fact that the acoustic impedance of the gas is 5 orders of magnitude lower than that of the material of the ultrasonic shielding layer 203 and the reflectivity r of the ultrasonic wave at the interface is (Z2-Z1)/(Z2+ Z1), the ultrasonic wave is almost totally emitted at the air-material interface of the holes. When the ultrasonic wave enters the inside of the ultrasonic shielding layer 203 with a plurality of holes, total reflection repeatedly occurs at the air interface of the holes, so that the ultrasonic wave is continuously lost until the energy is exhausted, namely the ultrasonic wave is absorbed after entering the inside of the ultrasonic shielding layer 203 and cannot propagate to the outside of the ultrasonic shielding layer 203, and the ultrasonic shielding layer 203 plays a role in ultrasonic shielding.
Although the ultrasonic shielding layer 203 may also have a cavity therein to shield ultrasonic waves, the ultrasonic shielding layer 203 with a porous structure may have a better supporting function and is more favorable for practical application.
In some embodiments of the present invention, the ultrasound shielding layer 203 is prepared by preparing a porous material mixture, such as mixing ammonium bicarbonate with PMMA (Poly-methyl methacrylate). In a specific embodiment, as shown in fig. 3, a porous material mixture may be coated on the surface of the insulating layer of the gate electrode T1, and then the ultrasonic shield layer 203 having a porous structure may be formed by annealing. Since the ultrasonic shield layer 203 is formed to have a relatively thick thickness, it is preferably formed over the gate T1.
In some embodiments of the present invention, the ultrasonic shielding layer 203 is located between the circuit structure 201 and the ultrasonic structure 202, as shown in fig. 5, fig. 5 is a schematic cross-sectional structure diagram of an ultrasonic fingerprint identification module according to another embodiment of the present invention, and the ultrasonic shielding layer 203 is located between the first electrode 2021 of the ultrasonic structure 202 and the drain T3 of the thin film transistor T in the circuit structure 201. Based on this, the ultrasonic shielding layer 203 can shield not only the interference of the ultrasonic wave signal from the outside and the like below to the ultrasonic structure 202, but also the interference of the electric signal in the circuit structure 201 such as the thin film transistor T to the ultrasonic structure 202, and the interference of the ultrasonic wave signal in the ultrasonic structure 202 to the circuit structure 201.
Of course, in other embodiments, the ultrasound shielding layer 203 may also be located between two adjacent film layers in the circuit structure 201. As shown in fig. 2, the first electrode 2021 of the ultrasonic structure 202 is located at the same layer as the drain T3 of the thin film transistor T in the circuit structure 201, and the drain T3 is electrically connected to the first electrode 2021, that is, the first electrode 2021 of the ultrasonic structure 202 is reused as the drain T3 of the thin film transistor T, so the ultrasonic shielding layer 203 may also be located between the drain T3 and the gate T1 of the thin film transistor T. It should be noted that in other embodiments of the invention, the source T2 may be electrically connected to the first electrode 2021, and the drain T3 is electrically connected to an external circuit, which is not described herein again. Based on this, the ultrasonic shielding layer 203 can shield not only the signal on the gate T1 in the circuit structure 201 such as the thin film transistor T from interfering with the ultrasonic structure 202, but also the ultrasonic signal in the ultrasonic structure 202 from interfering with the gate T1 and the active layer T4 in the circuit structure 201.
Of course, in other embodiments of the present invention, the ultrasound shielding layer 203 may also be located between the gate T1 and the active layer T4 in the circuit structure 201, or between the active layer T4 and the substrate 1, so as to shield the ultrasound structure 202 from the external ultrasonic signals and the like below, which will not be described herein again.
It should be noted that, when the ultrasonic shielding layer 203 is located between the drain electrode T3 and the active layer T4, in some embodiments of the present invention, both the source electrode T2 and the drain electrode T3 are electrically connected to the active layer T4 through the electrical connection structure 2031 penetrating through the ultrasonic shielding layer 203.
As shown in fig. 3, in some embodiments of the invention, the electrical connection structure 2031 includes vias, i.e., the source T2 and the drain T3 are both electrically connected to the active layer T4 through vias penetrating the ultrasonic shielding layer 203. Because the area of the via that penetrates the ultrasonic shield 203 is small, the shielding effect on the ultrasonic shield 203 is less or substantially not affected. However, since the ultrasonic shielding layer 203 has a relatively thick thickness, which results in an excessively deep via, in order to affect other structures when the via is formed by etching, in other embodiments of the present invention, the plurality of vias are connected by using a connection layer in the middle, that is, the electrical connection structure 2031 includes a plurality of vias and a connection layer between the vias.
As shown in fig. 6, fig. 6 is a schematic cross-sectional structure view of an ultrasonic fingerprint identification module according to another embodiment of the present invention, in which the electrical connection structure 2031 includes a first via hole G1, a first connection layer L1, and a second via hole G2 electrically connected in sequence, the first connection layer L1 is at the same layer as the gate T1, the first via hole G1 penetrates through a film between the source T2 and the first connection layer L1, and the second via hole G2 penetrates through a film between the first connection layer L1 and the active layer T4. That is, the first via hole G1 penetrates through the ultrasonic shield layer 203 and the interlayer insulating layer, etc., between the source T2 and the first connection layer L1, the second via hole G2 penetrates through the gate insulating layer, etc., between the first connection layer L1 and the active layer T4, and both the source T2 and the drain T3 are electrically connected to the active layer T4 through the first via hole G1, the first connection layer L1, and the second via hole G2.
It should be noted that, in other embodiments of the present invention, the number of the vias in the electrical connection structure 2031 may be greater than 2, and any two adjacent vias are connected through a connection layer. It should be noted that the first connection layer L1 is the same layer as the gate T1 in fig. 6, but the invention is not limited thereto, and in other embodiments, the first connection layer L1 may also be the same layer as other layers between the drain T3 and the active layer T4.
In another embodiment of the present invention, as shown in fig. 7, fig. 7 is a schematic cross-sectional structure view of an ultrasonic fingerprint identification module according to another embodiment of the present invention, the ultrasonic shielding layer 203 may have an opening region K, the opening region K does not have an ultrasonic shielding layer material therein, and the source T2 and the drain T3 are electrically connected to the active layer T4 through an electrical connection structure 2032 located in the opening region K.
Also, in some embodiments of the present invention, as shown in fig. 7, the electrical connection structure 2032 includes vias, i.e., the source T2 and the drain T3 are electrically connected to the active layer T4 through the vias located in the opening region K. Because the via hole does not need to penetrate through the ultrasonic shielding layer 203, and the depth of the via hole is shallow, the manufacturing difficulty of the via hole and the influence on other structures in the manufacturing process are reduced.
In other embodiments, as shown in fig. 8, fig. 8 is a schematic cross-sectional structure view of an ultrasonic fingerprint identification module according to another embodiment of the present invention, the electrical connection structure 2032 may also include a first via hole G3, a first connection layer L2, and a second via hole G4 electrically connected in sequence, the first connection layer L2 is at the same layer as the gate T1, the first via hole G3 penetrates through a film layer between the source T2 and the first connection layer L2, and the second via hole G4 penetrates through a film layer between the first connection layer L2 and the active layer T4. That is, the first via hole G3 penetrates through the interlayer insulating layer between the source T2 and the first connection layer L2, the second via hole G4 penetrates through the gate insulating layer between the first connection layer L2 and the active layer T4, and the source T2 and the drain T3 are electrically connected to the active layer T4 through the first via hole G3, the first connection layer L2, and the second via hole G4.
In order to facilitate the fabrication of the electrical connection structure 2032 between the source T2 and the active layer T4 and the electrical connection structure 2032 between the drain T3 and the active layer T4, in some embodiments of the invention, the number of the opening regions K disposed corresponding to the source T2 and the drain T3 is 1, and the projection of the opening regions K on the substrate 1 covers the projection of the active layer T4 and the gate T1 on the substrate 1.
Of course, the present invention is not limited thereto, and in other embodiments, as shown in fig. 9, fig. 9 is a schematic cross-sectional structure view of an ultrasonic fingerprint identification module according to another embodiment of the present invention, wherein the opening area K includes a first opening area K1 and a second opening area K2.
The source T2 is electrically connected to the active layer T4 through the electrical connection structure 2033 located in the first opening region K1, and the drain T3 is electrically connected to the active layer T4 through the electrical connection structure 2033 located in the second opening region K2. And an ultrasonic shielding layer is arranged between the first opening region K1 and the second opening region K2, and the projection of the ultrasonic shielding layer on the substrate 1 covers the projection of the grid T1 on the substrate 1 so as to reduce the area of the opening region K and avoid the influence of the overlarge area of the opening region K on the shielding effect of the ultrasonic shielding layer 203.
It should be noted that the electrical connection structure 2033 may include one via, or may include a plurality of vias and a connection layer between adjacent vias, which is not described herein again.
In some embodiments of the present invention, as shown in fig. 7 to 9, an included angle between a sidewall of the ultrasound shielding layer 203 near the opening region K and a surface of the ultrasound shielding layer 203 near the substrate 1 is an acute angle, that is, an included angle α between a sidewall of the ultrasound shielding layer 203 near the opening region K and a bottom surface of the ultrasound shielding layer 203 is an acute angle. Therefore, the deposition of the metal film layers such as the source electrode T2 and the drain electrode T3 can be facilitated, and the uniformity of the deposited metal film layers can be improved.
Since the thickness of the ultrasonic shield layer 203 is thick, the interlayer distance between the source T2, the drain T3 and the active layer T4 is increased, and the parasitic capacitance between the source T2, the drain T3 and the active layer T4 is decreased. Therefore, in order to ensure the magnitude of the parasitic capacitance, on the basis of any of the above embodiments, in some embodiments of the present invention, the projection of the source T2 and/or the drain T3 on the substrate 1 at least partially overlaps with the projection of the gate T1 on the substrate 1. As shown in fig. 10, fig. 10 is a schematic cross-sectional structure view of an ultrasonic fingerprint identification module according to another embodiment of the present invention, taking a source T2 as an example, a projection of the source T2 on the substrate 1 is at least partially overlapped with a projection of the gate T1 on the substrate 1.
In some embodiments of the present invention, as shown in fig. 11, fig. 11 is a schematic cross-sectional structure view of an ultrasonic fingerprint identification module according to another embodiment of the present invention, when the ultrasonic shielding layer 203 has an opening region K, the ultrasonic transmitting/receiving layer 2023 includes a plurality of ultrasonic transmitting/receiving posts S and a plurality of ultrasonic shielding posts P, and the ultrasonic shielding posts P are located between two adjacent ultrasonic transmitting/receiving posts S. And, the projection of the ultrasonic shielding post P on the substrate 1 covers the projection of the opening area K on the substrate 1 to serve as a shielding function at the opening area K by the ultrasonic shielding post P.
On this basis, in some embodiments of the present invention, as shown in fig. 12, fig. 12 is a schematic top view structure diagram of an ultrasound pixel array according to an embodiment of the present invention, and an ultrasound shielding pillar P is located between adjacent ultrasound pixel units 20 to further shield interference between the adjacent ultrasound pixel units 20, so as to improve a signal-to-noise ratio of an ultrasound signal of each ultrasound pixel unit 20, and improve sensitivity of fingerprint detection.
An embodiment of the present invention further provides a display module, as shown in fig. 13, fig. 13 is a schematic cross-sectional structure diagram of the display module according to an embodiment of the present invention, where the display module includes a display panel M and an ultrasonic fingerprint identification module C, where the ultrasonic fingerprint identification module C is the ultrasonic fingerprint identification module according to any one of the embodiments.
In the embodiment of the present invention, the display panel M includes a liquid crystal display panel, an LED display panel, an OLED display panel, and the like. Taking the OLED display panel as an example, the display panel M includes a substrate and a pixel unit array sequentially located on the substrate, where the pixel unit array includes a plurality of pixel units arranged in an array, each pixel unit includes a driving circuit and an OLED light emitting device, the driving circuit includes a driving transistor, and a drain of the driving transistor is connected to an anode of the OLED light emitting device to drive the OLED light emitting device to emit light. Of course, the display panel M may also have a color resistance layer, a touch electrode layer, and the like, which are not described herein again.
Furthermore, as shown in fig. 13, the display panel M includes a display side X1 and a non-display side X2 which are opposite to each other, the ultrasonic fingerprint identification module C is located on the non-display side X2 of the display panel M, that is, the ultrasonic fingerprint identification module C is located between the display panel M and the rear case H, and the ultrasonic structure of the ultrasonic fingerprint identification module C is disposed toward the display panel M.
That is, the ultrasonic signal that ultrasonic structure 202 in the ultrasonic fingerprint identification module C sent can pierce through display panel M outgoing, and ultrasonic signal is by the finger reflection back, can pierce through display panel M again and get back to in ultrasonic structure 202, is absorbed by supersound receiving and dispatching layer 2023 and is converted into the signal of telecommunication, can obtain the fingerprint image according to the different signals of telecommunication of different supersound pixel unit 20 outputs, and then can carry out fingerprint identification.
The embodiment of the invention also provides electronic equipment which comprises the display module. As shown in fig. 14, fig. 14 is a schematic structural diagram of an electronic apparatus according to an embodiment of the present invention, where the display device P includes, but is not limited to, a full-screen mobile phone, a tablet computer, a digital camera, and the like. Alternatively, the display device P is a liquid crystal display device.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (15)
1. An ultrasonic fingerprint identification module is characterized by comprising a substrate and an ultrasonic pixel array positioned on the substrate, wherein the ultrasonic pixel array comprises a plurality of ultrasonic pixel units which are arranged in an array;
the ultrasonic pixel unit comprises a circuit structure and an ultrasonic structure which are sequentially positioned on the substrate; the circuit structure is electrically connected with the ultrasonic structure;
the ultrasound pixel cell further comprises an ultrasound shielding layer located between the ultrasound structure and the substrate.
2. The ultrasonic fingerprint identification module of claim 1, wherein the ultrasonic shielding layer is located between the circuit structure and the ultrasonic structure;
or the ultrasonic shielding layer is positioned between two adjacent film layers in the circuit structure.
3. The ultrasonic fingerprint identification module of claim 1, wherein the ultrasonic shielding layer is an ultrasonic absorption shielding layer with a porous structure.
4. The ultrasonic fingerprint identification module of claim 1, wherein the ultrasonic structure comprises a first electrode, an ultrasonic transceiver layer, and a second electrode sequentially disposed on the substrate;
the circuit structure comprises a thin film transistor, the thin film transistor comprises a grid electrode, a source electrode, a drain electrode and an active layer, the grid electrode and the drain electrode are sequentially positioned on the substrate, the source electrode, the drain electrode and the first electrode are positioned on the same layer, and the source electrode or the drain electrode is electrically connected with the first electrode;
the ultrasonic shielding layer is located between the source and the gate.
5. The ultrasonic fingerprint identification module of claim 4, wherein the source electrode and the drain electrode are electrically connected to the active layer through an electrical connection structure penetrating through the ultrasonic shielding layer.
6. The module according to claim 5, wherein the ultrasonic shielding layer has an opening region, and the source electrode and the drain electrode are electrically connected to the active layer through an electrical connection structure located in the opening region.
7. The ultrasonic fingerprint identification module of claim 6, wherein an included angle between a side wall of the ultrasonic shielding layer near the opening region and a surface of the ultrasonic shielding layer near a side of the substrate is an acute angle.
8. The ultrasonic fingerprint identification module of claim 5 or 6 wherein the electrical connection structure comprises a via.
9. The module according to claim 5 or 6, wherein the electrical connection structure comprises a first via hole, a first connection layer and a second via hole electrically connected in sequence, the first connection layer is on the same layer as the gate, the first via hole penetrates through a film layer between the source and the first connection layer, and the second via hole penetrates through a film layer between the first connection layer and the active layer.
10. The ultrasonic fingerprint identification module of claim 6, wherein the open area comprises a first open area and a second open area;
the source electrode is electrically connected with the active layer through an electric connection structure positioned in the first opening area; the drain electrode is electrically connected with the active layer through an electric connection structure positioned in the second opening area; the projection of the ultrasonic shielding layer between the first opening region and the second opening region on the substrate covers the projection of the grid electrode on the substrate.
11. The ultrasonic fingerprint identification module of claim 6, wherein a projection of the opening area on the substrate covers a projection of the active layer and the gate electrode on the substrate.
12. The ultrasonic fingerprint identification module of claim 6, wherein the ultrasonic transceiver layer comprises a plurality of ultrasonic transceiver posts and a plurality of ultrasonic shielding posts, and the ultrasonic shielding posts are located between two adjacent ultrasonic transceiver posts;
the projection of the ultrasonic shielding column on the substrate covers the projection of the opening area on the substrate.
13. The ultrasonic fingerprint identification module of claim 4, wherein a projection of the source or the drain on the substrate at least partially overlaps a projection of the gate on the substrate.
14. A display module is characterized by comprising a display panel and an ultrasonic fingerprint identification module;
the ultrasonic fingerprint identification module is the ultrasonic fingerprint identification module of any one of claims 1-13;
the display panel includes relative demonstration side and non-demonstration side, ultrasonic fingerprint identification module is located display panel's non-demonstration side, just ultrasonic fingerprint identification module's supersound structure orientation display panel sets up.
15. An electronic device comprising the display module of claim 14.
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| CN113536988A (en) * | 2021-06-29 | 2021-10-22 | 上海天马微电子有限公司 | Ultrasonic fingerprint identification module, detection method thereof and display module |
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| EP3716008A1 (en) * | 2017-11-28 | 2020-09-30 | Samsung Electronics Co., Ltd. | Electronic device having light absorbing member arranged between display panel and ultrasonic sensor |
| CN110112202A (en) * | 2019-05-24 | 2019-08-09 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof |
| CN110201872A (en) * | 2019-06-17 | 2019-09-06 | 京东方科技集团股份有限公司 | A kind of detection panel, display device, detection panel driving method and production method |
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| CN113536988A (en) * | 2021-06-29 | 2021-10-22 | 上海天马微电子有限公司 | Ultrasonic fingerprint identification module, detection method thereof and display module |
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