CN112631006A

CN112631006A - Display device

Info

Publication number: CN112631006A
Application number: CN202010639007.3A
Authority: CN
Inventors: 郭正夏; 颜嘉纬
Original assignee: Innolux Corp
Current assignee: Innolux Corp
Priority date: 2019-10-08
Filing date: 2020-07-06
Publication date: 2021-04-09

Abstract

The present disclosure provides a display device having a display side and comprising: a first substrate and a second substrate. The first substrate has a first surface and a second surface, wherein the first surface is closer to the display side than the second surface. The second substrate is arranged opposite to the first substrate. The second surface is arranged between the first surface and the second substrate, and the area of the first substrate is larger than that of the second substrate. The first substrate has a side surface, and the side surface has a chamfer structure.

Description

Display device

Technical Field

The present disclosure relates to a display device, and more particularly, to a display device having a chamfered structure at an edge of a substrate.

Background

The conventional display device is usually provided with a frame to cover the display panel inside so as to achieve the protection effect. However, as the demands of consumers on the appearance of the display device are gradually increased, the size of the frame is not preferred by consumers. In addition, when an electrostatic discharge (ESD) test is performed on the display device, if external static electricity is not smoothly grounded, the test may not be passed. Therefore, how to solve the above problems is an important issue.

Disclosure of Invention

Some embodiments of the present disclosure provide a display device having a display side and comprising: a first substrate and a second substrate. The first substrate has a first surface and a second surface, wherein the first surface is closer to the display side than the second surface. The second substrate is arranged opposite to the first substrate. The second surface is arranged between the first surface and the second substrate, and the area of the first substrate is larger than that of the second substrate. The first substrate has a side edge, and the side edge has a chamfered structure.

Drawings

The various views and configurations of the present disclosure will be more fully understood from the following detailed description taken in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale and are merely illustrative. In fact, the dimensions of the elements may be arbitrarily expanded or reduced to clearly illustrate the features of the present disclosure. The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:

fig. 1 shows a partial perspective view of a display device according to an embodiment of the disclosure.

Fig. 2 shows a schematic cross-sectional view along the line C-C shown in fig. 1.

Fig. 3 shows a partially enlarged view along the area a shown in fig. 2.

Fig. 4 shows a schematic cross-sectional view of a display module according to an embodiment of the disclosure.

Description of the symbols

10 display module

20: outer frame

30: outer casing

100 display device

101 display side

110 metal part

120: frame

131 adhesive material

132 adhesive material

140 first substrate

141 first surface

142 second surface

143 lateral surface

146 first part

147 second part

148 third part

150 second substrate

161 upper polarizing film

162 lower polarizing film

170 circuit board

171 light emitting element

172 reflecting sheet

173 light guide plate

174 optical film

180 flexible film

181 drive chip

190 conductive structure

200 insulating material

A is a region

d is distance

Angle of theta

Detailed Description

The display device of the embodiment of the present disclosure is explained below. It should be appreciated, however, that the disclosed embodiments provide many suitable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific ways to make and use the disclosure, and do not limit the scope of the disclosure.

The present disclosure may be understood by reference to the following detailed description taken in conjunction with the accompanying drawings, in which it is noted that, for the sake of clarity, the various drawings in the disclosure depict only some of the electronic devices and are not necessarily drawn to scale. In addition, the number and size of the elements in the figures are merely illustrative and are not intended to limit the scope of the present disclosure.

Certain terms are used throughout the description and following claims to refer to particular elements. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that differ in function but not name. In the following description and claims, the terms "including", "comprising", "having", "with", and the like are open-ended terms, and thus should be construed to mean "including, but not limited to …". Thus, when the terms "comprises," "comprising," and/or "having" are used in the description of the present disclosure, they specify the presence of stated features, regions, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, regions, steps, operations, and/or components.

Furthermore, relative terms, such as "below" or "bottom" and "above" or "top," may be used in connection with the embodiments to describe one element's relative relationship to another element in the figures. It will be understood that if the device of the drawings is turned over and turned upside down, elements described as being on the "lower" side will be elements on the "upper" side.

When a corresponding element (e.g., layer or region) is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. On the other hand, when an element is referred to as being "directly on" another element, there is no element present therebetween. In addition, when a component is referred to as being "on" another component, the two components may be located above or below the other component in a top-down relationship, depending on the orientation of the device.

The terms "substantially" and "approximately" are generally to be construed as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range. The quantities given herein are approximate quantities, that is, the meanings of "substantially" and "substantially" are implied in the absence of the recitation of "substantially" or "substantially".

It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, layers and/or sections, these elements, layers and/or sections should not be limited by these terms, but rather should be used to distinguish one element, layer and/or section from another element, layer and/or section. Thus, a first element, layer and/or section discussed below could be termed a second element, layer and/or section without departing from the teachings of some embodiments of the present disclosure. In addition, for the sake of brevity, terms such as "first" and "second" may not be used in the description to distinguish different elements. The first element and/or the second element recited in the claims may be construed as any element consistent with the description thereof, unless such elements are not inconsistent with the scope defined by the appended claims.

In some embodiments of the present disclosure, terms relating to bonding, connecting, such as "connected," "interconnected," and the like, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, unless otherwise defined, wherein another structure is disposed between the two structures. And the terms coupled and connected should also be construed to include both structures being movable or both structures being fixed. In addition, the term "coupled" encompasses any direct and indirect electrical connection.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. In addition, the term "substrate" may include any type of device formed on a substrate or various layers or lines overlying a substrate, such as a substrate on which any desired active devices (e.g., transistors) may be formed, although for simplicity of the drawings, a planar substrate is shown. It is to be understood that the following illustrative embodiments may be implemented by replacing, recombining, and mixing features of several different embodiments without departing from the spirit of the present disclosure.

Fig. 1 shows a partial perspective view of a display device 100 according to an embodiment of the disclosure. It should be noted that the electronic device of the present disclosure may include a display device, an antenna device (e.g., a liquid crystal antenna), a sensing device, a touch electronic device (touch display), a curved electronic device (curved display), or a non-rectangular electronic device (free shape display), but is not limited thereto. The electronic device can be a bendable or flexible electronic device. The electronic device may include liquid crystal, light emitting diode, fluorescent (fluorescent), phosphorescent (phosphor), other suitable display medium, or a combination thereof, but is not limited thereto. The light emitting diode may include, for example, an Organic Light Emitting Diode (OLED), a submillimeter light emitting diode (mini LED), a micro light emitting diode (micro LED), or a quantum dot light emitting diode (QD, including, for example, QLED and QDLED), other suitable materials, or any combinations thereof, but is not limited thereto. The display device may include, for example, a tiled display device, but is not so limited. It should be noted that the electronic device can be any permutation and combination of the foregoing, but not limited thereto. In addition, the exterior of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have a peripheral system such as a drive system, a control system, a light source system, a shelf system …, etc. to support the display device, the antenna device, or the tile device. The disclosure will be described below in terms of a display device, but the disclosure is not limited thereto.

As shown in fig. 1, the display device 100 includes a metal member 110, a frame 120 disposed on the metal member 110, a first substrate 140 disposed on the frame 120, and a flexible film 180 having a driving chip 181. The driving chip 181 may be used to control the operation of the display device 100. In addition, the display device 100 also includes a conductive structure 190 disposed to be electrically connected to the metal element 110. In some embodiments, the conductive structure 190 and the metal element 110 can serve as a ground path of the display device 100, so that the conductive structure 190 is not electrically connected to the driving chip 181 of the flexible film 180. In the present embodiment, the conductive structure 190 does not contact the driving chip 181. Thus, the probability of failure of the display device 100 can be reduced. The complete structure of the display device 100 will be further described with reference to fig. 2.

Fig. 2 shows a schematic cross-sectional view along the line C-C shown in fig. 1. As shown in fig. 2, the display device 100 further includes a second substrate 150 disposed on the frame 120. The metal member 110 may be used to support the frame 120, and the frame 120 may be used to support the first substrate 140 and the second substrate 150. In the present embodiment, the first substrate 140 and the second substrate 150 have a normal direction, which is parallel to the Z direction. The X and Y directions are perpendicular to the normal directions of the first and

second substrates

140 and 150. In addition, the display device 100 has a display side 101, wherein the light of the display device 100 can be emitted through the display side 101, i.e. the user can observe the light emitted by the display device 100 or the display image on the display side 101. In the present embodiment, the metal member 110 is disposed with respect to the display side 101 of the display device 100, but is not limited thereto.

For example, the material of the metal element 110 may include, but is not limited to, a metal, any other suitable conductive material, or a combination thereof. In addition, a circuit board 170, a light emitting device 171, a reflective sheet 172, a light guide plate 173 and/or an optical film 174 may be selectively disposed on the metal component 110, the light emitting device 171 may be disposed on the circuit board 170 and electrically connected to the circuit board 170 to provide a backlight source, the light guide plate 173 may be disposed on the reflective sheet 172, and the optical film 174 may be disposed on the light guide plate 173. Light emitted from the light emitting element 171 can be transmitted through the reflective sheet 172, the light guide plate 173, and the optical film 174 and irradiated to the display side 101 of the display device 100. In the present embodiment, the light emitting elements 171 are disposed beside the light guide plate 173, that is, the light emitting elements 171 may not overlap the light guide plate 173 when viewed from a direction (Z direction) perpendicular to the display side 101. In detail, the display device 100 in this embodiment includes a side-in type backlight structure, but the disclosure is not limited thereto. In other embodiments, the display device 100 may also be a direct-type backlight structure, for example, in the cross-sectional view, the reflective sheet 172 may be disposed between the light emitting element 171 and the circuit board 170, but the disclosure is not limited thereto. Further, although the optical film 174 is illustrated as a single-layer structure in the present embodiment, it is not limited thereto. In other embodiments, optical film 174 may comprise a multilayer structure, for example, optical film 174 may comprise, but is not limited to, a diffuser, a prism sheet, and/or a brightness enhancement film.

For example, the first substrate 140 may be a Thin-Film Transistor (TFT) substrate, which may be a flexible substrate or an inflexible substrate, and the material of the first substrate 140 may include, for example, glass, sapphire, ceramic, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethersulfone (PES), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), or Polyarylate (PAR), other suitable materials, or a combination thereof, but is not limited thereto. The first substrate 140 has a first surface 141, a second surface 142 and a side surface 143, wherein the side surface 143 connects the first surface 141 and the second surface 142. In the present embodiment, the first surface 141 faces the display side 101 of the display device 100, i.e., the first surface 141 is closer to the display side 101 than the second surface 142. The first substrate 140 may include a pixel array or a light emitting diode, but the disclosure is not limited thereto.

In this embodiment, the second substrate 150 may be a light-filtering substrate, but is not limited thereto, and in some implementations, the second substrate 150 may be selectively provided with a light-shielding layer (not shown), a color filter layer and/or a light-converting layer (e.g., quantum dot material). In other embodiments, the second substrate 150 may be an encapsulation layer to prevent moisture erosion, so as to improve the display quality of the display device 100 and improve the reliability of the display device 100. It is understood that in some embodiments, a liquid crystal layer (not shown) may be disposed between the first substrate 140 and the second substrate 150. In some embodiments, the liquid crystal layer may include nematic liquid crystal (nematic), smectic liquid crystal (cholesteric), cholesteric liquid crystal (cholesteric), Blue phase liquid crystal (Blue phase), or any other suitable liquid crystal material. In this embodiment, the second surface 142 of the first substrate 140 is between the first surface 141 of the first substrate 140 and the second substrate 150.

In addition, an upper polarizing film 161 may be disposed on the first substrate 140, and a lower polarizing film 162 may be disposed on the second substrate 150, that is, the first substrate 140 and the second substrate 150 are disposed between the upper polarizing film 161 and the lower polarizing film 162, and the second substrate 150 is disposed between the lower polarizing film 162 and the first substrate 150. In the present embodiment, the lower polarizing film 162 can be disposed above the frame 120. In the present embodiment, the area of the first substrate 140 is larger than that of the second substrate 150, but is not limited thereto. In some embodiments, the area of the second substrate 150 may be larger than that of the lower polarizing film 162, and the area of the first substrate 140 may be larger than that of the upper polarizing film 161, but is not limited thereto. In some embodiments, the upper polarizing film 161 may almost cover the first surface 141 of the first substrate 140 up to the side surface 143. It is to be noted that the areas of the above-described first substrate 140, second substrate 150, upper polarizing film 161, and lower polarizing film 162 are, for example, the maximum areas measured along a plane (e.g., X-Y plane) parallel to the display side 101, or the maximum areas measured, for example, as viewed in a plan view direction (e.g., Z direction). It should be understood that although the upper and lower

polarizing films

161 and 162 are simultaneously shown in the present embodiment, a person skilled in the art should be able to adjust the number and positions of the upper and lower

polarizing films

161 and 162 according to the requirement. In some embodiments, a plurality of upper polarizing films 161 and/or a plurality of lower polarizing films 162 may be disposed. In some embodiments, the upper polarizing film 161 and/or the lower polarizing film 162 may be omitted.

As shown in fig. 2, an adhesive 131 may be disposed on the frame 120 to bond the second substrate 150 to the frame 120. In some embodiments, a portion of the lower polarizer 162 may be disposed between the adhesive 131 and the second substrate 150 to achieve a good bonding effect, but is not limited thereto. In some embodiments, the upper surface of the adhesive 131 is in contact with the second substrate 150 and the lower polarizer 162, but not limited thereto.

In addition, the display device 100 further includes a flexible film 180 and a conductive structure 190, wherein a portion of the metal element 110 may be disposed between the first substrate 140 and a portion of the flexible film 180, and the flexible film 180 is disposed on the second surface 142 of the first substrate 140 and may be bent toward the second substrate 150, or may be bent toward the opposite side 101 of the display side, and the conductive structure 190 is disposed on the flexible film 180, and in some embodiments, the conductive structure 190 may be disposed on an outer surface of the flexible film 180, that is, at least a portion of the flexible film 180 is disposed between the conductive structure 190 and the frame 120. In this embodiment, the flexible film 180 may be, for example, a Chip On Film (COF) or any other component capable of transmitting an electrical signal, but is not limited thereto. In the present disclosure, the first substrate 140 provided with the flexible film 180 is disposed closer to the viewer, and the flexible film 180 is disposed on the second surface 142 of the first substrate 140, so that the upper polarizing film 161 can almost cover the first surface 141 of the first substrate 140, and through the above design, an almost frameless or narrow frame effect can be achieved, so that the display device 100 is more beautiful.

The conductive structure 190 is electrically connected to the metal element 110. In some embodiments, the conductive structure 190 may be in direct contact with the metal piece 110, but is not limited thereto. In other words, the conductive structure 190 and the metal element 110 can form a conductive path, so that external static electricity can be effectively grounded through the conductive path, and the probability of electrostatic damage can be effectively reduced. In addition, in some embodiments, the display device 100 may be provided with a plurality of conductive structures 190 electrically connected to the metal element 110. By providing a plurality of conductive structures 190, the average conductive path can be effectively shortened, and a better grounding effect can be obtained.

Fig. 3 shows a partially enlarged view along the area a shown in fig. 2. As shown in fig. 3, the side surface 143 of the first substrate 140 includes a first portion 146, a second portion 147, and a third portion 148, wherein the second portion 147 is located between the first portion 146 and the third portion 148. In this embodiment, at least one of the first portion 146 and the third portion 148 is a chamfered structure, and the second portion 147 is a plane parallel to the Y-Z plane connecting the chamfered structures. For example, the chamfered structure of the first portion 146 and the third portion 148 may be an inclined plane, as viewed from the display side 101 (i.e., along the z-direction) of the display device 100, but is not limited thereto. As shown in fig. 3, the second portion 147 is substantially perpendicular to the first surface 141 and/or the second surface 142, and the first portion 146 and the third portion 148 are not perpendicular to the first surface 141 and/or the second surface 142. That is, a portion of the side surface 143 of the present embodiment may not be perpendicular to the first surface 141 and/or the second surface 142. Also the first portion 146 and the third portion 148 are not parallel to the second portion 147. With continued reference to fig. 3, the first portion 146 of the side surface 143 and the extension line of the first surface 141 form an included angle θ, wherein the included angle θ may be in a range from about 15 ° to 45 ° (15 ° ≦ θ ≦ 45 °). In some embodiments, the included angle θ can be in a range from about 20 ° to 40 ° (20 ° ≦ θ ≦ 40 °), but is not limited thereto.

In some embodiments, the maximum distance d between the second portion 147 and the edge of the upper polarizing film 161 nearest to the second portion 147 in the X direction (i.e., the maximum width of the first portion 146 in the X direction) may be in a range of about 0.05mm to about 0.3mm (0.05mm ≦ d ≦ 0.3mm), but is not limited thereto. In some embodiments, the maximum distance d between the second portion 147 and the edge of the upper polarizing film 161 nearest to the second portion 147 in the X direction may be in a range of about 0.15mm to about 0.2mm (0.15mm ≦ d ≦ 0.2mm), but is not limited thereto. By providing the first portion 146 as a chamfered structure, the display device 100 can be more attractive, or the first substrate 140 is less likely to scratch a user or other devices. It should be appreciated that in other embodiments, the first portion 146 and the third portion 148 may be provided with a curved surface or a rounded configuration or any other suitable configuration to provide an aesthetic or otherwise non-marring effect.

In addition, in some implementations, the first portion 146 and the third portion 148 may be formed after physical processing (e.g., diamond cutting wheel, laser cutting, or mechanical grinding), and thus the roughness of the first portion 146 and the roughness of the third portion 148 may not be the same, and the roughness of the first portion 146 and the third portion 148 may not be the same as the roughness of the second portion 147.

In addition, the display device 100 may further include a sealant 132 filled in a gap between the third portion 148 and the flexible film 180. By configuring the third portion 148 as a chamfered structure, the contact area between the adhesive 132 and the first substrate 140 can be increased, and the adhesion of the adhesive 132 can be improved. In some embodiments, the glue 132 may extend to the second portion 147, i.e., the glue 132 contacts the second portion 147 and the third portion 148. In some embodiments, the adhesive 132 may further extend to the second surface 142 of the first substrate 140 and contact at least a portion of the second surface 142 and at least a portion of the flexible film 180. In some embodiments, one end of the conductive structure 190 may be covered by the adhesive 132. Through the arrangement of the adhesive material 132, each element of the display device 100 can be bonded, thereby improving the structural strength of the display device 100. For example, the material of the glue 132 may include an ultraviolet curable glue, other suitable adhesive materials, or a combination thereof, but is not limited thereto. In other embodiments, the glue 132 may not be in contact with the first portion 146.

In some embodiments, the assembly process of the display device 100 includes bonding the flexible film 180 to the first substrate 140, and filling the adhesive 132 between the flexible film 180 and the first substrate 140. Subsequently, the first substrate 140 (and the second substrate 150) is bonded to the frame 120 (e.g., through the adhesive material 131), and the conductive structure 190 is disposed on the flexible film 180 and in contact with the metal element 110. Finally, a protective housing may be optionally disposed outside the display device 100, wherein the housing may be made of, for example, metal or any other suitable material, but is not limited thereto. It should be understood that the assembling process of the display device 100 is only an example, and those skilled in the art of the present disclosure can adjust the assembling process as needed, and will not be described in detail below.

Fig. 4 shows a schematic cross-sectional view of a display module 10 according to an embodiment of the disclosure. As shown in fig. 4, the display module 10 may include a display device (e.g., the display device 100 shown in fig. 2), and a housing 20 and a casing 30 disposed outside the display device. For example, the material of the outer frame 20 and the housing 30 may include metal, plastic, other suitable materials, or a combination thereof, but is not limited thereto. By the arrangement of the outer frame 20 and the housing 30, the elements of the internal display device can be protected, and the impact from the outside can be reduced. In some embodiments, a portion of the outer frame 20 may not overlap with the first substrate 140, but is not limited thereto, when viewed from a direction perpendicular to the display side 101. In some embodiments, an insulating material 200 is disposed on the outer frame 20. For example, the material of the insulating material 200 includes MYLAR (MYLAR), other suitable material, or a combination of the foregoing, but is not limited thereto. The insulating material 200 can ensure insulation between the outer frame 20 and the metal member 110.

In addition, in some embodiments, there may be a gap between the conductive structure 190 and the outer frame 20 and/or between the outer frame 20 and the housing 30, so that a tolerance (tolerance) between the components can be immediately responded to improve an assembly yield, but the disclosure is not limited thereto. In some embodiments, the conductive structure 190 and the frame 20 and/or the frame 20 and the housing 30 can be directly contacted to reduce the size of the display module 10.

In summary, the embodiments of the present disclosure provide a display device having a chamfer structure at an edge of a substrate. By means of the arrangement of the chamfering structure, the display device can be more attractive, or the display device is not easy to scratch a user. In addition, the substrate provided with the flexible film is arranged closer to a viewer, and the polarizing film can be almost spread on one surface of the substrate, so that the effect of almost no frame or narrow frame can be achieved, and the ornamental value of the display device is improved. In addition, the display device provided by the embodiment of the disclosure is further provided with a conductive structure in contact with a metal piece (such as a back plate), so that the probability of electrostatic damage can be effectively reduced.

Although embodiments of the present disclosure and their advantages have been disclosed above, it should be understood that various changes, substitutions and alterations can be made herein by those skilled in the art without departing from the spirit and scope of the disclosure. Moreover, the scope of the present disclosure is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but rather, the present disclosure will suggest themselves to those skilled in the art having the benefit of this disclosure, and is intended to cover such modifications as would normally occur to one skilled in the art to which this disclosure pertains, if not expressly written herein, to the extent that such modifications are capable of being carried out in the practice of the present disclosure, or the equivalent of such modifications. Accordingly, the scope of the present disclosure includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described in the specification, in any combination, and do not depart from the spirit or scope of the invention. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present disclosure also includes combinations of the respective claims and embodiments.

Claims

1. A display device having a display side and comprising:

a first substrate having a first surface and a second surface, wherein the first surface is closer to the display side than the second surface; and

a second substrate disposed opposite to the first substrate, the second surface being between the first surface and the second substrate, and the area of the first substrate being larger than that of the second substrate in a plan view direction,

the first substrate has a side surface, and the side surface has a chamfer structure.

2. The display device of claim 1, further comprising a flexible film disposed on the second surface.

3. The display device according to claim 2, wherein the flexible film is bent toward the second substrate.

4. The display device of claim 2, further comprising a conductive structure disposed on the flexible film.

5. The display device according to claim 4, further comprising a metal element, wherein a portion of the metal element is disposed between the first substrate and a portion of the flexible film.

6. The display device according to claim 5, wherein the conductive structure is electrically connected to the metal member.

7. The display device of claim 1, further comprising a glue, wherein the side surface comprises a first portion, a second portion and a third portion, the second portion is located between the first portion and the third portion, and the glue contacts the second portion and the third portion.

8. The display device of claim 7, further comprising a flexible film disposed on the second surface, wherein the adhesive contacts at least a portion of the second surface and at least a portion of the flexible film.

9. The display device of claim 1, further comprising a frame and an adhesive, wherein the frame is bonded to the second substrate through the adhesive.

10. The display device of claim 9, further comprising a polarizing film, the second substrate being disposed between the polarizing film and the first substrate, wherein the adhesive material contacts the second substrate and the polarizing film.