CN112625400A - Low dielectric loss resin for coaxial test package socket - Google Patents
Low dielectric loss resin for coaxial test package socket Download PDFInfo
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- CN112625400A CN112625400A CN202011509028.XA CN202011509028A CN112625400A CN 112625400 A CN112625400 A CN 112625400A CN 202011509028 A CN202011509028 A CN 202011509028A CN 112625400 A CN112625400 A CN 112625400A
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- low dielectric
- resin
- epoxy resin
- mixture
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- 229920005989 resin Polymers 0.000 title claims abstract description 24
- 239000011347 resin Substances 0.000 title claims abstract description 24
- 238000012360 testing method Methods 0.000 title claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000012745 toughening agent Substances 0.000 claims abstract description 10
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 18
- 239000011324 bead Substances 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 6
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 3
- ZMAMKNPVAMKIIC-UHFFFAOYSA-N (5-benzyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC=1N=C(C=2C=CC=CC=2)NC=1CC1=CC=CC=C1 ZMAMKNPVAMKIIC-UHFFFAOYSA-N 0.000 claims description 3
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 claims description 3
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 3
- XSXYESVZDBAKKT-UHFFFAOYSA-N 2-hydroxybenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1O XSXYESVZDBAKKT-UHFFFAOYSA-N 0.000 claims description 3
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 claims description 3
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 claims description 3
- DFATXMYLKPCSCX-UHFFFAOYSA-N 3-methylsuccinic anhydride Chemical compound CC1CC(=O)OC1=O DFATXMYLKPCSCX-UHFFFAOYSA-N 0.000 claims description 3
- ABFSXLLAQAXSFU-UHFFFAOYSA-N 4-(1H-imidazol-2-yl)-5-phenylbenzene-1,2-diol Chemical compound C1(=CC=CC=C1)C1=C(C=C(C(=C1)O)O)C=1NC=CN1 ABFSXLLAQAXSFU-UHFFFAOYSA-N 0.000 claims description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- FLISWPFVWWWNNP-BQYQJAHWSA-N dihydro-3-(1-octenyl)-2,5-furandione Chemical compound CCCCCC\C=C\C1CC(=O)OC1=O FLISWPFVWWWNNP-BQYQJAHWSA-N 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000012510 hollow fiber Substances 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 claims description 3
- 125000001624 naphthyl group Chemical group 0.000 claims description 3
- 239000004843 novolac epoxy resin Substances 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 abstract description 10
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract 1
- 238000002955 isolation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a low dielectric and loss resin for a coaxial test packaging socket, which comprises the following components in parts by weight: 30-60 parts of epoxy resin, 5-30 parts of a toughening agent, 10-40 parts of a curing agent, 1-5 parts of a latent accelerator, 1-5 parts of a silane coupling agent, 30-70 parts of a low dielectric filler and 1-5 parts of a defoaming agent. The low-dielectric and lossy resin has the advantages of low dielectric constant and dielectric loss, good fluidity, easy encapsulation, high metal adhesion, good mechanical property and easy machining, meets the high-frequency test requirement of a chip, and can be used for a coaxial test packaging socket.
Description
Technical Field
The invention belongs to the technical field of resin, and particularly relates to low-dielectric loss resin for a coaxial test packaging socket.
Background
With digital high definition 4K, the communication frequency is higher and higher, the carrier frequency of the chip is higher and higher, and the requirement on the anti-interference capability between signals is higher and higher, wherein the isolation requirement between a channel and a channel is-40 dB or lower, and the traditional test socket can not meet the existing test of the chip performance gradually due to larger crosstalk between the channel and the channel, so that the semiconductor chip test socket with the impedance matching structure has wider and wider prospects.
Coaxial test socket need punch earlier the back encapsulating and secondary operation shaping vestibule, and along with the Pitch of customer's chip is littleer and more, the pinhole diameter on the coaxial socket is littleer and more, and the very high isolation of chip function requirement itself, this is just to the encapsulation resin of coaxial test socket have severer performance requirement.
The potting resin of the coaxial test socket needs to have good fluidity, high adhesion to metal, high hardness and excellent impact resistance, and simultaneously needs to have low dielectric constant and dielectric loss as much as possible, and the low-dielectric and low-loss resin on the market at present cannot simultaneously meet the performance requirements.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a low-dielectric loss resin for a coaxial test package socket.
In order to achieve the purpose, the invention provides the following technical scheme: the low dielectric loss resin for the coaxial test packaging socket comprises the following components in parts by weight: 30-60 parts of epoxy resin, 5-30 parts of a toughening agent, 10-40 parts of a curing agent, 1-5 parts of a latent accelerator, 1-5 parts of a silane coupling agent, 30-70 parts of a low dielectric filler and 1-5 parts of a defoaming agent.
Preferably, the epoxy resin is one or a mixture of more of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, alicyclic epoxy resin, biphenyl epoxy resin, naphthalene ring structure epoxy resin, hydrogenated epoxy resin and organosilicon epoxy resin.
Preferably, the toughening agent is one or a mixture of more of a butadiene elastomer system, an organosilicon modified system and a rubber system.
Preferably, the curing agent is one or a mixture of more of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl succinic anhydride, octenyl succinic anhydride, dodecenyl succinic anhydride, methyl nadic anhydride, methyl tetrahydrophthalic anhydride or methyl hexahydrophthalic anhydride.
Preferably, the latent accelerator is one or a mixture of more of heptadecyl imidazole, 2-phenyl-4, 5-dihydroxyphenyl imidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazole, 2-phenyl-4-benzyl-5-hydroxymethyl imidazole, triphenylphosphine, aluminum acetylacetonate, cobalt naphthenate and salicyloyl hydrazine.
Preferably, the silane coupling agent is one or a mixture of more of KH-540, KH-550, KH-560, KH-570 and KH-792.
Preferably, the low dielectric filler is one or a mixture of several of hollow glass beads, hollow ceramic beads, hollow fibers, silicon carbide, polytetrafluoroethylene powder and polypropylene powder.
Compared with the prior art, the invention has the beneficial effects that: the low-dielectric and low-loss resin for the coaxial test packaging socket provided by the invention has low dielectric constant and low dielectric loss, can meet the high-frequency test requirement of a chip, and is easy to encapsulate and process.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the low dielectric loss resin for the coaxial test packaging socket comprises the following components in parts by weight: 35 parts of epoxy resin, 8 parts of toughening agent, 16 parts of curing agent, 3 parts of latent accelerator, 2 parts of silane coupling agent, 34 parts of low dielectric filler and 2 parts of defoaming agent.
Example 2:
the low dielectric loss resin for the coaxial test packaging socket comprises the following components in parts by weight: 30 parts of epoxy resin, 6 parts of toughening agent, 15 parts of curing agent, 3 parts of latent accelerator, 2.5 parts of silane coupling agent, 42 parts of low dielectric filler and 1.5 parts of defoaming agent.
Example 3:
the low dielectric loss resin for the coaxial test packaging socket comprises the following components in parts by weight: 38 parts of epoxy resin, 8 parts of toughening agent, 16 parts of curing agent, 3 parts of latent accelerator, 1.5 parts of silane coupling agent, 32 parts of low dielectric filler and 1.5 parts of defoaming agent.
The parts by weight of the components of examples 1-3 are shown in Table 1.
| Epoxy resin | Toughening agent | Curing agent | Latency accelerator | Silane coupling agent | Low dielectric filler | Defoaming agent | |
| Example 1 | 35 | 8 | 16 | 3 | 2 | 34 | 2 |
| Example 2 | 30 | 6 | 15 | 3 | 2.5 | 42 | 1.5 |
| Example 3 | 38 | 8 | 16 | 3 | 1.5 | 32 | 1.5 |
TABLE 1
Specifically, the epoxy resin is one or a mixture of more of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, alicyclic epoxy resin, biphenyl epoxy resin, naphthalene ring structure epoxy resin, hydrogenated epoxy resin and organosilicon epoxy resin.
Specifically, the toughening agent is one or a mixture of more of a butadiene elastomer system, an organosilicon modification system and a rubber system.
Specifically, the curing agent is one or a mixture of several of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl succinic anhydride, octenyl succinic anhydride, dodecenyl succinic anhydride, methyl nadic anhydride, methyl tetrahydrophthalic anhydride or methyl hexahydrophthalic anhydride.
Specifically, the latent accelerator is one or a mixture of more of heptadecyl imidazole, 2-phenyl-4, 5-dihydroxyphenyl imidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazole, 2-phenyl-4-benzyl-5-hydroxymethyl imidazole, triphenylphosphine, aluminum acetylacetonate, cobalt naphthenate and salicyloyl hydrazine.
Specifically, the silane coupling agent is one or a mixture of more of KH-540, KH-550, KH-560, KH-570 and KH-792.
Specifically, the low dielectric filler is one or a mixture of several of hollow glass beads, hollow ceramic beads, hollow fibers, silicon carbide, polytetrafluoroethylene powder and polypropylene powder.
The finished products prepared in the examples were subjected to the following performance tests, the results of which are shown in table 2:
table 2 performance test data:
| dielectric constant | Dielectric loss | Hardness of | Adhesion force | Impact toughness | |
| Example 1 | 2.8 | 0.0034 | 89D | First stage | 54Kj/m2 |
| Example 2 | 2.7 | 0.003 | 90D | First stage | 50Kj/m2 |
| Example 3 | 2.85 | 0.0035 | 87D | First stage | 56Kj/m2 |
TABLE 2
As can be seen from Table 2, the resin of the invention has low dielectric constant and dielectric loss, excellent adhesion, and convenient processing, and can be used for a chip coaxial test packaging socket.
In summary, the following steps: the low-dielectric and low-loss resin for the coaxial test packaging socket provided by the invention has low dielectric constant and low dielectric loss, can meet the high-frequency test requirement of a chip, and is easy to encapsulate and process.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (7)
1. A low dielectric loss resin for a coaxial test package socket, characterized in that: the formula comprises the following components in parts by weight: 30-60 parts of epoxy resin, 5-30 parts of a toughening agent, 10-40 parts of a curing agent, 1-5 parts of a latent accelerator, 1-5 parts of a silane coupling agent, 30-70 parts of a low dielectric filler and 1-5 parts of a defoaming agent.
2. The low dielectric, lossy resin of claim 1, wherein: the epoxy resin is one or a mixture of more of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, alicyclic epoxy resin, biphenyl epoxy resin, naphthalene ring structure epoxy resin, hydrogenated epoxy resin and organic silicon epoxy resin.
3. The low dielectric, lossy resin of claim 1, wherein: the toughening agent is one or a mixture of more of a butadiene elastomer system, an organic silicon modified system and a rubber system.
4. The low dielectric, lossy resin of claim 1, wherein: the curing agent is one or a mixture of more of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl succinic anhydride, octenyl succinic anhydride, dodecenyl succinic anhydride, methyl nadic anhydride, methyl tetrahydrophthalic anhydride or methyl hexahydrophthalic anhydride.
5. The low dielectric, lossy resin of claim 1, wherein: the latent accelerator is one or a mixture of more of heptadecyl imidazole, 2-phenyl-4, 5-dihydroxyphenyl imidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazole, 2-phenyl-4-benzyl-5-hydroxymethyl imidazole, triphenylphosphine, aluminum acetylacetonate, cobalt naphthenate and salicyloyl hydrazine.
6. The low dielectric, lossy resin of claim 1, wherein: the silane coupling agent is one or a mixture of more of KH-540, KH-550, KH-560, KH-570 and KH-792.
7. The low dielectric, lossy resin of claim 1, wherein: the low dielectric filler is one or a mixture of several of hollow glass beads, hollow ceramic beads, hollow fibers, polytetrafluoroethylene powder and polypropylene powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011509028.XA CN112625400A (en) | 2020-12-18 | 2020-12-18 | Low dielectric loss resin for coaxial test package socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011509028.XA CN112625400A (en) | 2020-12-18 | 2020-12-18 | Low dielectric loss resin for coaxial test package socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112625400A true CN112625400A (en) | 2021-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011509028.XA Pending CN112625400A (en) | 2020-12-18 | 2020-12-18 | Low dielectric loss resin for coaxial test package socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112625400A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115742523A (en) * | 2022-10-28 | 2023-03-07 | 山东森荣新材料股份有限公司 | Manufacturing process of ultralow dielectric microwave composite substrate material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111363308A (en) * | 2020-03-27 | 2020-07-03 | 顺德职业技术学院 | Epoxy modified low-dielectric fluorine-containing polyphenyl ether coating and high-frequency high-speed copper-clad plate prepared from same |
| CN111440575A (en) * | 2020-03-27 | 2020-07-24 | 顺德职业技术学院 | Special low-dielectric high-thermal-conductivity underfill adhesive for chip packaging |
-
2020
- 2020-12-18 CN CN202011509028.XA patent/CN112625400A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111363308A (en) * | 2020-03-27 | 2020-07-03 | 顺德职业技术学院 | Epoxy modified low-dielectric fluorine-containing polyphenyl ether coating and high-frequency high-speed copper-clad plate prepared from same |
| CN111440575A (en) * | 2020-03-27 | 2020-07-24 | 顺德职业技术学院 | Special low-dielectric high-thermal-conductivity underfill adhesive for chip packaging |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115742523A (en) * | 2022-10-28 | 2023-03-07 | 山东森荣新材料股份有限公司 | Manufacturing process of ultralow dielectric microwave composite substrate material |
| CN115742523B (en) * | 2022-10-28 | 2023-07-07 | 山东森荣新材料股份有限公司 | Manufacturing process of ultralow dielectric microwave composite substrate material |
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Application publication date: 20210409 |