CN112608688A - UV adhesive and application thereof - Google Patents
UV adhesive and application thereof Download PDFInfo
- Publication number
- CN112608688A CN112608688A CN202011515921.3A CN202011515921A CN112608688A CN 112608688 A CN112608688 A CN 112608688A CN 202011515921 A CN202011515921 A CN 202011515921A CN 112608688 A CN112608688 A CN 112608688A
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- Prior art keywords
- acrylate
- methyl
- parts
- monomer
- agent
- Prior art date
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- Pending
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- 239000000853 adhesive Substances 0.000 title claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 22
- 239000000178 monomer Substances 0.000 claims abstract description 28
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 16
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 5
- 239000011324 bead Substances 0.000 claims abstract description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 4
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000001336 alkenes Chemical class 0.000 claims abstract description 4
- 239000012767 functional filler Substances 0.000 claims abstract description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920000728 polyester Polymers 0.000 claims abstract description 4
- 229920000570 polyether Polymers 0.000 claims abstract description 4
- 229920000098 polyolefin Polymers 0.000 claims abstract description 4
- 239000004814 polyurethane Substances 0.000 claims abstract description 4
- 229920002635 polyurethane Polymers 0.000 claims abstract description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims abstract 10
- 229910000077 silane Inorganic materials 0.000 claims abstract 2
- -1 silane modified (methyl) acrylate Chemical class 0.000 claims abstract 2
- 239000003999 initiator Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000007822 coupling agent Substances 0.000 claims description 9
- 229910021485 fumed silica Inorganic materials 0.000 claims description 9
- 239000012760 heat stabilizer Substances 0.000 claims description 7
- 239000013008 thixotropic agent Substances 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000002318 adhesion promoter Substances 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 150000003254 radicals Chemical class 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 abstract description 3
- 238000002834 transmittance Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 16
- 238000003756 stirring Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229940119545 isobornyl methacrylate Drugs 0.000 description 2
- 230000001795 light effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- NWAHZAIDMVNENC-UHFFFAOYSA-N octahydro-1h-4,7-methanoinden-5-yl methacrylate Chemical compound C12CCCC2C2CC(OC(=O)C(=C)C)C1C2 NWAHZAIDMVNENC-UHFFFAOYSA-N 0.000 description 2
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- RZLXRFDFCORTQM-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCCn1c(=O)n(CCO)c(=O)n(CCO)c1=O Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCCn1c(=O)n(CCO)c(=O)n(CCO)c1=O RZLXRFDFCORTQM-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a UV adhesive which comprises the following components in parts by weight: 20-80 parts of UV oligomer, 10-60 parts of UV functional monomer, 1-5 parts of photoinitiator, 0.1-5 parts of auxiliary agent and 1-10 parts of functional filler. The UV oligomer comprises one or a combination of polyurethane (methyl) acrylate, polyester (methyl) acrylate, polyether (methyl) acrylate, epoxy (methyl) acrylate, polyolefin modified (methyl) acrylate, silane modified (methyl) acrylate and pure acrylate. The UV functional monomer is an active monomer which can be initiated to polymerize by a photoinitiator, and comprises one or a combination of (methyl) acrylic acid monomer, olefin monomer, vinyl ether monomer and allyl monomer. The UV adhesive disclosed by the invention has the characteristics of high light transmittance, high curing speed, tough adhesive layer, vibration resistance, good stability, good weather resistance, good insulativity, high temperature resistance, water resistance, high hardness and the like, and is particularly suitable for packaging LED lamp beads.
Description
Technical Field
The invention relates to the field of LED lamps, in particular to a UV adhesive and application thereof.
Background
The TOP type LED packaging glue is mostly formed by mixing A, B two kinds of glue, stirring is needed before use, and baking is needed for 1-2 hours after glue dispensing is completed. For example, the existing packaging adhesive for TOP LEDs has the following disadvantages in the production process: the glue is generally formed by mixing A, B two kinds of glue, needs to be proportioned according to the actual glue condition according to the ratio, needs to be stirred at the same time, is relatively complex to operate, is relatively strict in ratio error, has relatively high requirement on the uniformity of glue stirring, and increases the use difficulty; after dispensing, baking is needed for curing, the curing condition is 1-2h, the productivity is easily limited, and the production cost is high.
In addition, the common problems of LED packaging adhesives in the packaging process are:
firstly, the LED is yellow, and the main reasons are:
1. the drying temperature is too high or the drying time is too long;
2. the glue preparation proportion is not correct, and the glue A is easy to yellow.
Secondly, the LED bubble problem mainly includes:
1. air bubbles in the bowl: the bracket is poor in glue dipping;
2. bracket bubble: the curing temperature is too high, and the epoxy curing is too violent;
3. cracking glue and bursting top: the curing time is short and the epoxy resin is not cured completely or uniformly. The AB glue exceeds the usable time.
Thirdly, the LED support climbs and glues, and its leading reason has:
1. the surface of the bracket is uneven, so that a capillary phenomenon is generated;
and the AB glue contains volatile materials.
Fourth, the LED encapsulation short bakes off-mold back field bake and discolours, and its reason has:
1. the stacking in the oven is too dense, and the ventilation is poor;
2. the local temperature of the oven is too high;
3. other colored contaminants are present in the oven.
In summary, there is a need to research a UV adhesive and its application in LED lamp bead packaging.
Disclosure of Invention
The UV adhesive has the characteristics of high light transmittance, high curing speed, tough adhesive layer, vibration resistance, good stability, good weather resistance, good insulativity, high temperature resistance, water resistance, high hardness and the like, and is particularly suitable for packaging LED lamps; and the LED lamp can emit light in 360 degrees in all directions when being electrified so as to increase the light emitting area and the light effect, and the LED lamp is more energy-saving and environment-friendly.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme:
the UV adhesive comprises the following components in parts by weight: 20-80 parts of UV oligomer, 10-60 parts of UV functional monomer, 1-5 parts of photoinitiator, 0.1-5 parts of auxiliary agent and 1-10 parts of functional filler.
Preferably, the UV oligomer comprises one or a combination of polyurethane (meth) acrylate, polyester (meth) acrylate, polyether (meth) acrylate, epoxy (meth) acrylate, polyolefin (meth) acrylate, silane-modified (meth) acrylate and pure acrylate.
Preferably, the UV functional monomer is a reactive monomer capable of being initiated by a photoinitiator, and includes one or more of (meth) acrylic acid monomer, olefin monomer, vinyl ether monomer, and allyl monomer.
Preferably, the photoinitiator comprises one or a combination of a free radical initiator and a cationic initiator.
Preferably, the auxiliary agent comprises an adhesion promoter, a thixotropic agent, a coupling agent, a defoaming agent, a dispersing agent and a heat stabilizer; wherein the coupling agent is silane coupling agent KH550, KH560, KH570, titanate coupling agent; the thixotropic agent is one or two of fumed silica and polyamide wax.
The invention also relates to an application of the UV adhesive in LED lamp bead packaging.
The invention has the beneficial effects that:
the UV adhesive has the characteristics of high light transmittance, high curing speed, tough adhesive layer, vibration resistance, good stability, good weather resistance, good insulativity, high temperature resistance, water resistance, high hardness and the like, and is particularly suitable for packaging LED lamps; and the LED lamp can emit light in 360 degrees in all directions when being electrified so as to increase the light emitting area and the light effect, and the LED lamp is more energy-saving and environment-friendly.
The foregoing is a summary of the present invention, and in order to provide a clear understanding of the technical means of the present invention and to be implemented in accordance with the present specification, preferred embodiments of the present invention are described below in detail. Specific embodiments of the present invention are given in detail by the following examples.
Detailed Description
The invention is further described below:
the UV adhesive comprises the following components in parts by weight: 20-80 parts of UV oligomer, 10-60 parts of UV functional monomer, 1-5 parts of photoinitiator, 0.1-5 parts of auxiliary agent and 1-10 parts of functional filler.
Preferably, the UV oligomer comprises one or a combination of polyurethane (meth) acrylate, polyester (meth) acrylate, polyether (meth) acrylate, epoxy (meth) acrylate, polyolefin (meth) acrylate, silane-modified (meth) acrylate and pure acrylate.
Preferably, the UV functional monomer is a reactive monomer capable of being initiated by a photoinitiator, and includes one or more of (meth) acrylic acid monomer, olefin monomer, vinyl ether monomer, and allyl monomer.
Preferably, the photoinitiator comprises one or a combination of a free radical initiator and a cationic initiator.
Preferably, the auxiliary agent comprises an adhesion promoter, a thixotropic agent, a coupling agent, a defoaming agent, a dispersing agent and a heat stabilizer; wherein the coupling agent is silane coupling agent KH550, KH560, KH570, titanate coupling agent; the thixotropic agent is one or two of fumed silica and polyamide wax.
The invention also relates to an application of the UV adhesive in LED lamp bead packaging.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
During actual packaging, the light-emitting wafer is placed in the wafer groove, the metal wires are welded on the electrodes of the light-emitting wafer and the metal wiring terminals to form a circuit, then UV packaging glue is poured on the light-emitting wafer and the UV base in a dispensing mode, and UVLED ultraviolet light is used for irradiating, so that the UV packaging glue is solidified on the light-emitting wafer and the UV base. The UV packaging adhesive is mainly prepared by mixing the following materials in proportion in the embodiment:
example 1:
30% of special acrylic resin A, 36% of isobornyl methacrylate, 8% of tris (2-hydroxyethyl) isocyanurate triacrylate, 12% of hexamethylenediol diacrylate, 5% of hydrophobic functional material, 1.5% of initiator TPO and 1843%; fumed silica 4%; 0.5 percent of heat stabilizer.
Firstly, 1.5kg of TPO and 3kg of 184, 36kg of isobornyl methacrylate, 8kg of tris (2-hydroxyethyl) isocyanurate triacrylate and 12kg of hexamethylenediol diacrylate as initiators are added into a stirring kettle and stirred until the solid is completely dissolved;
secondly, adding 4kg of fumed silica into the stirring kettle, dispersing at high speed until the fumed silica is uniformly dispersed,
and step three, adding 30kg of UV special acrylic resin A into a stirring kettle, mechanically stirring uniformly, adding 0.5kg of heat stabilizer and 5kg of hydrophobic functional material, dispersing uniformly, filtering and packaging.
Example 2
The special acrylic resin B41%, the dicyclopentanyl methacrylate 30%, the tris (2-hydroxyethyl) isocyanuric acid triacrylate 5%, the tricyclodecane dimethanol dimethacrylate 10%, the hydrophobic functional material 5%, the initiator TPO 1.5%, the initiator 1843%, the fumed silica 4% and the heat stabilizer 0.5%.
Firstly, 1.5kg of TPO, 3kg of 184, 30kg of dicyclopentanyl methacrylate, 5kg of tris (2-hydroxyethyl) isocyanurate triacrylate and 10kg of tricyclodecane dimethanol dimethacrylate as initiators are added into a stirring kettle and stirred until all solids are dissolved;
secondly, adding 4kg of fumed silica into the stirring kettle, dispersing at high speed until the fumed silica is uniformly dispersed,
and step three, adding 41kg of UV special acrylic resin B into a stirring kettle, mechanically stirring uniformly, adding 0.5kg of heat stabilizer and 5kg of hydrophobic functional material, dispersing uniformly, filtering and packaging.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. The UV adhesive is characterized in that: the paint comprises the following components in parts by weight: 20-80 parts of UV oligomer, 10-60 parts of UV functional monomer, 1-5 parts of photoinitiator, 0.1-5 parts of auxiliary agent and 1-10 parts of functional filler.
2. The UV adhesive according to claim 1, wherein: the UV oligomer comprises one or a combination of polyurethane (methyl) acrylate, polyester (methyl) acrylate, polyether (methyl) acrylate, epoxy (methyl) acrylate, polyolefin (methyl) acrylate, silane modified (methyl) acrylate and pure acrylate.
3. The UV adhesive according to claim 1, wherein: the UV functional monomer is an active monomer which can be initiated to polymerize by a photoinitiator, and comprises one or a combination of a plurality of monofunctional (methyl) acrylic monomer, olefin monomer, vinyl ether monomer and allyl monomer.
4. The UV adhesive according to claim 1, wherein: the photoinitiator comprises free radical initiators 184, 651, TPO-L, 819, 1173, BP, EDB, ITX.
5. The UV adhesive according to claim 1, wherein: the auxiliary agent comprises at least one of an adhesion promoter, a thixotropic agent, a coupling agent, a defoaming agent, a dispersing agent and a heat stabilizer.
6. The UV adhesive according to claim 1, wherein: the coupling agent is silane coupling agent and titanate coupling agent; the thixotropic agent is one or more of fumed silica and polyamide wax.
7. The use of the UV adhesive according to any one of claims 1-6 in LED bead packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011515921.3A CN112608688A (en) | 2020-12-21 | 2020-12-21 | UV adhesive and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011515921.3A CN112608688A (en) | 2020-12-21 | 2020-12-21 | UV adhesive and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112608688A true CN112608688A (en) | 2021-04-06 |
Family
ID=75245418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011515921.3A Pending CN112608688A (en) | 2020-12-21 | 2020-12-21 | UV adhesive and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112608688A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112521870A (en) * | 2020-12-21 | 2021-03-19 | 苏州赛美思高分子科技有限公司 | Ultraviolet light curing adhesive composition and application thereof |
| CN115254562A (en) * | 2022-06-20 | 2022-11-01 | 东莞理工学院 | Buffer layer applied to bending and attaching of flexible OLED screen and curing method thereof |
| CN116445097A (en) * | 2023-04-28 | 2023-07-18 | 太仓斯迪克新材料科技有限公司 | Adhesive film for direct display Mini LED packaging protection and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104031592A (en) * | 2014-06-30 | 2014-09-10 | 江苏华程光电科技有限公司 | Sealant with low shrinkage rate for encapsulating LED (light-emitting diode) |
| CN106634789A (en) * | 2016-11-09 | 2017-05-10 | 东莞市贝特利新材料有限公司 | Ultraviolet light cured type adhesive and preparation method thereof |
| CN112521870A (en) * | 2020-12-21 | 2021-03-19 | 苏州赛美思高分子科技有限公司 | Ultraviolet light curing adhesive composition and application thereof |
-
2020
- 2020-12-21 CN CN202011515921.3A patent/CN112608688A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104031592A (en) * | 2014-06-30 | 2014-09-10 | 江苏华程光电科技有限公司 | Sealant with low shrinkage rate for encapsulating LED (light-emitting diode) |
| CN106634789A (en) * | 2016-11-09 | 2017-05-10 | 东莞市贝特利新材料有限公司 | Ultraviolet light cured type adhesive and preparation method thereof |
| CN112521870A (en) * | 2020-12-21 | 2021-03-19 | 苏州赛美思高分子科技有限公司 | Ultraviolet light curing adhesive composition and application thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112521870A (en) * | 2020-12-21 | 2021-03-19 | 苏州赛美思高分子科技有限公司 | Ultraviolet light curing adhesive composition and application thereof |
| CN115254562A (en) * | 2022-06-20 | 2022-11-01 | 东莞理工学院 | Buffer layer applied to bending and attaching of flexible OLED screen and curing method thereof |
| CN115254562B (en) * | 2022-06-20 | 2023-10-03 | 东莞理工学院 | Buffer layer applied to flexible OLED screen bending and bonding and curing method thereof |
| CN116445097A (en) * | 2023-04-28 | 2023-07-18 | 太仓斯迪克新材料科技有限公司 | Adhesive film for direct display Mini LED packaging protection and preparation method thereof |
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Application publication date: 20210406 |