CN112602181A - 高频粘合剂粘合 - Google Patents

高频粘合剂粘合 Download PDF

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Publication number
CN112602181A
CN112602181A CN201980051150.6A CN201980051150A CN112602181A CN 112602181 A CN112602181 A CN 112602181A CN 201980051150 A CN201980051150 A CN 201980051150A CN 112602181 A CN112602181 A CN 112602181A
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China
Prior art keywords
adhesive
conductive plate
material layers
high frequency
layers
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CN201980051150.6A
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English (en)
Inventor
C·B·斯威尼
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Essentim
Essentium Inc
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Essentim
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
    • B29C65/3608—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
    • B29C65/3612—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements comprising fillers
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
    • B29C65/3608—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/3684—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract

一种用于将第一材料层与第二材料层粘合的系统和方法，包括第一导电板、与第一导电板间隔开的第二导电板。第二导电板电气接地。与第一导电板电连通的高频发生器向第一导电板提供高频电信号。施加到第一材料层和第二材料层中的一者的粘合剂具有电磁感应材料，当受到电场作用时，电磁感应材料将粘合剂加热到粘合剂固化温度，以将第一材料层与第二材料层粘合。夹紧机构向第一材料层和第二材料层中的一者施加压力，以使第一材料层和第二层保持接触，直到粘合剂固化时间结束。

Description

高频粘合剂粘合
技术领域
本公开总体上涉及利用电磁场通过粘合剂系统来粘合材料层。
背景技术
本部分陈述仅提供与本公开相关的背景信息，可构成也可不构成现有技术。
一般粘合剂系统是通过烘箱、红外加热或蒸汽来进行加压固化和/或加热固化。例如，在制鞋过程中，将鞋整体加热以将热量传递至粘合剂，从而使粘合剂固化，将鞋各层粘合。通常鞋类所用材料导热性一般，因此需要较长时间才能加热到有粘合剂的鞋芯处。此外，固化粘合剂所需的过高热量会破坏鞋类所用材料。
因此，虽然当前的粘合剂系统实现了其预期目的，但是仍需要一种新的改进的系统和方法，用于例如在制鞋过程中粘合材料。这种新的改进的方法使用粘合剂自身从内部产生固化所需的热量，以防止破坏鞋的周围材料层。此外，由于粘合剂被直接加热而不是由鞋的周围部分间接加热，因而该新的和改进的方法比常规方法更快且更节能。
发明内容
根据若干方面，提供了一种用于将第一材料层与第二材料层粘合的系统。该系统包括第一导电板、与第一导电板间隔开的第二导电板。第二导电板电气接地。与第一导电板电连通的高频发生器向第一导电板提供高频电信号，以在第一导电板和第二导电板之间产生电场。将粘合剂施加到第一材料层和第二材料层中的一者上。粘合剂具有电磁感应(susceptor)材料，当受到电场作用时，该电磁感应材料将粘合剂加热到粘合剂固化温度。该系统还包括夹紧机构，该夹紧机构用于向第一材料层和第二材料层中的一者施加压力以使第一层和第二层保持接触，直到粘合剂固化时间结束。
在本公开的另一方面，第一导电板和第二导电板中的至少一者形成为与第一材料层和第二材料层中的一者的形状匹配。
在本公开的另一方面，第一导电板与第二导电板平行。
在本公开的另一方面，高频发生器产生选自包括6.78MHz、13.56MHz、27.12MHz、40.68MHz和433.92MHz的组的射频或其它频率，例如915MHz、2.45GHz和5.8GHz的微波频率。
在本公开的另一方面，以预定图案将粘合剂施加到第一材料层和第二材料层中的一者上。
在本公开的另一方面，粘合剂的预定图案为在第一材料层和第二材料层中的一者的周边上的线条的形式。
在本公开的另一方面，粘合剂的预定图案为基本上覆盖第一材料层和第二材料层中的一者的整个表面的粘合剂层的形式。
在本公开的另一方面，粘合剂的预定图案为在第一材料层和第二材料层中的一者的表面上的多条相交线的形式。
在本公开的另一方面，粘合剂的预定图案为在第一材料层和第二材料层中的一者的表面上的多个同心环的形式。
在本公开的另一方面，电磁感应材料为分散在粘合剂中的多个碳纳米管。
在本发明的另一方面，提供了一种用于将第一材料层与第二材料层粘合的方法。该方法包括设置第一导电板和与第一导电板间隔开的第二导电板。第二导电板电气接地。此外，该方法使用与第一导电板电连通的高频发生器产生高频电信号，以在第一导电板和第二导电板之间产生电场。将粘合剂分配在第一材料层和第二材料层中的一者的表面上。粘合剂具有电磁感应材料，当受到电场作用时，该电磁感应材料将粘合剂加热到粘合剂固化温度。使用夹紧机构将压力施加到第一材料层和第二材料层中的一者上，以使第一层和第二层中的一者与第一层和第二层中的另一者保持接触，直到粘合剂固化时间结束。
在本公开的另一方面，设置第一导电板和第二导电板还包括设置第一导电板和第二导电板形成为与第一材料层和第二材料层中的一者的形状匹配。
在本公开的另一方面，设置第一导电板和第二导电板还包括设置第一导电板平行于第二导电板。
在本公开的另一方面，产生高频电信号还包括控制高频发生器产生选自包括6.78MHz、13.56MHz、27.12MHz、40.68MHz和433.92MHz的组的射频或其它频率，例如915MHz、2.45GHz和5.8GHz的微波频率。
在本公开的另一方面，将粘合剂分配在第一材料层和第二材料层中的一者的表面上还包括将粘合剂以预定图案施加到第一材料层和第二材料层中的一者上。
在本公开的另一方面，将粘合剂分配在第一材料层和第二材料层中的一者的表面上还包括以在第一材料层和第二材料层中的一者的周边上的线条的形式施加粘合剂。
在本公开的另一方面，将粘合剂分配在第一材料层和第二材料层中的一者的表面上还包括以基本上覆盖第一材料层和第二材料层中的一者的整个表面的粘合剂层的形式施加粘合剂。
在本公开的另一方面，将粘合剂分配在第一材料层和第二材料层中的一者的表面上还包括以在第一材料层和第二材料层中的一者的表面上的多条相交线的形式施加粘合剂。
在本公开的另一方面，将粘合剂分配在第一材料层和第二材料层中的一者的表面上还包括以在第一材料层和第二材料层中的一者的表面上的多个同心环的形式施加粘合剂。
根据本文提供的描述，其他适用领域将变得显而易见。应理解，描述和具体实例仅用于说明目的，并不旨在限制本公开的范围。
附图说明
本文描述的附图仅用于说明目的，并不旨在以任何方式限制本公开的范围。
图1和图1a分别是根据本发明的一个方面的鞋或运动鞋以及用于将第一材料层与第二材料层粘合的系统的俯视图和侧视图；
图2是根据本发明的一方面的外底的顶表面的俯视图，其中粘合剂以第一预定图案分配在外底的表面上；
图3是根据本发明的一方面的外底的顶表面的俯视图，其中粘合剂以第二预定图案分配在外底的表面上；
图4是根据本发明的一方面的外底的顶表面的俯视图，其中粘合剂以第三预定图案分配在外底的表面上；以及
图5是根据本发明的一方面的外底的顶表面的俯视图，其中粘合剂以第四预定图案分配在外底的表面上。
具体实施方式
以下描述本质上仅仅是示例性的，并不旨在限制本公开、应用或用途。
本发明提供了一种用于将第一材料层与第二材料层粘合的系统。材料层可以选自各种材料成分。例如，可用该材料层形成或制成各种不同的产品，诸如鞋或运动鞋。
参照图1和图1a，分别示出了根据本发明的一个方面的鞋或运动鞋10以及用于将第一材料层与第二材料层粘合的系统12的俯视图和侧视图。例如，运动鞋10为可使用用于将第一材料层与第二材料层粘合的系统12制造的产品。
运动鞋10具有外底14、中底16和鞋面18。外底14也可以称为鞋底，是运动鞋10与地面直接接触的最底部。外底14可由多种材料制成，包括皮革和橡胶。通常，外底14是运动鞋10的包括鞋底纹20的部分，鞋底纹20提供对运动鞋10的穿着者所行走表面的附着摩擦力。某些类型的外底14利用特定的鞋底纹20材料或设计实现具有比其他外底更大的附着摩擦力。中底16是设置于运动鞋10的内底(未示出)和外底14之间的材料层。中底16的样式和外形设计为可以减震。中底16通常由乙烯-醋酸乙烯酯共聚物(EVA)制成。在本发明的一个方面，中底16由第一材料层制成，外底14由第二材料层制成。在本发明的另一方面，中底16的材料成分不同于外底14。鞋面18是运动鞋10的覆盖脚趾、脚背、脚侧部和脚后跟的一个或多个部分。根据鞋的样式，鞋面18剪切成或成型为单片，或者鞋面18由多片缝合在一起构成。
继续参考图1a，示出了根据本发明的用于将中底16与外底14粘合的系统12。用于将中底16与外底粘合的系统12包括第一导电板20和第二导电板22。第二导电板22与第一导电板20间隔开。在本发明的一方面，第一导电板20与第二导电板22平行。在本发明的另一方面，导电板20、22中的一者或两者分别形成或成形为与中底16或外底14的形状匹配。第二导电板22电气接地。
系统12还包括高频发生器24。高频发生器24与第一导电板20电连通，并向第一导电板20提供高频电信号，以在第一导电板20和第二导电板22之间产生电场26。高频发生器24产生例如选自工业、科学、医学频段(ISM频段)的射频信号，包括：6.78MHz、13.56MHz、27.12MHz、40.68MHz和433.92MHz或其它频率，例如915MHz、2.45GHz和5.8GHz的微波频率。外底14和中底16设置在第一导电板20和第二导电板22之间，使得外底14和中底16沿其整个长度暴露于在第一导电板20和第二导电板22之间产生的电场中。
将粘合剂28施加到外底14(即第一材料层)或中底16(即第二材料层)。粘合剂28具有电磁感应材料(未示出)，当受到电场26作用时，电磁感应材料将粘合剂28加热到粘合剂固化温度。粘合剂28具有例如聚合物组分和纳米材料感应组分，其中聚合物组分选自以下组：环氧树脂、聚氨酯、聚酯、聚丙烯酸酯、溶剂聚合物粘合剂、接触型粘合剂、热熔粘合剂、热塑性粘合剂。可以向电场26施加与粘合剂有效耦合的电容耦合。加热一段时间，然后冷却后，粘合剂28将中底16与外底14粘合。运动鞋其余部分所用的材料一般为低损耗介电材料，其暴露于电场26时不加热。纳米材料感应组分或电磁感应材料例如选自以下组：碳纳米管、炭黑、巴基球、石墨烯、超顺磁性纳米粒子、磁性纳米粒子、金属纳米线、半导体纳米线、量子点、聚苯胺(PANI)、聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸钠(poly3,4-ethylenedioxythiophene polystyrenesulfonate)及其组合。聚合物粘合剂中电磁感应材料的重量百分比通常为0.1％至10％，特别是0.5％至4％，以便将纳米材料/粘合剂系统调节至可积极响应所选的电磁频率。分散在粘合剂28中的电磁感应材料使粘合剂28作为用于固化粘合剂28的热源，同时鞋的其余部分能够保持冷却，直到粘合剂28被内部加热到其固化温度。在另一实例中，粘合剂28为由上述粘合剂系统之一制成的3D打印细丝(filament)。3D打印细丝可以是纳米材料/聚合物粘合剂混合物的单丝，或者可以是具有在细丝生产过程期间或之后制备的富含纳米材料的涂层或芯的多层结构。富含纳米材料的涂层的厚度为聚合物细丝直径的0.005％至30％。例如，富含纳米材料的涂层的厚度为约100nm至0.5mm。在一个实例中，涂层包括1wt％至50wt％的碳纳米管或其它纳米电磁感应材料。在另一实例中，涂层包括3wt％至10wt％的碳纳米管或其他纳米电磁感应材料。优选地，使用多层共挤模头来制造细丝。此外，本发明设想使用自动分配系统例如3D打印机等以3D细丝的形式分配粘合剂28。在另一实例中，如国际专利申请WO2015147939A1中描述了细丝和纳米材料，该申请的内容通过引用并入本文。现在参照图2，示出了根据本发明的一方面的外底14的顶表面30的俯视图，其中粘合剂28以第一预定图案分配在外底14的表面30上。粘合剂28以在顶表面30的周边上的线条32的形式施加到外底14的顶表面30上。
现在参照图3，示出了根据本发明的一方面的外底14的顶表面30的俯视图，其中粘合剂28以第二预定图案分配在外底14的表面30上。粘合剂28的第二预定图案为基本上覆盖外底14的整个表面30的粘合剂28层34的形式。
现在参照图4，示出了根据本发明的一方面的外底14的顶表面30的俯视图，其中粘合剂28以第三预定图案分配在外底14的表面30上。粘合剂28的第三预定图案为在顶表面30周边上的线条32和在外底14的表面30上的线条32内的多条相交线36的形式。
现在参照图5，示出了根据本发明的一方面的外底14的顶表面30的俯视图，其中粘合剂28以第四预定图案分配在外底14的表面30上。粘合剂28的第四预定图案为分配在外底14的表面30上的多个同心环38、40和42的形式。环38是粘合剂28以环形或椭圆形的形式分配在顶表面30的周边上的线条。环40是粘合剂28以环形或椭圆形的形式分配在顶表面30上的环38内的线条。环42是粘合剂28以环形或椭圆形的形式分配在顶表面30上的环40内的线条。
此外，参照图1，根据本发明的一个方面，粘合剂粘合系统12还包括夹紧机构44。夹紧机构44配置成向外底14或中底16施加压力以使外底14和中底16保持接触，直到粘合剂固化时间结束。在本发明的一个方面，夹紧机构44为液压缸，其作用于第一导电板20和第二导电板22中的一者上，将该板按压并保持在外底14或中底16上，同时使另一个板保持固定。
本发明还包括一种用于将第一材料层与第二材料层粘合的方法。该方法首先设置与第二导电板间隔开的第一导电板。第二导电板电气接地。此外，本发明的方法包括使用与第一导电板电连通的高频发生器产生高频电信号，以在第一导电板和第二导电板之间产生电场。该方法包括将粘合剂分配在第一材料层和第二材料层中的一者的表面上。粘合剂具有电磁感应材料，当受到电场作用时，电磁感应材料将粘合剂加热到粘合剂固化温度。例如，电磁感应材料为分散在粘合剂中的多个碳纳米管。第一材料层和第二材料层位于第一导电板和第二导电板之间。使用夹紧机构将压力施加到第一材料层和第二材料层中的一者上，以使第一材料层和第二层中的一者与第一材料层和第二层中的另一者保持接触，直到粘合剂固化时间结束。
本发明设想第一导电板和第二导电板形成为与第一材料层和第二材料层中的一者的形状匹配。此外，在本发明的一方面，该方法包括设置第一导电板与第二导电板平行。控制高频发生器产生选自包括6.78MHz、13.56MHz、27.12MHz、40.68MHz和433.92MHz的组的射频信号或其它频率，例如915MHz、2.45GHz和5.8GHz的微波频率。将粘合剂以及第一材料层和第二材料层暴露于电场中进行加热一段时间之后，粘合剂将第一材料层与第二材料层粘合。第一材料层和第二材料层通常是低损耗介电材料，其暴露于电场中时不会加热，因此不易损坏。有利的是，分散在粘合剂中的电磁感应材料使粘合剂作为固化粘合剂的热源，同时周围的材料层可以保持冷却，直到粘合剂被内部加热到其固化温度。此外，由于粘合剂被直接加热而不是由鞋的周围部分间接加热，所以本发明的方法比传统方法更快且更节能。
以预定图案将粘合剂施加到第一材料层和第二材料层中的一者上。例如，以在第一材料层和第二材料层中的一者的周边上的线条的形式施加粘合剂。在另一实例中，以基本上覆盖第一材料层和第二材料层中的一者的整个表面的粘合剂层的形式施加粘合剂。在又一实例中，以在第一材料层和第二材料层中的一者的表面上的多条相交线的形式施加粘合剂。在又一实例中，以在第一材料层和第二材料层中的一者的表面上的多个同心环的形式施加粘合剂。
本公开的描述本质上仅仅是示例性的，并且不脱离本公开的主旨的变化旨在落入本公开的范围内。这些变化不应视为偏离了本公开的精神和范围。

Claims (19)

1.一种用于将第一材料层与第二材料层粘合的系统，所述系统包括：
第一导电板；
第二导电板，其与所述第一导电板间隔开，其中，所述第二导电板电气接地；
高频发生器，其与所述第一导电板电连通，用于向所述第一导电板提供高频电信号以在所述第一导电板和所述第二导电板之间产生电场；
粘合剂，施加到所述第一材料层和所述第二材料层中的一者上，其中，所述粘合剂具有电磁感应材料，当受到所述电场作用时，所述电磁感应材料将所述粘合剂加热到粘合剂固化温度；以及
夹紧机构，用于向所述第一材料层和所述第二材料层中的一者施加压力，以使第一层和第二层中的一者与第一层和第二层中的另一者保持接触，直到粘合剂固化时间结束。
2.根据权利要求1所述的系统，其中，所述第一导电板和所述第二导电板中的至少一者形成为与所述第一材料层和所述第二材料层中的一者的形状匹配。
3.根据权利要求1所述的系统，其中，所述第一导电板与所述第二导电板平行。
4.根据权利要求1所述的系统，其中，所述高频发生器产生选自包括6.78MHz、13.56MHz、27.12MHz、40.68MHz和433.92MHz的组的射频。
5.根据权利要求1所述的系统，其中，以预定图案将所述粘合剂施加到所述第一材料层和所述第二材料层中的一者上。
6.根据权利要求1所述的系统，其中，所述粘合剂的预定图案为在所述第一材料层和所述第二材料层中的一者的周边上的线条的形式。
7.根据权利要求1所述的系统，其中，所述粘合剂的预定图案为基本上覆盖所述第一材料层和所述第二材料层中的一者的整个表面的粘合剂层的形式。
8.根据权利要求1所述的系统，其中，所述粘合剂的预定图案为在所述第一材料层和所述第二材料层中的一者的表面上的多条相交线的形式。
9.根据权利要求1所述的系统，其中，所述粘合剂的预定图案为在所述第一材料层和所述第二材料层中的一者的表面上的多个同心环的形式。
10.根据权利要求1所述的系统，其中，所述电磁感应材料为分散在所述粘合剂中的多个碳纳米管。
11.一种用于将第一材料层与第二材料层粘合的方法，所述方法包括：
设置第一导电板；
设置与所述第一导电板间隔开的第二导电板，其中，所述第二导电板电气接地；
使用与所述第一导电板电连通的高频发生器产生高频电信号，以在所述第一导电板与所述第二导电板之间产生电场；
将粘合剂分配在所述第一材料层和所述第二材料层中的一者的表面上，其中，所述粘合剂具有电磁感应材料，当受到所述电场作用时，所述电磁感应材料将所述粘合剂加热到粘合剂固化温度；以及
使用夹紧机构向所述第一材料层和所述第二材料层中的一者施加压力，以使所述第一层和所述第二层中的一者与所述第一层和所述第二层中的另一者保持接触，直到粘合剂固化时间结束。
12.根据权利要求11所述的方法，其中，设置第一导电板和第二导电板还包括设置第一导电板和第二导电板形成为与所述第一材料层和所述第二材料层中的一者的形状匹配。
13.根据权利要求11所述的方法，其中，设置第一导电板和第二导电板还包括设置所述第一导电板平行于所述第二导电板。
14.根据权利要求11所述的方法，其中，产生高频电信号还包括控制所述高频发生器产生选自包括6.78MHz、13.56MHz、27.12MHz、40.68MHz和433.92MHz的组的射频。
15.根据权利要求11所述的方法，其中，将粘合剂分配在所述第一材料层和所述第二材料层中的一者的表面上还包括将所述粘合剂以预定图案施加到所述第一材料层和所述第二材料层中的一者上。
16.根据权利要求11所述的方法，其中，将粘合剂分配在所述第一材料层和所述第二材料层中的一者的表面上还包括以在所述第一材料层和所述第二材料层中的一者的周边上的线条的形式施加所述粘合剂。
17.根据权利要求11所述的方法，其中，将粘合剂分配在所述第一材料层和所述第二材料层中的一者的表面上还包括以基本上覆盖所述第一材料层和所述第二材料层中的一者的整个表面的粘合剂层的形式施加所述粘合剂。
18.根据权利要求11所述的方法，其中，将粘合剂分配在所述第一材料层和所述第二材料层中的一者的表面上还包括以在所述第一材料层和所述第二材料层中的一者的表面上的多条相交线的形式施加所述粘合剂。
19.根据权利要求11所述的方法，其中，将粘合剂分配在所述第一材料层和所述第二材料层中的一者的表面上还包括以在所述第一材料层和所述第二材料层中的一者的表面上的多个同心环的形式施加所述粘合剂。
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