CN112601431A

CN112601431A - Electronic equipment

Info

Publication number: CN112601431A
Application number: CN202011599747.5A
Authority: CN
Inventors: 杨小会; 宋献斌; 周顺林
Original assignee: Hangzhou DPTech Technologies Co Ltd
Current assignee: Hangzhou DPTech Technologies Co Ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-04-02
Anticipated expiration: 2040-12-29
Also published as: CN112601431B

Abstract

The application provides an electronic equipment, this electronic equipment's first plug-in card group is pegged graft in the first side of backplate, and the second plug-in card group is pegged graft in the second side of backplate, and first plug-in card group is connected through the quadrature connector with the second plug-in card group, and each second plug-in card group all pegs graft there is the radiator, the power peg graft in the second side of backplate, it is visible, quick-witted incasement portion is provided with a plurality of radiators, and these radiators all peg graft in the second plug-in card group for the installation is convenient with the dismantlement, and in the use, if some radiators break down, then only need to dismantle alright to the radiator that breaks down, remaining radiator can play the radiating effect in the short time, and then need not to stop electronic equipment's operation, thereby on installation and dismantlement convenient basis, can improve electronic equipment's reliability.

Description

Electronic equipment

Technical Field

The application relates to the technical field of structures, in particular to an electronic device.

Background

With the increasing performance of electronic devices, the application range of mainframe box-type network devices is wider and wider, so that the structural design of the electronic devices is more and more complex, and the power consumption of single boards is higher and higher. Therefore, the requirement on the reliability of the electronic equipment is higher and higher, and an important index for causing high reliability is good heat dissipation capacity. Besides meeting the design requirements of overall dimension, safety regulation and the like, the electronic equipment is of great importance as being capable of having a complete and effective hardware architecture.

At present, an electronic device generally includes a chassis, a backplane inside the chassis, plug-in cards plugged in the front side and the rear side of the backplane, a power supply, and a fan frame. In order to realize the heat dissipation of the case, the fan frame penetrates through the inside of the whole case to dissipate heat of the whole case, so that the size of the fan frame is larger, and the installation and the disassembly are difficult; in addition, in the use process, once the fan in the fan frame is damaged, the whole fan frame needs to be removed to replace the fan, and at the moment, the temperature in the case is increased instantly due to the lack of the fan frame, so that the electronic equipment has to stop operating in order to protect the components in the case.

Disclosure of Invention

The application provides an improved electronic device to on the basis of installation and dismantlement convenience, can improve electronic device's reliability.

An embodiment of the present application provides an electronic device, which includes: case, first plug-in card group, two at least second plug-in card groups, backplate, quadrature connector, power and radiator:

the first card inserting group is inserted at the first side of the backboard, the second card inserting group is inserted at the second side of the backboard, the first card inserting group is connected with the second card inserting group through the orthogonal connector, each second card inserting group is inserted with the radiator, the power supply is inserted at the second side of the backboard, wherein the first card inserting group, the second card inserting group, the backboard, the orthogonal connector, the power supply and the radiator are all arranged in the case.

In an embodiment of the application, a panel surface of the first card insertion group opposite to the chassis is provided with an air inlet, a panel surface of the back panel is provided with an air vent, and a shell of the heat radiator is provided with an air outlet; wherein the air outlet is opposite to the vent hole.

In one embodiment of the present application, the electronic device further includes: the power supply adapter plate is arranged in the case;

the power supply adapter plate is inserted in the second side of the back plate, and the power supply is inserted in the power supply adapter plate.

In an embodiment of the present application, the power adapter board is inserted above the backplane in relation to the second card group.

In an embodiment of the present application, each of the power supplies is correspondingly provided with a fan for dissipating heat of the power supply.

In one embodiment of the present application, the number of heat sinks is at least twice that of the second card insertion set;

at least two radiators are inserted into each second inserting and clamping group.

In one embodiment of the present application, the heat sink includes a fan and a fan frame provided with an air outlet;

the fan is arranged in the fan frame and is opposite to the air outlet.

In one embodiment of the present application, the electronic device further includes: the heat dissipation component and the shell are provided with an air outlet;

the heat dissipation assembly is arranged in the shell and is opposite to the air outlet.

In one embodiment of the present application, the chassis is provided with a front vent hole, and the front vent hole is arranged on a side surface of the chassis so as to be opposite to the air inlet hole;

and/or the first and/or second light sources,

the rear vent hole is arranged on the side face of the case and is opposite to the air outlet.

In one embodiment of the present application, the electronic device further comprises a heat pipe,

the heat conduction pipe is installed between the air outlet and the rear ventilation hole, so that hot air discharged from the air outlet is discharged to the outside of the case through the heat dissipation holes.

Therefore, the embodiment of the application provides electronic equipment, a first card inserting group of the electronic equipment is inserted in a first side of a backboard, a second card inserting group is inserted in a second side of the backboard, the first card inserting group and the second card inserting group are connected through an orthogonal connector, each second card inserting group is inserted with a radiator, a power supply is inserted in the second side of the backboard, a plurality of radiators are arranged in a case, the radiators are inserted in the second card inserting groups, the installation and the disassembly are convenient, in the using process, if part of the radiators break down, the radiators with faults can be disassembled only, the rest radiators can play a role in heat dissipation in a short time, the operation of the electronic equipment does not need to be stopped, and the reliability of the electronic equipment can be improved on the basis of convenient installation and disassembly.

Drawings

Fig. 1 is an exploded view of some of the components within an electronic equipment enclosure shown in an exemplary embodiment of the present application;

fig. 2 is an assembly diagram of an electronic device enclosure with a heat sink mounted therein according to an exemplary embodiment of the present application;

FIG. 3 is a second card-insertion set and fan frame assembly according to an exemplary embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a power supply and power adapter board shown in an exemplary embodiment of the present application;

fig. 5 is a schematic diagram of a backplane according to an exemplary embodiment of the present application.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of "first," "second," and similar terms in the description and claims of this application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Similarly, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one, and if only "a" or "an" is denoted individually. "plurality" or "a number" means two or more. Unless otherwise specified, "front", "back", "lower" and/or "upper", "top", "bottom", and the like are for ease of description only and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

Referring to fig. 1 to 5, fig. 1 is an exploded schematic view of an internal component of an electronic device according to an exemplary embodiment of the present disclosure, fig. 2 is a schematic view of a structure of a heat sink mounted on the electronic device according to the exemplary embodiment, fig. 3 is a schematic view of an assembly of a second card group and a fan frame according to the exemplary embodiment, fig. 4 is a schematic view of a power supply and a power adapter board according to the exemplary embodiment, and fig. 5 is a schematic view of a back board according to the exemplary embodiment.

As shown in fig. 1 to 5, an electronic device provided in an embodiment of the present application may include: case 1, first plug-in card group 2, at least two second plug-in card groups 3, backplate 4, orthogonal connector, power 5 and radiator 6:

the first card inserting set 2 is inserted into a first side of the back plate 4, the second card inserting set 3 is inserted into a second side of the back plate 4, the first card inserting set 2 and the second card inserting set 3 are connected through the orthogonal connector, the heat radiator 6 is inserted into each second card inserting set 3, and the power supply 5 is inserted into a second side of the back plate 4, wherein the first card inserting set, the second card inserting set 3, the back plate 4, the orthogonal connector, the power supply 5 and the heat radiator 6 are all arranged in the case 1.

The first card inserting set 2 is inserted into a first side of the back plate 4, that is, a front side surface of the back plate 4, and is generally called a front panel; the second card inserting set 3 is inserted into the second side of the back plate 4, i.e. the back side of the back plate 4, and is generally called as a back panel. The cards in the first card-insertion group 2 and the cards in the second card-insertion group 3 can be orthogonal inside the enclosure 1 by means of a plurality of orthogonal connectors.

The radiator 6 is inserted into each second card inserting set 3, so that the heat of the second card inserting set 3 can be radiated, and the whole case 1 can also be radiated. Meanwhile, since each second card inserting set 3 is inserted with at least two radiators 6, in the using process, if a certain radiator 6 is damaged, at this time, the damaged radiator 6 only needs to be removed to replace a new radiator 6 or repair the new radiator 6, and at this time, because other radiators 6 are still in operation in the case 1, the influence of heat dissipation on the case 1 in a short time is not great, and therefore, the electronic equipment cannot stop operation due to lack of one or part of radiators 6.

In order to realize the heat dissipation of the chassis 1, the heat sink 6 may be operated to form a certain wind pressure inside the chassis 1, and the air may have a certain fluidity inside the chassis 1 under the pressure, so as to make the air inside the chassis 1 have a better fluidity. As an embodiment, an air inlet is formed in a plate surface of the first card insertion group 2 opposite to the case 1, a vent hole is formed in a plate surface of the back plate 4, and an air outlet is formed in a shell of the heat sink 6; wherein, the air outlet is opposite to the vent hole. The air inlet hole penetrates through the board surface of the first card inserting group 2, the air outlet hole also penetrates through the shell, and in addition, the air vent hole also penetrates through the board surface of the back board 4. Therefore, the air holes formed in the back plate 4 greatly reduce the resistance of air entering from the front panel and exiting from the back panel, and a stable air duct for ventilating the front and the back inside the case 1 is realized. Under the premise, an air duct for air circulation can be formed in the case 1 by the air inlet of the first card insertion group 2, the air vent of the back plate 4 and the air outlet of the heat sink 6, and under the operation of the heat sink 6, air enters from the air inlet of the first card insertion group 2 and carries heat of the components in the first card insertion group 2 to enter the plurality of second card insertion groups 3 from the air vent, and takes away the heat of the components in the second card insertion groups 3, and finally the air is sucked into the heat sink 6 and discharged through the air outlet under the action of the heat sink 6, so that an air circulation channel is formed in the case 1, and the heat generated by the components in the case 1 during the operation is quickly taken away under the action of the heat sink 6, thereby achieving the purpose of quick heat dissipation.

In order to enable heat generated by components arranged in the case 1 to be quickly taken away under the action of the radiator 6, as an embodiment, the case 1 is provided with a front vent hole which is arranged on the side surface of the case 1 so as to be opposite to the air inlet hole. Therefore, air outside the case 1 enters the case 1 through the front vent hole and enters the first card inserting group 2 through the air inlet hole of the first card inserting group 2, components in the first card inserting group 2 are cooled, then the vent hole penetrating through the back plate 4 penetrates through the space between the second card inserting groups 3, heat generated by the back plate 4 and the second card inserting groups 3 is taken away together, and the air rapidly enters the radiator 6 under the action of the radiator 6 and is discharged to the outside of the case 1 through the air outlet of the radiator 6. The machine case 1 is provided with a rear vent hole which is arranged on the side surface of the machine case 1 so as to be opposite to the air outlet. As another embodiment, the electronic device further includes a heat pipe, which is installed between the air outlet and the rear vent, so that the hot air discharged from the air outlet is discharged to the outside of the chassis 1 through the heat dissipation hole. Therefore, heat extracted by the radiator 6 can be quickly radiated to the outside of the case 1 directly through the rear vent hole, and the heat emission speed is improved.

As an embodiment, the electronic device further comprises: the heat dissipation component and the shell are provided with an air outlet; the heat dissipation assembly is arranged in the shell and is opposite to the air outlet. The heat dissipation assembly may be composed of a heat conduction block and a fan, and since each second card set 3 corresponds to at least two heat sinks 6, even if a single heat sink 6 is damaged and does not operate in the operation of the device, the heat dissipation of the second card set 3 is not affected, which is called a heat sink 6 redundant design. In the actual use process, if one heat conduction assembly fails, the shell with the built-in failed heat conduction assembly can be detached to repair or replace a new heat dissipation assembly, and the rest heat radiators 6 run in the electronic equipment, so that even if the electronic equipment does not stop running, the rest heat radiators 6 can also play a heat dissipation role in a short time, and the phenomenon that the heat in the electronic equipment is instantly increased to damage components inside the case 1 due to the fact that one heat radiator 6 is less can be avoided. It can be seen that the size of the heat sink 6 in this embodiment is small, the installation and the disassembly are both convenient, and great convenience is brought to the later maintenance, and meanwhile, the redundancy design of the heat sink 6 can improve the reliability of the electronic device. As another embodiment, the heat sink 6 includes a fan and a fan frame provided with an air outlet; the fan is arranged in the fan frame and is opposite to the air outlet. In this way, if one fan fails during use, the fan frame with the failed fan built therein can be removed to replace the new fan, and in addition, the fan frame is plugged into the second plug-in card group 3, so that the fan frame with the replaced fan can be plugged into the second plug-in card group 3 again even if the electronic equipment does not stop running. Therefore, the fan frame provided with the fan is small in structural size, simple in structure and easy to replace, install and detach, so that great convenience is brought to later maintenance, and meanwhile, the reliability of the electronic equipment can be further improved due to the redundant design of the radiator 6.

Still peg graft on backplate 4 and have power 5, with second plug-in card group 3 homonymy, as an embodiment, power 5 can be pegged graft in the upper portion of backplate 4 for second plug-in card group 3 relatively, that is, is located second plug-in card group 3's the higher authority to power 5's plug makes convenient operation, simple can bring good experience for the user. It should be noted that the plugging position of the power supply 5 in this embodiment may be set to be deeper, so that the backplane 4 can be plugged together well, in addition, because in the device selection and scheme design, it is not necessarily ensured that the depth of the power supply 5 is consistent with the depth of the second card group 3, and the depth of the second card group 3 in a general electronic communication device is deeper than the depth of the power supply 5, in order to be able to use a suitable power supply 5, as an embodiment, the electronic device further includes: a power supply adapter plate 7 arranged in the case 1; the power supply adapter plate 7 is inserted at the second side of the back plate 4, and the power supply 5 is inserted at the power supply adapter plate 7. So that the depth dimension of the power supply 5 plus the depth dimension of the power adapter plate 7 is equal to the depth of the second card inserting set 3, and the purpose of ensuring that the depth of the power supply 5 plus the power adapter plate 7 is consistent with the depth of the second card inserting set 3 is to ensure that the back plate 4 is on one plane, thereby reducing the complexity of design and processing to a certain extent and also reducing certain cost.

In addition, as an embodiment, each of the power supplies 5 is correspondingly provided with a fan for dissipating heat of the power supply 5, that is, each of the power supplies 5 may be provided with a separate fan for dissipating heat of the power supply 5, and meanwhile, in the process of dissipating heat of the power supply 5, the heat of each component in the chassis 1 may also be dissipated to a certain extent.

Based on electronic equipment machine case 1 size is fixed, for rational layout, can peg graft radiator 6 in second card group 3 to it is neat with the rear panel of quick-witted case 1, power 5 pegs graft in second card group 3, and install in quick-witted case 1 back, is neat with quick-witted case 1 rear panel, and like this, power 5, radiator 6, second card group 3 are installed in quick-witted case 1 back, and power 5, radiator 6 and second card group 3's back section all are neat with quick-witted case 1 rear panel.

As described above, the space on the front side of the backplane 4 is used for arranging the first card group 2, the space on the rear side of the backplane 4 is used for arranging the second card group 3, the power supply 5 above the second card group 3, and the heat sink 6 plugged into the second card group 3, so that the layout of components in the whole chassis 1 is more compact.

Therefore, the embodiment of the present application provides an electronic device, in which a first card inserting set 2 of the electronic device is inserted into a first side of a back panel 4, a second card inserting set 3 is inserted into a second side of the back panel 4, the first card inserting set 2 and the second card inserting set 3 are connected by an orthogonal connector, each second card inserting set 3 is inserted with a heat sink 6, a power supply 5 is inserted into the second side of the back panel 4, it can be seen that a plurality of heat sinks 6 are arranged in the case 1, and the heat sinks 6 are all inserted into the second inserting-clamping group 3, so that the installation and the disassembly are convenient, and in the using process, if a part of the radiators 6 are out of order, only the radiator 6 out of order needs to be disassembled, the rest radiators 6 can perform the heat radiation function in a short time, furthermore, the operation of the electronic equipment does not need to be stopped, so that the reliability of the electronic equipment can be improved on the basis of convenient installation and disassembly.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An electronic device, characterized in that the electronic device comprises: case, first plug-in card group, two at least second plug-in card groups, backplate, quadrature connector, power and radiator:

2. The electronic device of claim 1, wherein a panel surface of the first card insertion set opposite to the chassis is provided with an air inlet, a panel surface of the back panel is provided with an air vent, and a housing of the heat sink is provided with an air outlet; wherein the air outlet is opposite to the vent hole.

3. The electronic device of claim 1, further comprising: the power supply adapter plate is arranged in the case;

4. The electronic device of claim 2, wherein the power adapter board is plugged above the backplane with respect to the second card nest.

5. The electronic device according to any one of claims 1 to 4, wherein each power supply is provided with a fan for dissipating heat of the power supply.

6. The electronic device of claim 1, wherein the number of heat sinks is at least twice as many as the second card-insertion set;

7. The electronic device of claim 1, wherein the heat sink comprises a fan and a fan frame provided with an air outlet;

the fan is arranged in the fan frame and is opposite to the air outlet.

8. The electronic device of claim 1, further comprising: the heat dissipation component and the shell are provided with an air outlet;

9. The electronic device according to claim 2, wherein the cabinet is provided with a front vent hole provided in a side surface of the cabinet so as to be opposed to the air inlet hole;

and/or the first and/or second light sources,

10. The electronic device of claim 9, further comprising a heat pipe,