CN112599707B - Light-emitting module and display device - Google Patents
Light-emitting module and display device Download PDFInfo
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- CN112599707B CN112599707B CN202011480501.6A CN202011480501A CN112599707B CN 112599707 B CN112599707 B CN 112599707B CN 202011480501 A CN202011480501 A CN 202011480501A CN 112599707 B CN112599707 B CN 112599707B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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Abstract
The embodiment of the invention discloses a light-emitting module and a display device, wherein the light-emitting module comprises: the backlight module comprises a body, a light emitting panel and a light guide plate, wherein the light emitting panel is provided with a light emitting side and a backlight side which are oppositely arranged; and the fluorescent material film layer is arranged on the peripheral side of the body and/or the backlight side. According to the light-emitting module and the display device provided by the embodiment of the invention, the fluorescent material film layer is arranged on the peripheral side and/or the backlight side of the light-emitting panel of the light-emitting module, and the fluorescent material film layer has the fluorescent characteristic, so that the peripheral side and/or the backlight side of the light-emitting panel can be self-luminous by utilizing the fluorescent characteristic, the defects generated during attaching can be conveniently detected, detection equipment is not required to be additionally used for detection, and the detection accuracy and the detection efficiency are further improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a light-emitting module and a display device.
Background
An Organic Light-Emitting Diode (OLED) display device is a self-luminous display device, and has the advantages of wider viewing angle, higher contrast ratio, faster response speed and lower power consumption compared with a liquid crystal display device. In addition, since the OLED display device does not require a backlight, it can be manufactured to be thin and light. With the development of OLED display technology, more and more OLED display devices have been widely applied to electronic devices as display panels. In the related art OLED display device, the OLED light emitting module is one of important components.
However, since the lamination structure of the peripheral side of the light emitting module and the position of the backlight side is complicated, it is difficult to optically detect defects generated during bonding in the bonding process. The existing optical detection method generally utilizes detection equipment to detect the attached light-emitting modules and needs to perform sampling inspection or full inspection on the display modules, but the detection method often has the problem of low detection precision due to the problems of equipment precision and the like, and if sampling inspection is performed, all the light-emitting modules cannot be completely detected, the problem of missing inspection exists, and if full inspection is performed, each display module needs to be aligned with the detection equipment one by one, so that the detection efficiency is reduced. Therefore, how to more conveniently realize the optical detection of the peripheral side and the backlight side of the light emitting module to ensure the reliability of the light emitting module is an urgent problem to be solved in the field.
Disclosure of Invention
The embodiment of the invention provides a light-emitting module and a display device, and aims to solve the problem of difficulty in optical detection in a bonding process.
In one aspect, an embodiment of the present invention provides a light emitting module, including: the backlight module comprises a body, a light emitting panel and a light guide plate, wherein the light emitting panel is provided with a light emitting side and a backlight side which are oppositely arranged; and the fluorescent material film layer is arranged on the peripheral side of the body and/or the backlight side.
In some embodiments, a portion of the thin film layer of phosphor material from the light exit side to the backlight side is continuous.
In some embodiments, the thin film layer of phosphor material completely covers the backlight side.
In some embodiments, the material of the fluorescent material thin film layer is at least one of organic small molecules, organic macromolecules and inorganic salts.
In some embodiments, the material of the fluorescent material thin film layer is a conductive organic polymer.
In some embodiments, the thin film layer of phosphor material has an area resistance of 10 3 Ω-10 8 Ω。
In some embodiments, the thin film layer of phosphor material has a thickness of 0.4 μm to 300 μm; preferably, the thickness of the fluorescent material thin film layer is 1 μm to 10 μm.
In some embodiments, the light emitting module further comprises an adhesive layer disposed between the fluorescent material thin film layer and the light emitting panel.
In some embodiments, the light emitting panel is an organic light emitting diode panel.
On the other hand, an embodiment of the present invention provides a display device, including the light emitting module according to any one of the embodiments of the present invention.
According to the light-emitting module and the display device provided by the embodiment of the invention, the fluorescent material film layer is arranged on the peripheral side and/or the backlight side of the light-emitting panel of the light-emitting module, and the fluorescent material film layer has the fluorescent characteristic, so that the peripheral side and/or the backlight side of the light-emitting panel can be self-luminous by utilizing the fluorescent characteristic, the defects generated when the light-emitting module is attached can be conveniently detected, detection equipment does not need to be additionally utilized for detection, and the detection accuracy and the detection efficiency are further improved.
Drawings
Other features, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof, and which are not to scale.
Fig. 1 is a schematic cross-sectional view illustrating a light emitting module according to an embodiment of the invention;
fig. 2 is a schematic cross-sectional view illustrating a light emitting module according to another embodiment of the invention;
fig. 3 is a schematic cross-sectional view illustrating a light emitting module according to another embodiment of the invention;
fig. 4 is a schematic cross-sectional view illustrating a light emitting module according to another embodiment of the invention;
fig. 5 is a schematic cross-sectional view illustrating a light emitting module according to another embodiment of the invention;
fig. 6 is a schematic cross-sectional view illustrating a light emitting module according to another embodiment of the invention.
Description of reference numerals:
1-body;
100-a cover plate;
200-a light-emitting panel;
300-a thin film layer of fluorescent material;
400-adhesive layer.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
With the technical development of the OLED light emitting module, the requirement for the bonding precision of the light emitting module is higher and higher, but the lamination structure of the peripheral side and the backlight side position of the light emitting module is complex, so that the optical detection of the defects generated during bonding in the bonding process is difficult. The existing optical detection method generally utilizes detection equipment to detect the attached light-emitting modules and needs to perform sampling inspection or full inspection on the display modules, but the detection method often has the problem of low detection precision due to the problems of equipment precision and the like, and if sampling inspection is performed, all the light-emitting modules cannot be completely detected, the problem of missing inspection exists, and if full inspection is performed, each display module needs to be aligned with the detection equipment one by one, so that the detection efficiency is reduced.
To solve the above problems in the prior art, an embodiment of the present invention provides a light emitting module and a display device including the same, where the light emitting module includes: the light emitting panel is provided with a light emitting side and a backlight side which are oppositely arranged; and the fluorescent material film layer is arranged on the peripheral side of the light-emitting panel and/or the backlight side. According to the light-emitting module and the display device provided by the embodiment of the invention, the fluorescent material film layer is arranged on the peripheral side and/or the backlight side of the light-emitting panel of the light-emitting module, and the fluorescent material film layer has the fluorescent characteristic, so that the peripheral side and/or the backlight side of the light-emitting panel can be self-luminous by utilizing the fluorescent characteristic, the defects generated when the light-emitting module is attached can be conveniently detected, detection equipment does not need to be additionally utilized for detection, and the detection accuracy and the detection efficiency are further improved.
While the light emitting module according to the embodiments of the present invention will be described with reference to the accompanying drawings, it is to be understood that the embodiments of the present invention have been described in detail for the purpose of enhancing the understanding of the present invention, and that the technical solutions claimed in the present application can be implemented without these details and with various changes and modifications based on the embodiments described below.
Fig. 1 is a schematic cross-sectional view of a light emitting module according to an embodiment of the invention. As shown in fig. 1, the light emitting module includes a body 1, the body 1 includes a cover plate 100 and a light emitting panel 200, the light emitting panel 200 has a light emitting side and a backlight side opposite to each other, and the cover plate 100 is disposed on the light emitting side of the light emitting panel 200. The light emitting module further includes a fluorescent material thin film layer 300, and the fluorescent material thin film layer 300 is disposed at a peripheral side of the light emitting panel 200. By arranging the fluorescent material film layer 300 on the peripheral side of the light-emitting panel 200, because the fluorescent material film layer 300 has the fluorescent characteristic, when the peripheral side of the light-emitting panel 200 has a bonding defect, the fluorescent characteristic of the fluorescent material film layer 300 can be utilized to enable the peripheral side of the light-emitting panel 200 to emit light, so that the defect generated on the peripheral side of the light-emitting panel 200 during bonding of the light-emitting module can be conveniently detected, detection equipment does not need to be additionally utilized for detection, and the detection accuracy and the detection efficiency are further improved.
Fig. 2 is a schematic cross-sectional view of a light emitting module according to another embodiment of the present invention. As shown in fig. 2, the fluorescent material film layer 300 is disposed on the backlight side of the light-emitting panel 200, and by disposing the fluorescent material film layer 300 on the backlight side of the light-emitting panel 200, since the fluorescent material film layer 300 has a fluorescent characteristic, when the backlight side of the light-emitting panel 200 has a bonding defect, the fluorescent characteristic of the fluorescent material film layer 300 can be used to make the backlight side of the light-emitting panel 200 self-emit light, so that the defect generated on the backlight side of the light-emitting panel 200 when the light-emitting module is bonded can be conveniently detected, and no additional detection equipment is needed to perform detection, thereby improving the detection accuracy and detection efficiency.
Fig. 3 is a schematic cross-sectional view of a light emitting module according to another embodiment of the invention. As shown in fig. 3, the fluorescent material film layer 300 is disposed on the peripheral side and the backlight side of the light-emitting panel 200, and by disposing the fluorescent material film layer 300 on the peripheral side and the backlight side of the light-emitting panel 200, since the fluorescent material film layer 300 has the fluorescent characteristic, when the peripheral side and the backlight side of the light-emitting panel 200 have a bonding defect, the peripheral side and the backlight side of the light-emitting panel 200 can be self-illuminated by using the fluorescent characteristic of the fluorescent material film layer 300, so that the defects generated on the peripheral side and the backlight side of the light-emitting panel 200 when the light-emitting module is bonded can be detected conveniently without using additional detection equipment, and the detection accuracy and the detection efficiency can be improved.
In some alternative embodiments, the phosphor thin film layer 300 is capable of self-luminescence; or can emit light in the presence of external excitation light (e.g., ultraviolet light) illumination. Therefore, defects generated during the pasting can be conveniently detected, detection equipment does not need to be additionally utilized for detection, and the detection accuracy and the detection efficiency are further improved.
In some alternative embodiments, the portion of the thin film layer 300 of phosphor material from the light exit side to the backlight side is continuous. The continuous thin film layer 300 of phosphor material may cover the entire edge structure of the light-emitting panel 200, thereby further improving the accuracy of detection. Certainly, the part of the fluorescent material thin film layer 300 from the light emitting side to the backlight side may also be discontinuous, and the fluorescent material thin film layer 300 may be reasonably arranged according to the actual position to be detected, which is not specifically limited herein.
In some optional embodiments, the fluorescent material film layer 300 completely covers the backlight side of the light-emitting panel 200, and the backlight side of the light-emitting panel 200 is completely covered by the fluorescent material film layer 300, so that defects generated on the backlight side when the whole light-emitting module is attached can be detected, and the detection accuracy and the detection efficiency are improved. Of course, the fluorescent material film layer 300 may not completely cover the backlight side of the light-emitting panel 200, and the fluorescent material film layer 300 may be reasonably disposed according to the actual detection position, which is not particularly limited herein.
In some optional embodiments, the material of the fluorescent material thin film layer 300 is at least one of organic small molecules, organic high molecules, and inorganic salts. Illustratively, the organic small molecule may include a metal complex or the like, the organic polymer may include a polystyrene derivative or the like, and the inorganic salt may include ZnO: liSiO phosphor and the like. Preferably, the fluorescent material film layer is made of rare earth metal salt or pi-system conjugated small molecules, and the fluorescent material film layer 300 made of the material is selected, so that the fluorescent material film layer 300 has fluorescent property before complete curing, and the fluorescent property disappears after complete curing, and the appearance of the final product under light is not affected.
In some optional embodiments, the material of the fluorescent material thin film layer 300 is a conductive organic polymer, and specifically, may be a mixture of polythiophene, polyurethane, and a fluorescent material, polyvinyl alcohol, or an organic salt. The conductive organic polymer material has certain conductive capability, can lead out static electricity generated in the preparation process and the use process of the light-emitting module in time, and improves the performance of the light-emitting module.
In some alternative embodiments, the sheet resistance (sheet resistance) of the phosphor thin film layer 300 is 10 3 Ω-10 8 Omega, the surface resistance of the fluorescent material thin film layer 300 is set to the above range, so that the fluorescent material thin film layer 300 has a certain conductive capability, static electricity generated in the preparation process and the use process of the light emitting module can be led out in time, and the performance of the light emitting module is improved. Illustratively, the area resistance of the phosphor thin film layer 300 may be 10 3 Ω、10 4 Ω、10 5 Ω、10 6 Ω、10 7 Ω、10 8 Ω, the surface resistance of the fluorescent material thin film layer 300 should not be too large, and when the material of the fluorescent material thin film layer 300 is selected to be a conductive organic polymer material, the electrostatic conductivity of the fluorescent material thin film layer 300 is weakened due to too large surface resistance; the sheet resistance of the phosphor film layer 300 should not be too small, otherwise the overall thickness of the light emitting module is increased. Preferably, the area resistance of the fluorescent material thin film layer 300 may be 1.8 × 10 5 Ω、2×10 5 Ω、2.5×10 5 Ω、3×10 5 Ω、1.8×10 6 Ω、2×10 6 Ω、2.5×10 6 Ω、3×10 6 Omega, so can guarantee under the circumstances that fluorescent material thin layer 300 has good static electric conduction ability, can reduce the thickness of luminous module again as far as possible to guarantee that luminous module's performance is more excellent.
In some alternative embodiments, the thin film layer of phosphor material has a thickness of 0.4 μm to 300 μm, such as 5 μm, 50 μm, 100 μm, 200 μm. Preferably, the thickness of the fluorescent material thin film layer is 1 μm to 10 μm, so that the whole light-emitting module can be thinner and lighter on the premise of realizing the detection function.
In some optional embodiments, as shown in fig. 4 to 6, the light emitting module further includes an adhesive layer 400, and the adhesive layer 400 is disposed between the fluorescent material thin film layer 300 and the body 1. By arranging the adhesion layer 400 between the fluorescent material film layer 300 and the body 1, the adhesion between the fluorescent material film layer 300 and the body 1 can be increased, the fluorescent material film layer 300 is prevented from falling off in the technical process, and the stability of the technical process is improved. The adhesion layer 400 can function as a transition layer, and is used as a bridge for connecting between the body 1 and the fluorescent material thin film layer 300, and simultaneously, can prevent the light emitting module from being affected by the environment, especially the environmental humidity. Optionally, the material of the adhesion layer 400 may be selected to be a stable and inert material, such as polymethyl methacrylate, so that the adhesion between the phosphor thin film layer 300 and the body 1 can be ensured, and the reaction between the adhesion layer 400 and the phosphor thin film layer 300 and the body 1 can be prevented. Optionally, the adhesive layer 400 has certain flexibility, so that the adhesive layer is not easy to break and fall off, is more suitable for flexible and bending occasions, and has a better anti-seismic effect. Alternatively, the adhesion layer may be a single layer or multiple layers, and those skilled in the art can select the adhesion layer according to actual needs.
In the above embodiment of the light emitting module, the light emitting panel 200 may be an OLED panel. In other embodiments, the Light Emitting panel 200 may also be a Light-Emitting Diode (LED) panel or a Quantum-tube Light-Emitting Diode (QLED) panel.
In some alternative embodiments, the fluorescent material thin film layer 300 may be formed on the peripheral side and/or the backlight side of the light-emitting panel 200 by coating. After coating, a curing treatment may be performed as needed, for example, a method of promoting solvent evaporation such as heating and ventilation, or a method of promoting chemical reaction of active materials in a material to perform crosslinking curing such as heating and ultraviolet rays.
In some optional embodiments, a needle valve coating mode can be selected, wherein the needle valve has a needle head inner diameter size of 0.1mm-0.5mm, the needle head material can be PP (polypropylene) or PTFE (polytetrafluoroethylene, teflon), and the coating speed is 10-100mm/s; alternatively, a valve-spray coating scheme can be used, using a PicoPulse spray system, to spray droplets having a volume on the order of nL. The thin film layer of the fluorescent material prepared by the coating method is uniform and compact, and has higher process precision.
In the light emitting module provided by the above embodiment, the fluorescent material film layer 300 is disposed on the peripheral side and/or the backlight side of the light emitting panel 200 of the light emitting module, and the fluorescent material film layer 300 has a fluorescent characteristic, so that the peripheral side and/or the backlight side of the light emitting panel 200 can be self-illuminated by using the fluorescent characteristic, thereby facilitating detection of defects generated when the light emitting module is attached, and no additional detection equipment is needed for detection, thereby improving detection accuracy and detection efficiency.
The embodiment of the invention also provides a display device which comprises the light-emitting module in any embodiment.
The embodiments of the light emitting module can be applied not only to display devices, but also to other fields such as lighting devices. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. In addition, each component included in the light emitting module needs to be selected and arranged according to the implementation function thereof, and is not limited to the specific structure related to each embodiment of the present disclosure.
Thus, various embodiments of the present invention have been described in detail. Some details well known in the art have not been described in order to avoid obscuring the concepts of the present invention. It will be fully apparent to those skilled in the art from the foregoing description how to practice the presently disclosed embodiments.
Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for the purpose of illustration and is not intended to limit the scope of the invention. It will be understood by those skilled in the art that various changes may be made in the above embodiments or equivalents may be substituted for elements thereof without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (11)
1. A light emitting module, comprising:
a light-emitting panel having a light-exit side and a backlight side disposed opposite to each other;
and the fluorescent material film layer is attached to the backlight side of the light emitting panel and/or connected with the light emitting side and the peripheral side of the backlight side.
2. The lighting module of claim 1, wherein the phosphor film layer is continuous from the light exit side to the backlight side.
3. The lighting module of claim 1, wherein the thin film layer of phosphor material completely covers the backlight side.
4. The light-emitting module according to claim 1, wherein the material of the fluorescent thin film layer is at least one of organic small molecules, organic polymers and inorganic salts.
5. The illumination module as claimed in claim 4, wherein the material of the phosphor thin film layer is a conductive organic polymer.
6. The illumination module as recited in claim 1 wherein the thin film layer of phosphor material has an areal resistance of 10 3 Ω-10 8 Ω。
7. The light module of claim 1, wherein the thin film layer of phosphor material has a thickness of 0.4 μm to 300 μm.
8. The illumination module as recited in claim 7 wherein the thin film layer of phosphor material has a thickness of 1 μm to 10 μm.
9. The lighting module of claim 1, further comprising an adhesive layer disposed between the phosphor film layer and the light-emitting panel.
10. The lighting module of any one of claims 1-9, wherein the light-emitting panel is an organic light-emitting diode panel.
11. A display device comprising the light-emitting module according to any one of claims 1 to 10.
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| CN202011480501.6A CN112599707B (en) | 2020-12-15 | 2020-12-15 | Light-emitting module and display device |
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| CN101566583B (en) * | 2008-04-23 | 2011-04-13 | 财团法人工业技术研究院 | Defect detection system of panel component |
| KR20100101916A (en) * | 2009-03-10 | 2010-09-20 | 주식회사 하이닉스반도체 | Method for manufacturing phase shift mask using fluorescence layer |
| CN102608797A (en) * | 2012-04-09 | 2012-07-25 | 友达光电股份有限公司 | Alignment method for assembling liquid crystal display device |
| US9625108B2 (en) * | 2014-10-08 | 2017-04-18 | Rockwell Automation Technologies, Inc. | Auxiliary light source associated with an industrial application |
| CN106842699A (en) * | 2016-12-30 | 2017-06-13 | 吴中区穹窿山德毅新材料技术研究所 | A kind of quantum dot reflectance coating and the backlight module using the film |
| CN107369701A (en) * | 2017-07-19 | 2017-11-21 | 京东方科技集团股份有限公司 | Encapsulating structure, display panel, display device and the method for detecting encapsulating structure |
| CN108615749B (en) * | 2018-05-18 | 2020-04-28 | 京东方科技集团股份有限公司 | Light-emitting module and display device |
| CN109166474B (en) * | 2018-10-10 | 2021-08-31 | 京东方科技集团股份有限公司 | Display module and laminating precision detection method |
| CN109935570B (en) * | 2019-03-22 | 2021-04-27 | 京东方科技集团股份有限公司 | Flexible substrate |
| CN111834244B (en) * | 2020-07-24 | 2022-04-19 | 昆山国显光电有限公司 | Display panel mother board and preparation method |
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