CN112592672A - Adhesive tape for wafer processing and manufacturing method thereof - Google Patents
Adhesive tape for wafer processing and manufacturing method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C08J2333/10—Homopolymers or copolymers of methacrylic acid esters
- C08J2333/12—Homopolymers or copolymers of methyl methacrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2455/00—Characterised by the use of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08J2423/00 - C08J2453/00
- C08J2455/02—Acrylonitrile-Butadiene-Styrene [ABS] polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C08K2003/265—Calcium, strontium or barium carbonate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2455/00—Presence of ABS
- C09J2455/006—Presence of ABS in the substrate
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Abstract
The invention discloses a wafer processing adhesive tape and a manufacturing method thereof, relating to the field of adhesive tapes, wherein a base material film used in the invention mainly aims to protect a semiconductor wafer from impact during grinding processing of the back surface of the semiconductor wafer, and an acrylonitrile-butadiene-styrene copolymer is a thermoplastic high-molecular structure material which has high strength, good toughness and easy processing and forming, but has insufficient performances such as impact strength and the like; the modified coating type marble powder filler has the advantages that the melamine formaldehyde resin is used as a coating layer to coat the surface of the marble powder filler, the surface of the modified coating type marble powder filler is compact through modification of a coupling agent, the surface is changed from hydrophilicity to hydrophobicity, and the modified coating type marble powder filler has good compatibility with an acrylonitrile-butadiene-styrene copolymer system; meanwhile, the modified coated marble filler is added into an acrylonitrile-butadiene-styrene copolymer system, so that the hardness performance of the whole system can be obviously improved, and the advantage of the modified coated marble filler in the aspect of toughness is kept.
Description
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to an adhesive tape for wafer processing and a manufacturing method thereof.
Background
An adhesive tape for wafer processing, which is mainly aimed at protecting a semiconductor wafer from impact during grinding of the back surface of the semiconductor wafer, and more particularly, is important to have water resistance against washing with water and the like and retention of processed parts, so that there are high demands for mechanical properties such as strength, toughness and the like of the adhesive tape for wafer processing, and acrylonitrile-butadiene-styrene copolymer is a thermoplastic polymer structure material having high strength, good toughness and easy processing and molding, and it is conceivable to add it to a raw material for producing the adhesive tape for wafer processing for improving toughness, however, its impact strength and the like are insufficient, and defects and problems in practical use are still overcome, and therefore, an adhesive tape for wafer processing and a method for manufacturing the same are provided.
Disclosure of Invention
The present invention is directed to a wafer processing tape and a method for manufacturing the same, which solves the above problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme:
the adhesive tape for processing the wafer comprises a base material film and an adhesive layer, wherein the base material film comprises the following raw materials of 50-100 parts of adhesive tape resin, 20-50 parts of acrylonitrile-butadiene-styrene copolymer and 10-30 parts of modified coated marble filler; the modified coated marble filler is obtained by coating a marble powder filler serving as a core and melamine-formaldehyde resin serving as a coating on the surface of the marble powder filler to obtain the coated marble filler and then modifying the coated marble filler by using a coupling agent.
The adhesive tape resin is one or a mixture of several of homopolymers or copolymers of alpha-olefin such as polyethylene, polypropylene, ethylene-propylene copolymers, polybutylene, ethylene-vinyl acetate copolymers, ethylene-acrylate copolymers, ionomers and the like, polyethylene terephthalate, polycarbonate and polymethyl methacrylate.
In a still further aspect of the present invention, the substrate film has a thickness of 90 μm to 180 μm.
In a still further aspect of the present invention, the adhesive of the adhesive layer is an ultraviolet-curable adhesive.
The preparation method of the modified coated marble filler comprises the following steps of 1) preparing melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of (1-5) to (1-6), mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH is 7-8 and the temperature is 55-65 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine formaldehyde resin prepolymer and a surfactant aqueous solution according to the weight ratio of 1 (5-10), stirring and mixing for 1h, wherein the mass fraction of the surfactant aqueous solution is 30%, then adding marble powder and gelatin according to the ratio of 0.5:1:0.5 of the melamine formaldehyde resin prepolymer, the marble powder and the gelatin, reacting for 3-4h at the pH of 3-4 and the temperature of 50-60 ℃, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying a coupling agent accounting for 0.5-1.5% of the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 30-40min, and discharging to obtain the modified coated marble filler.
As a still further aspect of the present invention, the coupling agent is vinyltrimethoxysilane.
As a further scheme of the invention, the base material film comprises the following raw materials of 50 parts of adhesive tape resin, 20 parts of acrylonitrile-butadiene-styrene copolymer and 10 parts of modified coated marble filler.
As a further scheme of the invention, the base material film comprises the following raw materials of 100 parts of adhesive tape resin, 50 parts of acrylonitrile-butadiene-styrene copolymer and 30 parts of modified coated marble filler.
A preparation method of the wafer processing adhesive tape comprises the following steps of 1) weighing raw materials according to a formula; 2) adding the adhesive tape resin, the acrylonitrile-butadiene-styrene copolymer and the modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; 3) extruding a material which is heated to obtain fluidity from the mixture, and cooling the extruded material by a cooling roller to form a film so as to obtain a base material film; 4) an adhesive layer was coated on the base film and cured by ultraviolet rays to obtain an adhesive tape.
Compared with the prior art, the invention has the beneficial effects that:
the substrate film used in the present invention is mainly intended to protect a semiconductor wafer from impact during grinding of the back surface of the semiconductor wafer, and particularly, is important to have water resistance to water washing and the like and retention of a processed member. The acrylonitrile-butadiene-styrene copolymer is a thermoplastic high-molecular structure material with high strength, good toughness and easy processing and molding, however, the properties such as impact strength and the like of the acrylonitrile-butadiene-styrene copolymer are insufficient; in the invention, the melamine formaldehyde resin is arranged as a coating to coat the surface of the marble powder filler and the surface of the modified coated marble powder filler is compact through modification by a coupling agent, the surface is changed from hydrophilicity to hydrophobicity, the compatibility with an acrylonitrile-butadiene-styrene copolymer system is good, and a stable system with uniform dispersion can be formed; meanwhile, the modified coated marble filler is added into an acrylonitrile-butadiene-styrene copolymer system, so that the hardness performance of the whole system can be obviously improved, and the advantage of the modified coated marble filler in the aspect of toughness is kept.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In an embodiment of the present invention, there is provided a wafer processing tape comprising a base film and an adhesive layer disposed on at least one side of the base film. The surface of the base film opposite to the surface contacting the adhesive layer is the surface (back surface) of the base film on which the adhesive layer is not formed, and is the outermost surface in a state of being bonded to the wafer.
The substrate film used in the present invention is mainly intended to protect a semiconductor wafer from impact during grinding of the back surface of the semiconductor wafer, and particularly, is important to have water resistance to water washing and the like and retention of a processed member. The base material film comprises the following raw materials of 50-100 parts of adhesive tape resin, 20-50 parts of acrylonitrile-butadiene-styrene copolymer and 10-30 parts of modified coating marble filler; the modified coated marble filler is obtained by coating a marble powder filler serving as a core and melamine-formaldehyde resin serving as a coating on the surface of the marble powder filler to obtain the coated marble filler and then modifying the coated marble filler by using a coupling agent. The acrylonitrile-butadiene-styrene copolymer is a thermoplastic high-molecular structure material which has high strength and good toughness and is easy to process and mold, however, the properties such as impact strength and the like of the acrylonitrile-butadiene-styrene copolymer are insufficient; in the invention, the melamine formaldehyde resin is arranged as a coating to coat the surface of the marble powder filler and the surface of the modified coated marble powder filler is compact through modification by a coupling agent, the surface is changed from hydrophilicity to hydrophobicity, the compatibility with an acrylonitrile-butadiene-styrene copolymer system is good, and a stable system with uniform dispersion can be formed; meanwhile, the modified coated marble filler is added into an acrylonitrile-butadiene-styrene copolymer system, so that the hardness performance of the whole system can be obviously improved, and the advantage of the modified coated marble filler in the aspect of toughness is kept.
In the embodiment of the invention, the modified coated marble filler is obtained by coating a marble powder filler serving as a core and melamine formaldehyde resin serving as a coating on the surface of the marble powder filler to obtain the coated marble filler and then modifying the coated marble filler by using a coupling agent. In the invention, the melamine formaldehyde resin is arranged as a coating to coat the surface of the marble powder filler and the surface of the modified coated marble powder filler is compact through modification by the coupling agent, the surface is changed from hydrophilicity to hydrophobicity, the compatibility with an acrylonitrile-butadiene-styrene copolymer system is good, and a stable system with uniform dispersion can be formed; meanwhile, the modified coated marble filler is added into an acrylonitrile-butadiene-styrene copolymer system, so that the hardness performance of the whole system can be obviously improved, and the advantage of the modified coated marble filler in the aspect of toughness is kept.
In the embodiment of the invention, the adhesive tape resin is one or a mixture of more of homopolymers or copolymers of alpha-olefins such as polyethylene, polypropylene, ethylene-propylene copolymers, polybutylene, ethylene-vinyl acetate copolymers, ethylene-acrylate copolymers, ionomers and the like, polyethylene terephthalate, polycarbonate and polymethyl methacrylate. The thickness of the substrate film is 90-180 μm. The adhesive of the adhesive layer is ultraviolet-curable.
In the embodiment of the invention, the preparation method of the modified coated marble filler specifically comprises the following steps of 1) preparing melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of (1-5) to (1-6), mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH is 7-8 and the temperature is 55-65 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine formaldehyde resin prepolymer and a surfactant aqueous solution according to the weight ratio of 1 (5-10), stirring and mixing for 1h, wherein the mass fraction of the surfactant aqueous solution is 30%, then adding marble powder and gelatin according to the ratio of 0.5:1:0.5 of the melamine formaldehyde resin prepolymer, the marble powder and the gelatin, reacting for 3-4h at the pH of 3-4 and the temperature of 50-60 ℃, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying a coupling agent accounting for 0.5-1.5% of the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 30-40min, and discharging to obtain the modified coated marble filler. The coupling agent is vinyl trimethoxy silane.
The invention also provides a preparation method of the wafer processing adhesive tape, which comprises the following steps of weighing the raw materials according to a formula; adding the adhesive tape resin, the acrylonitrile-butadiene-styrene copolymer and the modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; the adhesive tape is produced by extruding a material which is obtained by heating the above-mentioned mixture to obtain fluidity, cooling the extruded material by a cooling roll to form a film, coating an adhesive layer on the film, and curing the film by ultraviolet rays.
Examples of certain embodiments of the invention are given below, which are not intended to limit the scope of the invention. In addition, it should be noted that the numerical values given in the following examples are as precise as possible, but those skilled in the art will understand that each numerical value should be understood as a divisor rather than an absolutely exact numerical value due to measurement errors and experimental operational problems that cannot be avoided. For example, with respect to the weight values of the respective raw materials in the high toughness modified plastics of the respective examples, it should be understood that they may have an error of. + -. 2% or. + -. 1% due to an error of a weighing instrument.
Example 1
In the embodiment of the invention, the preparation method of the modified coated marble filler comprises the following steps:
1) preparing a melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of 1:1:3, mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH value is 8 and the temperature is 60 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine-formaldehyde resin prepolymer and a hexadecyl trimethyl ammonium bromide aqueous solution according to a weight ratio of 1:10, stirring and mixing for 1h, wherein the mass fraction of the hexadecyl trimethyl ammonium bromide aqueous solution is 30%, then adding marble powder and gelatin according to a ratio of the melamine-formaldehyde resin prepolymer, 300-mesh marble powder and gelatin of 0.5:1:0.5, reacting for 3h at the temperature of 60 ℃ under the condition of pH of 3, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying 1.5% of vinyl trimethoxy silane based on the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 35min, and discharging to obtain a modified coated marble filler;
weighing 50 parts of polymethyl methacrylate, 20 parts of acrylonitrile-butadiene-styrene copolymer and 10 parts of modified coated marble filler;
in an embodiment of the present invention, a method for preparing a wafer processing tape includes:
adding the weighed polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer and modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; the adhesive tape is produced by extruding a material which is obtained by heating the above-mentioned mixture to obtain fluidity, cooling the extruded material by a cooling roll to form a film, coating an adhesive layer on the film, and curing the film by ultraviolet rays.
Example 2
In the embodiment of the invention, the preparation method of the modified coated marble filler comprises the following steps:
1) preparing a melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of 1:1:3, mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH value is 8 and the temperature is 60 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine-formaldehyde resin prepolymer and a hexadecyl trimethyl ammonium bromide aqueous solution according to a weight ratio of 1:10, stirring and mixing for 1h, wherein the mass fraction of the hexadecyl trimethyl ammonium bromide aqueous solution is 30%, then adding marble powder and gelatin according to a ratio of the melamine-formaldehyde resin prepolymer, 300-mesh marble powder and gelatin of 0.5:1:0.5, reacting for 3h at the temperature of 60 ℃ under the condition of pH of 3, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying 1.5% of vinyl trimethoxy silane based on the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 35min, and discharging to obtain a modified coated marble filler;
weighing 50 parts of polymethyl methacrylate, 20 parts of acrylonitrile-butadiene-styrene copolymer and 15 parts of modified coated marble filler;
in an embodiment of the present invention, a method for preparing a wafer processing tape includes:
adding the weighed polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer and modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; the adhesive tape is produced by extruding a material which is obtained by heating the above-mentioned mixture to obtain fluidity, cooling the extruded material by a cooling roll to form a film, coating an adhesive layer on the film, and curing the film by ultraviolet rays.
Example 3
In the embodiment of the invention, the preparation method of the modified coated marble filler comprises the following steps:
1) preparing a melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of 1:1:3, mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH value is 8 and the temperature is 60 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine-formaldehyde resin prepolymer and a hexadecyl trimethyl ammonium bromide aqueous solution according to a weight ratio of 1:10, stirring and mixing for 1h, wherein the mass fraction of the hexadecyl trimethyl ammonium bromide aqueous solution is 30%, then adding marble powder and gelatin according to a ratio of the melamine-formaldehyde resin prepolymer, 300-mesh marble powder and gelatin of 0.5:1:0.5, reacting for 3h at the temperature of 60 ℃ under the condition of pH of 3, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying 1.5% of vinyl trimethoxy silane based on the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 35min, and discharging to obtain a modified coated marble filler;
weighing 50 parts of polymethyl methacrylate, 20 parts of acrylonitrile-butadiene-styrene copolymer and 20 parts of modified coated marble filler;
in an embodiment of the present invention, a method for preparing a wafer processing tape includes:
adding the weighed polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer and modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; the adhesive tape is produced by extruding a material which is obtained by heating the above-mentioned mixture to obtain fluidity, cooling the extruded material by a cooling roll to form a film, coating an adhesive layer on the film, and curing the film by ultraviolet rays.
Example 4
In the embodiment of the invention, the preparation method of the modified coated marble filler comprises the following steps:
1) preparing a melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of 1:1:3, mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH value is 8 and the temperature is 60 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine-formaldehyde resin prepolymer and a hexadecyl trimethyl ammonium bromide aqueous solution according to a weight ratio of 1:10, stirring and mixing for 1h, wherein the mass fraction of the hexadecyl trimethyl ammonium bromide aqueous solution is 30%, then adding marble powder and gelatin according to a ratio of the melamine-formaldehyde resin prepolymer, 300-mesh marble powder and gelatin of 0.5:1:0.5, reacting for 3h at the temperature of 60 ℃ under the condition of pH of 3, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying 1.5% of vinyl trimethoxy silane based on the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 35min, and discharging to obtain a modified coated marble filler;
weighing 50 parts of polymethyl methacrylate, 20 parts of acrylonitrile-butadiene-styrene copolymer and 25 parts of modified coated marble filler;
in an embodiment of the present invention, a method for preparing a wafer processing tape includes:
adding the weighed polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer and modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; the adhesive tape is produced by extruding a material which is obtained by heating the above-mentioned mixture to obtain fluidity, cooling the extruded material by a cooling roll to form a film, coating an adhesive layer on the film, and curing the film by ultraviolet rays.
Example 5
In the embodiment of the invention, the preparation method of the modified coated marble filler comprises the following steps:
1) preparing a melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of 1:1:3, mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH value is 8 and the temperature is 60 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine-formaldehyde resin prepolymer and a hexadecyl trimethyl ammonium bromide aqueous solution according to a weight ratio of 1:10, stirring and mixing for 1h, wherein the mass fraction of the hexadecyl trimethyl ammonium bromide aqueous solution is 30%, then adding marble powder and gelatin according to a ratio of the melamine-formaldehyde resin prepolymer, 300-mesh marble powder and gelatin of 0.5:1:0.5, reacting for 3h at the temperature of 60 ℃ under the condition of pH of 3, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying 1.5% of vinyl trimethoxy silane based on the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 35min, and discharging to obtain a modified coated marble filler;
weighing 50 parts of polymethyl methacrylate, 20 parts of acrylonitrile-butadiene-styrene copolymer and 30 parts of modified coated marble filler;
in an embodiment of the present invention, a method for preparing a wafer processing tape includes:
adding the weighed polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer and modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; the adhesive tape is produced by extruding a material which is obtained by heating the above-mentioned mixture to obtain fluidity, cooling the extruded material by a cooling roll to form a film, coating an adhesive layer on the film, and curing the film by ultraviolet rays.
Test of
The experimental method comprises drying the wafer processing adhesive tape obtained in the example at 80 deg.C for 2h, preparing sample with injection molding machine at 200 deg.C, adjusting at 21 + -2 deg.C and 45 + -5% humidity for 20h, and testing mechanical properties; wherein the mechanical property test comprises tensile property (tensile rate of 20mm/min according to GB/T1040-2006), bending property (pressing speed of 2mm/min according to GB/T9341-2008), impact strength (pendulum bob according to GB/T1043-2008, 7.5J), Rockwell hardness (indenter diameter of 12.7mm according to GB/T3398-2008) and abrasion resistance (rubbing for 10 minutes using a steel brush)
1. Exploring the influence of different materials selected by the adhesive tape resin on the final obtained adhesive tape product for wafer processing
In this test example, the preparation method of the modified coated marble filler:
1) preparing a melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of 1:1:3, mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH value is 8 and the temperature is 60 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine-formaldehyde resin prepolymer and a hexadecyl trimethyl ammonium bromide aqueous solution according to a weight ratio of 1:10, stirring and mixing for 1h, wherein the mass fraction of the hexadecyl trimethyl ammonium bromide aqueous solution is 30%, then adding marble powder and gelatin according to a ratio of the melamine-formaldehyde resin prepolymer, 300-mesh marble powder and gelatin of 0.5:1:0.5, reacting for 3h at the temperature of 60 ℃ under the condition of pH of 3, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying 1.5% of vinyl trimethoxy silane based on the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 35min, and discharging to obtain a modified coated marble filler;
weighing 100 parts of polymethyl methacrylate, 50 parts of acrylonitrile-butadiene-styrene copolymer and 30 parts of modified coated marble filler;
in this test example, a method for preparing a wafer processing tape includes:
adding the weighed polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer and modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; the adhesive tape is produced by extruding a material which is obtained by heating the above-mentioned mixture to obtain fluidity, cooling the extruded material by a cooling roll to form a film, coating an adhesive layer on the film, and curing the film by ultraviolet rays.
The polymethyl methacrylate is respectively replaced by a polyethylene (group 1), a polypropylene (group 2), an ethylene-propylene copolymer (group 3) and a polybutylene, an ethylene-vinyl acetate copolymer, an ethylene-acrylate copolymer, an ionomer or other alpha-olefin homopolymer or copolymer, polyethylene terephthalate, polycarbonate and a polymethyl methacrylate mixture (group 4), and tests show that the adhesive tape resin has small influence on data of test results due to the selection of different similar raw materials, so that the influence caused by the selection of different adhesive tape resin raw materials can be eliminated.
2. The products obtained in the above examples were used for effect verification to explore the effect of the modified coated marble fillers in different proportions on the adhesive tape, and the test results were as follows:
| content/% | Notched impact strength/kJ · m-2 | Flexural Strength/MPa | Tensile strength/MPa |
| Example 1 | 21.5 | 75.6 | 43.8 |
| Example 2 | 34.8 | 104.7 | 66.9 |
| Example 3 | 37.9 | 106.7 | 69.4 |
| Example 4 | 37.3 | 106.3 | 68.9 |
| Example 5 | 22.6 | 77.3 | 43.9 |
In summary, from the above data, it can be seen that, in the final products obtained by adding the modified coated marble filler in different proportions, the best effect of the adhesive tape product obtained in example 3 is obtained, and the following effect verification is continued based on example 3, and in order to highlight the actual effect, the following control groups are specifically set:
a comparison group 1, on the basis of the embodiment 3, replacing the modified coating type marble filler component with a single marble powder filler;
a contrast group 2, replacing the modified coating marble filler component with a coating marble powder filler which is not modified by a coupling agent;
a blank group, wherein the wafer processing adhesive tape comprises the following raw materials of 50 parts of polymethyl methacrylate and 20 parts of acrylonitrile-butadiene-styrene copolymer;
in summary, as can be seen from the table data, the modified coated marble filler in the embodiment of the present invention, which is obtained by adding the modified coated marble filler to obtain the wafer processing tape, significantly improves the properties of the wafer processing tape, such as strength and hardness, and the modified coated marble filler in the embodiment of the present invention is obtained by coating the surface of the marble powder filler with the marble powder filler as a core and the melamine-formaldehyde resin as a coating layer to obtain a coated marble filler, and then modifying the coated marble filler with a coupling agent. In the invention, the melamine formaldehyde resin is arranged as a coating to coat the surface of the marble powder filler and the surface of the modified coated marble powder filler is compact through modification by a coupling agent, the surface is changed from hydrophilicity to hydrophobicity, the compatibility with an acrylonitrile-butadiene-styrene copolymer system is good, and a stable system with uniform dispersion can be formed; meanwhile, the modified coated marble filler is added into an acrylonitrile-butadiene-styrene copolymer system, so that the hardness performance of the whole system can be obviously improved, and the advantage of the modified coated marble filler in the aspect of toughness is kept.
It should be particularly noted that, although the present specification describes embodiments, each embodiment does not include only an independent technical solution, and such description of the specification is only for clarity, and those skilled in the art should take the specification as a whole, and technical solutions in various embodiments may be appropriately combined to form other embodiments that can be understood by those skilled in the art, and the above-mentioned embodiments only express the preferred embodiments of the technical solutions, and the description thereof is more specific and detailed, but should not be construed as limiting the scope of the claims of the technical solutions. It should be noted that, for those skilled in the art, various modifications, improvements and substitutions can be made without departing from the spirit of the invention, and all of them belong to the protection scope of the technical solution.
Claims (9)
1. The adhesive tape for processing the wafer comprises a base material film and an adhesive layer, and is characterized in that the base material film comprises the following raw materials of 50-100 parts of adhesive tape resin, 20-50 parts of acrylonitrile-butadiene-styrene copolymer and 10-30 parts of modified coated marble filler; the modified coated marble filler is obtained by coating a marble powder filler serving as a core and melamine-formaldehyde resin serving as a coating on the surface of the marble powder filler to obtain the coated marble filler and then modifying the coated marble filler by using a coupling agent.
2. A wafer processing tape according to claim 1, wherein the tape resin is one or a mixture of several of polyethylene, polypropylene, ethylene-propylene copolymer, polybutylene, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, ionomer and other α -olefin homopolymers or copolymers, polyethylene terephthalate, polycarbonate and polymethyl methacrylate.
3. A wafer processing tape according to claim 2 wherein the substrate film has a thickness of 90 μm to 180 μm.
4. The wafer processing tape according to claim 3, wherein the adhesive of the adhesive layer is of an ultraviolet curing type.
5. The wafer processing tape according to claim 4, wherein the preparation method of the modified coated marble filler comprises the following steps of 1) preparing melamine formaldehyde resin prepolymer: taking melamine, formaldehyde solution and distilled water according to the weight ratio of (1-5) to (1-6), mixing, wherein the mass fraction of the formaldehyde solution is 20%, and reacting for 1h under the conditions that the pH is 7-8 and the temperature is 55-65 ℃ to obtain a melamine-formaldehyde resin prepolymer; 2) preparing a coated marble powder filler: taking a melamine formaldehyde resin prepolymer and a surfactant aqueous solution according to the weight ratio of 1 (5-10), stirring and mixing for 1h, wherein the mass fraction of the surfactant aqueous solution is 30%, then adding marble powder and gelatin according to the ratio of 0.5:1:0.5 of the melamine formaldehyde resin prepolymer, the marble powder and the gelatin, reacting for 3-4h at the pH of 3-4 and the temperature of 50-60 ℃, and filtering, washing and drying to obtain a coated marble powder filler; 3) preparing modified coating type marble filler: adding the coated marble powder filler into a high-speed dispersion machine, uniformly spraying a coupling agent accounting for 0.5-1.5% of the mass of the coated marble powder filler at the temperature of 100 ℃, keeping stirring for 30-40min, and discharging to obtain the modified coated marble filler.
6. A wafer processing tape according to claim 5 wherein the coupling agent is vinyltrimethoxysilane.
7. A wafer processing tape according to claim 6 wherein the base film comprises 50 parts of a tape resin, 20 parts of an acrylonitrile-butadiene-styrene copolymer, and 10 parts of a modified and coated marble filler.
8. A wafer processing tape according to claim 6 wherein the base film comprises 100 parts of a tape resin, 50 parts of an acrylonitrile-butadiene-styrene copolymer, and 30 parts of a modified and coated marble filler.
9. A method of preparing a wafer processing tape according to any one of claims 1 to 8, comprising the steps of 1) weighing the raw materials according to a formulation; 2) adding the adhesive tape resin, the acrylonitrile-butadiene-styrene copolymer and the modified coated marble filler into a mixing container, and uniformly mixing to obtain a mixture; 3) extruding a material which is heated to obtain fluidity from the mixture, and cooling the extruded material by a cooling roller to form a film so as to obtain a base material film; 4) an adhesive layer was coated on the base film and cured by ultraviolet rays to obtain an adhesive tape.
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| CN202011480151.3A CN112592672A (en) | 2020-12-15 | 2020-12-15 | Adhesive tape for wafer processing and manufacturing method thereof |
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| CN107112229A (en) * | 2015-03-06 | 2017-08-29 | 古河电气工业株式会社 | Semiconductor wafer surface protection adhesive tape |
| CN111793319A (en) * | 2020-08-12 | 2020-10-20 | 汕头市邦腾科技有限公司 | High-toughness modified plastic and preparation method and application thereof |
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|---|---|---|---|---|
| CN107112229A (en) * | 2015-03-06 | 2017-08-29 | 古河电气工业株式会社 | Semiconductor wafer surface protection adhesive tape |
| CN111793319A (en) * | 2020-08-12 | 2020-10-20 | 汕头市邦腾科技有限公司 | High-toughness modified plastic and preparation method and application thereof |
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