CN112588624A - Wafer sorting equipment and wafer sorting method - Google Patents
Wafer sorting equipment and wafer sorting method Download PDFInfo
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- CN112588624A CN112588624A CN202011546173.5A CN202011546173A CN112588624A CN 112588624 A CN112588624 A CN 112588624A CN 202011546173 A CN202011546173 A CN 202011546173A CN 112588624 A CN112588624 A CN 112588624A
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 235000012431 wafers Nutrition 0.000 claims abstract description 209
- 238000007599 discharging Methods 0.000 claims abstract description 42
- 238000000926 separation method Methods 0.000 claims abstract description 12
- 238000001914 filtration Methods 0.000 claims description 14
- 210000001503 joint Anatomy 0.000 claims description 6
- 238000007664 blowing Methods 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 230000002950 deficient Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims 1
- 230000003749 cleanliness Effects 0.000 abstract description 24
- 238000002955 isolation Methods 0.000 description 26
- 239000002245 particle Substances 0.000 description 7
- 238000005192 partition Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000012864 cross contamination Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- -1 region Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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Abstract
The present disclosure provides a wafer sorting apparatus and a wafer sorting method, the wafer sorting apparatus including: the separation chamber is divided into a first chamber and a second chamber which are independent, the first chamber is provided with a first feeding end and a first feed opening, and the second chamber is provided with a second feeding end and a second feed opening; the calibrator unit is arranged between the first cavity and the second cavity and is divided into a first part and a second part, the first part is provided with a first feeding port and a first discharging end communicated with the first feeding end, the second part is provided with a second feeding port and a second discharging end communicated with the second feeding end, and the first cavity is provided with a first mechanical arm used for grabbing qualified wafers from the first part and conveying the qualified wafers to the first discharging port; the second chamber is provided with a second mechanical arm used for grabbing unqualified wafers from the second part and transmitting the unqualified wafers to the second feed opening. The wafer sorting equipment and the wafer sorting method can improve the cleanliness of the wafer sorting environment, reduce the pollution risk and improve the efficiency.
Description
Technical Field
The invention relates to the field of semiconductor production and manufacturing, in particular to wafer sorting equipment and a wafer sorting method.
Background
With the rapid development of semiconductors, the cleanliness requirement of wafers is higher and higher, and the cleanliness of a wafer sorting device (shifting Compiler) is particularly important as a sorting device before the wafers are shipped. Some wafers that are originally OK (qualified) may be contaminated by the wafer sorting equipment.
In the related art, the main structure of the wafer sorting apparatus is: the equipment comprises a sorting chamber, wherein an Aligner (calibrator) mechanism is arranged at one end of the sorting chamber, a Load port (feeding port) and an Unload port (discharging port) of a wafer are respectively arranged at the front side and the rear side of the sorting chamber, and a robot and a mechanical arm are arranged in the sorting chamber and used for grabbing and transferring the wafer. The cleanliness levels in the sorting chambers of the whole equipment are the same, the conventional wafer sorting equipment for 12-inch wafers is generally provided with 8-10 Port openings (upper and lower material openings), and the equipment space is large; an EFU unit (fan filtering unit) is arranged above the sorting chamber, and airflow is uniformly and stably blown from top to bottom under a static condition.
The existing wafer sorting equipment has the following defects:
1) when the equipment is sorted and operated, an internal Robot (Robot) and a mechanical arm move ceaselessly, and each movement inevitably generates vortex, so that the turbulence is increased, particles (particles) in the equipment fall above a wafer, and the product quality is influenced, so that the moving speed of the Robot and the mechanical arm needs to be reduced, but the productivity of the equipment is influenced;
2) the existing wafer sorting equipment is of a single-layer structure, and the equipment efficiency is low;
3) OK wafers (qualified wafers) and NG wafers (unqualified wafers) in the sorting chamber are sorted in a chamber environment, contact the same mechanical arm, and have the risk of mutual cross contamination;
4) the currently used wafer sorting equipment generally has 8-10 Port openings (upper and lower material openings), the equipment space is large, the occupied area of a production line is large, the cleanliness of such a large area is ensured to be always free from problems, and the difficulty is high;
5) when equipment PM is cleaned, the whole machine needs to be stopped.
Disclosure of Invention
The embodiment of the disclosure provides wafer sorting equipment and a wafer sorting method, which can improve the environmental cleanliness during wafer sorting, reduce the pollution risk and improve the efficiency.
The technical scheme provided by the embodiment of the disclosure is as follows:
a wafer sorting apparatus comprising:
the separation device comprises a separation chamber, a first separation chamber and a second separation chamber, wherein the separation chamber is divided into a first chamber and a second chamber which are independent, the first chamber is provided with a first feeding end and a first discharging port, and the second chamber is provided with a second feeding end and a second discharging port;
the calibrator unit is arranged between the first chamber and the second chamber, the chamber of the calibrator unit is further divided into a first part and a second part, the first part is provided with a first feeding port for feeding qualified wafers and a first discharging end communicated with the first feeding end, the second part is provided with a second feeding port for feeding unqualified wafers and a second discharging end communicated with the second feeding end,
the first cavity is internally provided with a first mechanical arm which is used for grabbing qualified wafers from the first part through the first feeding end and transmitting the qualified wafers to the first discharging port;
and a second mechanical arm is arranged in the second cavity and used for grabbing unqualified wafers from the second part through the second feeding end and conveying the unqualified wafers to the second feeding port.
For example, a first filtering fan unit is arranged above the first chamber and used for blowing airflow into the first chamber from top to bottom; and a second filtering fan unit is arranged above the second chamber and used for blowing airflow into the second chamber from top to bottom.
Illustratively, the first feeding end of the first chamber and the second feeding end of the second chamber are arranged oppositely and staggered by a predetermined distance;
the first feeding port and the second feeding port are respectively located on two opposite sides of a cavity of the calibrator unit, the first discharging end and the second discharging end of the calibrator unit are respectively arranged on two opposite sides of the cavity of the calibrator unit and are opened in opposite directions, so that the first feeding end is in butt joint communication with the first discharging end, and the second feeding end is in butt joint communication with the second discharging end.
Illustratively, a first electric isolating door is arranged between the first feeding end and the first discharging end;
a second electric isolating door is arranged between the second feeding end and the second discharging end;
and a third electric isolating door is arranged between the first part and the second part.
Illustratively, the wafer sorting apparatus further comprises:
the control unit is connected with the first mechanical arm, the second mechanical arm, the first filtering fan unit, the second filtering fan unit, the first electric isolating door, the second electric isolating door and the third electric isolating door and used for controlling the working states of the first mechanical arm, the second mechanical arm, the first filtering fan unit, the second filtering fan unit, the first electric isolating door, the second electric isolating door and the third electric isolating door.
Illustratively, the aligner unit is internally provided with a contraposition mechanism and a wafer conveying mechanism for conveying wafers.
A wafer sorting method for sorting qualified wafers and unqualified wafers by using the wafer sorting apparatus as described above, the method comprising:
transferring qualified wafers into the first part of the aligner unit through the first loading port, controlling the first manipulator to grab the qualified wafers from the first part, and transferring the qualified wafers into the first unloading port in the first chamber;
and conveying unqualified wafers into the second part of the calibrator unit through the second feeding port, controlling the second manipulator to grab unqualified wafers from the second part, and conveying the unqualified wafers to the second feeding port in the second chamber.
For example, in the method, the moving speed of the first manipulator is controlled to be smaller than the moving speed of the second manipulator.
In the method, after the qualified wafer is transferred into the first portion of the aligner unit through the first loading port, before the first robot is controlled to grasp the qualified wafer from the first portion, the method further includes:
controlling the first electric isolating door and the third electric isolating door to be closed, and aligning qualified wafers by the calibrator unit, wherein when the qualified wafers do not reach a preset position, the third electric isolating door is opened to align qualified wafer sheets, and when the qualified wafers reach the preset position, the third electric isolating door is closed, the alignment is completed, and the first electric isolating door is opened;
in the method, after the defective wafer is transferred into the second portion of the aligner unit through the second loading port, before controlling the second robot to grasp the defective wafer from the second portion, the method further includes:
and controlling the second electric isolating door and the third electric isolating door to be closed, aligning unqualified wafers by the calibrator unit, opening the third electric isolating door when the unqualified wafers do not reach a preset position, carrying out sheet-passing alignment on the unqualified wafers, closing the third electric isolating door when the unqualified wafers reach the preset position, completing the alignment, and opening the second electric isolating door.
The beneficial effects brought by the embodiment of the disclosure are as follows:
the wafer sorting equipment and the wafer sorting method provided by the embodiment of the disclosure divide the sorting chamber into two independent chambers, namely, a first chamber for sorting qualified wafers and a second chamber for sorting unqualified wafers, so that, the first chamber and the second chamber are managed in a partition mode, so that the first chamber where qualified wafers are located is a high-cleanliness area, the second chamber where unqualified wafers are located is a common-cleanliness area, similarly, the calibrator units are divided into a first part and a second part in a partition mode, when the qualified wafer enters the first portion from the first loading port of the aligner unit, the aligner unit performs Notch alignment, after the alignment is finished, a first mechanical arm for grabbing the qualified wafer enters the first part, and the qualified wafer is moved to the first feed opening through the first chamber; similarly, when the unqualified wafer enters the second part from the second feeding port of the calibrator unit, the calibrator unit performs Notch alignment, and after the alignment is completed, the second mechanical arm for grabbing the unqualified wafer enters the second part and moves the unqualified wafer to the second feeding port through the second chamber. Therefore, the second mechanical arm of the low-cleanliness area (namely the second chamber) where the unqualified wafer is located can be set to have higher moving speed, the sorting speed is increased, and the equipment utilization rate is improved; and the high cleanliness district at qualified wafer place, first cavity promptly, consider the vortex influence, first manipulator can set up lower moving speed, guarantees higher cleanliness factor simultaneously, like this, because general cleanliness factor district and high cleanliness factor are distinguished and are strictly divided, can divide the regional equipment PM that carries on clean, greatly promote equipment efficiency.
Drawings
Fig. 1 is a schematic structural view of a wafer sorting apparatus according to the related art;
fig. 2 is a schematic structural diagram of a wafer sorting apparatus provided in an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Before the detailed description of the wafer sorting apparatus and the wafer sorting method according to the embodiments of the present disclosure, it is necessary to describe the following for the related art:
in the related art, as shown in fig. 1, the main structure of the wafer sorting apparatus is as follows: the sorting device comprises a sorting chamber 10, an Aligner (calibrator) unit 20 is arranged at one end of the sorting chamber, a Load port (feeding port) 11 and an Unload port (discharging port) 12 of wafers are respectively arranged at the front side and the rear side of the sorting chamber 10, and a robot and a mechanical arm 30 are arranged in the sorting chamber 10 and used for grabbing and transferring the wafers. The cleanliness levels in the sorting chambers of the whole equipment are the same, the conventional wafer sorting equipment for 12-inch wafers is generally provided with 8-10 Port openings (upper and lower material openings), and the equipment space is large; an EFU unit (fan filtering unit) is arranged above the sorting chamber, and airflow is uniformly and stably blown from top to bottom under a static condition.
The existing wafer sorting equipment has the following defects:
1) when the equipment is sorted and operated, an internal Robot (Robot) and a mechanical arm move ceaselessly, and each movement inevitably generates vortex, so that the turbulence is increased, particles (particles) in the equipment fall above a wafer, and the product quality is influenced, so that the moving speed of the Robot and the mechanical arm needs to be reduced, but the productivity of the equipment is influenced;
2) the existing wafer sorting equipment is of a single-layer structure, and the equipment efficiency is low;
3) OK wafers (qualified wafers) and NG wafers (unqualified wafers) in the sorting chamber are sorted in a chamber environment, contact the same mechanical arm, and have the risk of mutual cross contamination;
4) the currently used wafer sorting equipment generally has 8-10 ports (ports), the equipment space is large, the occupied area of a production line is large, and the problem of cleanliness of such a large area is ensured all the time, so that the difficulty is large;
5) when equipment PM is cleaned, the whole machine needs to be stopped.
Therefore, the technical problems to be solved by the current wafer sorting equipment are as follows: how to ensure the cleanliness of qualified wafers, not being polluted by unqualified wafers sorted simultaneously, how to realize PM partitioning, improve the utilization rate of equipment and accelerate the productivity.
In view of the above problems, the embodiments of the present disclosure provide a wafer sorting apparatus and a wafer sorting method, which can improve the environmental cleanliness during wafer sorting, reduce the risk of contamination, and improve the efficiency.
As shown in fig. 2, a wafer sorting apparatus provided by an embodiment of the present disclosure includes:
the separation chamber is divided into a first chamber 110 and a second chamber 120 which are independent, the first chamber 110 is provided with a first feeding end and a first discharging port 111, and the second chamber 120 is provided with a second feeding end and a second discharging port 121;
and a calibrator unit 200, wherein the calibrator unit 200 is disposed between the first chamber 110 and the second chamber 120, and the chamber of the calibrator unit 200 is further divided into a first portion 210 and a second portion 220, the first portion 210 is provided with a first loading port 211 for feeding qualified wafers and a first discharging end communicated with the first feeding end, the second portion 220 is provided with a second loading port 221 for feeding unqualified wafers and a second discharging end communicated with the second feeding end,
a first robot arm 112 is further disposed in the first chamber 110, and is configured to pick up a qualified wafer from the first portion 210 through the first feeding end, and transfer the qualified wafer to the first discharging opening 111;
a second robot 122 is disposed in the second chamber 120, and is configured to pick an unqualified wafer from the second portion 220 through the second feeding end and transfer the unqualified wafer to the second feeding port 121.
The wafer sorting apparatus and the wafer sorting method according to the embodiment of the present disclosure divide a sorting chamber into two independent chambers, namely, a first chamber 110 and a second chamber 120, for partition management, wherein the first chamber 110 is used for sorting qualified wafers, and the second chamber 120 is used for sorting unqualified wafers, so that the first chamber 110 and the second chamber 120 are managed in a partition manner, such that the first chamber 110 where the qualified wafers are located is a high cleanliness area, the second chamber 120 where the unqualified wafers are located is a general cleanliness area, and similarly, the aligner unit 200 is divided into a first portion 210 and a second portion 220 in a partition manner, when the qualified wafers enter the first portion 210 from a first loading port 211 of the aligner unit 200, the aligner unit 200 performs Notch alignment, and after the alignment is completed, the first robot 112 that picks up qualified wafers enters the first portion 210, moving the qualified wafer to a first discharge port 111 through the first chamber 110; similarly, when the unqualified wafer enters the second portion 220 from the second loading opening 221 of the aligner unit 200, the aligner unit 200 performs Notch alignment, and after the alignment is completed, the second robot 122 gripping the unqualified wafer enters the second portion 220 to move the unqualified wafer to the second loading opening 121 through the second chamber 120. In this way, the second robot arm 122 in the low cleanliness area (i.e., the second chamber 120) where the unqualified wafer is located can set a higher moving speed, so that the sorting speed is increased, and the equipment utilization rate is improved; and the high cleanliness district that qualified wafer was located, first chamber 110, considered the vortex influence, first robotic arm 112 can set up lower moving speed, guarantees higher cleanliness factor simultaneously, like this, because general cleanliness factor district and high cleanliness factor are strict separately, can divide the regional equipment PM that carries on clean, greatly promotes equipment efficiency.
In some exemplary embodiments, a first filter fan unit (EFU) is disposed above the first chamber 110 for blowing an air flow into the first chamber 110 from top to bottom; a second filter fan unit is disposed above the second chamber 120, and is configured to blow an airflow into the second chamber 120 from top to bottom.
In the above scheme, the filter fan units of the first chamber 110 and the second chamber 120 are also separately and independently arranged, and the EFU air speed and other parameters in different chambers can be controlled to be independently controlled, so that the cleanliness of the first chamber 110 is higher, for example, the air speed of the first filter fan unit can be controlled to be properly increased, particles (particles) can be conveniently taken away, and abnormal risks of products caused by wafer sorting equipment are reduced.
Further, in some exemplary embodiments, the first feed end of the first chamber 110 and the second feed end of the second chamber 120 are disposed opposite and offset by a predetermined distance; the first feeding port 211 and the second feeding port 221 are located on two opposite sides of a cavity of the calibrator unit 200, the first discharging end and the second discharging end of the calibrator unit 200 are respectively arranged on two opposite sides of the cavity of the calibrator unit 200 and open in opposite directions, so that the first feeding end is in butt joint with the first discharging end, and the second feeding end is in butt joint with the second discharging end.
In the above scheme, the first chamber 110 and the second chamber 120 are arranged side by side and at intervals, the feeding ends of the two chambers are arranged in opposite directions and staggered by a certain distance, the first discharging end on the chamber of the calibrator unit 200 is over against the first feeding end of the first chamber 110, and the first discharging end is over against the second feeding end of the second chamber 120, so that the structural design is ingenious, and the occupied space of the equipment can be saved. It will be understood, of course, that in practice, the manner in which the first chamber 110 communicates with the first portion 210 of the calibrator unit 200 and the manner in which the second chamber 120 communicates with the second portion 220 of the calibrator unit 200 are not limited thereto.
Further, in some exemplary embodiments, as shown in fig. 2, a first powered isolation gate 310 is disposed between the first infeed end and the first outfeed end; a second electric isolating door 320 is arranged between the second feeding end and the second discharging end; a third electrically powered isolation door 330 is disposed between the first portion 210 and the second portion 220.
By adopting the above scheme, the first electric isolation door 310 is arranged between the first feeding end and the first discharging end, that is, the first electric isolation door 310 is arranged between the first chamber 110 and the first part 210 of the aligner unit 200, so that during sorting, before qualified wafers enter the first part 210 of the aligner unit 200, the first electric isolation door 310 and the third electric isolation door 330 are controlled to be closed, the aligner unit 200 is used for aligning qualified wafers, when the qualified wafers do not reach a preset position, the third electric isolation door 330 is opened, qualified wafer passing alignment is performed, when the qualified wafers reach the preset position, the third electric isolation door 330 is closed, and after the alignment is completed, the first electric isolation door 310 is opened, so that the first mechanical arm 112 captures the qualified wafers; similarly, before the unqualified wafers enter the second part 220 of the calibrator unit 200, the second electric isolation door 320 and the third electric isolation door 330 are controlled to be closed, the calibrator unit 200 is used for aligning the unqualified wafers, when the unqualified wafers do not reach a preset position, the third electric isolation door 330 is opened, the unqualified wafers are subjected to wafer passing alignment, when the unqualified wafers reach the preset position, the third electric isolation door 330 is closed, and after the alignment is completed, the second electric isolation door 320 is opened, so that the second robot arm 122 can grasp the unqualified wafers. In the whole process, the first electric isolating door 310, the second electric isolating door 320 and the third electric isolating door 330 are designed to control the opening and closing of the electric isolating doors, so that strict partition management of the first chamber 110 and the second chamber 120 can be ensured, and the cleanliness can be ensured.
In some exemplary embodiments, the wafer sorting apparatus further comprises: a control unit, connected to the first robot arm 112, the second robot arm 122, the first filter fan unit, the second filter fan unit, the first electric isolation door 310, the second electric isolation door 320, and the third electric isolation door 330, for controlling the operating states of the first robot arm 112, the second robot arm 122, the first filter fan unit, the second filter fan unit, the first electric isolation door 310, the second electric isolation door 320, and the third electric isolation door 330.
According to the scheme, the control unit controls the working state of each part to realize automation.
In addition, in some exemplary embodiments, the aligner unit 200 is provided with an alignment mechanism and a wafer transfer mechanism for transferring a wafer.
The specific structure of the sheet conveying mechanism in the calibrator unit 200 is not limited, and may be implemented by using a robot arm, for example. For example, in an exemplary embodiment, the film transfer mechanism includes a third robot arm (not shown) for transferring the film, which is disposed inside the calibrator unit 200, and the position of the third robot arm may be fixed above the third power isolation door 330, or on any inner wall inside the chamber of the calibrator unit 200.
In addition, the embodiment of the disclosure also provides a wafer sorting method, which is used for sorting qualified wafers and unqualified wafers by adopting the wafer sorting equipment of the embodiment of the disclosure, and the method comprises the following steps:
transferring a qualified wafer into the first portion 210 of the aligner unit 200 through the first loading port 211, controlling the first robot to pick up a qualified wafer from the first portion 210, and transferring the qualified wafer to the first unloading port 111 in the first chamber 110;
and transferring the unqualified wafer into the second portion 220 of the aligner unit 200 through the second loading port 221, controlling the second robot to pick the unqualified wafer from the second portion 220, and transferring the unqualified wafer into the second loading port 121 in the second chamber 120.
For example, in the method, the moving speed of the first manipulator is controlled to be smaller than the moving speed of the second manipulator. Thus, the efficiency of the apparatus can be improved.
For example, in the method, after the qualified wafer is transferred into the first portion 210 of the aligner unit 200 through the first loading port 211, before the first robot is controlled to grasp the qualified wafer from the first portion 210, the method further includes:
controlling the first electric isolating door 310 and the third electric isolating door 330 to be closed, and aligning qualified wafers by the calibrator unit 200, wherein when the qualified wafers do not reach a preset position, the third electric isolating door 330 is opened, the qualified wafers are subjected to wafer passing alignment, when the qualified wafers reach the preset position, the third electric isolating door 330 is closed, the alignment is completed, and the first electric isolating door 310 is opened;
in the method, after the unqualified wafer is transferred into the second portion 220 of the aligner unit 200 through the second loading port 221, before the second robot is controlled to grasp the unqualified wafer from the second portion 220, the method further comprises:
the second electric isolation door 320 and the third electric isolation door 330 are controlled to be closed, the calibrator unit 200 aligns unqualified wafers, when the unqualified wafers do not reach a preset position, the third electric isolation door 330 is opened, the unqualified wafers are subjected to wafer transferring alignment, when the unqualified wafers reach the preset position, the third electric isolation door 330 is closed, the alignment is completed, and the second electric isolation door 320 is opened.
In summary, the wafer sorting apparatus and the wafer sorting method provided by the embodiment of the present disclosure can implement the partition management of cleanliness, and the material outlets of the qualified wafers and the unqualified wafers are separated, and for the area where the qualified wafers are located, key management and control can be implemented, and key PM cleaning and the like can be implemented, so that the risk of contamination of the qualified wafers is reduced, and the calibrator unit 200 is provided with the material inlet, so that the moving range of the robot arm can be reduced, and the risk of particle contamination is reduced.
The following points need to be explained:
(1) the drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to the common design.
(2) For purposes of clarity, the thickness of layers or regions in the figures used to describe embodiments of the present disclosure are exaggerated or reduced, i.e., the figures are not drawn on a true scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(3) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.
The above is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and the scope of the present disclosure should be determined by the scope of the claims.
Claims (9)
1. A wafer sorting apparatus, comprising:
the separation device comprises a separation chamber, a first separation chamber and a second separation chamber, wherein the separation chamber is divided into a first chamber and a second chamber which are independent, the first chamber is provided with a first feeding end and a first discharging port, and the second chamber is provided with a second feeding end and a second discharging port;
the calibrator unit is arranged between the first chamber and the second chamber, the chamber of the calibrator unit is further divided into a first part and a second part, the first part is provided with a first feeding port for feeding qualified wafers and a first discharging end communicated with the first feeding end, the second part is provided with a second feeding port for feeding unqualified wafers and a second discharging end communicated with the second feeding end,
the first cavity is internally provided with a first mechanical arm which is used for grabbing qualified wafers from the first part through the first feeding end and transmitting the qualified wafers to the first discharging port;
and a second mechanical arm is arranged in the second cavity and used for grabbing unqualified wafers from the second part through the second feeding end and conveying the unqualified wafers to the second feeding port.
2. The wafer sorting apparatus of claim 1,
a first filtering fan unit is arranged above the first chamber and used for blowing airflow into the first chamber from top to bottom; and a second filtering fan unit is arranged above the second chamber and used for blowing airflow into the second chamber from top to bottom.
3. The wafer sorting apparatus of claim 1,
the first feeding end of the first chamber and the second feeding end of the second chamber are arranged oppositely and staggered by a preset distance;
the first feeding port and the second feeding port are respectively located on two opposite sides of a cavity of the calibrator unit, the first discharging end and the second discharging end of the calibrator unit are respectively arranged on two opposite sides of the cavity of the calibrator unit and are opened in opposite directions, so that the first feeding end is in butt joint communication with the first discharging end, and the second feeding end is in butt joint communication with the second discharging end.
4. The wafer sorting apparatus of claim 2,
a first electric isolating door is arranged between the first feeding end and the first discharging end;
a second electric isolating door is arranged between the second feeding end and the second discharging end;
and a third electric isolating door is arranged between the first part and the second part.
5. The wafer sorting apparatus of claim 4,
the wafer sorting apparatus further comprises:
the control unit is connected with the first mechanical arm, the second mechanical arm, the first filtering fan unit, the second filtering fan unit, the first electric isolating door, the second electric isolating door and the third electric isolating door and used for controlling the working states of the first mechanical arm, the second mechanical arm, the first filtering fan unit, the second filtering fan unit, the first electric isolating door, the second electric isolating door and the third electric isolating door.
6. The wafer sorting apparatus of claim 2,
the calibrator unit is internally provided with a contraposition mechanism and a wafer transmission mechanism for transmitting wafers.
7. A wafer sorting method for sorting a qualified wafer and a rejected wafer using the wafer sorting apparatus according to any one of claims 1 to 6, the method comprising:
transferring qualified wafers into the first part of the aligner unit through the first loading port, controlling the first manipulator to grab the qualified wafers from the first part, and transferring the qualified wafers into the first unloading port in the first chamber;
and conveying unqualified wafers into the second part of the calibrator unit through the second feeding port, controlling the second manipulator to grab unqualified wafers from the second part, and conveying the unqualified wafers to the second feeding port in the second chamber.
8. The method of claim 7,
in the method, the moving speed of the first manipulator is controlled to be smaller than the moving speed of the second manipulator.
9. The method of claim 7,
a first electric isolating door is arranged between the first feeding end and the first discharging end;
a second electric isolating door is arranged between the second feeding end and the second discharging end;
a third electric isolating door is arranged between the first part and the second part;
in the method, after the qualified wafer is transferred into the first portion of the aligner unit through the first loading port, before controlling the first robot to grasp the qualified wafer from the first portion, the method further comprises:
controlling the first electric isolating door and the third electric isolating door to be closed, and aligning qualified wafers by the calibrator unit, wherein when the qualified wafers do not reach a preset position, the third electric isolating door is opened to align qualified wafer sheets, and when the qualified wafers reach the preset position, the third electric isolating door is closed, the alignment is completed, and the first electric isolating door is opened;
in the method, after the defective wafer is transferred into the second portion of the aligner unit through the second loading port, before controlling the second robot to grasp the defective wafer from the second portion, the method further includes:
and controlling the second electric isolating door and the third electric isolating door to be closed, aligning unqualified wafers by the calibrator unit, opening the third electric isolating door when the unqualified wafers do not reach a preset position, carrying out sheet-passing alignment on the unqualified wafers, closing the third electric isolating door when the unqualified wafers reach the preset position, completing the alignment, and opening the second electric isolating door.
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