CN112588540A - Hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation and preparation method thereof - Google Patents
Hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation and preparation method thereof Download PDFInfo
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- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
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- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/102—Pretreatment of metallic substrates
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
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Abstract
The invention discloses a hydrophilic-hydrophobic heterogeneous patterned surface for intensifying dropwise condensation and a preparation method thereof, wherein the surface of a copper substrate is sequentially subjected to polishing treatment and deoiling treatment to obtain a complete and clean copper surface; etching the copper surface by adopting a chemical etching method to obtain a super-hydrophilic surface; rotationally coating negative photoresist on the super-hydrophilic surface; irradiating the pattern mask under UV light; the super-hydrophilic areas on the pattern mask are square in array arrangement, and the distance between any two adjacent super-hydrophilic areas is kept consistent; developing the copper surface by using a negative photoresist developer; plating fluorinated polymer Cytop on the copper surface after development treatment in a rotating way, and forming a super-hydrophobic surface on the copper surface outside the photoresist covering position; and heating and curing the copper substrate by adopting a stripping process to obtain the super-hydrophilic/super-hydrophobic patterned combined surface. The hydrophilic and hydrophobic heterogeneous patterned surface prepared by the method can enhance the dropwise condensation efficiency and improve the condensation heat transfer coefficient of the surface.
Description
Technical Field
The invention belongs to the field of metal surface treatment, and particularly relates to a hydrophilic and hydrophobic heterogeneous patterned surface for enhancing dropwise condensation and a preparation method thereof.
Background
Steam condensation widely exists in the industrial fields of thermal power generation, industrial waste heat utilization, building heat supply, refrigeration and the like. Generally, the condensing mode may be divided into droplet-shaped condensation and film-shaped condensation according to the wettability of the condensing surface. The drop-shaped condensation occurs on a non-wetting surface, and can generate better condensation heat transfer performance, and the condensation heat transfer coefficient of the drop-shaped condensation is 5-10 times that of film-shaped condensation. Film-like condensation has poor condensation effect, but the thermal resistance of droplet nucleation is small, and the nucleation is rapid. The surface of the material with the static contact angle of the liquid drop larger than 150 degrees is called super-hydrophobic surface, and the surface with the contact angle smaller than 10 degrees is called super-hydrophilic surface. In recent years, a great number of researchers have made superhydrophobic surfaces to form droplet-shaped condensation to improve condensation heat transfer performance. Ma et al in the literature (fluorescence of processing conditions of polymer film on hydrowire condensation Heat Transfer [ J ]. International Journal of Heat and Mass Transfer,2002,45 (16)), using ion beam dynamic combination implantation (DIMI) technology in copper pipe outer wall preparation to obtain a super hydrophobic surface, and studied its Heat Transfer characteristics, the experimental results show that the droplet condensation relative to film condensation its Heat Transfer coefficient can be maximally improved by about 28.6 times. Miljkovic et al experimentally studied the droplet morphology and droplet-shaped condensation heat transfer performance of a superhydrophobic surface in a document (Jumping-simple-enhanced condensation on scalable surface [ J ] Nano Letter,2013,13,179-187.), and compared with a common hydrophobic surface, the superhydrophobic surface with a Nano structure can improve the heat flux by 25% and the condensation heat transfer coefficient by 30%.
However, it was found that the energy barrier for droplet nucleation on superhydrophobic surfaces is much larger than that on superhydrophilic surfaces, and the condensed droplet nucleation density is also much smaller than that on superhydrophilic surfaces, especially in the initial stages of droplet nucleation. This means that, under the same condensation conditions, film-like condensation nucleates in a shorter time than drop-like condensation and preferentially forms a liquid film on the condensation walls. Therefore, in recent years, approaches to achieve enhanced droplet condensation heat transfer performance have begun to focus on preparing hydrophilic/hydrophobic composite surfaces with mixed wettabilities. Patent CN109732195A discloses a method for preparing a superhydrophobic-superhydrophilic surface on a titanium alloy by using a pulse laser technology, wherein superhydrophobic regions and superhydrophilic regions are alternately arranged in a wedge shape or a triangle shape, but the surface prepared by using the method cannot well regulate and control the shedding diameter and merging frequency of condensed liquid drops due to the staggered arrangement of the superhydrophilic regions and the superhydrophobic regions, and the laser processing manufacturing cost is relatively high. Patent CN111069001A discloses a bionic hydrophobic-hydrophilic surface material, which is a micro-nano composite surface material formed by constructing nano protrusions on a composite surface with hydrophilic-hydrophobic regions with hydrophilic micron protrusions alternately, wherein the static contact angle of liquid drops on the composite hydrophilic-hydrophobic surface is 90-130 degrees, but the composite surface is a non-super-hydrophilic surface and a non-super-hydrophobic surface, and the advantages of low nucleation thermal resistance of the super-hydrophilic surface and high condensation heat transfer coefficient of the super-hydrophobic surface cannot be fully exerted. Patent CN110255492A discloses a method for making a super-hydrophobic and super-hydrophilic area distribution surface on a silicon substrate by using a laser processing technology, which needs to combine a chemical modification method, laser ablation processing and irradiation under mask ultraviolet light, and has high processing difficulty and high cost, and the substrate is a non-metal silicon wafer material and is difficult to use in engineering heat exchange fields such as condensing heat exchangers and high-temperature distillers.
In view of the above, the surface and the preparation method thereof are provided, which can realize ordered and controllable distribution of the super-hydrophilic region and the super-hydrophobic region with non-uniform wetting characteristics on the copper substrate, have the advantages of rapid liquid drop nucleation and high condensation heat transfer coefficient, and can orderly regulate and control the shedding diameter, merging frequency and size distribution of condensed liquid drops, and have important significance for enhancing the drop-shaped condensation efficiency and reducing the energy consumption.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a hydrophilic and hydrophobic heterogeneous patterned surface for enhancing dropwise condensation and a preparation method thereof, and aims to enhance the dropwise condensation efficiency of the hydrophilic and hydrophobic heterogeneous patterned surface and improve the condensation heat transfer coefficient of the surface.
The technical scheme adopted by the invention is as follows:
a preparation method of a hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation comprises the following steps:
step 3, rotationally coating negative photoresist on the obtained super-hydrophilic surface;
step 4, irradiating the pattern mask under UV light; the super-hydrophilic areas on the pattern mask are square in array arrangement, and the distance between any two adjacent super-hydrophilic areas is kept consistent;
step 5, developing the copper surface by using a negative photoresist developer;
step 6, rotationally plating fluorinated polymer Cytop on the copper surface after the development treatment, and forming a super-hydrophobic surface on the copper surface except the photoresist covering position;
and 7, heating and curing the copper substrate by adopting a stripping process to obtain the super-hydrophilic/super-hydrophobic patterned combined surface.
Further, the method for polishing the surface of the copper substrate by grinding in the step 1 is as follows: the copper surface is mechanically polished and polished by sand paper of 400 meshes, 800 meshes, 1200 meshes, 2000 meshes and 5000 meshes in sequence until the surface is bright, so that a copper mirror phenomenon appears.
Further, the method for cleaning and degreasing in the step 1 comprises the following steps: and (3) placing the polished copper surface in an acetone solution, performing ultrasonic oscillation for 10 minutes to remove grease and impurities on the copper surface, taking out, washing with ethanol and deionized water respectively, taking out, and drying with nitrogen. And (3) putting the copper substrate with a clean surface into a citric acid solution to remove impurities such as copper green and copper oxide on the copper surface, taking out the copper substrate, fully washing the copper substrate with deionized water, and finally drying the surface by using nitrogen.
Further, the method for obtaining the super-hydrophilic surface by the chemical etching method in the step 2 comprises the following steps: and immersing the obtained copper substrate into an alkaline solution consisting of 3mol/L potassium hydroxide and 0.065mol/L potassium persulfate at room temperature, uniformly stirring, reacting for 15 minutes, taking out, cleaning by using deionized water, and drying by using nitrogen to obtain a super-hydrophilic surface.
Further, the method for rotationally coating the photoresist in the step 3 comprises the following steps: firstly, a copper substrate is adsorbed or fixed on a vacuum chuck, then liquid negative photoresist is dripped to the center of the copper surface, the vacuum chuck is rotated at a low speed of 200-.
Further, the method for irradiating UV light by using the pattern mask in the step 4 comprises the following steps: the pattern of the mask and the position of the surface of the copper substrate are aligned and precisely registered, and ultraviolet light (UV light) proximity exposure is used to change the solubility of the photoresist in a developing solution.
Further, the developing treatment method using the negative photoresist developer in the step 5 is as follows: the unexposed portions are removed using a negative photoresist developer (n-heptane) for development. After development, the photoetching quality needs to be checked, and if the film is unqualified, reworking is needed.
Further, in step 7, a Lift-off stripping process is used for metal deposition and metal stripping to remove the thin film layer.
A drip-shaped condensation-enhanced hydrophilic-hydrophobic heterogeneous patterned surface is prepared by adopting the preparation method, super-hydrophilic areas are square in array arrangement, and the outer part of the super-hydrophilic areas is a super-hydrophobic surface; by adjusting the size of the super-hydrophilic region pattern and the adjacent distance of the super-hydrophilic region, the combination frequency, the shedding diameter and the shedding frequency of the condensed liquid drops are orderly regulated and controlled.
The invention has the beneficial effects that:
1. the super-hydrophilic/super-hydrophobic controllable patterned combined surface prepared by the method combines the advantages of low condensation nucleation thermal resistance and high droplet nucleation rate of the super-hydrophilic surface and high condensation heat transfer coefficient of the super-hydrophobic surface, and can orderly regulate and control the merging frequency, the shedding diameter and the shedding frequency of condensed droplets by regulating the pattern size and the adjacent distance of the super-hydrophilic area. Compared with a single characteristic surface, the efficiency of the dropwise condensation heat exchange is enhanced.
2. According to the technical scheme, the photoetching technology is used, the required pattern mask can be manufactured according to the requirement to prepare the micron-level precision surface, the shape and the position of the pattern are controllable, the processing precision is high, the method can be used for preparing various patterned mixed surfaces, a foundation is laid for experimental research and preparation of different surfaces, and meanwhile, the method is convenient to process, low in energy consumption and capable of realizing large-scale industrial production.
3. According to the technical scheme, the chemical etching method and the photoetching technology are utilized to prepare the super-hydrophilic/super-hydrophobic patterned combined surface on the copper-based surface, the preparation process is simple, the material cost is low, and the economic benefit is high.
Drawings
FIG. 1 is a schematic representation of a hydrophilic-hydrophobic heterogeneous patterned surface; FIGS. 1(a) and 1(b) are schematic plan view and schematic perspective view of a patterned hydrophilic-hydrophobic heterogeneous surface designed according to the present invention.
FIG. 2 is an SEM image and a droplet contact angle measurement image of a hydrophilic-hydrophobic heterogeneous patterned surface; fig. 2(a) is a super-hydrophilic surface SEM image and a droplet contact angle measurement image, and fig. 2(b) is a super-hydrophobic surface SEM image and a contact angle measurement image.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment provides a preparation method of an efficient condensation hydrophilic-hydrophobic heterogeneous patterned surface with a micro-nano composite structure, which comprises the following steps:
Grinding and polishing treatment process: and (3) mechanically grinding and polishing the surface of the copper substrate by using 400-mesh, 800-mesh, 1200-mesh, 2000-mesh and 5000-mesh sand papers respectively in sequence until the surface is bright to have a copper mirror phenomenon, and paying attention to not scratch the surface.
Cleaning and oil removing treatment processes: and placing the obtained copper substrate in an acetone solution for ultrasonic oscillation for 10 minutes to remove grease and impurities on the surface of the copper substrate, taking out the copper substrate, washing the copper substrate with ethanol and deionized water respectively, and then drying the copper substrate with nitrogen. And (3) putting the copper substrate with a clean surface into a citric acid solution to remove copper oxide and verdigris on the surface, taking out the copper substrate, fully washing the copper substrate with deionized water, and drying the surface by using nitrogen.
And 2, immersing the obtained copper sheet into an alkaline solution consisting of 3mol/L potassium hydroxide and 0.065mol/L potassium persulfate at room temperature, uniformly stirring, reacting for 15 minutes, taking out, cleaning with deionized water, and drying with nitrogen to obtain the super-hydrophilic surface.
And 3, adsorbing the copper substrate on a vacuum chuck, dripping a sufficient amount of liquid negative photoetching b-rubber resistance agent to the center of the copper substrate, rotating the vacuum chuck at a low speed of 400rpm to diffuse the photoresist at the center, and then rotating the vacuum chuck at a high speed of 4500rpm to obtain a uniform photoresist pattern layer. And after the glue homogenizing and bonding, carrying out hot air convection until the temperature is reduced after drying.
Step 4, drawing a lithography mask graph in a DWG File format by using AutoCAD, namely, the super-hydrophilic regions are square in array arrangement, and the distance between any two adjacent super-hydrophilic regions is kept consistent, specifically, as shown in the attached drawings 1(a) and 1(b), in the embodiment, a square super-hydrophilic region surface is constructed on the surface of the super-hydrophobic structure, the side length L of the super-hydrophilic region is greater than 100 micrometers and smaller than 1mm, and the distance S between two adjacent super-hydrophilic regions is greater than 100 micrometers and smaller than 1 mm. And processing the mask plate according to the drawing. The mask and the copper substrate are aligned and fixed at required processing positions, the pattern of the mask and the position of the surface of the copper substrate are aligned and precisely sleeved, a small gap (10-25 mu m) exists between the mask and the surface, the damage of the mask and the surface can be reduced, and then ultraviolet light (UV light) proximity exposure is used for 15s to change the solubility of photoresist in developing solution.
And 5, using a dimethylbenzene solution as a negative photoresist developing solution, and immersing the copper surface in the developing solution for dissolving a soluble area caused by exposure within one minute. The copper surface is then removed and rinsed with ethanol (or n-heptane).
And 6, rotationally plating fluorinated polymer Cytop on the developed copper surface in a rotating mode like the glue homogenizing mode in the step 5, and rotationally coating the Cytop on the surface after adsorbing the copper substrate on the vacuum chuck to enable the surface to have super-hydrophobic characteristics. The fluorinated polymer Cytop (1-butyl vinyl ether) used in step 6 is a non-crystalline, highly transparent fluoropolymer, similar to polytetrafluoroethylene (Teflon).
And 7, heating and curing the copper substrate by using a Lift-off process to obtain the required super-hydrophilic/super-hydrophobic controllable patterned combined surface.
Based on the dropwise condensation enhanced hydrophilic-hydrophobic heterogeneous patterned surface prepared by the preparation method, the super-hydrophilic area is in a square shape arranged in an array, and the super-hydrophobic surface is arranged outside the super-hydrophilic area; by adjusting the size and the adjacent distance of the super-hydrophilic region pattern, the combination frequency, the shedding diameter and the shedding frequency of the condensed liquid drops are orderly regulated and controlled. By combining the super-hydrophilic surface SEM image and the droplet contact angle measurement image in fig. 2(a) and the super-hydrophobic surface SEM image and the contact angle measurement image in fig. 2(b), it can be seen that the super-hydrophilic region exhibits a composite microstructure of nanoflowers and nanorods, and the surface contact angle is 0 degrees, the super-hydrophobic region microstructure is dense, and the surface contact angle is 160 degrees.
The above embodiments are only used for illustrating the design idea and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the content of the present invention and implement the present invention accordingly, and the protection scope of the present invention is not limited to the above embodiments. Therefore, all equivalent changes and modifications made in accordance with the principles and concepts disclosed herein are intended to be included within the scope of the present invention.
Claims (9)
1. A preparation method of a hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation is characterized by comprising the following steps:
step 1, sequentially carrying out grinding and polishing treatment and cleaning and oil removing treatment on the surface of a copper substrate, and removing impurities to obtain a complete and clean copper surface;
step 2, etching the copper surface treated in the step 1 by adopting a chemical etching method to obtain a super-hydrophilic surface;
step 3, rotationally coating negative photoresist on the obtained super-hydrophilic surface;
step 4, irradiating the pattern mask under UV light; the super-hydrophilic areas on the pattern mask are square in array arrangement, and the distance between any two adjacent super-hydrophilic areas is kept consistent;
step 5, developing the copper surface by using a negative photoresist developer;
step 6, rotationally plating fluorinated polymer Cytop on the copper surface after the development treatment, and forming a super-hydrophobic surface on the copper surface except the photoresist covering position;
and 7, heating and curing the copper substrate by adopting a stripping process to obtain the super-hydrophilic/super-hydrophobic patterned combined surface.
2. The method for preparing the hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation according to claim 1, wherein the surface of the copper substrate is polished by the following method: the copper surface is mechanically polished and polished by sand paper of 400 meshes, 800 meshes, 1200 meshes, 2000 meshes and 5000 meshes in sequence until the surface is bright, so that a copper mirror phenomenon appears.
3. The method for preparing the hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation according to claim 1, wherein the method for cleaning and degreasing the copper substrate comprises the following steps: placing the polished copper surface in an acetone solution, performing ultrasonic oscillation for 10 minutes to remove grease and impurities on the copper surface, washing with ethanol and deionized water respectively, taking out, and drying with nitrogen; and (3) putting the copper substrate with a clean surface into a citric acid solution to remove impurities such as copper green and copper oxide on the copper surface, taking out the copper substrate, fully washing the copper substrate with deionized water, and finally drying the surface by using nitrogen.
4. The method for preparing the hydrophilic-hydrophobic heterogeneous patterned surface for enhancing the dropwise condensation according to claim 1, 2 or 3, wherein the chemical etching method is used for obtaining the super-hydrophilic surface by the following steps: and immersing the obtained copper substrate into an alkaline solution consisting of 3mol/L potassium hydroxide and 0.065mol/L potassium persulfate at room temperature, uniformly stirring, reacting for 15 minutes, taking out, cleaning by using deionized water, and drying by using nitrogen to obtain a super-hydrophilic surface.
5. The method for preparing the hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation according to claim 4, wherein the method for rotationally coating the photoresist comprises the following steps: firstly, a copper substrate is adsorbed or fixed on a vacuum chuck, then liquid negative photoresist is dripped to the center of the copper surface, the vacuum chuck is rotated at a low speed of 200-.
6. The method for preparing the lyophilic and hydrophobic heterogeneous patterned surface for enhancing the dropwise condensation as claimed in claim 4, wherein the method for irradiating the ultraviolet light by using the patterned mask is as follows: the pattern of the mask and the position of the surface of the copper substrate are aligned and precisely matched, and the solubility of the photoresist in the developing solution is changed by using ultraviolet proximity exposure.
7. The method for preparing the hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation as claimed in claim 4, wherein the developing treatment using a negative photoresist developer in the step 5 comprises: the unexposed portions are removed using a negative photoresist developer solution for development processing.
8. The method for preparing the hydrophilic-hydrophobic heterogeneous patterned surface for enhancing dropwise condensation as claimed in claim 4, wherein in step 7, metal deposition and metal stripping are carried out to remove the thin film layer by using a Lift-off stripping process.
9. A drop-condensation enhanced hydrophilic-hydrophobic heterogeneous patterned surface prepared by the method of claim 1, wherein the super-hydrophilic regions are squares arranged in an array, and the outer parts of the super-hydrophilic regions are super-hydrophobic surfaces; by adjusting the size of the super-hydrophilic region pattern and the adjacent distance of the super-hydrophilic region, the combination frequency, the shedding diameter and the shedding frequency of the condensed liquid drops are orderly regulated and controlled.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113105263A (en) * | 2021-04-09 | 2021-07-13 | 电子科技大学 | Preparation method of super-hydrophobic surface with nanoscale hydrophilic sites |
| CN113265083A (en) * | 2021-05-25 | 2021-08-17 | 四川大学 | Patterned wetting differential surface, alkali etching preparation method and application |
| CN113307505A (en) * | 2021-06-18 | 2021-08-27 | 西南石油大学 | Photo-initiation prepared patterned super-hydrophilic-super-hydrophobic alternate surface and preparation method thereof |
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| CN113307505A (en) * | 2021-06-18 | 2021-08-27 | 西南石油大学 | Photo-initiation prepared patterned super-hydrophilic-super-hydrophobic alternate surface and preparation method thereof |
| CN117210811A (en) * | 2023-09-15 | 2023-12-12 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Preparation method of super-hydrophilic gallium-based liquid metal composite surface |
| CN117210811B (en) * | 2023-09-15 | 2024-05-24 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Preparation method of super-hydrophilic gallium-based liquid metal composite surface |
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