CN112574677A - Surface treatment method for enhancing bonding performance of epoxy resin adhesive joint - Google Patents
Surface treatment method for enhancing bonding performance of epoxy resin adhesive joint Download PDFInfo
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- CN112574677A CN112574677A CN202011415474.4A CN202011415474A CN112574677A CN 112574677 A CN112574677 A CN 112574677A CN 202011415474 A CN202011415474 A CN 202011415474A CN 112574677 A CN112574677 A CN 112574677A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/30—Presence of wood
- C09J2400/303—Presence of wood in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Abstract
The invention discloses a surface treatment method for enhancing the bonding performance of an epoxy resin adhesive bonding joint, which comprises the steps of coating a resin solution on a bonding interface of a base material before coating an epoxy resin adhesive, standing for 2-4 hours, coating the epoxy resin adhesive on the bonding interface for bonding, and then carrying out pressurization curing; the resin solution is formed by mixing resin and acetone, wherein the resin accounts for 5-20% of the total mass of the resin solution, and the balance is acetone. The invention is not only simple and convenient, but also can provide good permeability and wettability on the bonding interface of the base material, can help the epoxy resin glue to permeate into the microcracks and micropores on the surface layer of the base material, increase the contact area and the bonding depth of the epoxy resin glue and the surface of the base material, and obviously improve the bonding performance of the bonding joint.
Description
Technical Field
The invention relates to the technical field of surface treatment of epoxy resin adhesive joints, in particular to a surface treatment method for enhancing the adhesive property of an epoxy resin adhesive joint.
Background
Bonding is achieved by bonding the bonding interface of two or more materials together with an adhesive (e.g., an epoxy glue). The basic principle of bonding is that the bonding interface and the adhesive are firmly connected into a whole by virtue of the adhesive force formed between the curing reaction of the adhesive and the bonding interface. Compared with the traditional mechanical connection joint, the bonding joint has the advantages of uniform stress distribution, less part number, low cost, light weight, high connection efficiency, convenient construction and the like. The factors influencing the bonding performance of the bonded joint mainly include the surface treatment mode of the bonded interface, the bonding length, the type of the adhesive, the bonding process (temperature, time, pressure and the like), and the like, wherein the type and the bonding length of the adhesive are determined in the design stage, and the bonding temperature and the bonding pressure are difficult to control accurately in the actual production life to enable the bonded joint to achieve higher strength, so the surface treatment mode of the bonded interface becomes an important method for improving the bonding performance of the bonded joint in the actual engineering.
The surface treatment method of the bonding interface mainly comprises a physical method and a chemical method, wherein the physical method mainly means that the surface appearance of the material is improved through technical means such as polishing, sand blasting, resin precoating and the like, so that a good contact surface is formed between the adhesive and the material interface, and higher bonding performance is obtained. The chemical method is mainly characterized in that the surface activity of the material is changed by methods such as a plasma spraying technology and a coupling agent treatment (namely silanization treatment), active groups are formed on the surface of the material, and firmer chemical bonds are formed between the active groups and the adhesive, so that stronger bonding force is obtained.
At present, the surface treatment technology of the base material for bonding joints before the adhesive is coated mainly comprises the following methods:
(1) surface sand blasting treatment: the surface sand blasting is to rapidly spray a spray material (iron sand, carborundum, quartz sand and the like) to the surface of a material by using compressed air, so that concave-convex surface topography is formed on the surface of the material, the roughness and the porosity of the surface of the material can be improved, and the bonding strength of a bonding joint is improved.
However, the surface blasting treatment has the following disadvantages:
the material has narrow application range. Although the surface sand blasting can form a certain surface appearance on the surface of the material to increase the interface roughness, the surface sand blasting has great destructiveness on the surface of the material and often causes structural damage on the surface layer of the material, so the surface sand blasting is mainly used for rigid materials such as metal materials and the like, and is less applied to materials such as wood and the like.
Secondly, the controllability of the technology is poor. The surface sand blasting can increase the roughness of the material surface, but the roughness is uncontrollable, the formed surface topography is irregular, and the prior art cannot realize that the regular surface topography is obtained on the material surface by the sand blasting technology, which causes great uncertainty on the bonding performance of the structure.
And surface wettability is poor. The microcracks and micropores formed on the surface of the material by the surface sand blasting treatment make the surface of the material difficult to be completely wetted, and the viscous epoxy resin with the hardening agent is difficult to permeate into the microcracks on the surface of the material, so that micro bubbles are formed between the adhesive and the interface, and the micro bubbles can cause stress concentration when the bonding node bears load, form microcracks when the bonding node is broken, and reduce the bonding performance of the bonded joint.
And fourthly, the cleaning difficulty is high. To ensure optimum bonding conditions, the workpiece should be ultrasonically cleaned after the surface blasting process to achieve optimum bonding conditions, and the ultrasonic cleaning technique is only available in well-equipped factories and laboratories. Therefore, the construction site usually uses compressed air to blow air to clean the surface particles, but the air blowing method is difficult to clean the residual particles in the surface microcracks, and the cleaning effect is far less effective than that of ultrasonic cleaning.
(2) And (3) low-temperature plasma technology treatment: the surface of the material treated by low-temperature plasma can generate various physical and chemical changes, so that the surface of the base material is etched to form a compact cross-linking layer, and a polar group is introduced, so that the hydrophilicity, the cohesiveness, the dyeing property, the biocompatibility, the electrical property and the like of the material are improved, and a better surface condition is provided for adhesion.
However, the low-temperature plasma technology treatment has the following defects:
the low-temperature plasma technology has timeliness. The effect of plasma on material surface modification treatment cannot be maintained permanently, the plasma surface modification treatment has timeliness, polar groups introduced on the material surface by low-temperature plasma treatment are gradually reduced in number along with the lapse of time, the surface activity of the material is reduced, the surface wettability is reduced, and in actual engineering, uncertainty of environmental factors such as temperature and humidity enables the effective time of the plasma surface treatment not to be guaranteed, the construction time cannot be mastered, and normal development of construction progress is not facilitated.
② the low temperature plasma technology has complex process. The low-temperature plasma treatment technology and the bonding technology both need to pass through a plurality of process flows, the material surface needs to be strictly stored and maintained after being subjected to low-temperature plasma treatment, and the material surface is conveyed to a construction site for bonding. The complexity of the process operation and the timeliness of the plasma treatment make the surface treatment of the material in the actual construction difficult to achieve the ideal effect.
High cost and strong equipment dependence. The plasma surface treatment needs expensive instruments such as a plasma jet machine and the like, has strong dependence on the instruments, can be equipped only in a factory and a laboratory with fine equipment, is not suitable for large-scale engineering sites, and the plasma surface treatment technology can greatly improve the structural bonding cost and is difficult to popularize on a large scale in actual engineering.
(3) Coating the surface of the coupling agent: the coupling agent contains two functional groups with different properties, wherein one functional group can react with inorganic molecules at an interface to form a covalent bond, and the other functional group can form a chemical bond with a resin base (epoxy, vinyl and the like). The coupling agent can greatly improve the surface activity of wood and improve the adhesive property of the wood and epoxy resin, so the coupling agent is considered as a bridge for connecting an inorganic phase and an organic phase. Taking an HMR (hydroxymethyl resorcinol solution, solid content 5%) coupling agent as an example, in the bonding process of the epoxy resin glue and wood, the HMR coupling agent can generate ether bond connection with the epoxy resin glue and generate covalent bond connection with wood fibers, and a stable chemical bond is formed between a bonding interface and an adhesive, so that the effects of coupling and bridging are achieved, and the bonding node obtains higher bonding performance.
However, the coupling agent surface coating treatment has the following disadvantages:
the configuration difficulty is large. Taking an HMR coupling agent as an example, 90.43g of deionized water, 3.34g of crystalline resorcinol, 3.79g of 37% formalin and 2.44g of sodium hydroxide are required for preparing 100g of the HMR coupling agent, sodium hydroxide is firstly added into the deionized water to form an alkaline reaction environment, then the resorcinol and the formalin are sequentially added, and after 4 hours of reaction at room temperature, coating treatment is carried out on wood. The preparation process is complicated, needs precise control, has long reaction time, and is not suitable for the requirement of preparation in actual work.
Secondly, the precision requirement is high, and the method is difficult to adapt to large-scale engineering sites. The coupling agent actually acts as a monolayer, and the amount of the coupling agent is not excessive, so that the precision requirement on the concentration of the coupling agent in actual operation is high. If the mass fraction of the coupling agent is too high, on one hand, the treatment cost is increased, and on the other hand, the coating layer formed on the surface of the composite material is too thick, so that self-polymerization crosslinking occurs between the coupling agents, a coupling agent thin layer is formed between the adhesive and the bonding interface, and the bonding strength of the material is reduced to a great extent. If the mass fraction of the coupling agent is too low, part of the coupling agent can penetrate into the wood fiber, so that the residual coupling agent on the interface is reduced, the requirement of good bridging cannot be met, and the effect of the coupling agent is limited.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the surface treatment method for enhancing the bonding performance of the epoxy resin adhesive bonding joint, which is simple and convenient, can provide good permeability and wettability on the bonding interface of the base material, can help the epoxy resin adhesive to penetrate into micro cracks and micro pores on the surface layer of the base material, increases the contact area and bonding depth of the epoxy resin adhesive and the surface of the base material, and obviously improves the bonding performance of the bonding joint.
The invention is realized by the following technical scheme:
a surface treatment method for enhancing the bonding performance of an epoxy resin adhesive bonding joint comprises the steps of coating a resin solution on a bonding interface of a base material before coating an epoxy resin adhesive, standing for 2-4 hours, coating the epoxy resin adhesive on the bonding interface for bonding, and then carrying out pressure curing; the resin solution is formed by mixing resin and acetone, wherein the resin accounts for 5-20% of the total mass of the resin solution, and the balance is acetone.
Preferably, the resin in the resin solution is the same resin as the resin in the epoxy glue.
Preferably, the base material is at least one of wood, bamboo, recombined bamboo, glued wood, steel plate, aluminum plate, carbon fiber plate and glass fiber cloth.
Preferably, the application of the resin solution to the bonding interface of the substrate is completed within 30 minutes of the preparation of the resin solution.
Preferably, said coating comprises dipping, brushing or spraying.
Preferably, the preparation method of the resin solution comprises: pouring acetone into a container, adding resin, and stirring until the whole solution is clear and free of precipitate for 60-90 s to obtain the resin solution.
Preferably, the epoxy resin glue is epoxy resin AB glue; and after the epoxy resin AB glue is mixed, the bonding is finished within 10-20 minutes.
Preferably, the pressurizing pressure of the pressurizing and curing is controlled to be 1.1-2.0 MPa, the pressurizing time is 24-48 hours, and the temperature during the pressurizing and curing is kept at 20-30 ℃.
Preferably, after the pressure curing, the pressure cured adhesive joint is placed in a ventilated place and maintained at 20-30 ℃ for 24-48 hours.
According to the technical scheme provided by the invention, the surface treatment method for enhancing the bonding performance of the epoxy resin adhesive bonding joint, provided by the invention, is characterized in that before the epoxy resin adhesive is coated, the resin solution is coated on the bonding interface of the substrate, the resin solution penetrates into micropores and microcracks at a certain depth on the surface layer of the substrate, air in the micropores and the microcracks is discharged, a wetting film is formed on the surface, and when the epoxy resin adhesive is used for bonding, the epoxy resin adhesive can penetrate into the micropores and the microcracks with the help of the surface wetting film and is filled in the certain depth on the surface layer of the substrate, so that the bonding performance of the bonding joint is remarkably improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic diagram illustrating a basic principle of a surface treatment method for enhancing the bonding performance of an epoxy resin adhesive joint according to an embodiment of the present invention.
Fig. 2 is a schematic view of a construction process flow of a bamboo-based material bonded joint provided in embodiment 1 of the present invention.
FIG. 3 is a schematic view of a process flow for preparing a resin solution according to example 1 of the present invention.
Fig. 4 is a schematic view of a surface polishing process provided in embodiment 1 of the present invention.
FIG. 5 is a schematic view of a resin solution coating process for different-sized members provided in example 1 of the present invention.
Fig. 6 is a schematic view of a press curing process provided in example 1 of the present invention.
Fig. 7 is a schematic view of a load displacement curve reflecting an adhesion performance improvement effect provided in embodiment 1 of the present invention.
Fig. 8 is a schematic diagram of average shear strength reflecting an effect of improving adhesive properties provided in embodiment 1 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
The surface treatment method for enhancing the bonding performance of the epoxy resin adhesive joint provided by the present invention is described in detail below. Details which are not described in detail in the embodiments of the invention belong to the prior art which is known to the person skilled in the art.
A surface treatment method for enhancing the bonding performance of an epoxy resin adhesive bonding joint is characterized in that before epoxy resin adhesive is coated, resin solution is coated on a bonding interface of a base material, the base material is placed in a ventilation position and stands for 2-4 hours, acetone in the resin solution is volatilized, then the epoxy resin adhesive is coated on the bonding interface for bonding, and then pressure curing is carried out.
Specifically, the surface treatment method may include the following embodiments:
(1) the resin solution is formed by mixing resin and acetone, the resin accounts for 5-20% of the total mass of the resin solution, and the balance is acetone. The resin in the resin solution and the resin in the epoxy resin glue adopt the same resin. The resin solution is prepared according to the mass fraction ratio. Because the acetone solvent has extremely high volatility and needs to be prepared and used immediately, the resin solution needs to be coated on the bonding interface of the base material within 30 minutes after the resin solution is prepared, so as to ensure that the resin solution on the surface of the base material is at the optimal concentration.
(2) The base material is at least one of bamboo-based composite materials such as wood, bamboo, recombined bamboo and the like, wood-based engineering composite materials such as laminated wood and the like, metal materials such as steel plates, aluminum plates and the like, and fiber-reinforced composite materials such as carbon fiber plates, glass fiber cloth and the like. Before the resin solution is coated on the bonding interface of the substrate, the bonding interface of the substrate is preferably subjected to surface polishing treatment and cleaning treatment to obtain good surface bonding conditions. For metal materials such as steel, aluminum and the like, a sand blasting method (namely, metal oxides such as aluminum oxide and the like are used for impacting the surface of the material under certain pressure) or a polishing method (namely, a grinding wheel is used for polishing the surface of the metal material) is adopted for carrying out surface treatment on a bonding interface of a base material, so that the surface of the material is uneven, a rough surface appearance is obtained, and then compressed air is used for blowing away metal chips on the surface; for bamboo-based composite materials such as bamboo, wood, recombined bamboo and the like, a bonding interface of a base material can be polished by using 100-200-mesh abrasive paper, the polishing depth is not more than 0.5mm, then bamboo chips on the surface are cleaned by using a clean brush, the polished materials can be subjected to ultrasonic cleaning by using organic solvents such as absolute ethyl alcohol and the like conditionally, and the cleaned materials are placed in a cool and ventilated place for standing for 5-10 min; for the fiber reinforced composite material, the bonding interface of the base material can be polished by using 100-200-mesh sand paper so as to obtain better interface bonding conditions.
(3) The coating can be carried out by means of dipping, brushing, spraying and the like in the prior art. Different resin solution coating modes can be adopted according to different sizes of the base material.
(4) The epoxy resin glue can adopt epoxy resin AB glue in the prior art. In order to prevent the glue from being cured after being exposed in the air for a long time, after the glue A of the epoxy resin AB glue and the glue B of the epoxy resin AB glue are well mixed, the base material bonding is completed within 10-20 minutes.
(5) The pressure curing can adopt a pressure curing method in the prior art, but the pressure of the pressure curing is controlled to be 1.1-2.0 MPa, the pressure time is 24-48 hours, and the temperature is kept at 20-30 ℃ during the pressure curing. And after the pressure curing, placing the pressure cured bonding joint in a ventilated place, and curing for 24-48 hours at the temperature of 20-30 ℃ to obtain the epoxy resin adhesive bonding joint with enhanced bonding performance.
Further, as shown in fig. 1a, the bonding interface surface of the substrate has micro-pores and micro-cracks, and in the prior art, the epoxy resin adhesive is directly coated on the bonding interface surface of the substrate, but the epoxy resin adhesive is difficult to penetrate into the micro-pores and micro-cracks of the surface, and gas remains in the micro-pores and micro-cracks. As shown in fig. 1b, fig. 1c and fig. 1d, in the present invention, before the epoxy resin glue is coated, the resin solution is coated on the bonding interface of the substrate, compared with the thick epoxy resin glue, the resin solution can easily penetrate into the micro-pores and micro-cracks on the surface of the substrate, exhaust the air in the micro-pores and micro-cracks, and form a resin film on the surface; when the epoxy resin adhesive is coated on the bonding interface coated by the resin solution, the epoxy resin adhesive can permeate into the micropores and the microcracks with the help of the resin film, the micropores and the microcracks on the surface of the substrate are filled, the surface retained air bubbles are discharged, the epoxy resin adhesive is fully contacted with the bonding surface, and the bonding performance of the bonded joint is obviously improved.
Compared with the prior art, the surface treatment method for enhancing the bonding performance of the epoxy resin adhesive joint provided by the invention at least has the following advantages:
(1) the permeability is strong. In the prior art, viscous epoxy resin glue is difficult to permeate into micropores and microcracks on the surface layer of a substrate, bubbles are easy to form on a bonding interface, and residual particles on the surface layer of the substrate can greatly weaken the bonding performance of a bonding joint of the epoxy resin glue. Before the epoxy resin adhesive is coated, the resin solution is coated on the surface of the bonding interface of the base material, and the resin solution can penetrate into micropores and microcracks on the surface of the base material, so that a good surface topography condition is provided for the bonding of the epoxy resin adhesive.
(2) The wettability is good. According to the invention, after the resin solution is coated on the surface of the base material, a wetting film is formed on the surface of the base material, so that the surface of the base material can be completely wetted, and even if micro dust and particles exist on the bonding interface, the bonding performance is not influenced. The surface of the steel substrate after sand blasting is also temporarily protected by the wetting film, which is beneficial to keeping better wettability for a long time.
(3) The operation is simple. Most of the existing surface treatment technologies are complex to operate or high in technical difficulty, such as coupling agent preparation, low-temperature plasma jet technology and the like, and in practical engineering, excellent equipment such as an ultrasonic cleaning machine and the like cannot be assembled usually, so that the base material cannot be well cleaned in surface, and the optimal surface bonding condition is difficult to achieve. The surface treatment method provided by the invention is simple to operate, only the resin solution is coated on the surface of the base material, and the preparation method of the resin solution is simple, so that the resin solution can be prepared and used immediately in practical engineering.
(4) The adhesive property is effectively improved. After the resin solution is coated on the surface of the base material, when the epoxy resin adhesive is used for bonding, the epoxy resin adhesive can be helped to better permeate into micropores and microcracks on the surface of the base material, the contact area of the adhesive and the base material is increased, and meanwhile, the microcracks on the surface of the base material and the epoxy resin adhesive are firmly bonded into a whole by curing the adhesive to form a meshing structure, so that the bonding strength is effectively improved.
(5) The application range is wide. The principle of resin solution coating in the invention is that the resin solution permeates into micropores and microcracks on the surface of the base material to eliminate surface defects and ensure that the surface of the base material obtains good surface appearance and wettability, so the invention is not only suitable for the surfaces of bamboo and wood which are difficult to permeate by epoxy resin glue, but also suitable for the surfaces of materials such as concrete, FRP, steel, aluminum and the like, which can repair the surfaces of the materials, and the good wettability of the resin solution is also beneficial to the maintenance of the materials such as concrete and the like.
In conclusion, the embodiment of the invention is simple and convenient, can provide good permeability and wettability on the bonding interface of the base material, can help the epoxy resin glue to permeate into the microcracks and micropores on the surface layer of the base material, increases the contact area and bonding depth of the epoxy resin glue and the surface of the base material, and obviously improves the bonding performance of the bonding joint.
In order to more clearly show the technical solutions and the technical effects provided by the present invention, the following describes in detail the surface treatment method for enhancing the adhesion performance of the epoxy resin adhesive joint according to the present invention with specific embodiments.
Example 1
As shown in figure 2, a surface treatment method for enhancing the bonding performance of an epoxy resin adhesive joint is used for treating a bamboo-based material, and comprises the steps of coating a resin solution (which can be coated by adopting a dipping, brushing or spraying method) on a bonding interface of the bamboo-based material before coating an epoxy resin adhesive, standing for 2-4 hours in a ventilated place, volatilizing acetone in the resin solution, coating the epoxy resin adhesive on the bonding interface for bonding, and then carrying out pressurization curing, so that the epoxy resin adhesive joint with enhanced bonding performance is obtained.
Specifically, the surface treatment method may include the following embodiments:
(1) preparing a resin solution: the resin solution is formed by mixing resin and acetone, and the resin accounts for 5-20% (preferably 10%) of the total mass of the resin solution, and the balance is acetone. The resin in the resin solution and the resin in the epoxy resin glue adopt the same resin. The resin solution is prepared according to the mass fraction ratio. As shown in fig. 3, taking preparation of a resin solution with a resin mass concentration of 10% as an example, acetone and resin are weighed according to a mass ratio of acetone to resin of 9:1, the acetone solution is poured into a container, then the resin is poured into the container, the mixed solution is fully and uniformly stirred clockwise by a wood rod or a glass rod until the whole solution is clear without precipitation and is stirred without resistance for 60 s-90 s, so that the resin is uniformly distributed in the acetone solvent, and the resin solution is prepared and can be put into use. The acetone solvent has extremely high volatility and needs to be prepared and used immediately, so the resin solution needs to be coated on the bonding interface of the bamboo-based material within 30 minutes after the resin solution is prepared, so that the resin solution on the surface of the base material is ensured to be at the optimal concentration.
(2) Surface polishing treatment and cleaning treatment: after the bamboo-based material is prepared into a member, the member needs to be subjected to surface polishing treatment and cleaning treatment to obtain good surface bonding conditions. After the surface of the component is polished, the component can be cleaned by ultrasonic cleaning with organic solvents such as absolute ethyl alcohol and the like under certain conditions, and residual particles on the bonding surface can be blown off by compressed air through an air blowing method under certain conditions so as to facilitate better bonding. As shown in fig. 4, after the bamboo-based material is prepared into a member, the surface of the member may be cleaned, the bonding interface may be polished with 120-240 mesh sandpaper, the residual bamboo dust on the surface may be blown off by blowing with compressed air, the bonding interface may be observed to ensure no residual bamboo dust, and then a layer of plastic film may be coated on the member to wait for the resin solution coating process.
(3) Coating with resin solution: different resin solution coating modes are adopted according to different sizes of the base materials. As shown in fig. 5, the small-sized component (for example, a component with a size of 50 x 200 mm) can be coated with the resin solution by dipping, i.e., the small-sized component is soaked in the resin solution for 60s to 90s, then taken out and placed in a ventilated place to stand for 2 to 4 hours, so as to obtain the resin pre-coated component; the coated resin pre-coated member may be stored by covering with a clean plastic film to be subjected to the bonding process. The resin solution can be coated on a medium-sized member (such as a member with the length dimension of 100-500 mm) by adopting a brush coating mode, namely, a clean brush is used for dipping a proper amount of resin solution and uniformly coating the resin solution on a bonding interface of the member, the brush coating amount is controlled by adopting a wire method, a wire with the diameter of 0.5-1 mm is placed in a brush coating area, the thickness of the brush coating solution is controlled to be equal to that of the wire, and then the member after brush coating is placed in a ventilated and dry place and stands for 2-4 hours to obtain a resin precoated member; the coated resin pre-coated member may be stored by covering with a clean plastic film to be subjected to the bonding process. In order to avoid the concentration change of the resin solution caused by acetone volatilization, the component needs to finish the coating of the resin solution within 30 minutes after the preparation of the resin solution is finished.
(4) Bonding the components: the epoxy resin glue can adopt epoxy resin AB glue in the prior art, namely, the epoxy resin AB glue can be adopted for component bonding. The member bonding method comprises the following steps: mixing the glue A of the epoxy resin AB glue (namely the resin of the epoxy resin glue) and the glue B of the epoxy resin AB glue (namely the curing agent of the epoxy resin glue) according to the mass ratio of 1:1, and slowly stirring for 2-3 minutes along a pointer until the glue is clear and has no sticky matter; in order to prevent the glue from being cured after being exposed in the air for a long time, when the glue A of the epoxy resin AB glue and the glue B of the epoxy resin AB glue are well mixed, the bonding of the components is finished within 10-20 minutes; uniformly coating the mixed epoxy resin AB glue on the bonding interface of the component by using a brush, wherein the glue coating amount is controlled by adopting a wire method, and the glue coating amount of the bonding interface is ensured to be more than or equal to 150g/cm3。
(5) And (3) pressurizing and curing: the bonded joint bonded by the epoxy resin adhesive needs to be cured by pressing, for example: in practical engineering, a press or a weight press can be used for pressure curing. As shown in figure 6, the bonded member is placed on a press or in a die groove, the press numerical value or the weight is added for pressurizing and curing, the pressurizing pressure is controlled to be 1.1MPa to 2.0MPa, the pressurizing time is 24 to 48 hours, and the temperature during pressurizing and curing is kept between 20 ℃ and 30 ℃ (in winter, an indoor air conditioner is required to be started to control the temperature to be 20 ℃ to 30 ℃). And after the pressurization and solidification are finished, unloading the pressurization device, placing the pressurized and solidified bonding joint in a ventilation position, and maintaining for 24-48 hours at the temperature of 20-30 ℃ so as to fully solidify the bonding joint and ensure that the bonding strength of the bonding joint reaches the best. And after the colloid is fully cured, cleaning the overflowing colloid tumor by using a file to obtain the engineering bonding member.
Furthermore, according to the prior art, resin solution is not coated, epoxy resin glue is directly coated on the bonding interface of the bamboo-based material for bonding, and thus the epoxy resin glue bonding joint processed by the prior art is obtained. In the implementation process of the embodiment 1 of the invention, resin solutions with the resin mass concentrations of 5%, 10% and 20% are respectively adopted for coating, so that three different epoxy resin adhesive joints can be obtained. The epoxy resin adhesive joints processed in the prior art and the three different epoxy resin adhesive joints processed in the embodiment 1 of the present invention are respectively subjected to adhesion performance detection, and the epoxy resin adhesive joints processed in the prior art are used as blank control groups, so that a load displacement curve diagram shown in fig. 7 and an average shear strength diagram shown in fig. 8 can be obtained. As can be seen from fig. 7 and 8: compared with a blank control group, the limit load of the epoxy resin adhesive joint obtained by processing in the embodiment 1 of the invention is improved by 106-145%, and the load bearing capacity of the adhesive joint is greatly improved; meanwhile, the average shear strength of the epoxy resin adhesive joint obtained by processing in the embodiment 1 of the invention is improved by 108-153% compared with that of a blank control group, and the shear resistance of the adhesive joint is effectively improved.
In conclusion, the embodiment of the invention is simple and convenient, can be applied to practical engineering, can provide good permeability and wettability on the bonding interface of the base material, can help the epoxy resin adhesive to penetrate into the microcracks and micropores on the surface layer of the base material, increases the contact area and the bonding depth of the epoxy resin adhesive and the surface of the base material, and obviously improves the bonding performance of the bonding joint.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A surface treatment method for enhancing the bonding performance of an epoxy resin adhesive bonding joint is characterized in that before epoxy resin adhesive is coated, a resin solution is coated on a bonding interface of a base material, standing is carried out for 2-4 hours, then the epoxy resin adhesive is coated on the bonding interface for bonding, and then pressure curing is carried out;
the resin solution is formed by mixing resin and acetone, wherein the resin accounts for 5-20% of the total mass of the resin solution, and the balance is acetone.
2. The method of claim 1 wherein the resin in the resin solution is the same resin as the resin in the epoxy glue.
3. The surface treatment method for enhancing the bonding performance of the epoxy resin adhesive joint according to claim 1 or 2, wherein the base material is at least one of wood, bamboo, recombined bamboo, laminated wood, steel plate, aluminum plate, carbon fiber plate and glass fiber cloth.
4. The method of claim 1 or 2, wherein the step of applying the resin solution to the bonding interface of the substrate is performed within 30 minutes after the resin solution is prepared.
5. The method of claim 1 or 2, wherein the coating comprises dipping, brushing or spraying.
6. The surface treatment method for enhancing the adhesion performance of an epoxy resin adhesive joint according to claim 1 or 2, wherein the preparation method of the resin solution comprises: pouring acetone into a container, adding resin, and stirring until the whole solution is clear and free of precipitate for 60-90 s to obtain the resin solution.
7. The surface treatment method for enhancing the bonding performance of the epoxy resin adhesive joint according to claim 1 or 2, wherein the epoxy resin adhesive is epoxy resin AB adhesive; and after the epoxy resin AB glue is mixed, the bonding is finished within 10-20 minutes.
8. The surface treatment method for enhancing the adhesion performance of an epoxy resin adhesive joint according to claim 1 or 2, wherein the pressure curing is performed under a pressure of 1.1MPa to 2.0MPa for 24 to 48 hours, and the temperature during the pressure curing is maintained at 20 ℃ to 30 ℃.
9. The surface treatment method for enhancing the adhesive property of an epoxy resin adhesive joint according to claim 1 or 2, wherein after the pressure curing, the pressure cured adhesive joint is placed in a ventilated place and cured at 20 ℃ to 30 ℃ for 24 to 48 hours.
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| CN202011415474.4A CN112574677A (en) | 2020-12-04 | 2020-12-04 | Surface treatment method for enhancing bonding performance of epoxy resin adhesive joint |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115785507A (en) * | 2022-11-24 | 2023-03-14 | 大连理工大学 | Surface treatment method for improving bonding performance of vulcanized rubber and composite material in integrated molding process |
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| CN106497441A (en) * | 2016-10-31 | 2017-03-15 | 长安大学 | A kind of method of adhering with epoxy resin with surface is repaired |
| CN108559431A (en) * | 2018-04-26 | 2018-09-21 | 山西省交通科学研究院 | A kind of linking new and old concrete interface adhesive and preparation method thereof and construction technology |
| CN111718680A (en) * | 2020-05-27 | 2020-09-29 | 山西省交通科技研发有限公司 | Interface adhesive for improving bonding force of new and old concrete and preparation method and construction process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106497441A (en) * | 2016-10-31 | 2017-03-15 | 长安大学 | A kind of method of adhering with epoxy resin with surface is repaired |
| CN108559431A (en) * | 2018-04-26 | 2018-09-21 | 山西省交通科学研究院 | A kind of linking new and old concrete interface adhesive and preparation method thereof and construction technology |
| CN111718680A (en) * | 2020-05-27 | 2020-09-29 | 山西省交通科技研发有限公司 | Interface adhesive for improving bonding force of new and old concrete and preparation method and construction process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115785507A (en) * | 2022-11-24 | 2023-03-14 | 大连理工大学 | Surface treatment method for improving bonding performance of vulcanized rubber and composite material in integrated molding process |
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