CN112573811A - Substrate dividing method and scribing stage - Google Patents

Abstract

The invention discloses a substrate dividing method and a scribing stage, which can stably cut out a product area while avoiding damage to the product area cut out from a substrate. A glass substrate (11) is directly disposed on a table top having a first support surface made of a first material having a Young's modulus of 3GPa or more and a second support surface made of a second material having a Young's modulus smaller than that of the first material. A first scribe line (SL1) is formed on the glass substrate along a first virtual line (ML1) on the first supporting surface. A first groove line (TLx) is formed along a second virtual line (ML2) having a first portion on the first support surface, a second portion on the second support surface, and a first intersection point (XP1) intersecting the first virtual line by sliding the blade tip on the glass substrate. And breaking the crack-free state of the first groove line by taking the intersection of the first scribing line and the first groove line at the first intersection point as a trigger.

Description

Substrate dividing method and scribing stage

Technical Field

The invention relates to a substrate dividing method and a scribing stage.

Background

In the manufacture of electrical devices such as flat display panels and solar cell panels, it is often necessary to split a brittle substrate. In a typical dividing method, first, a crack line is formed on a brittle substrate. In the present specification, the "crack line" refers to a line in which a crack partially or completely progressing in the thickness direction of the brittle substrate linearly extends on the surface of the brittle substrate. Subsequently, a so-called breaking step is performed. Specifically, the brittle substrate is subjected to stress, whereby the crack of the crack line completely advances in the thickness direction. Thus, the brittle substrate can be divided along the crack line.

According to japanese patent laid-open No. 9-188534 (patent document 1), some sort of depression is generated on the upper surface of the glass plate at the time of scribing. In the above publication, the depression is referred to as a "scribe line". Further, a crack extending from the scribe line in the direction directly below the scribe line is generated at the same time as the scribing line is scribed. Thus, in the typical conventional technique, a scribe line is formed and a crack line is formed at the same time.

In contrast, according to japanese patent application laid-open No. 2018-69536 (patent document 2), a segmentation technique that is significantly different from the above-described typical segmentation technique is proposed. According to this technique, first, the cutting edge is plastically deformed by sliding on the brittle substrate, thereby forming a groove shape called a groove line. At the time of forming the trench line, no crack is formed thereunder. Thereafter, a crack line is formed by extending the crack along the trench line. That is, unlike the aforementioned typical technique, a groove line not accompanied by a crack is formed first, and then a crack line is formed along the groove line. Thereafter, a normal breaking process is performed along the crack line.

The technique disclosed in japanese patent application laid-open No. 2018-69536 is intended to form a dividing groove smoothly even in a substrate having a thickness of 100 μm or less. According to this method, first, the cutting edge is moved on the substrate with a small load of about 0.05N, thereby forming a groove by plastic deformation on the substrate. At this time, no crack propagating into the substrate is formed below the groove. The linear groove is called a trench line. When the cutting edge reaches the end position of the forming range of the groove line, the cutting edge is pressed by a specified amount in the direction approaching the workbench on which the substrate is placed. Thereby, a crack is generated on the substrate, and the crack propagates to the trench line. Thereafter, the substrate is divided by applying a stress called a breaking step to completely extend the crack in the thickness direction.

Generally, in the scribing operation, the following control is performed in consideration of the undulation of the substrate and the table top supporting the substrate: the blade tip is positioned on the side of the table other than the surface of the substrate placed on the table surface, and the blade tip and the substrate are moved relatively. If the thickness of the substrate is reduced to, for example, 100 μm or less, it is necessary to position the tip within a very small height range from the surface of the table at the time of scribing. Therefore, the smaller the thickness of the substrate, the more difficult the process becomes.

According to the above-mentioned japanese patent application laid-open No. 2018-69536, air is blown to the back surface of the substrate placed on the table to float the substrate to a height capable of abutting the cutting edge. Then, the substrate and the blade tip are relatively moved, thereby forming a groove on the surface of the floated substrate. When forming the groove line, the substrate placed on the table is lifted to a height capable of abutting against the cutting edge, and therefore, the cutting edge does not need to be positioned within a height range slightly smaller than the surface of the table. Further, since the surface of the substrate is pressed against the cutting edge by the pressure applied by the pressure applying unit, the cutting groove can be appropriately formed in the surface of the substrate by the relative movement between the cutting edge and the substrate. Therefore, the dividing groove can be formed smoothly even on a substrate having an extremely small thickness.

Patent document 1: japanese laid-open patent publication No. 9-188534

Patent document 2: japanese patent laid-open publication No. 2018-69536

Disclosure of Invention

Technical problem to be solved by the invention

In the technique described in the above publication, it is necessary to precisely control the ejection of air to the back surface of the substrate placed on the stage. In order to perform such precise control, a complicated scribing stage and a dedicated control device therefor are required. Further, unless an optimum condition for this control is obtained, it is difficult to stably perform scribing. Therefore, a simpler method that does not require such complicated control is desired. However, when scribing a substrate without blowing air to the back surface of the substrate, the substrate is easily affected by the undulation of the table surface, and the following problems are caused depending on the material of the table surface.

In the case of a hard countertop, the substrate is susceptible to damage from the countertop. Thereby, there is a possibility that damage may be caused to a portion cut out from the substrate to serve as a product area. On the other hand, when the table surface is soft, the substrate is easily deformed when scribing is performed, and if the thickness of the substrate is thin, the degree of deformation is large. Due to the influence of the deformation, it is difficult to stably scribe. Therefore, it is difficult to stably cut out the product region. As described above, it is difficult to stably cut out a product region while avoiding damage to the product region cut out from a substrate.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a substrate dividing method capable of stably cutting out a product region cut out from a substrate while avoiding damage to the product region.

Means for solving the technical problem

The substrate dividing method of the present invention includes: a step of directly disposing a substrate on a table top, the table top having a first support surface and a second support surface, the first support surface being made of a first material having a Young's modulus of 3GPa or more, the second support surface being made of a second material having a Young's modulus smaller than that of the first material; forming a first scribe line on the substrate along a first virtual line on the first supporting surface; forming a first groove line along a second virtual line by sliding a cutting edge on the substrate, the second virtual line having a first portion on the first support surface, a second portion on the second support surface, and a first intersection intersecting the first virtual line; and a step of extending a first crack line in a crack-free state, which breaks the first trench line, in a direction from the first intersection toward the second portion, triggered by the intersection of the first scribe line and the first trench line at the first intersection.

Effects of the invention

According to the substrate dividing method of the present invention, the first crack line includes a second portion located in a region of the substrate supported by the relatively soft second support surface of the table top. This makes this region of the substrate less susceptible to damage from the table top than if it were supported by a rigid support surface. Thus, by using this area as a product area, the product area can be cut out with the first crack line while avoiding damage to the product area. In another aspect, a first scribe line is formed in a region of the substrate that is supported by a relatively rigid first support surface of the table top. This makes the region of the substrate less likely to be deformed when the first scribe line is formed, as compared with the case where the substrate is supported by a soft support surface. Therefore, the first scribe line can be stably formed, and as a result, the first crack line formed by using the first scribe line as a trigger can be stably formed. As described above, the product region cut out from the substrate can be stably cut out while avoiding damage to the product region.

Drawings

Fig. 1 is a plan view showing a groove line.

Fig. 2 is a schematic sectional view along line II-II of fig. 1.

Fig. 3 is a plan view showing the scribe line.

Fig. 4 is a schematic sectional view taken along line IV-IV of fig. 3.

Fig. 5 is a cross-sectional view schematically showing a breaking process for the crack line of fig. 4.

Fig. 6 is a side view schematically showing the structure of an instrument for forming a score line by sliding a tip.

Fig. 7 is a bottom view from the viewpoint indicated by arrow VII in fig. 6.

Fig. 8 is a side view schematically showing the structure of an instrument for forming a scribing line by rotation of a tip.

Fig. 9 is a front view from the viewpoint indicated by an arrow IX of fig. 8.

Fig. 10 is a plan view schematically showing the structure of the scribing stage according to embodiment 1.

Fig. 11 is a schematic sectional view along line XI-XI of fig. 10.

Fig. 12 is a plan view schematically showing the steps of the substrate dividing method in embodiment 1.

Fig. 13 is a schematic sectional view taken along line XIII-XIII of fig. 12.

Fig. 14 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 1.

Fig. 15 is a schematic sectional view taken along line XV-XV of fig. 14.

Fig. 16 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 1.

Fig. 17 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 1.

Fig. 18 is a plan view schematically showing the steps of the substrate dividing method in embodiment 1.

Fig. 19 is a plan view schematically showing the steps of the substrate dividing method in embodiment 1.

Fig. 20 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 1.

Fig. 21 is a plan view schematically showing the steps of the substrate dividing method in embodiment 1.

Fig. 22 is a plan view schematically showing the steps of the substrate dividing method in embodiment 1.

Fig. 23 is a plan view schematically showing the steps of the substrate dividing method in embodiment 1.

Fig. 24 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 1.

Fig. 25 is a plan view schematically showing the steps of the substrate dividing method according to embodiment 2.

Fig. 26 is a schematic sectional view taken along line XXVI-XXVI of fig. 25.

Fig. 27 is a plan view schematically showing the steps of the substrate dividing method according to embodiment 2.

Fig. 28 is a schematic sectional view taken along line XXVIII-XXVIII of fig. 27.

Fig. 29 is a plan view schematically showing the structure of the scribing stage according to embodiment 3.

Fig. 30 is a schematic cross-sectional view taken along line XXX-XXX of fig. 29.

Fig. 31 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 3.

Fig. 32 is a schematic cross-sectional view along line XXXII-XXXII of fig. 31.

Fig. 33 is a plan view schematically showing the steps of the substrate dividing method according to embodiment 4.

FIG. 34 is a schematic cross-sectional view taken along line XXXIV-XXXIV of FIG. 33.

Fig. 35 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 5.

Fig. 36 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 5.

Fig. 37 is a plan view schematically illustrating a process of the substrate dividing method according to the first modification of embodiment 5.

Fig. 38 is a plan view schematically illustrating a process of a substrate dividing method according to a second modification of embodiment 5.

Fig. 39 is a plan view schematically illustrating a process of a substrate dividing method according to a third modification of embodiment 5.

Fig. 40 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 6.

Fig. 41 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 6.

Fig. 42 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 6.

Fig. 43 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 6.

Fig. 44 is a plan view schematically illustrating a process of the substrate dividing method according to the first modification of embodiment 6.

Fig. 45 is a plan view schematically illustrating a step of the substrate dividing method according to the second modification of embodiment 6.

Fig. 46 is a plan view schematically illustrating a process of a substrate dividing method according to a third modification of embodiment 6.

Fig. 47 is a plan view schematically showing the steps of the substrate dividing method according to the fourth modification of embodiment 6.

Fig. 48 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 7.

Fig. 49 is a plan view schematically showing the steps of the substrate dividing method according to embodiment 7.

Fig. 50 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 7.

Fig. 51 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 7.

Fig. 52 is a plan view schematically illustrating a step of the substrate dividing method according to the modification of embodiment 7.

Fig. 53 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 8.

Fig. 54 is a plan view schematically illustrating a step of the substrate dividing method according to embodiment 8.

Fig. 55 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 8.

Fig. 56 is a plan view schematically illustrating the steps of the substrate dividing method according to embodiment 8.

Description of the reference numerals

11 … glass substrate; 20 … a base portion; 21 … support member; 22 … protective member; 23 … a panel member; 51 … knife tip; 121-124 … scribing object stage; 151 … scoring wheel (nose); CL … crack line; CLd1 … first dummy crack line; CLd2 … second dummy crack line; CLx … first crack line; CLy … second crack line; ML1 … first virtual line; ML2 … second virtual line; ML3 … third virtual line; ML4 … fourth virtual line; RN … peripheral region; RP … product field; SL … scribe lines; an SL1 … first scribe line; an SL2 … second scribe line; SL3 … third scribe line; SP … worktop; SP1 … first bearing surface; SP2 … second bearing surface; SS1 … direct bearing surface; SS2 … indirect bearing surface; TL … slot line; TL2 … auxiliary trench line; TLa1 … first auxiliary trench line; TLa2 … second auxiliary trench line; TLd1 … first dummy trench line; TLd2 … second dummy trench line; TLx … a first trench line; TLy … second slot line.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that in the following drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof is not repeated.

Before specifically describing the embodiments of the present invention, first, the meanings of the terms of the groove line, the crack line, and the scribe line in the present specification are described below.

Fig. 1 is a plan view showing a trench line TL extending on an upper surface SF1 of a glass substrate 11, and fig. 2 is a schematic sectional view taken along line II-II of fig. 1. The step of forming the trench line TL is performed so as to obtain a crack-free state in which the glass substrate 11 is continuously connected directly below the trench line TL in a direction DC intersecting the trench line TL. In the crack-free state, the groove line TL is formed due to plastic deformation caused by tip sliding, but no crack is formed along the groove line TL. In order to obtain a crack-free state, the load applied to the tip is so small that no cracks occur and so large that plastic deformation occurs.

Fig. 3 is a plan view showing the scribe line SL extending on the upper surface SF1 of the glass substrate 11, and fig. 4 is a schematic sectional view taken along the line IV-IV of fig. 3. The scribe line SL has a trench line TL and a crack line CL extending along the trench line TL directly below the trench line TL. Directly below the trench line TL, the glass substrate 11 is continuously connected in a direction DC intersecting the trench line TL but is blocked by the crack line CL. Here, "continuously connected" means that the connection is not interrupted by a crack. In the continuously connected but blocked state as described above, the glass substrates 11 may be partially in contact with each other through the crack line CL. In addition, the trench line TL and the crack line CL are generally connected to each other as shown in fig. 4, but the trench line TL and the crack line CL may be slightly separated in the thickness direction DT.

The scribe line SL is formed by two methods. The first method is a method of performing a typical scribing which has been widely used in the past. In this case, the trench line TL and the crack line CL are formed at the same time, and thus the above-described trench line TL in the crack-free state cannot be obtained. The second method is a method of extending the crack line CL in a crack-free state that breaks the trench line TL after forming the trench line TL in a crack-free state (fig. 1 and 2). The mechanism of the expansion phenomenon of the crack line CL is presumed to be that the crack line CL expands as the stress accumulated in the vicinity of the trench line TL in the crack-free state is released.

The above-mentioned stress relief usually requires some kind of triggering. As a first example of the trigger, in the step of extending the trench line TL in the crack-free state, when the trench line TL crosses the existing scribe line SL, the crack-free state in which the trench line TL is broken is triggered. Specifically, the crack line CL extends along the trench line TL starting from a portion intersecting the scribe line SL. Therefore, in this case, the formation direction of the trench line TL and the formation direction of the crack line CL along the trench line TL are opposite to each other. As a second example of the trigger, when the scribe line is formed so as to intersect the existing trench line TL, a crack-free state that breaks the trench line TL is triggered.

Fig. 5 is a cross-sectional view schematically showing a breaking process for the crack line CL of fig. 4. By applying the stress FB to the glass substrate 11, the crack of the crack line CL completely proceeds in the thickness direction DT as indicated by an arrow EB. Thereby, the brittle substrate is divided along the crack line CL. As shown in fig. 4, the crack line CL generated by breaking the crack-free state does not normally reach the back surface SF2 of the glass substrate 11. Therefore, the above-described breaking step is generally required to separate the glass substrate 11. Note that, under the condition that the thickness of the glass substrate 11 is extremely thin, the crack line CL generated by breaking the crack-free state may reach the back surface SF2 of the glass substrate 11, and in this case, the breaking step may be omitted.

Fig. 6 is a side view schematically showing the structure of a cutting tool 50 for forming a groove line TL (fig. 1 and 2) by tip sliding, and fig. 7 is a bottom view from the viewpoint indicated by an arrow VII of fig. 6. The cutting implement 50 has a tip 51 and a shank 52. The cutting edge 51 is fixed to a shank 52 as a holder thereof. Therefore, the cutting edge 51 is fixed to the shank 52 and cannot rotate.

The cutting edge 51 has a top surface SD1 and a plurality of surfaces surrounding the top surface SD 1. These multiple faces include side SD2 and side SD 3. The top surface SD1, the side surface SD2 and the side surface SD3 face in different directions and are adjacent to each other. The cutting edge 51 has a vertex formed by merging a top surface SD1, a side surface SD2, and a side surface SD3, and the protrusion PP of the cutting edge 51 is formed by the vertex. The side surface SD2 and the side surface SD3 form ridge lines that form the side portions PS of the cutting edge 51. The side portions PS extend linearly from the projection PP. In addition, as described above, the side portions PS are ridge lines and thus have a convex shape extending linearly. The shank 52 extends along the axial direction AX. The cutting edge 51 is preferably attached to the shank 52 so that the normal direction of the top surface SD1 is substantially along the axial direction AX.

The tip 51 is preferably a diamond nicking tool. That is, the cutting edge 51 is preferably made of diamond from the viewpoint of being able to reduce hardness and surface roughness. More preferably, the tip 51 is made of single crystal diamond. Further preferably, crystallographically, the top surface SD1 is a {001} surface, and the side surfaces SD2 and SD3 are {111} surfaces, respectively. In this case, side SD2 and side SD3 have different orientations, but are crystallographically equivalent crystal planes to each other. Further, non-single crystal diamond, for example, polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method, may be used. Alternatively, polycrystalline diamond sintered from fine graphite or non-graphite carbon without containing a bonding material such as an iron group element, or sintered diamond obtained by bonding diamond particles with a bonding material such as an iron group element may be used.

Next, an example of a method of forming the groove line TL using the cutting tool 50 will be described below.

The blade edge 51 is pressed against the upper surface SF1 of the glass substrate 11. Specifically, the projecting portion PP and the side portion PS of the cutting edge 51 are pressed against the thickness direction DT of the glass substrate 11. Subsequently, the pressed blade edge 51 slides in the direction DA on the upper surface SF 1. The direction DA is a direction in which a direction extending from the projection PP along the side portion PS is projected onto the upper surface SF1, and substantially corresponds to a direction in which the axial direction AX is projected onto the upper surface SF 1. During sliding, the tip 51 is dragged by the shank 52 over the upper surface SF 1. This sliding causes plastic deformation in the upper surface SF1 of the glass substrate 11. Thereby forming the trench line TL. The groove line TL can be formed in a crack-free state without excessively setting the load on the cutting edge 51. If the load is increased as much as possible within the range in which the crack-free state can be obtained, it becomes easier to destroy the crack-free state by the above-described trigger. When the crack-free state is broken, the crack line CL (fig. 4) extends in the direction DB along the groove line TL.

Next, the outline of the structure of the cutting edge for forming a scribe line by rotating the cutting edge and the method of using the same will be described below.

Fig. 8 is a side view schematically showing the structure of a cutting tool 150 for forming a scribe line SL by rotation of a tip, and fig. 9 is a front view from the viewpoint indicated by an arrow IX in fig. 8. The cutting tool 150 has a scoring wheel 151 (tip), a pin 152, and a holder 153. The scribing wheel 151 has a substantially disk-like shape, and its diameter is typically about several mm. The scribing wheel 151 is rotatably held by a holder 153 via a pin 152 about a rotation axis AR. Therefore, the scribing wheel 151 can rotate on the upper surface SF1 of the substrate 11.

The scribing wheel 151 has an outer peripheral portion PF provided with a cutting edge. The outer peripheral portion PF extends annularly around the rotation axis AR. As shown in fig. 9, the outer peripheral portion PF is configured to stand up in a ridge line shape at a visual level, thereby forming a cutting edge including a ridge line and an inclined surface. Further, the uneven pattern may be repeatedly formed along the outer peripheral portion PF. The scribing wheel 151 is formed using a hard material such as cemented carbide, sintered diamond, polycrystalline diamond, or single crystal diamond.

The scribing wheel 151 easily and reliably forms the scribing line SL even when rotating between the edge ED1 and the edge ED2 of the glass substrate 11 along a trajectory away from these edges. In other words, even if the scribing wheel 151 cannot perform scribing, that is, scribing by rotation of the cutting edge, due to the cutting edge being in contact with the edge of the glass substrate 11, the scribe line SL can be formed easily and reliably. Note that if the cutting edge 51 (fig. 6) is slid along the same trajectory, the crack line CL is not easily formed even if the groove line TL is formed.

Embodiments 1 to 8 to which the above-described technology is applied will be described below.

< embodiment 1>

Referring to fig. 10 and 11, the scribing stage 121 according to the present embodiment partially supports the glass substrate 11 to be scribed, using the protective member 22 (fig. 12 and 13). Stage 121 has a direct bearing surface SS1 and an indirect bearing surface SS 2. Referring to fig. 15, the indirect support surface SS2 (fig. 11) supports the glass substrate 11 via the protective member 22. Referring to fig. 15, the direct support surface SS1 protrudes toward the glass substrate 11 beyond the indirect support surface SS2, and directly supports the glass substrate 11. To obtain this structure, the stage 121 has a base portion 20 (indirect support portion) and a direct support member 21. The direct support member 21 is supported on a flat surface of the base portion 20. The direct support member 21 may be a sheet-like member having a certain thickness. The material of the direct support member 21 (the first material in the present embodiment) has a young's modulus of 3GPa or more, and is, for example, metal or a relatively hard resin. As the relatively hard resin, for example, acrylic resin or polyvinyl chloride resin is used. A substrate dividing method using the stage 121 will be described below.

Referring to fig. 12 and 13, the protection member 22 is supported on an indirect support surface SS2 formed by the base portion 20 (indirect support portion) of the stage 121. Thereby, the table top SP including the stage 121 and the protective member 22 is constituted. The table surface SP has a first support surface SP1 formed by the direct support member 21 of the stage 121 and a second support surface SP2 formed by the protective member 22. In the present embodiment, the first support surface SP1 corresponds to the direct support surface SS1 (fig. 11) formed by the direct support member 21. The first support surface SP1 is made of a first material having a young's modulus of 3GPa or more. The first support surface SP1 preferably has an arithmetic average roughness Ra of 0.04 μm or less, more preferably 0.02 μm or less. The sheathing member 22 may be a sheet-shaped member having a certain thickness. The second support surface SP2 is made of a second material having a young's modulus smaller than that of the first material. In other words, the young's modulus of the protective member 22 is smaller than that of the direct support member 21. The material of the protective member 22 is preferably a material having a young's modulus of 2GPa or less, and is, for example, a relatively soft resin or paper. As the relatively soft resin, for example, polyethylene terephthalate (PET) is used. The thickness of the protective member 22 is preferably 0.005mm or more and 0.2mm or less.

Referring to fig. 14 and 15, the glass substrate 11 is directly disposed on the table top SP. The glass substrate 11 may have a thickness of 100 μm or less.

Referring to fig. 16, a first scribe line SL1 is formed on the glass substrate 11 along a first virtual line ML1 on the first support surface SP1 (fig. 15). Further, the second scribe line SL2 is formed on the glass substrate 11 along the third virtual line ML3 on the first support surface SP1 (see fig. 15). The first scribe line SL1 and the second scribe line SL2 are formed by rotation of the tip on the glass substrate 11. As a blade edge for this, a scribing wheel 151 (fig. 8 and 9) can be used.

Referring to fig. 17, the second virtual line ML2 has a first cross point XP1 that crosses the first virtual line ML1, a first portion (right portion in the drawing) on the first support surface SP1 (fig. 15), and a second portion (left portion in the drawing) on the second support surface SP2 (fig. 15). By the sliding of the blade edge on the glass substrate 11, a first groove line TLx along the second virtual line ML2 is formed in the direction indicated by the arrow. As the cutting edge used for this, a cutting edge 51 (fig. 6 and 7) can be used.

Referring to fig. 18, as a trigger, the first scribe line SL1 and the first trench line TLx (fig. 17) intersect at the first intersection XP1, and the first crack line CLx which breaks the crack-free state of the first trench line TLx is extended in the direction indicated by the arrow in the direction from the first intersection XP1 toward the left portion. Referring to fig. 19, by repeating this process, a plurality of first crack lines CLx are formed.

Referring to fig. 20, the fourth virtual line ML4 has a second cross point XP2 that crosses the third virtual line ML3, a third portion (upper portion in the drawing) on the first support plane SP1 (fig. 15), and a fourth portion (lower portion in the drawing) on the second support plane SP2 (fig. 15). The second groove line TLy along the fourth virtual line ML4 is formed in the direction indicated by the arrow by sliding the fixed blade edge on the glass substrate 11. As the cutting edge used for this, a cutting edge 51 (fig. 6 and 7) can be used.

Referring to fig. 21, the second crack line CLy in the crack-free state, which breaks the second trench line TLy, is extended in the direction indicated by the arrow in the direction from the intersection toward the lower portion, triggered by the intersection of the first crack line CLx and the second trench line TLy (fig. 20). As the formation of the second trench line TLy proceeds, the phenomenon of breaking the crack-free state is repeated according to the number of the first crack lines CLx. In order to reliably generate this phenomenon, the load applied to the cutting edge when the second groove line TLy (fig. 20) is formed is preferably larger than the load applied to the cutting edge when the first groove line TLx (fig. 17) is formed. From this point of view, it is preferable that the load applied to the cutting edge when forming the first groove line TLx (fig. 17) is small within a range in which a phenomenon of a crack-free state can be induced and thereafter broken. In the present embodiment, the first scribe line SL1 formed by rotating the cutting edge is the only element that breaks the first groove line TLx (fig. 17) in the crack-free state, and in this case, the crack-free state is likely to be broken even if the load is small.

Referring to fig. 22, as the sliding of the cutting edge on the glass substrate 11 further progresses, a second groove line TLy along a fourth virtual line ML4 is formed in the direction indicated by the arrow. Further, referring to fig. 23, as a trigger, the second scribe line SL2 and the second trench line TLy intersect at the second intersection XP2, the second crack line CLy breaking the crack-free state of the second trench line TLy extends as indicated by an arrow in a direction from the second intersection XP2 toward the lower portion. Referring to fig. 24, by repeating this process, a plurality of second crack lines CLy are formed.

Through the above steps, scribing of the glass substrate 11 is completed. Referring to fig. 24, the region surrounded by the pair of first split lines CLx and the pair of second split lines CLy located at the outermost side is a product region RP, and the outer side thereof is a peripheral region RN. The peripheral region RN is a region not used for product purposes. The product region RP is surrounded by the peripheral region RN and is a region for product use. Then, the breaking step is performed as necessary, thereby completing the substrate dividing method. Thereby, a plurality of products (or semi-finished products) can be cut out from the product region RP.

The scribing stage 121 (fig. 11) according to the present embodiment is provided with an indirect support surface SS2 (fig. 11) that supports the glass substrate 11 (fig. 15) via the protective member 22, and a direct support surface SS1 (fig. 11) that protrudes toward the glass substrate 11 beyond the indirect support surface SS2 and directly supports the glass substrate 11. This makes it possible to form a table top SP (fig. 13) having a first support surface SP1 constituted by a direct support surface SS1 and a second support surface SP2 constituted by the protective member 22. By selecting a material softer than the direct support surface SS1 as the material of the protective member 22, the second support surface SP2 can be made softer than the first support surface SP 1. Therefore, the substrate dividing method can be performed using the table top SP.

According to the substrate dividing method of the present embodiment, the first crack line CLx (fig. 24) includes a portion located in a region of the glass substrate 11 supported by the relatively soft second support surface SP2 of the table surface SP. This makes the region of the glass substrate 11 less likely to be damaged from the table top SP than when it is supported by a relatively hard support surface. Therefore, by using this region as the product region RP, the product region RP can be cut out with the first crack lines CLx while avoiding damage to the product region RP. On the other hand, the first scribe line SL1 is formed in the region of the glass substrate 11 supported on the relatively hard first support surface SP1 of the table top SP. This makes this region of the glass substrate 11 less likely to deform when the first scribe line SL1 is formed, as compared with the case where the region is supported by a soft support surface. Therefore, the first scribe line SL1 can be stably formed, and as a result, the first split line CLx formed using the first scribe line SL1 as a trigger can also be stably formed. As described above, the product region RP can be cut out stably while avoiding damage to the product region RP cut out from the glass substrate 11.

Note that the scribe line formed in the product region RP is formed by breaking a crack-free state after the formation of the trench line TL (fig. 4) in the crack-free state. When the groove line TL is formed in a crack-free state, the load to the tip is relatively small. Therefore, even if the second support surface SP2 supporting the product region RP is soft, the process is not likely to become unstable. Therefore, the product region RP can be cut out stably.

When the thickness of the glass substrate 11 is 100 μm or less, the glass substrate 11 is likely to be deformed greatly if the first scribe line SL1 is formed on a soft support surface because the rigidity of the glass substrate 11 is low. In this case, it is particularly difficult to stably form the first scribe line SL 1. According to the present embodiment, since the first scribe line SL1 is formed on a strong support surface, this problem can be avoided.

The first support surface SP1 (fig. 15) preferably has an arithmetic average roughness Ra of 0.04 μm or less. This enables the first scribe line SL1 to be formed more stably on the first support surface SP 1.

The scribing stage 121 (fig. 13) includes a direct support member 21 forming a first support surface SP1 (fig. 13) and a base portion 20 (indirect support portion) supporting the protective member 22, and the protective member 22 is more flexible than the direct support member 21. Thus, the second supporting surface SP2, which is more flexible than the first supporting surface SP1, can be formed using the protective member 22.

The step of forming first scribe line SL1 (fig. 16) is performed by rotating the cutting edge on glass substrate 11. This makes it easy to reliably form the first scribe line SL 1. In particular, when the cutting edge is suppressed from contacting the edge of the glass substrate 11, the first scribe line SL1 can be formed more easily and reliably in the case where the cutting edge is rotated than in the case where the cutting edge is slid. By suppressing the contact of the cutting edge with the edge of the glass substrate 11, it is possible to prevent, for example, the breakage of the edge of the glass substrate 11 or the damage to the surface SP caused by the cutting edge coming into contact with the surface SP beyond the edge of the glass substrate 11.

By stretching the second crack line CLy (fig. 24), the second crack line CLy intersecting the first crack line CLx can be obtained. Thereby, the product region RP can be cut out with the first and second crack lines CLx and CLy intersecting each other.

< embodiment 2>

Referring to fig. 25 and 26, the base portion 20 of the scribing stage 122 according to the present embodiment has a flat surface (upper surface in fig. 26). By placing the protection member 22 on a part of the flat surface, the table top SP including the base portion 20 and the protection member 22 is configured. The table top SP has a first support surface SP1 formed by the base portion 20 and a second support surface SP2 formed by the protection member 22. In other words, the flat surface has a portion that supports the protective member 22 forming the second support surface SP2 and a portion that forms the first support surface SP 1. The material of the base portion 20 (the first material in the present embodiment) has a young's modulus of 3GPa or more, and is, for example, metal or a relatively hard resin. As the relatively hard resin, for example, acrylic resin or polyvinyl chloride resin is used. The young's modulus of the material (second material) of the protective member 22 is smaller than the young's modulus of the material (first material in the present embodiment) of the base portion 20. Therefore, as in embodiment 1, the second support surface SP2 is made of a second material having a young's modulus smaller than that of the first material constituting the first support surface SP 1. The material of the base portion 20 may be the same as that of the above-described direct support member 21 (fig. 12 and 13: embodiment 1).

Referring to fig. 27 and 28, the glass substrate 11 is directly disposed on the table top SP. Thereafter, the substrate dividing method is performed by performing the same steps as in embodiment 1.

Note that the smaller the level difference between the first bearing surface SP1 and the second bearing surface SP2, the more stable the scribe line near their boundary. According to the experiment using the glass substrate 11 having a thickness of 50 μm, it was possible to perform substantially stable scribing at least until the step difference was 0.2 mm. Therefore, if the thickness of the protective member 22 is 0.2mm or less, the adverse effect due to the level difference is considered to be small.

According to the present embodiment, since the direct support member 21 (fig. 12 and 13: embodiment 1) is omitted, it is not necessary to perform the work of disposing the direct support member 21 and the protection member 22 adjacent to each other. This can improve the work efficiency.

< embodiment 3>

Referring to fig. 29 and 30, as in embodiment 1, the scribing stage 123 of the present embodiment includes the direct support member 21 forming the direct support surface SS1 and the indirect support member forming the indirect support surface SS 2. In the present embodiment, the indirect support portion has a plate member 23 in addition to the base portion 20. The plate member 23 directly supports the direct support member 21 and forms an indirect support surface SS 2. Therefore, in the present embodiment, the plate member 23 directly supports the protection member 22 (fig. 31 and 32). The base part 20 detachably supports the plate member 23. The material of the plate member 23 has a young's modulus of 3GPa or more, and is, for example, metal or a relatively hard resin. As the metal, for example, aluminum is used. As the relatively hard resin, for example, acrylic resin or polyvinyl chloride resin is used.

Referring to fig. 31 and 32, the protection member 22 is supported on the indirect support surface SS2 of the stage 123. Thereby, the table top SP including the stage 123 and the protection member 22 is constituted. As in embodiment 1, the table surface SP includes a first support surface SP1 formed by the direct support member 21 of the stage 123 and a second support surface SP2 formed by the protective member 22. Therefore, a substrate dividing method substantially similar to that of embodiment 1 or 2 can be performed.

According to the present embodiment, the glass substrate 11 can be conveyed together with the plate member 23 by attaching and detaching the plate member 23 from the base portion 20. This enables the glass substrate 11 to be easily conveyed. In particular, since the glass substrate 11 having a thickness of 100 μm or less is difficult to convey, the effect of the present embodiment is remarkable. In addition, it is possible to prepare a plurality of kinds of units having the plate member 23 and the direct support member 21 fixed to each other, and select and use a unit of a specification suitable for the substrate dividing method from these units. This makes it possible to easily and quickly meet various specifications of the substrate dividing method.

< embodiment 4>

Referring to fig. 33 and 34, the scribing stage 124 of the present embodiment includes a plate member 23 and a base portion 20 that detachably supports the plate member 23. The plate member 23 forms a flat face (upper face in fig. 34). By placing the protection member 22 on a part of the flat surface, the table top SP including the plate member 23 and the protection member 22 is configured. The table top SP has a first support surface SP1 formed by the plate member 23 and a second support surface SP2 formed by the protection member 22. In other words, the flat surface has a portion that supports the protective member 22 forming the second support surface SP2 and a portion that forms the first support surface SP 1. As described above, the material of the plate member 23 (the first material in the present embodiment) has a young's modulus of 3GPa or more, and is, for example, a metal or a relatively hard resin. The young's modulus of the material (second material) of the protective member 22 is smaller than the young's modulus of the material (first material in the present embodiment) of the plate member 23. Therefore, similarly to embodiment 2, the second support surface SP2 is made of a second material having a young's modulus smaller than that of the first material constituting the first support surface SP 1. Therefore, a substrate dividing method substantially similar to embodiments 1 to 3 can be performed.

According to the present embodiment, since the direct support member 21 (fig. 12 and 13: embodiment 1) is omitted, it is not necessary to perform the work of disposing the direct support member 21 and the protection member 22 adjacent to each other. This can improve the work efficiency. Further, by attaching and detaching the plate member 23 from the base portion 20, the glass substrate 11 can be conveyed together with the plate member 23. This enables the glass substrate 11 to be easily conveyed. In particular, since the glass substrate 11 having a thickness of 100 μm or less is difficult to convey, the effect of the present embodiment is remarkable.

< embodiment 5>

In this embodiment, first, the steps shown in fig. 14 and 15 in embodiment 1 are performed.

Next, referring to fig. 35, as shown by arrows in the drawing, the first auxiliary groove line TLa1 and the second auxiliary groove line TLa2 are formed along the first virtual line ML1 and the third virtual line ML3, respectively, by sliding of the blade edge on the glass substrate 11.

Next, referring to fig. 36, by the rotation of the blade edge on the glass substrate 11, a third scribe line SL3 is formed which intersects the first virtual line ML1 and the third virtual line ML3, respectively. Specifically, the third scribe line SL3 intersecting the first auxiliary groove line TLa1 and the second auxiliary groove line TLa2, respectively, is formed by the rotation of the blade edge on the glass substrate 11. Triggered by the third scribe line SL3 crossing the first auxiliary trench line TLa1, the crack line in the crack-free state that breaks the first auxiliary trench line TLa1 (fig. 35) spreads in a direction opposite to the direction in which the first auxiliary trench line TLa1 is formed (the direction of the arrow in fig. 36 opposite to the direction of the arrow in fig. 35). In other words, the first scribe line SL1 including the crack line extends in the arrow direction in fig. 36. Thereby, the first scribe line SL1 is formed. Further, triggered by the third scribe line SL3 crossing the second auxiliary trench line TLa2, the crack line in the crack-free state that breaks the second auxiliary trench line TLa2 (fig. 35) spreads in the direction opposite to the direction in which the second auxiliary trench line TLa2 is formed (the direction of the arrow in fig. 36 opposite to the direction of the arrow in fig. 35). In other words, the second scribe line SL2 including the crack line extends in the arrow direction in fig. 36. Thereby, the second scribe line SL2 is formed.

As described above, substantially the same configuration as that in the step of fig. 16 of embodiment 1 can be obtained. Then, the substrate dividing method can be performed substantially in the same manner as in embodiment 1.

According to the present embodiment, in order to obtain the first and second scribe lines SL1 and SL2, the first and second auxiliary groove lines TLa1 and TLa2 are formed by the blade edge sliding instead of the blade edge rotating (fig. 35). The formation of the third scribing line SL3 (fig. 36) based on the tip rotation serves only as a trigger for a crack-free state of breaking the first auxiliary groove line TLa1 and the second auxiliary groove line TLa2 (fig. 35). Thus, unlike the case where the first scribe line SL1 and the second scribe line SL2 are formed along the trajectory of the cutting edge rotation as in embodiment 1, the length of the cutting edge rotation can be suppressed. Since the cutting edge is likely to be undesirably broken around the crack line formed by the rotation of the cutting edge, the length of the cutting edge to be rotated can be reduced, thereby suppressing the occurrence of the crack.

Note that the stage 121 described in detail in embodiment 1 is used in the above description, but the stage 122 described in detail in embodiment 2 (fig. 37), the stage 123 described in detail in embodiment 3 (fig. 38), or the stage 124 described in detail in embodiment 4 (fig. 39) may be used as a modification.

In addition, in the above description, the first auxiliary trench line TLa1 and the second auxiliary trench line TLa2 (fig. 35) are formed before the third scribe line SL3 (fig. 36) is formed, but as a modification, the third scribe line SL3 may be formed before the first auxiliary trench line TLa1 and the second auxiliary trench line TLa2 are formed. In any case, the first and second auxiliary trench lines TLa1 and TLa2 cross the third scribe line SL3, respectively, and the first and second scribe lines SL1 and SL2 are extended as triggered.

< embodiment 6>

In this embodiment, first, the step shown in fig. 19 in embodiment 1 is performed.

Referring to fig. 40, as described in embodiment 1 above, the first scribe line SL1 and the second scribe line SL2 are along the first virtual line ML1 and the third virtual line ML3, respectively. The first virtual line ML1 and the third virtual line ML3 are disposed in the peripheral edge region RN away from the product region RP. By the sliding of the blade tip on the peripheral edge region RN of the glass substrate 11, the first dummy groove line TLd1 is formed between the product region RP and the third dummy line ML3 in the direction indicated by the arrow in the figure.

Referring to fig. 41, triggered by the intersection of the first scribe line SL1 and the first dummy trench line TLd1 (fig. 40), the first dummy crack line CLd1 in a crack-free state, which breaks the first dummy trench line TLd1, extends in a direction opposite to the direction in which the first dummy trench line TLd1 is formed. Note that the order of the process of forming the first trench line TLx and the first crack line CLx and the process of forming the first dummy trench line TLd1 and the first dummy crack line CLd1 is arbitrary.

Referring to fig. 42, a plurality of second crack lines CLy are formed by performing the same steps as those of fig. 20 to 24 (embodiment 1). Next, the blade edge slides on the peripheral edge region RN of the glass substrate 11, thereby forming a second dummy groove line TLd2 between the product region RP and the first dummy line ML 1.

Referring to fig. 43, triggered by the intersection of the second scribe line SL2 and the second dummy trench line TLd2 (fig. 42), the second dummy crack line CLd2 in a crack-free state, which breaks the second dummy trench line TLd2, extends in a direction opposite to the direction in which the second dummy trench line TLd2 is formed. Note that the order of the process of forming the second trench line TLy and the second crack line CLy and the process of forming the second dummy trench line TLd2 and the second dummy crack line CLd2 is arbitrary.

According to the present embodiment, the product region RP is separated from the first and second scribe lines SL1 and SL2 by the first and second dummy crack lines CLd1 and CLd2, respectively. The first and second scribe lines SL1 and SL2 formed by the rotation of the tip easily cause an undesired fracture, but the progress of the fracture is stopped at the first and second dummy crack lines CLd1 and CLd2, whereby an undesired fracture in the product region RP can be avoided.

Note that the stage 121 described in detail in embodiment 1 is used in the above description, but the stage 122 described in detail in embodiment 2 (fig. 44), the stage 123 described in detail in embodiment 3 (fig. 45), or the stage 124 described in detail in embodiment 4 (fig. 46) may be used as a modification.

In addition, as a modification, as described in detail in embodiment 5, first scribe line SL1 and second scribe line SL2 may be formed using third scribe line SL3 (fig. 47). Further, a third dummy crack line CLd3 may be formed between the third scribe line SL3 and the product region RP. The third dummy crack line CLd3 and the third scribe line SL3 may be parallel. A third dummy groove line (not shown) is formed by the sliding of the cutting edge, and then the crack-free state is broken, thereby obtaining a third dummy crack line CLd 3. Triggering to break the crack-free state is obtained by the third dummy trench line crossing the first scribe line SL1 or the second scribe line SL 2.

< embodiment 7>

In the present embodiment, first, the steps shown in fig. 31 and 32 in embodiment 3 are performed.

Referring to fig. 48, next, as in embodiment 1, the first scribe line SL1 is formed by the turning of the cutting edge. Subsequently, the auxiliary groove line TL2 is formed by sliding the blade edge on the glass substrate 11.

Referring to fig. 49, triggered by the intersection of the first scribe line SL1 and the auxiliary trench line TL2 (fig. 48), the crack line in the crack-free state that breaks the auxiliary trench line TL2 extends in a direction opposite to the direction in which the auxiliary trench line TL2 is formed (the direction of the arrow in fig. 49 opposite to the direction of the arrow in fig. 48). In other words, the second scribe line SL2 extends in the arrow direction in fig. 49. Thereby, the second scribe line SL2 is formed. Then, the substrate dividing method can be performed by performing the same steps as those in fig. 17 and the following figures in embodiment 1.

Referring to fig. 50, a plurality of first crack lines CLx are formed by performing a process similar to that of fig. 17 to 19 (embodiment 1). Next, a plurality of second split lines CLy are formed by performing the same steps as those in fig. 20 to 24 (embodiment 1). Next, the blade edge slides on the peripheral edge region RN of the glass substrate 11, thereby forming a second dummy groove line TLd2 between the product region RP and the first dummy line ML 1. Note that, in this embodiment, the first dummy trench line TLd1 (fig. 40: embodiment 6) may not be formed.

Referring to fig. 51, triggered by the intersection of the second scribe line SL2 and the second dummy trench line TLd2 (fig. 50), the second dummy crack line CLd2 in a crack-free state, which breaks the second dummy trench line TLd2, extends in a direction opposite to the direction in which the second dummy trench line TLd2 is formed. When the first dummy trench line TLd1 (fig. 40: embodiment 6) is omitted from being formed as described above, the first dummy crack line CLd1 (fig. 41: embodiment 6) is also not formed. Note that the order of the process of forming the second trench line TLy (see fig. 22) and the second crack line CLy and the process of forming the second dummy trench line TLd2 (fig. 50) and the second dummy crack line CLd2 (fig. 51) is arbitrary.

Then, the breaking step is performed as necessary, thereby completing the substrate dividing method.

According to the present embodiment, the product region RP is separated from the first scribe line SL1 by the second dummy crack line CLd 2. The first scribe line SL1 formed by the tip rotation easily causes an undesired breakage, but the progress of the breakage stops at the second dummy crack line CLd2, whereby an undesired breakage in the product region RP can be avoided. In the present embodiment, the second scribe line SL2 is formed along a trajectory in which the cutting edge slides rather than rotates. Therefore, since the second scribe line SL2 is less likely to cause undesired cracking, the necessity of the first dummy crack line CLd1 is low. Therefore, the first dummy crack line CLd1 (fig. 41) is omitted and the adverse effect is small.

In addition, according to the present embodiment, the second scribing line SL2 is formed by a method similar to the second crack line CLy. This can improve the work efficiency.

Note that the stage 123 described in detail in embodiment 3 is used in the above description, but the stage 124 (fig. 52) described in detail in embodiment 4 may be used as a modification. Alternatively, the stage described in embodiment 1 or 2 may be used.

< embodiment 8>

In this embodiment, first, the steps shown in fig. 14 and 15 in embodiment 1 are performed. Referring to fig. 53, next, a first trench line TLx is formed.

Referring to fig. 54, next, the first scribe line SL1 is formed by the tip rotation. Triggered by the intersection of the first scribe line SL1 and the first trench line TLx (fig. 53), the first crack line CLx in the crack-free state that breaks the first trench line TLx is stretched in a direction opposite to the direction in which the first trench line TLx is formed (the direction of the arrow in fig. 54 opposite to the direction of the arrow in fig. 53). Thereby forming the first crack line CLx.

Referring to fig. 55, next, a second trench line TLy is formed. Referring to fig. 56, next, the second scribe line SL2 is formed by the tip rotation. Triggered by the intersection of the second scribe line SL2 and the second trench line TLy (fig. 54), the second crack line CLy in the crack-free state that breaks the second trench line TLy is extended in the direction opposite to the direction in which the second trench line TLy is formed (the direction of the arrow in fig. 56 opposite to the direction of the arrow in fig. 55). Thereby forming the second crack line CLy.

Then, the breaking step is performed as necessary, thereby completing the substrate dividing method.

The present embodiment can also provide substantially the same effects as embodiment 1. Note that the stage 121 described in detail in embodiment 1 is used in this embodiment, and the stages described in detail in embodiments 2 to 4 may be used instead.

Claims (15)

1. A substrate dividing method, comprising:

a step of directly disposing a substrate on a table top, the table top having a first support surface and a second support surface, the first support surface being made of a first material having a Young's modulus of 3GPa or more, the second support surface being made of a second material having a Young's modulus smaller than that of the first material;

forming a first scribe line on the substrate along a first virtual line on the first support surface;

forming a first groove line along a second virtual line having a first portion on the first support surface, a second portion on the second support surface, and a first intersection intersecting the first virtual line by sliding a cutting edge on the substrate; and

and a step of extending a first crack line in a crack-free state, which breaks the first trench line, in a direction from the first intersection toward the second portion, triggered by the first scribe line and the first trench line intersecting at the first intersection.

2. The substrate dividing method according to claim 1,

the substrate has a thickness of 100 μm or less.

3. The substrate dividing method according to claim 1 or 2,

the first bearing surface has an arithmetic average roughness Ra of 0.04 [ mu ] m or less.

4. The substrate dividing method according to any one of claims 1 to 3,

the work table is composed of a marking stage and a protection component, the stage comprises a direct supporting component and an indirect supporting component,

the direct support member forms the first support surface and is constructed of the first material,

the indirect support portion supports the protection member and the direct support member,

the protective member is composed of the second material.

5. The substrate dividing method according to claim 4,

the indirect support portion includes:

a plate member directly supporting the protection member and the direct support member; and

and a base part for detachably supporting the plate member.

6. The substrate dividing method according to any one of claims 1 to 3,

the table surface is composed of a scribing stage having a flat surface and a protection member, and the flat surface has a portion for supporting the protection member and a portion for forming the first support surface.

7. The substrate dividing method according to claim 6,

the stage includes:

a plate member forming the flat surface; and

and a base part for detachably supporting the plate member.

8. The substrate dividing method according to any one of claims 1 to 7,

the step of forming the first scribe line is performed by rotating a cutting edge on the substrate.

9. The substrate dividing method according to any one of claims 1 to 7,

the substrate dividing method further includes:

forming a second scribe line on the substrate along a third virtual line on the first supporting surface;

forming a second groove line along a fourth virtual line having a third portion on the first supporting surface, a fourth portion on the second supporting surface, and a second intersection intersecting the third virtual line by sliding a fixed blade edge on the substrate; and

and a step of extending a second crack line in a crack-free state, which breaks the second trench line, in a direction from the second intersection point toward the fourth portion, triggered by the intersection of the second scribe line and the second trench line at the second intersection point.

10. The substrate dividing method according to claim 9,

the step of forming the first scribe line is performed by rotating a cutting edge on the substrate.

11. The substrate dividing method according to claim 10,

the substrate has a peripheral edge region not used for product use and a product region surrounded by the peripheral edge region and used for product use, the first virtual line is disposed in the peripheral edge region away from the product region,

the substrate dividing method further includes:

forming a dummy groove line between the product area and the first dummy line by sliding a blade edge on the peripheral edge area of the substrate; and

and a step of extending a dummy crack line in a crack-free state, which breaks the dummy trench line, in a direction opposite to a direction in which the dummy trench line is formed, triggered by the intersection of the second scribe line and the dummy trench line.

12. The substrate dividing method according to claim 10 or 11,

the step of forming the second scribe line includes:

forming an auxiliary groove line by sliding a blade edge on the substrate; and

and a step of extending the second scribe line, which is in a crack-free state and which breaks the auxiliary trench line, in a direction opposite to a direction in which the auxiliary trench line is formed, using intersection of the first scribe line and the auxiliary trench line as a trigger.

13. The substrate dividing method according to claim 10,

the step of forming the second scribe line is performed by rotating a blade edge on the substrate,

the substrate has a peripheral edge region not used for product use and a product region surrounded by the peripheral edge region and used for product use, the first virtual line and the third virtual line are arranged in the peripheral edge region away from the product region,

the substrate dividing method further includes:

forming a first dummy groove line between the product area and the third dummy line by sliding a blade edge on the peripheral edge area of the substrate;

a step of extending a first dummy crack line in a crack-free state, which breaks the first dummy trench line, in a direction opposite to a direction in which the first dummy trench line is formed, triggered by intersection of the first scribe line and the first dummy trench line;

forming a second dummy groove line between the product area and the first dummy line by sliding a blade edge on the peripheral edge area of the substrate; and

and a step of extending a second dummy crack line in a crack-free state, which breaks the second dummy trench line, in a direction opposite to a direction in which the second dummy trench line is formed, triggered by the intersection of the second scribe line and the second dummy trench line.

14. The substrate dividing method according to claim 9,

the step of forming the first scribe line and the second scribe line includes:

forming a first auxiliary groove line and a second auxiliary groove line along the first virtual line and the second virtual line, respectively, by sliding the blade edge on the substrate;

forming a third scribe line intersecting the first virtual line and the second virtual line by rotating the cutting edge on the substrate;

a step of extending the first scribe line in a crack-free state, which has broken the first auxiliary trench line, in a direction opposite to a direction in which the first auxiliary trench line is formed, triggered by intersection of the third scribe line and the first auxiliary trench line; and

and a step of extending the second scribe line in a crack-free state, which breaks the second auxiliary groove line, in a direction opposite to a direction in which the second auxiliary groove line is formed, using the intersection of the third scribe line and the second auxiliary groove line as a trigger.

15. A scribing stage, which is characterized in that a substrate to be scribed is partially supported by a protective member, comprising:

an indirect support surface that supports the substrate via the protective member; and

and a direct support surface that protrudes toward the substrate than the indirect support surface and directly supports the substrate.

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