CN112566462A - Novel heat dissipation connector - Google Patents

Abstract

The utility model provides a novel heat dissipation connector, locates connector module outlying metal casing and heat dissipation module including connector module, cover, the metal casing forms the grafting space jointly with the connector module, still includes the partition structure, partition structure separates the grafting space into upper portion space, lower part space and is located the heat dissipation space between upper portion space and the lower part space, heat dissipation module combines in the heat dissipation space, heat dissipation module includes first heat dissipation part, second heat dissipation part and interlock spare, the interlock spare is with first heat dissipation part and second heat dissipation part along upper and lower direction activity combination, first heat dissipation part and second heat dissipation part can be along upper and lower direction relative movement, the interlock spare has counter force to being close to relatively of first heat dissipation part and second heat dissipation part. The radiator has better heat radiation performance and is beneficial to miniaturization design.

Description

Novel heat dissipation connector

[ technical field ] A method for producing a semiconductor device

The embodiment of the invention relates to the field of communication transmission, in particular to a novel heat dissipation connector.

[ background of the invention ]

A gigabit interface connector (GBIC) is a hot-pluggable input/output device that plugs into a gigabit ethernet port/slot responsible for connecting the port to a fiber optic network. GBIC can be used and interchanged on various Cisco products, and can be mixed port by port with 1000BaseSX, 1000BaseLX/LH or 1000BaseZX interfaces that conform to IEEE 802.3 z. Further, Cisco is offering a 1000BaseLX/LH interface that fully complies with the IEEE 802.3z1000BaseLX standard, but has a transmission distance on single mode fiber of up to 10 kilometers, 5 kilometers more than the normal 1000BaseLX interface. In summary, as new functions are continuously developed, it will be easier to upgrade these modules to the latest interface technologies, thereby maximizing customer investment.

These conventional plug-in designs have been successful in the past, but they tend not to meet the goals of continued miniaturization in the industry. It is desirable to miniaturize transceivers to increase port density associated with network connections such as switchboxes, cable patch panels, wiring closets, and computer input/output (I/O). Conventional pluggable module configurations are unable to meet these parameter requirements. It is also desirable to increase port density and optimize the connection interface of the SFP module.

A new standard has been published and is referred to herein as the hot-plug (SFP) standard, which is an abbreviation for smallformplugble, simply understood as an upgraded version of GBIC. The SFP module has a half of volume reduction compared with the GBIC module, and the number of ports which is more than one time can be configured on the same panel. The other functions of the SFP module are substantially identical to the GBIC. Some switch vendors call SFP modules as miniaturized GBIC (MINI-GBIC). The SFP module has a half of volume reduction compared with the GBIC module, and the number of ports which is more than one time can be configured on the same panel. The other functions of the SFP module are basically the same as the GBIC.

In the prior art, when the hot-plug type interface connector accommodates the plug-in optical module, a large amount of heat is generated between the optical module and the hot-plug type interface connector, in the prior art, for the stacked hot-plug type interface connector, because the stacked hot-plug type interface connector is downward used for being in butt joint with a circuit board, only a heat dissipation mechanism is arranged on an upper socket, and a position is difficult to be provided for a lower socket to arrange the heat dissipation mechanism, so that the heat dissipation performance of the lower socket is poor, the heat dissipation performance difference between the upper socket and the lower socket is large, and the uneven heat dissipation effect of the same connector is easily caused.

Therefore, there is a need for an improved hot-pluggable interface connector to overcome the above-mentioned shortcomings in the prior art.

[ summary of the invention ]

An object of this application is to provide a novel heat dissipation connector, has better heat dispersion, and does benefit to miniaturized design.

In order to achieve the above purpose, the present application is implemented by the following technical solutions:

the utility model provides a novel heat dissipation connector, locates connector module outlying metal casing and heat dissipation module including connector module, cover, the metal casing forms the grafting space jointly with the connector module, still includes the partition structure, partition structure separates the grafting space into upper portion space, lower part space and is located the heat dissipation space between upper portion space and the lower part space, heat dissipation module combines in the heat dissipation space, heat dissipation module includes first heat dissipation part, second heat dissipation part and interlock spare, the interlock spare is with first heat dissipation part and second heat dissipation part along upper and lower direction activity combination, first heat dissipation part and second heat dissipation part can be along upper and lower direction relative movement, the interlock spare has counter force to being close to relatively of first heat dissipation part and second heat dissipation part.

Further, the partition structure comprises an upper partition and a lower partition which are opposite in the vertical direction and are arranged at intervals, the heat dissipation space is formed between the upper partition and the lower partition, an upper through hole is formed in the upper partition in a penetrating mode, the first heat dissipation portion comprises an upper convex portion, the upper convex portion penetrates through the upper through hole and protrudes upwards to extend into the upper space, a lower through hole is formed in the lower partition in a penetrating mode, the second heat dissipation portion comprises a lower convex portion, and the lower convex portion penetrates through the lower through hole and protrudes downwards to extend into the lower space.

Further, the interlocking member includes a pressing member that is located between the first heat sink member and the second heat sink member and has the opposing force against the relative proximity of the first heat sink member and the second heat sink member.

Further, the urging member is a compression spring.

Further, the linkage piece comprises a shaft connecting piece, and the first heat dissipation part and the second heat dissipation part are limited by the shaft connecting piece in the up-down direction and can only move relative to each other within a limited distance range.

Furthermore, the first heat dissipation part, the pressure applying component and the second heat dissipation part are arranged on the shaft connecting piece in a penetrating mode, and the first heat dissipation part and the second heat dissipation part are limited by the two ends of the shaft connecting piece respectively.

Furthermore, the upper end of the linkage piece does not protrude into the upper space, and the lower end of the linkage piece does not protrude into the lower space.

Furthermore, the surfaces of the first heat dissipation part and the second heat dissipation part, which are opposite to each other, are respectively provided with a protruding part in a protruding manner, and the protruding part of the first heat dissipation part is opposite to the protruding part of the second heat dissipation part.

Further, the distance between two opposite protruding portions is A, the length of the first heat dissipation portion protruding upwards to the upper portion of the partition structure is B, the length of the second heat dissipation portion protruding downwards to the lower portion of the partition structure is C, and A is larger than or equal to B plus C.

Further, the connector module comprises an insulating seat and a plurality of conductive terminals fixed in the insulating seat, an upper butt joint cavity is formed in the insulating seat corresponding to the upper space, a lower butt joint cavity is formed in the insulating seat corresponding to the lower space, the plurality of conductive terminals form two rows of upper row terminal sets and two rows of lower row terminal sets, the two rows of upper row terminal sets are correspondingly combined with the upper butt joint cavity, the two rows of lower row terminal sets are correspondingly combined with the lower butt joint cavity, each conductive terminal is provided with a butt joint part which extends out of the insulating seat and is used for being in butt joint with a butt joint circuit board, and the partition plate structure and the heat dissipation module are located between the upper butt joint cavity and the lower butt joint cavity along the vertical direction.

Compared with the prior art, the method has the following beneficial effects: the radiator has better heat radiation performance and is beneficial to miniaturization design.

[ description of the drawings ]

Fig. 1 is a perspective view of the novel heat dissipating connector of the present application;

fig. 2 is a partially exploded perspective view of the novel heat dissipating connector of the present application, particularly a perspective view of the metal shell when separated from the connector module;

fig. 3 is a side view of the novel heat dissipating connector of the present application, specifically a right side view of the metallic shell separated from the connector module;

fig. 4 is an exploded perspective view of a heat sink module of the novel heat sink connector of the present application;

fig. 5 is a perspective view of a heat dissipating module of the novel heat dissipating connector of the present application;

fig. 6 is a perspective view of a connector module of the novel heat dissipation connector of the present application.

[ detailed description ] embodiments

It should be noted that the embodiments and features of the embodiments in the application may be combined with each other without conflict. Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the application can be understood by those of ordinary skill in the art as the case may be.

In the description of the application, it is to be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In addition, for the accuracy of the description of the present application, the direction of the application is referred to fig. 1, and the extending direction of the X axis is the left-right direction, wherein the positive direction of the X axis is the right direction; the Y-axis extending direction is a plugging direction (also referred to as a front-back direction, where the Y-axis forward direction is a back direction) of the mating connector (not shown); the extending direction of the Z axis is the up-down direction, wherein the positive direction of the Z axis is up. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1 to 6, a novel heat dissipation connector disclosed in the present application includes a connector module 1, a metal housing 2 covering the periphery of the connector module 1, and a heat dissipation module 3, where the metal housing 2 and the connector module 1 together form a plug space (not numbered) for inserting or pulling out a mating connector (not shown). The novel heat dissipation connector further comprises a partition structure 4, wherein the partition structure 4 divides the plugging space 10 into an upper space 101, a lower space 102 and a heat dissipation space 103 between the upper space 101 and the lower space 102.

The heat dissipation module 3 is combined in the heat dissipation space 103, and the heat dissipation module 3 includes a first heat dissipation portion 31, a second heat dissipation portion 32 and a linkage member 33. The interlocking member 33 movably couples the first heat sink 31 and the second heat sink 32 in the vertical direction. The first heat sink member 31 and the second heat sink member 32 can move relative to each other in the vertical direction. The interlocking member 33 has an opposing force to the relative approach of the first heat sink member 31 and the second heat sink member 31, so that the first heat sink member 31 and the second heat sink member 31 always tend to be away from each other.

Referring to fig. 2 and 3, the partition structure 4 includes an upper partition 41 and a lower partition 42 disposed opposite to each other at an interval in the vertical direction. The heat dissipation space 103 is formed between the upper partition plate 41 and the lower partition plate 42. An upper through hole (not numbered) is formed through the upper partition plate 41. The first heat sink member 31 includes an upper projection 311. The upper protrusion 311 protrudes upward into the upper space 101 through the upper through-hole 410. A lower through hole (not numbered) is formed through the lower partition plate 42. The second heat sink member 32 includes a lower projection 321. The lower protrusion 321 protrudes downward into the lower space 102 through the lower through-hole 420.

The upper protrusion 311 of the first heat sink piece 31 is correspondingly contacted with the part of the mating connector inserted into the upper space 101 to realize heat transfer, and the lower protrusion 321 of the second heat sink piece 32 is correspondingly contacted with the part of the mating connector inserted into the lower space 102 to realize heat transfer, so that heat on the mating connector located in the upper space 101 and heat on the mating connector located in the lower space 102 are transferred to the heat dissipation space 103 and then discharged to the outside (in this application, the heat can be discharged through the left and right sides of the metal casing 2).

The first heat sink piece 31 and the second heat sink piece 32 can move relatively in the vertical direction, so that after the butting connector is inserted into the upper space 101 and the lower space 102, the first heat sink piece 31 and the second heat sink piece 32 can adjust positions, more stable contact with the butting connector is realized, and meanwhile, the butting connector can be easily inserted. The interlocking member 33 has a spacing function between the first heat sink 31 and the second heat sink 32, and the first heat sink 31 and the second heat sink 32 can always keep contact with the mating connector.

Referring to fig. 2 to 5, the linkage 33 includes a pressing member 332, and the pressing member 332 is located between the first heat sink member 31 and the second heat sink member 32 and has the counterforce to the relative proximity of the first heat sink member 31 and the second heat sink member 32. Specifically, the biasing member 332 may be a compression spring. The linkage 33 further includes a shaft connector 331, and the first heat sink 31 and the second heat sink 32 are limited by the shaft connector 331 in the up-down direction and can only be displaced from each other within a limited distance range. Specifically, the first heat sink portion 31, the pressure applying member 332, and the second heat sink portion 32 are disposed on the shaft member 331 in a penetrating manner, and the first heat sink portion 31 and the second heat sink portion 32 are respectively limited by two ends of the shaft member 331 (in this application, the shaft member 331 is similar to a rivet structure).

Referring to fig. 2 to 5, the upper end of the linking member 33 does not protrude into the upper space 101, and the lower end of the linking member 33 does not protrude into the lower space 101. The first heat sink member 31 and the second heat sink member 32 have projections 30 on their surfaces facing each other, and the projections 30 of the first heat sink member 31 and the projections 30 of the second heat sink member 31 are arranged facing each other. In this application, the interval between two relative protrusions 30 is A, the length that first heat sink piece 31 upwards projects to baffle structure 4 top is B, the length that second heat sink piece 32 downwards projects to baffle structure 4 below is C, wherein satisfies A and is more than or equal to B and C. With such a design, on one hand, the first heat sink member 31 and the second heat sink member 31 can be locally thicker, and the end of the shaft connector 331 can have a coupling space, and on the other hand, the protrusion 30 coupled to the shaft connector 331 can limit the relative movement distance between the first heat sink member 31 and the second heat sink member 31, so that the first heat sink member 31 and the second heat sink member 31 can relatively move within an appropriate range.

Specifically, as shown in fig. 2 and 3, when the docking connector is not inserted into the upper space 101, the upper surface of the upper protrusion 311 protrudes above the upper surface of the upper partition 41, and when the first heat sink 31 is pressed down and moved downward, the upper surface of the upper protrusion 311 is flush with the upper surface of the upper partition 41. Similarly, of course, when the mating connector is not inserted into the lower space 102, the lower surface of the lower protrusion 321 protrudes below the lower surface of the lower partition 41, and when the second heat dissipation part 32 is pushed up and moved upward, the lower surface of the lower protrusion 321 can be flush with the lower surface of the lower partition 42. This ensures that the first heat sink piece 31 and the second heat sink piece 32 have a proper positional relationship with respect to the upper spacer 41 and the lower spacer 42 during insertion and removal of the mating connector.

Referring to fig. 2, 3 and 6, the connector module 1 includes an insulating base 11, a plurality of conductive terminals (not labeled) fixed in the insulating base 11, the insulating base 11 is formed with an upper docking cavity 111 corresponding to the upper space 101, the insulating base 11 is formed with a lower docking cavity 112 corresponding to the lower space 102, the plurality of conductive terminals form two rows of upper terminal sets (not shown) and two rows of lower terminal sets (not shown), the two rows of upper row terminal sets are correspondingly combined with the upper part butt joint cavity 111, the two rows of lower row terminal sets are correspondingly combined with the lower part butt joint cavity 112, each conductive terminal is provided with a butt joint part (not numbered) which extends out of the insulating seat 11 and is used for butt joint with a butt joint circuit board, and along the vertical direction, the partition structure 4 and the heat dissipation module 3 are located between the upper docking chamber 111 and the lower docking chamber 112.

The novel heat dissipation connector in the present application is a high-speed connector, and in the specific embodiment, may be an SFP, SFP +, QSFP, or QSFP + connector, but is not limited thereto.

This application is through designing brand-new heat dissipation module 3 structure and with baffle structure 4, metal casing 2 and connector module 1's relative position relation for the whole better heat dispersion that has of novel heat dissipation connector of this application, and do benefit to miniaturized design.

Although the present application has been described in detail with reference to preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present application.

The above description is only a part of the embodiments of the present application, and not all embodiments, and any equivalent changes to the technical solutions of the present application, which are made by those skilled in the art through reading the present specification, are covered by the claims of the present application.

Claims (10)

1. The utility model provides a novel heat dissipation connector, locates connector module outlying metallic casing and heat dissipation module including connector module, cover, the metallic casing forms grafting space, its characterized in that jointly with the connector module: the heat dissipation module comprises a first heat dissipation part, a second heat dissipation part and a linkage part, the linkage part movably combines the first heat dissipation part and the second heat dissipation part along the vertical direction, the first heat dissipation part and the second heat dissipation part can move relatively along the vertical direction, and the linkage part has counter force to the relative approach of the first heat dissipation part and the second heat dissipation part.

2. The novel heat dissipating connector of claim 1, wherein: the partition structure comprises an upper partition and a lower partition which are opposite in the vertical direction and are arranged at intervals, the heat dissipation space is formed between the upper partition and the lower partition, an upper through hole is formed in the upper partition in a penetrating mode, the first heat dissipation part comprises an upper convex part, the upper convex part penetrates through the upper through hole and protrudes upwards to extend into the upper space, a lower through hole is formed in the lower partition in a penetrating mode, the second heat dissipation part comprises a lower convex part, and the lower convex part penetrates through the lower through hole and protrudes downwards to extend into the lower space.

3. The novel heat dissipating connector of claim 1 or 2, wherein: the linking piece includes a pressing member that is located between the first heat sink member and the second heat sink member and has the opposing force against the relative proximity of the first heat sink member and the second heat sink member.

4. The novel heat dissipating connector of claim 3, wherein: the pressure-applying member is a compression spring.

5. The novel heat dissipating connector of claim 4, wherein: the linkage piece comprises a shaft connecting piece, and the first heat dissipation part and the second heat dissipation part are limited by the shaft connecting piece along the up-down direction and can only mutually displace within a limited distance range.

6. The novel heat dissipating connector of claim 5, wherein: the first heat dissipation part, the pressure-applying component and the second heat dissipation part are arranged on the shaft connecting piece in a penetrating mode, and the first heat dissipation part and the second heat dissipation part are limited by the two ends of the shaft connecting piece respectively.

7. The novel heat dissipating connector of claim 6, wherein: the upper end of the linkage piece does not protrude into the upper space, and the lower end of the linkage piece does not protrude into the lower space.

8. The novel heat dissipating connector of claim 1 or 2, wherein: the heat sink comprises a first heat sink body and a second heat sink body, wherein the first heat sink body is arranged on the first side of the heat sink body, the second heat sink body is arranged on the second side of the heat sink body, and the first heat sink body and the second heat sink body are arranged in a same plane.

9. The novel heat dissipating connector of claim 7, wherein: the distance between two opposite protrusions is A, the length of the first heat dissipation part protruding upwards to the upper side of the partition structure is B, the length of the second heat dissipation part protruding downwards to the lower side of the partition structure is C, and A is larger than or equal to B plus C.

10. The novel heat dissipating connector of claim 1 or 2, wherein: the connector module comprises an insulating seat and a plurality of conductive terminals fixed in the insulating seat, an upper butt joint cavity is formed in the insulating seat corresponding to the upper space, a lower butt joint cavity is formed in the insulating seat corresponding to the lower space, the plurality of conductive terminals form two rows of upper row terminal sets and two rows of lower row terminal sets, the two rows of upper row terminal sets are correspondingly combined with the upper butt joint cavity, the two rows of lower row terminal sets are correspondingly combined with the lower butt joint cavity, each conductive terminal is provided with a butt joint part extending out of the insulating seat and used for being in butt joint with a butt joint circuit board, and the partition plate structure and the heat dissipation module are located between the upper butt joint cavity and the lower butt joint cavity along the vertical direction.

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