CN112556897A - Corrosion-resistant pressure sensor chip assembly structure and method - Google Patents
Corrosion-resistant pressure sensor chip assembly structure and method Download PDFInfo
- Publication number
- CN112556897A CN112556897A CN202011451618.1A CN202011451618A CN112556897A CN 112556897 A CN112556897 A CN 112556897A CN 202011451618 A CN202011451618 A CN 202011451618A CN 112556897 A CN112556897 A CN 112556897A
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- CN
- China
- Prior art keywords
- sensor chip
- ceramic substrate
- cover plate
- circuit board
- pressure sensor
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Links
- 230000007797 corrosion Effects 0.000 title claims abstract description 26
- 238000005260 corrosion Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000003292 glue Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
Abstract
The invention relates to the technical field of sensor chip assembly, and discloses a corrosion-resistant pressure sensor chip assembly structure and a method, which comprises a sensor chip, a ceramic substrate and a circuit board, wherein the sensor chip is fixed on the ceramic substrate, the ceramic substrate is provided with an air inlet hole in a fixing area of the sensor chip, the air inlet hole is communicated with the outside, the ceramic substrate is fixed on the circuit board, the circuit board is provided with a mounting hole, the sensor chip is arranged in the mounting hole, the periphery of the sensor chip is provided with a cover plate, the cover plate is provided with a through hole, in the actual use, the corrosion resistance of a product is enhanced by adopting the ceramic substrate as a fixing base of the sensor chip, in addition, an electronic element layer of a pressure sensor and a pressure sensing module are separately installed, and the ceramic structure at the bottom can prevent acid solution, and finally, the sensor chip is positioned in the mounting hole on the circuit board, so that the thickness of the whole pressure sensor is reduced, and the pressure sensor is easy to mount.
Description
Technical Field
The invention relates to the technical field of sensor chip assembly, in particular to a corrosion-resistant pressure sensor chip assembly structure and a method.
Background
At present, gauge pressure sensors on the market either fix a pressure detecting silicon chip on a PCB circuit board or fix it directly on a ceramic board. However, the former is liable to cause product failure due to the fact that the PCB is not corrosion-resistant; the latter is easily brittle-broken due to the fact that all ceramic plates are used, thereby reducing reliability and service life of the product. In addition, due to different application scenes, when the pressure sensor with the structure is applied to automobile pressure detection, the acid solution which is condensed and reflows enters the sensing layer of the sensor from the air inlet along with the pressure change, the sensing module of the doping layer on the silicon wafer is corroded, and the output voltage of the pressure sensor is unstable. In practical use, along with the increase of the use time, the output drift of the pressure sensor becomes more and more serious, even the product can completely fail, and the normal use of the pressure detection function is influenced.
In addition, the whole thickness of the pressure sensor with the structure is the sum of the thickness of the ceramic substrate, the thickness of the PCB circuit board and the thickness of the pressure sensing silicon chip, and the installation space required in actual installation is large, so that the application range of the pressure sensor is limited.
Disclosure of Invention
In view of the defects of the background art, the invention provides a corrosion-resistant pressure sensor chip assembly structure and a corrosion-resistant pressure sensor chip assembly method, and aims to solve the technical problems that when the existing pressure sensor is applied, corrosive substances enter a sensing layer of the pressure sensor, so that the output of the pressure sensor drifts, the normal use of the pressure sensor is influenced, in addition, the required installation space is large, and the use range is limited.
In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides a corrosion-resistant pressure sensor chip assembly structure, includes sensor chip, ceramic substrate and circuit board, and the sensor chip is fixed on ceramic substrate, and ceramic substrate has seted up the inlet port in sensor chip's fixed area, and inlet port and external intercommunication, ceramic substrate fix on the circuit board, have seted up the mounting hole on the circuit board, and the sensor chip is located inside the mounting hole, and sensor chip periphery is provided with the apron, has seted up the thru hole on the apron.
As a further technical scheme, the cover plate is arranged on one surface of the circuit board, which is far away from the ceramic substrate, and the cover plate covers the mounting hole.
The pin terminal of the sensor chip is electrically connected with the wiring terminal on the circuit board through a wire.
As a further technical scheme, the sensor chip is bonded on the ceramic substrate through glue.
As a further technical scheme, one side of the ceramic substrate for fixing the sensor chip is welded on the circuit board.
As a further technical proposal, a cover plate is positioned inside the mounting hole, the cover plate is arranged on the ceramic substrate, the sensor chip is positioned inside the cover plate,
the pin terminal of the sensor chip is electrically connected with the wiring terminal on the ceramic substrate through a wire.
A method of assembling a corrosion resistant pressure sensor die comprising the steps of:
s1: arranging a mounting hole on the circuit board, and welding the used electronic component on the circuit board;
s2: fixing a sensor chip on a ceramic substrate, and forming an air inlet in the area of the ceramic substrate for fixing the sensor chip;
s3: fixing the ceramic substrate on the circuit board, and positioning the sensor chip in the mounting hole;
s4: a cover plate is arranged on the periphery of the sensor chip, and through holes are formed in the cover plate.
As a further technical solution, in step S4, a cover plate is mounted on a side of the circuit board away from the ceramic substrate, and the cover plate covers the mounting hole.
As a further technical solution, in step S4, a cover plate is mounted on the ceramic substrate, the cover plate is located inside the mounting hole, and the sensor chip is located inside the cover plate.
Compared with the prior art, the invention has the beneficial effects that: the invention uses the ceramic base plate as the fixed base of the sensor chip to strengthen the corrosion resistance of the product, thereby prolonging the service life, secondly, the invention realizes the separation installation of the electronic element layer and the pressure sensing module of the pressure sensor by welding the electronic element interacted with the sensor chip on the circuit board and fixing the sensor chip on the ceramic base plate, and the ceramic structure at the bottom can prevent the acid solution from flowing back to the PCB circuit board to corrode the electronic element, thereby further improving the corrosion resistance of the product, and finally, the thickness of the whole pressure sensor is reduced because the sensor chip is positioned in the mounting hole on the circuit board, the mounting space needed in the actual application is small, the mounting is easy, and the application range is wide.
Drawings
The invention has the following drawings:
FIG. 1 is a schematic structural diagram of a circuit board in an embodiment;
FIG. 2 is a schematic view of a fixing structure of a ceramic substrate and a sensor chip in the embodiment;
FIG. 3 is a schematic view of a mounting structure of the circuit board, the ceramic substrate and the cover plate in the embodiment;
fig. 4 is a schematic view of another mounting structure of the circuit board, the ceramic substrate and the cover plate in the embodiment.
In the figure: 1. the sensor comprises a circuit board, 2, a ceramic substrate, 3, a sensor chip, 4, glue, 5, a cover plate, 6, a lead, 10, a mounting hole, 11, an electronic component, 12, a wiring terminal on the circuit board, 20, an air inlet hole, 50 and a through hole.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1 to 4, a corrosion-resistant pressure sensor chip assembly structure includes a sensor chip 3, a ceramic substrate 2 and a circuit board 1, the sensor chip 3 is fixed on the ceramic substrate 2, the ceramic substrate 2 is provided with an air inlet 20 at a fixing area of the sensor chip 1, the air inlet 20 is communicated with the outside, the ceramic substrate 2 is fixed on the circuit board 1, the circuit board 1 is provided with a mounting hole 10, the sensor chip 1 is located inside the mounting hole, a cover plate 5 is provided at the periphery of the sensor chip 1, and the cover plate 5 is provided with a through hole 50.
Referring to fig. 3, in an alternative embodiment, the cover plate 5 is mounted on a surface of the circuit board 1 facing away from the ceramic substrate 2, and the cover plate 5 covers the mounting hole 10.
When the cover plate 5 is mounted on the circuit board 1, if the sensor chip 3 is to be interacted, the pin terminals of the sensor chip 3 can be electrically connected with the connection terminals 12 on the circuit board through the wires 6, and the connection terminals 12 on the circuit board are electrically connected with the pin terminals corresponding to the electronic components 11.
Referring to fig. 4, in an alternative embodiment, the cover plate 5 is located inside the mounting hole 10, the cover plate 10 is mounted on the ceramic substrate 2, and the sensor chip 3 is located inside the cover plate 5.
When the cover plate 5 is mounted on the ceramic substrate 2, if the sensor chip 3 is to be interacted, the pin terminal of the sensor chip 3 can be electrically connected with the connection terminal on the ceramic substrate 2 through the wire 6, and the connection terminal on the ceramic substrate 2 is electrically connected with the pin terminal corresponding to the electronic component 11.
Referring to fig. 3 and 4, in the present embodiment, the sensor chip 3 is optionally bonded to the ceramic substrate 2 by glue 4.
Optionally, in this embodiment, one surface of the ceramic substrate 2, on which the sensor chip 3 is fixed, is soldered on the circuit board 1.
A method of assembling a corrosion resistant pressure sensor die comprising the steps of:
s1: arranging a mounting hole 10 on the circuit board 1, and welding the used electronic component 11 on the circuit board 1;
s2: fixing a sensor chip 3 on a ceramic substrate 1, and forming an air inlet 20 in the area of the ceramic substrate 2 for fixing the sensor chip 3;
s3: fixing the ceramic substrate 2 on the circuit board 1, and positioning the sensor chip 3 in the mounting hole 10;
s4: a cover plate 5 is provided on the periphery of the sensor chip 3, and a through hole 50 is provided in the cover plate 5.
Alternatively, in step S4, the cover plate 5 is mounted on the side of the circuit board 1 away from the ceramic substrate 2, and the cover plate 5 covers the mounting hole 10.
Alternatively, in step S4, the cover 5 is mounted on the ceramic substrate 2, the cover 5 is located inside the mounting hole 10, and the sensor chip 3 is located inside the cover 5.
In summary, in practical use, the present invention has the following improvements: firstly, the ceramic substrate 2 is used as a fixed base of the sensor chip 3, so that the corrosion resistance of the product is enhanced, and the service life is prolonged; secondly, the electronic component 11 interacting with the sensor chip 3 is welded on the circuit board 1, and the sensor chip 3 is fixed on the ceramic substrate 2, so that the electronic component layer and the pressure sensing module of the pressure sensor are separately installed, and the ceramic structure at the bottom can prevent an acid solution from flowing back to the PCB circuit board 1 to corrode the electronic component, thereby further improving the corrosion resistance of the product; finally, the sensor chip 3 is positioned in the mounting hole 10 on the circuit board 1, so that the thickness of the whole pressure sensor is reduced, the mounting space required in practical application is small, the mounting is easy, and the application range is wide.
In light of the foregoing, it is to be understood that various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The utility model provides a corrosion-resistant pressure sensor chip assembly structure which characterized in that: the sensor chip is fixed on the ceramic substrate, an air inlet hole is formed in the fixing area of the sensor chip on the ceramic substrate, the air inlet hole is communicated with the outside, the ceramic substrate is fixed on the circuit board, a mounting hole is formed in the circuit board, the sensor chip is located inside the mounting hole, a cover plate is arranged on the periphery of the sensor chip, and a through hole is formed in the cover plate.
2. A corrosion-resistant pressure sensor die attach structure according to claim 1, wherein: the cover plate is arranged on one surface of the circuit board, which deviates from the ceramic substrate, and the cover plate covers the mounting hole.
3. A corrosion-resistant pressure sensor die attach structure according to claim 1 or 2, wherein: and the pin terminal of the sensor chip is electrically connected with the wiring terminal on the circuit board through a wire.
4. A corrosion-resistant pressure sensor die attach structure according to claim 1, wherein: the cover plate is located inside the mounting hole, the cover plate is mounted on the ceramic substrate, and the sensor chip is located inside the cover plate.
5. A corrosion-resistant pressure sensor die attach structure according to claim 1 or 4, wherein: and the pin terminal of the sensor chip is electrically connected with the wiring terminal on the ceramic substrate through a wire.
6. A corrosion-resistant pressure sensor die attach structure according to claim 1, wherein: the sensor chip is bonded on the ceramic substrate through glue.
7. A corrosion-resistant pressure sensor die attach structure according to claim 1, wherein: and one surface of the ceramic substrate for fixing the sensor chip is welded on the circuit board.
8. A method of assembling a corrosion resistant pressure sensor die comprising the steps of: s1: arranging a mounting hole on the circuit board, and welding the used electronic component on the circuit board; s2: fixing a sensor chip on a ceramic substrate, and forming an air inlet in the area of the ceramic substrate for fixing the sensor chip; s3: fixing the ceramic substrate on the circuit board, and positioning the sensor chip in the mounting hole; s4: a cover plate is arranged on the periphery of the sensor chip, and through holes are formed in the cover plate.
9. The method of assembling a corrosion resistant pressure sensor die of claim 8, wherein: in step S4, the cover plate is mounted on a surface of the circuit board facing away from the ceramic substrate, and the cover plate covers the mounting hole.
10. The method of assembling a corrosion resistant pressure sensor die of claim 8, wherein: in step S4, the cover plate is mounted on the ceramic substrate, the cover plate is located inside the mounting hole, and the sensor chip is located inside the cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011451618.1A CN112556897A (en) | 2020-12-10 | 2020-12-10 | Corrosion-resistant pressure sensor chip assembly structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011451618.1A CN112556897A (en) | 2020-12-10 | 2020-12-10 | Corrosion-resistant pressure sensor chip assembly structure and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112556897A true CN112556897A (en) | 2021-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011451618.1A Pending CN112556897A (en) | 2020-12-10 | 2020-12-10 | Corrosion-resistant pressure sensor chip assembly structure and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112556897A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113526455A (en) * | 2021-07-17 | 2021-10-22 | 安徽芯动联科微系统股份有限公司 | Packaging structure of MEMS pressure sensor |
-
2020
- 2020-12-10 CN CN202011451618.1A patent/CN112556897A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113526455A (en) * | 2021-07-17 | 2021-10-22 | 安徽芯动联科微系统股份有限公司 | Packaging structure of MEMS pressure sensor |
| CN113526455B (en) * | 2021-07-17 | 2023-08-22 | 安徽芯动联科微系统股份有限公司 | Packaging structure of MEMS pressure sensor |
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