CN112556596B - Three-dimensional deformation measurement system, method, device and storage medium - Google Patents
Three-dimensional deformation measurement system, method, device and storage medium Download PDFInfo
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- CN112556596B CN112556596B CN202011424019.0A CN202011424019A CN112556596B CN 112556596 B CN112556596 B CN 112556596B CN 202011424019 A CN202011424019 A CN 202011424019A CN 112556596 B CN112556596 B CN 112556596B
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
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Abstract
The embodiment of the application provides a three-dimensional deformation measurement system, a method, a device and a storage medium, wherein the three-dimensional deformation measurement system comprises: the high-resolution camera is used for acquiring a first global image of the object to be measured before deformation and a second global image of the object to be measured after deformation; the telescopic camera is used for acquiring a first local diagram of the object to be measured, which contains preset measuring points, before deformation and a second local diagram of the object to be measured, which contains the measuring points, after deformation; the laser range finder is used for acquiring first depth information of a measuring point before the object to be measured is deformed and second depth information of the measuring point after the object to be measured is deformed; and the processor is used for acquiring the three-dimensional deformation information of the measuring point according to the first global image, the first local image, the second global image, the second local image, the first depth information and the second depth information. By adopting the embodiment of the application, the rapid measurement of the three-dimensional deformation information can be realized while the measurement cost is reduced.
Description
Technical Field
The present invention relates to the field of measurement device technology, and more particularly, to a three-dimensional deformation measurement system, method, device and storage medium based on three-dimensional image laser.
Background
The method has great requirements for three-dimensional deformation measurement of large structures such as bridges, tunnels, dams, stadium domes and the like, and the measurement of the method has great significance for stress analysis based on multi-dimensional deformation of the structures, state monitoring, service life prediction, accident analysis and the like of the structures. Three-dimensional deformation measuring instruments commonly used in the industry currently include laser radars, automatic total stations, total station scanners, and the like.
The laser radar can acquire three-dimensional point cloud information, so that the overall deformation of the structure is acquired. However, since the point cloud information cannot bind the measurement points, the laser radar cannot acquire the deformation information of a certain measurement point.
And automatic instruments such as total stations and total station scanners scan in both pitch and yaw directions by using a precision turntable with an absolute position. Although monitoring the change in distance of a measurement point in a certain direction can be achieved, the deformation of the measurement point in the plane cannot be determined. Meanwhile, for large-scale long-distance measurement, instruments such as an automatic total station instrument, a total station scanner and the like all need an ultra-high precision turntable, and the turntable is often expensive and needs to be adjusted regularly.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a three-dimensional deformation measurement system, method, apparatus and storage medium, which can reduce the measurement cost and simultaneously realize the rapid measurement of three-dimensional deformation information.
According to a first aspect of the present invention, an embodiment of the present invention provides a three-dimensional deformation measurement system, including:
the high-resolution camera is used for acquiring a first global image of the object to be measured before deformation and a second global image of the object to be measured after deformation;
the telescopic camera is used for acquiring a first local diagram of the object to be measured, which contains preset measuring points, before deformation and a second local diagram of the object to be measured, which contains the measuring points, after deformation;
the laser range finder is used for acquiring first depth information of a measuring point before the object to be measured is deformed and second depth information of the measuring point after the object to be measured is deformed;
and the processor is used for acquiring the three-dimensional deformation information of the measuring point according to the first global image, the first local image, the second global image, the second local image, the first depth information and the second depth information.
In some embodiments of the invention, in obtaining three-dimensional deformation information of the measurement point according to the first global map, the first local map, the second global map, the second local map, the first depth information, and the second depth information, the processor is specifically configured to:
acquiring first in-plane pixel coordinates of the measuring points according to the first global image and the first local image, and acquiring second in-plane pixel coordinates of the measuring points according to the second global image and the second local image;
and acquiring three-dimensional deformation information of the measuring point according to the pixel coordinate in the first surface, the pixel coordinate in the second surface, the first depth information and the second depth information.
In some embodiments of the invention, the processor is further configured to:
setting a global control point;
in an aspect of obtaining the coordinates of the pixels in the first plane of the measurement point according to the first global map and the first local map, the processor is specifically configured to:
acquiring the first in-plane pixel coordinates of the measuring points according to the first global image, the first local image and the global control points;
in obtaining second in-plane pixel coordinates of the measurement points from the second global map and the second local map, the processor is specifically configured to:
and acquiring the second in-plane pixel coordinates of the measuring points according to the second global image, the second local image and the global control points.
In some embodiments of the invention, the processor is further configured to:
obtaining angle information of the three-dimensional deformation measurement system according to the first global map and the first local map, or
Acquiring angle information of the three-dimensional deformation measurement system according to the second global image and the second local image;
and acquiring the path information of the previous measuring point and the next measuring point according to the angle information.
In some embodiments of the present invention, the three-dimensional deformation measurement system further comprises:
and the theodolite is used for bearing the telescopic camera and the laser range finder and driving the telescopic camera and the laser range finder to rotate in the pitching and yawing directions.
In some embodiments of the invention, the laser equivalent point of transmission of the laser rangefinder is provided at the intersection of the rotational axes of the pitch and yaw directions of the theodolite.
In some embodiments of the invention, the telescopic camera is arranged coaxially with the laser rangefinder.
According to a second aspect of the present invention, an embodiment of the present invention provides a three-dimensional deformation measurement method, including:
acquiring a first global picture of an object to be measured before deformation and a second global picture of the object to be measured after deformation;
acquiring a first local graph containing preset measuring points of an object to be measured before deformation and a second local graph containing the measuring points of the object to be measured after deformation;
acquiring first depth information of a measuring point before the object to be measured deforms and second depth information of the measuring point after the object to be measured deforms;
and acquiring three-dimensional deformation information of the measuring points according to the first global image, the first local image, the second global image, the second local image, the first depth information and the second depth information.
In some embodiments of the present invention, acquiring three-dimensional deformation information of a measurement point from a first global map, a first local map, a second global map, a second local map, first depth information, and second depth information includes:
acquiring a first in-plane pixel coordinate of the measuring point according to the first global image and the first local image, and acquiring a second in-plane pixel coordinate of the measuring point according to the second global image and the second local image;
and acquiring three-dimensional deformation information of the measuring point according to the pixel coordinate in the first surface, the pixel coordinate in the second surface, the first depth information and the second depth information.
In some embodiments of the present invention, the three-dimensional deformation measurement method, in which a first global map of an object to be measured before deformation and a second global map of the object to be measured after deformation are acquired, further includes:
setting a global control point;
obtaining the first in-plane pixel coordinates of the measurement point according to the first global map and the first local map comprises:
acquiring the first in-plane pixel coordinates of the measuring point according to the first global image, the first local image and the global control point;
acquiring the second in-plane pixel coordinates of the measurement point according to the second global map and the second local map comprises:
and acquiring the second in-plane pixel coordinates of the measuring points according to the second global image, the second local image and the global control points.
In some embodiments of the present invention, the deformation measuring method further comprises:
obtaining angle information of the three-dimensional deformation measurement system according to the first global map and the first local map, or
Acquiring angle information of the three-dimensional deformation measurement system according to the second global image and the second local image;
and acquiring the path information of the previous measuring point to the next measuring point according to the angle information.
According to a third aspect of the present invention, embodiments of the present invention further provide a three-dimensional deformation measurement apparatus, including a memory for storing computer-readable instructions and a processor for executing the computer-readable instructions to implement the method of any one of the foregoing embodiments.
According to a fourth aspect of the present invention, the embodiment of the present invention further provides a computer storage medium, which stores a computer program, and the computer program realizes the method of any one of the foregoing embodiments when executed by a processor.
The invention adopts an image registration scheme between a global image and a local image and is matched with laser ranging, thereby realizing the rapid measurement of in-plane deformation in image registration. Specifically, after the measuring points are quickly locked by image registration, the distance of the measuring points is measured by synchronously adopting laser ranging, and then the deformation of the measuring points in the distance direction is obtained. From this, the deformation measurement system that this application provided need not high accuracy rotating system, also need not to carry out the timing to rotating system and can carry out accurate three-dimensional deformation measurement, has advantages such as easy operation, maintenance convenience and low cost.
Drawings
FIG. 1 is a block diagram of a three-dimensional deformation measurement system according to one embodiment of the invention;
FIG. 2 is a diagram of an application scenario of a three-dimensional deformation measurement system according to an embodiment of the present invention;
FIG. 3 is a schematic view of the three-dimensional deformation measurement system of FIG. 2;
FIG. 4 is a schematic diagram of the laser coaxial telescope camera of FIG. 3;
FIG. 5 is a schematic diagram of the operation of a three-dimensional deformation measurement system according to one embodiment of the invention before deformation of the object to be measured;
FIG. 6 is a schematic diagram of the operation of a three-dimensional deformation measurement system after deformation of an object to be measured according to one embodiment of the invention;
FIG. 7 is a schematic flow diagram of a three-dimensional deformation measurement method according to one embodiment of the invention;
fig. 8 is a flowchart of process 103 of fig. 7.
Detailed Description
Various aspects of the invention are described in detail below with reference to the figures and the detailed description. Well-known modules, units and their interconnections, links, communications or operations with each other are not shown or described in detail. Furthermore, the described features, architectures, or functions can be combined in any manner in one or more implementations. It will be understood by those skilled in the art that the various embodiments described below are illustrative only and are not intended to limit the scope of the present invention. It will also be readily understood that the modules or units or processes of the embodiments described herein and illustrated in the figures can be combined and designed in a wide variety of different configurations.
One embodiment of the present invention provides a three-dimensional deformation measurement system 1, as shown in fig. 1, and in the embodiment of the present invention, the three-dimensional deformation measurement system 1 includes:
the high-resolution camera 11 is used for acquiring a first global image of the object to be measured before deformation and a second global image of the object to be measured after deformation;
a telescopic camera 12 for acquiring a first partial view of the object to be measured containing a preset measuring point before deformation and a second partial view of the object to be measured containing the measuring point after deformation;
the laser range finder 13 is used for acquiring first depth information of the measuring point before the object to be measured deforms and second depth information of the measuring point after the object to be measured deforms;
and the processor 14 is used for acquiring the three-dimensional deformation information of the measuring point according to the first global map, the first local map, the second global map, the second local map, the first depth information and the second depth information.
The high-resolution camera 11 may be a camera capable of acquiring a large-size image, and based on this, the three-dimensional deformation measurement system 1 may be applied to scenes such as large projects and large structures with shooting objects having distances of hundreds of meters and breadth of hundreds of meters.
In this embodiment, in terms of obtaining three-dimensional deformation information of the measurement point according to the first global map, the first local map, the second global map, the second local map, the first depth information, and the second depth information, the processor 14 is specifically configured to:
and acquiring the first in-plane pixel coordinates of the measuring points according to the first global map and the first local map, and acquiring the second in-plane pixel coordinates of the measuring points according to the second global map and the second local map. In the present embodiment, the in-plane pixel coordinates refer to pixel coordinates of the measurement point in the acquired global map, and are used to describe position information of the measurement point.
Specifically, in the present embodiment, an image registration method may be adopted, that is, a local map including the measurement point is captured by the telescopic camera 12, and the local map is matched with the global map captured by the high-resolution camera 11, so as to lock the measurement point, and then the in-plane pixel coordinate of the measurement point is acquired.
Based on this, the processor 14 may acquire three-dimensional deformation information of the measurement point from the first in-plane pixel coordinates, the second in-plane pixel coordinates, the first depth information, and the second depth information.
Meanwhile, in order to ensure that the global pixel coordinate of each position including the measuring point in the object to be measured is uniquely determined, the subsequent processing is simplified. In this embodiment, the processor 14 is also used to set global control points. Specifically, before the whole measurement process, 1 stable object can be selected from the object to be measured, that is, the object does not change with the change of the engineering structure, and the position of a reference point which can be used as the change of the engineering structure is used as a global control point, so that a coordinate system is established based on the global control point, and the uniqueness of the global pixel coordinate of each position is ensured.
Based on this, in obtaining the first in-plane pixel coordinates of the measurement points from the first global map and the first local map, the processor 14 is specifically configured to: acquiring the first in-plane pixel coordinates of the measuring points according to the first global image, the first local image and the global control points; in obtaining the second in-plane pixel coordinates of the measurement points from the second global map and the second local map, the processor 14 is specifically configured to: and acquiring the second in-plane pixel coordinates of the measuring points according to the second global image, the second local image and the global control points. Thus, uniqueness of the pixel coordinates within the first surface and the pixel coordinates within the second surface can be ensured.
In addition, in the present embodiment, the processor 14 is further configured to obtain angle information of the surveying instrument according to the first global map and the first local map, or obtain angle information of the three-dimensional deformation system 1 according to the second global map and the second local map, so as to obtain path information to a next surveying point according to the angle information. Therefore, the running path of the three-dimensional deformation system 1 is optimized, and the dependence on a high-precision rotary table is eliminated while time is saved.
In view of this, in the present embodiment, a theodolite is used as a carrier for moving the surveying instrument. Specifically, the three-dimensional deformation measurement system 1 further includes a theodolite 15 for carrying the telescopic camera 12 and the laser range finder 13 and driving the telescopic camera 12 and the laser range finder 13 to rotate in the pitch and yaw directions.
Further, in order to ensure that the depth information measured by the laser range finder 13 has a clear relationship with the obtained in-plane pixel coordinates, in the present embodiment, the laser equivalent emitting point of the laser range finder 13 is provided at the intersection of the rotation axes in the pitch and yaw directions of the theodolite 15, and the telescopic camera 12 and the laser range finder 13 are coaxially provided. Specifically, through the above arrangement, it is ensured that the depth information measured by the laser range finder 13 is naturally and tightly coupled with the in-plane pixel coordinates, and therefore, the situation that other data processing is required to be performed after the depth information and the in-plane pixel coordinates are obtained so that the depth information and the in-plane pixel coordinates are associated with each other is avoided, and a new calibration error is generated between the depth information and the in-plane pixel coordinates due to the introduction of other data processing methods. In other words, the measurement accuracy of the three-dimensional deformation measurement system provided by the present embodiment can be improved by adopting the above structure.
Therefore, the invention adopts an image registration scheme between the global image and the local image and is matched with laser ranging, thereby realizing the rapid measurement of in-plane deformation in image registration. Specifically, after the measuring points are locked quickly by adopting image registration, the distance of the measuring points is measured by synchronously adopting laser ranging, and then the deformation of the measuring points in the distance direction is obtained. From this, the deformation measurement system that this application provided need not high accuracy rotating system, also need not to carry out the timing to rotating system and can carry out accurate three-dimensional deformation measurement, has advantages such as easy operation, maintenance convenience and low cost.
Hereinafter, the three-dimensional deformation measurement system 1 according to the present invention will be described with reference to specific examples.
As shown in fig. 2 and fig. 3, in the present embodiment, the three-dimensional deformation measurement system 1 can be applied to scenes which are distant from the shooting object by hundreds of meters, have a width of hundreds of meters, and belong to large projects and large structures. Specifically, the three-dimensional deformation measurement system 1 includes a high-resolution camera 11 (not shown), a laser coaxial telescopic camera 16, a processor 14 (not shown), and a theodolite 15.
As shown in fig. 3, in the present embodiment, the theodolite 15 is used for carrying the laser coaxial telescope camera 16, and can drive the laser coaxial telescope camera 16 to rotate around a rotation axis a-a 'in the pitch direction and a rotation axis B-B' in the yaw direction.
In this embodiment, the laser coaxial telescopic camera 16 may include a telescopic camera 12 and a laser range finder 13, as shown in fig. 4, the telescopic camera 12 may include an imaging lens 121 and an imager 122, and the laser range finder 13 may include an optical fiber 131, an optical fiber connection port 132 disposed on a side wall of the telescopic camera 12, and a spectroscope 133 disposed inside the telescopic camera 12 and between the imaging lens 121 and the imager 122.
The optical fiber connection port 132 can emit laser light into the telescope camera 12, and the laser light is reflected by the spectroscope 133 and emitted from the imaging lens 121. Meanwhile, in order to ensure that the telescopic camera 12 and the laser range finder 13 are coaxially arranged, in the present embodiment, the equivalent laser emitting point of the laser range finder 13 is located at the intersection point G of the rotation axis a-a 'in the pitch direction and the rotation axis B-B' in the yaw direction of the theodolite 15.
The operation of the three-dimensional deformation measurement system 1 provided in the present embodiment will be described below with reference to fig. 5 and 6.
In this embodiment, as shown in fig. 5, first, at least 1 global control point is determined in the object to be measured, which is denoted as P0, and coordinates are established based on the global control point P0, and the coordinates are set to (x0, y 0). The high resolution camera 11 is enabled to capture a global map of the current state of the object to be measured, denoted as F0, the higher the resolution of which the better. Starting the telescopic camera 12, randomly shooting a local image of an object to be measured, registering the local image with the global image F0, determining the current angle information of the telescopic camera 12, and determining the path information of shooting to the first measuring point according to the angle information.
In the present embodiment, several measurement points are set in advance on the object to be measured, for example, 100 measurement points are assumed to be set, and are denoted as Pn (n is 1,2,3 … 100). When the telescopic camera 12 reaches the shooting position of the measurement point Pn under the driving of the theodolite 15, the telescopic camera 12 is started to shoot a local map Fn including the measurement point Pn. Preferably, the measurement point Pn is ensured to be located at the center of the partial map Fn at the time of photographing.
In general, the resolution of the local map captured by the telescopic camera 12 is often higher than the resolution of the global map captured by the high-resolution camera 11, and therefore, the accuracy of determining the in-plane pixel coordinates of the measurement point in the global map can be improved by the local map having a higher resolution.
Based on this, by matching the local map Fn with the global map F0, the in-plane pixel coordinates (xn, yn) of the measurement point Pn can be determined based on the coordinates established therein by the global control point P0. Meanwhile, the laser range finder is started to obtain the depth information zn of the measurement point Pn.
In this embodiment, the laser range finder can adopt the broad spectrum laser ranging of higher accuracy, and therefore, the measurement accuracy of the depth information is improved by 6-7 orders of magnitude compared with the existing laser ranging accuracy.
After one point is measured, the current angle information of the current telescopic camera 12 can be determined according to the registration information of the current local map Fn and the global map F0, and the path information to the next measurement point for shooting can be determined according to the angle information.
After the deformation of the object to be measured is completed, as shown in fig. 6, the high resolution camera 11 is started again, and a deformed global image of the object to be measured is captured and marked as F' 0. And precisely matching the global map F '0 with the global control point P0 of the global map F0, and giving the transformed global map F' 0 the same coordinates as those of the global map F0. Starting the telescopic camera 12, randomly shooting a local image of an object to be measured, registering the local image with the global image F' 0, determining the current angle information of the telescopic camera 12, and determining the path information of shooting to the first measuring point according to the angle information.
In the present embodiment, when the telescopic camera 12 reaches the shooting position of the measurement point Pn under the driving of the theodolite 15, the telescopic camera 12 is activated to shoot the deformed local map F' n including the measurement point Pn. Preferably, the measurement point Pn is guaranteed to be located at the center of the partial map F' n at the time of photographing.
By matching the local map F 'n with the global map F' 0, the in-plane pixel coordinates (x 'n, y' n) of the measurement point Pn after the deformation of the object to be measured can be determined based on the coordinates established therein by the global control point P0. Meanwhile, the laser range finder is started to acquire depth information z' n of the measurement point Pn after the object to be measured deforms.
After a point is measured, the current angle information of the current telescopic camera 12 can be determined according to the registration information of the current local image F 'n and the global image F' 0, and the path information for going to the next measurement point for shooting can be determined according to the angle information.
Based on this, three-dimensional deformation information δ Xn (x ' n-Xn), δ Yn (y ' n-Yn), and δ Zn (z ' n-Zn) of the measurement point Pn can be obtained.
Fig. 7 is a schematic flow diagram of a three-dimensional deformation measurement method according to an embodiment of the present invention, and referring to fig. 7, the method includes:
100: acquiring a first global graph of an object to be measured before deformation and a second global graph of the object to be measured after deformation;
101: acquiring a first local graph containing preset measuring points of an object to be measured before deformation and a second local graph containing the measuring points of the object to be measured after deformation;
102: acquiring first depth information of a measuring point before the object to be measured deforms and second depth information of the measuring point after the object to be measured deforms;
103: and acquiring the three-dimensional deformation information of the measuring point according to the first global picture, the first local picture, the second global picture, the second local picture, the first depth information and the second depth information.
In this embodiment, an implementation of the process 103 is presented, as shown in fig. 8, comprising:
104: acquiring the coordinates of pixels in the first surface of the measuring points according to the first global image and the first local image;
105: acquiring the second in-plane pixel coordinates of the measuring points according to the second global image and the second local image;
106: and acquiring three-dimensional deformation information of the measuring point according to the pixel coordinate in the first surface, the pixel coordinate in the second surface, the first depth information and the second depth information.
In order to ensure that the global pixel coordinates of each position of the object to be measured, including the measurement point, are uniquely determined, subsequent processing is simplified. In this embodiment, prior to process 100, the method further comprises: and setting a global control point.
Based on this, process 104 may be implemented as follows:
and acquiring the first in-plane pixel coordinates of the measuring points according to the first global map, the first local map and the global control points.
The process 105 may be implemented as follows:
and acquiring the second in-plane pixel coordinates of the measuring points according to the second global image, the second local image and the global control points.
Meanwhile, in order to optimize the running path of the three-dimensional deformation system, the dependence on a high-precision rotary table is eliminated while the time is saved. In this embodiment, the method further comprises: and acquiring the angle information of the three-dimensional deformation system according to the first global image and the first local image, or acquiring the angle information of the three-dimensional deformation system according to the second global image and the second local image. And acquiring path information going to the next measuring point according to the angle information.
Through the above description of the embodiments, those skilled in the art will clearly understand that the present invention may be implemented by combining software and a hardware platform. Based on such understanding, all or part of the technical solutions of the present invention, which contribute to the background art, can be embodied in the form of a software product, which can be stored in a storage medium, such as a ROM/RAM, a magnetic disk, an optical disk, etc., and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the method according to the embodiments or some parts of the embodiments of the present invention.
Therefore, the embodiment of the present invention further provides a computer storage medium storing a computer program for implementing the three-dimensional deformation measuring method provided in the foregoing embodiment or implementation manner of the present invention when executed. For example, the storage medium may include a hard disk, a floppy disk, an optical disk, a magnetic tape, a magnetic disk, a flash memory, and the like.
The embodiment of the invention also provides a three-dimensional deformation measuring device, which comprises a memory, a measuring module and a control module, wherein the memory is used for storing computer readable instructions; and the processor is used for executing the computer readable instructions so as to realize the three-dimensional deformation measuring method provided by the previous embodiment or the implementation mode of the invention. Optionally, in an implementation manner of the embodiment of the present invention, the apparatus may further include an input/output interface for data communication. For example, the apparatus may be a computer, a smart terminal, a server, or the like.
The particular embodiments disclosed herein are illustrative only and should not be taken as limitations upon the scope of the invention, which is to be accorded the full scope consistent with the claims, as defined in the appended claims. Accordingly, the particular illustrative embodiments disclosed above are susceptible to various substitutions, combinations or modifications, all of which are within the scope of the disclosure.
Claims (8)
1. A three-dimensional deformation measurement system, characterized in that it comprises:
the high-resolution camera is used for acquiring a first global image of an object to be measured before deformation and a second global image of the object to be measured after deformation;
the telescopic camera is used for acquiring a first local diagram of the object to be measured, which contains preset measuring points, before deformation and a second local diagram of the object to be measured, which contains the measuring points, after deformation;
the laser range finder is used for acquiring first depth information of the measuring point before the object to be measured deforms and second depth information of the measuring point after the object to be measured deforms;
and the processor is used for setting a global control point, acquiring a first in-plane pixel coordinate of the measuring point according to the first global map, the first local map and the global control point, acquiring a second in-plane pixel coordinate of the measuring point according to the second global map, the second local map and the global control point, and acquiring three-dimensional deformation information of the measuring point according to the first in-plane pixel coordinate, the second in-plane pixel coordinate, the first depth information and the second depth information.
2. The three-dimensional deformation measurement system of claim 1, wherein the processor is further configured to:
obtaining angle information of the three-dimensional deformation measurement system according to the first global map and the first local map, or
Acquiring angle information of the three-dimensional deformation measurement system according to the second global image and the second local image;
and acquiring the path information of the previous measuring point and the next measuring point according to the angle information.
3. The three-dimensional deformation measurement system of claim 1, further comprising:
and the theodolite is used for bearing the telescope camera and the laser range finder and driving the telescope camera and the laser range finder to rotate in the pitching and yawing directions.
4. The three-dimensional deformation measurement system of claim 3,
the laser equivalent emitting point of the laser range finder is arranged at the intersection point of the rotation axes of the pitching and yawing directions of the theodolite.
5. The three-dimensional deformation measurement system according to any one of claims 1 to 4,
the telescopic camera and the laser range finder are coaxially arranged.
6. A three-dimensional deformation measurement method, characterized in that the deformation measurement method comprises:
acquiring a first global graph of an object to be measured before deformation and a second global graph of the object to be measured after deformation;
acquiring a first local diagram containing preset measuring points of the object to be measured before deformation and a second local diagram containing the measuring points of the object to be measured after deformation;
acquiring first depth information of the measuring point before the object to be measured is deformed and second depth information of the measuring point after the object to be measured is deformed;
setting a global control point;
acquiring a first in-plane pixel coordinate of the measuring point according to the first global map, the first local map and the global control point;
acquiring second in-plane pixel coordinates of the measuring points according to the second global image, the second local image and the global control points;
and acquiring three-dimensional deformation information of the measuring point according to the first in-plane pixel coordinate, the second in-plane pixel coordinate, the first depth information and the second depth information.
7. A three-dimensional deformation measuring device comprising a memory and a processor,
the memory is to store computer readable instructions;
the processor is configured to execute the computer-readable instructions to implement the method of claim 6.
8. A readable computer storage medium storing a computer program, characterized in that the computer program, when executed by a processor, implements the method of claim 6.
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| DE102006051538B4 (en) * | 2006-10-27 | 2009-04-09 | Schott Ag | Method and device for determining the waviness of glass panes |
| CN105716542B (en) * | 2016-04-07 | 2018-04-10 | 大连理工大学 | A kind of three-dimensional data joining method based on flexible characteristic point |
| CN109141266B (en) * | 2018-07-19 | 2020-10-16 | 北京建筑大学 | Steel structure measuring method and system |
| CN109146959A (en) * | 2018-08-29 | 2019-01-04 | 华南农业大学 | Monocular camera realizes dynamic point method for three-dimensional measurement |
| CN110065074B (en) * | 2019-05-29 | 2021-02-12 | 北京禾泽方圆智能科技有限公司 | Visual servo laser positioning system and method for picking robot |
| CN111754573B (en) * | 2020-05-19 | 2024-05-10 | 新拓三维技术(深圳)有限公司 | Scanning method and system |
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