CN112543555A

CN112543555A - Baking device for manufacturing system-level integrated circuit and using method thereof

Info

Publication number: CN112543555A
Application number: CN202011410684.4A
Authority: CN
Inventors: 王唐浩
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-12-04
Filing date: 2020-12-04
Publication date: 2021-03-23

Abstract

The invention discloses a baking device for manufacturing a system-level integrated circuit and a using method thereof, wherein the baking device comprises a baking oven body, wherein a drying mechanism is fixedly arranged at the top of the baking oven body; this scheme, can pass through the clamp plate, the slide bar, flexible post, the pushing down mechanism that the movable block constitutes pushes down the integrated circuit board of putting, avoid the situation that integrated circuit board emptys, integrated circuit board's stability has been improved, simultaneously when can will toast through dry mechanism, the moisture suction that evaporates from integrated circuit board to dry mechanism's inner chamber, after dry with moisture through the dry cotton filling block of anhydrous calcium chloride, send into the inner chamber of toasting the case body again, accomplish the drying, the moisture after having avoided toasting is saved in the situation of box inner chamber, through cooling body, can inhale the cold air in the external environment, filter the inner chamber of trading and drying the back and blowing in the box to the cold air, thereby integrated circuit board's cooling with higher speed.

Description

Baking device for manufacturing system-level integrated circuit and using method thereof

Technical Field

The invention relates to the technical field of integrated circuit board manufacturing, in particular to a baking device for manufacturing a system-level integrated circuit and a using method thereof.

Background

An integrated circuit board is a carrier on which an integrated circuit is mounted. But often the integrated circuit board is also brought on. The integrated circuit board is mainly made of silica gel, so the integrated circuit board is generally green. The integrated circuit board is made by using semiconductor manufacturing process, and many transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, and the components are combined into a complete electronic circuit by multilayer wiring or tunnel wiring. It is represented in the circuit by the letter "IC" (there is also the literal symbol "N", etc.)

The baking can eliminate the internal stress of the PCB, namely stabilize the size of the PCB. The baked board has a large improvement in warpage. The baking has the advantages that: after baking, the moisture in the bonding pad can be dried, the welding effect is enhanced, and the insufficient soldering rate, the repairing rate and the like are reduced. The disadvantages of baking are: the color of the PCB may change, which affects the appearance.

Integrated circuit board need use baking equipment to toast integrated circuit board in process of production, however traditional baking equipment can not compress tightly fixedly to integrated circuit board, and the circuit board is emptyd easily, leads to integrated circuit board to damage, toasts the in-process simultaneously, can not in time detach the inside moisture of baking equipment, still has a large amount of steam to exist after leading to toasting to accomplish, toast and adopt natural cooling's mode to cool off integrated circuit board usually after accomplishing moreover, and cooling efficiency is low.

Disclosure of Invention

The present invention is directed to a baking apparatus for manufacturing a system-in-a-package integrated circuit and a method for using the same, which solve the above problems.

In order to achieve the purpose, the invention provides the following technical scheme: a bake apparatus for system-in-a-line integrated circuit fabrication, comprising: the drying oven comprises an oven body, wherein a drying mechanism is fixedly mounted at the top of the oven body, a PLC (programmable logic controller) is fixedly mounted on the left side of the front surface of the oven body, and a cooling mechanism is fixedly mounted at the bottom of one side of the oven body, which is far away from the PLC;

the baking oven body comprises an oven body, a movable door is rotatably connected to the front surface of the oven body, a handle is welded to the front surface of the movable door and one side of the movable door far away from a PLC (programmable logic controller), a baking assembly is fixedly mounted on one side of an inner cavity of the oven body far away from a cooling mechanism, bottom plates are welded to the bottom and the center of one side of the inner cavity of the oven body near the cooling mechanism, first support columns are welded to two sides of the top of each bottom plate, a second support column is welded to the center of the top of each bottom plate, sliding grooves are formed in the opposite inner sides of the two bottom plates and the second support columns, sliding rods are connected to the opposite inner sides of the two bottom plates and the second support columns in a sliding mode, a moving block is welded to one end of each sliding rod, close to the sliding grooves, is located in the inner, the bottom of the telescopic column is welded with a pressing plate;

cooling body includes the second box, the fixed mounting of center department of second box inner chamber has the rose box, the top fixed mounting of rose box inner chamber has the non-woven fabrics filter layer, the bottom fixed mounting of rose box inner chamber has a plurality of calcium chloride drying layers, the center department intercommunication of rose box bottom has fourth trachea, the center department intercommunication at rose box top has fifth trachea, one side fixed mounting at rose box top has the second air exhauster, the air-out end and the fifth trachea intercommunication of second air exhauster, the air inlet end intercommunication of second air exhauster has the intake pipe.

Through adopting above-mentioned technical scheme, can push down through the clamp plate, the slide bar, flexible post, the pushing down mechanism that the movable block constitutes pushes down the integrated circuit board of putting, avoid the situation that integrated circuit board emptys, integrated circuit board's stability has been improved, simultaneously when can will toast through dry mechanism, the moisture suction that evaporates from integrated circuit board goes out to dry mechanism's inner chamber, after dry with moisture through the dry cotton filling block of anhydrous calcium chloride, send into the inner chamber of toasting the case body again, accomplish the drying, the situation of moisture accumulation in the case inner chamber after having avoided toasting, through cooling body, can inhale the cold air in the external environment, filter the cold air and trade and dry inner chamber of after blowing in the box, thereby integrated circuit board's cooling with higher speed.

Preferably, the inner cavity of the moving block is provided with a thread groove, and the inner cavity of the thread groove is in threaded connection with a thread column.

Through adopting above-mentioned technical scheme, can reach the gliding purpose of messenger's movable block at the sliding tray inner chamber through screwing and loosening the screw thread post, and then make the position of slide bar obtain changing.

Preferably, the front side of second support column is opened and is equipped with the fluting, the front end of screw thread post runs through the fluting and welds and have the knob, fluting and screw thread post sliding connection.

Through adopting above-mentioned technical scheme, the moment when the knob can increase the rotation screw thread post, and then has reached laborsaving purpose.

Preferably, flexible post is including a fixed section of thick bamboo, the inner chamber sliding connection of a fixed section of thick bamboo has the movable block, one side welding that the movable block is close to the slide bar has the spring, one side welding that the movable block is close to the clamp plate has movable post, the one end that the movable post is close to the clamp plate runs through a fixed section of thick bamboo and welds with the clamp plate.

Through adopting above-mentioned technical scheme, can make the activity post flexible at the inner chamber of fixed section of thick bamboo, the spring after the compression can keep one always to the power that the clamp plate pushed down, and then carries on spacingly to integrated circuit board.

Preferably, a silica gel pad is bonded to the bottom of the pressing plate, and the thickness of the silica gel pad is five to one centimeter at zero.

By adopting the technical scheme, the pressing plate can be prevented from being directly in rigid contact with the integrated circuit board, and the situation that the pressing plate causes the abrasion of the integrated circuit board is avoided.

Preferably, dry mechanism includes first box, the center department fixed mounting of first bottom half has first air exhauster, the convulsions end intercommunication of first air exhauster has first breather pipe, the air-out end intercommunication of first air exhauster has third breather pipe, the one end intercommunication that first air exhauster was kept away from to third breather pipe has the siphunculus, the inner chamber packing of siphunculus has the dry cotton filling block of anhydrous calcium chloride, the one end intercommunication that first air exhauster was kept away from to the siphunculus has the second breather pipe, the one end that first air exhauster was kept away from to first breather pipe runs through first box and box in proper order and communicates with the box, the one end that the siphunculus was kept away from to the second breather pipe runs through first box and box in proper order and communicates with the box.

Through adopting above-mentioned technical scheme, can make and form the circulation circuit of a intercommunication between drying mechanism and the baking oven body.

Preferably, the one end that the second air exhauster was kept away from to the intake pipe runs through the second box and the cover is equipped with the fly net, the aperture of fly net is three millimeters, the one end that the rose box was kept away from to fourth trachea runs through second box and box in proper order and communicates with the box.

By adopting the technical scheme, cold air can enter the inner cavity of the box body through the cooling mechanism, so that the integrated circuit board in the inner cavity of the box body is cooled in an accelerated manner.

The application method of the baking device for manufacturing the system-level integrated circuit comprises the following steps:

s1: the integrated circuit board is placed on the top of the bottom plate by opening the movable door, the circuit boards are accumulated to 20-40 layers, then the threaded column is rotated by the knob, one end, away from the knob, of the threaded column is not in contact with the second supporting column any more, the sliding rod slides downwards at the moment, the sliding rod presses down the pressing plate through the telescopic column, the silica gel pad at the bottom of the pressing plate is in contact with the integrated circuit board, a proper force is applied, the sliding rod presses down the fixing cylinder, the fixing cylinder compresses the spring, the integrated circuit board can be fixed at the moment, the threaded column is rotated, and one end, away from the knob, of the threaded column is in close contact with the inner wall;

s2: setting parameters through a PLC controller to enable the baking assembly to work;

s3: the first exhaust fan is started, the first exhaust fan pumps air containing moisture in the inner cavity of the box body through the first vent pipe, the air containing the moisture is conveyed to the inner cavity of the through pipe through the third vent pipe, and the air is conveyed to the inner cavity of the box body through the second vent pipe after being dried by the anhydrous calcium chloride dry cotton filling block in the inner cavity of the through pipe, so that the aim of drying the air in the inner cavity of the box body is fulfilled;

s4: simultaneously closing the baking component and the first exhaust fan, opening a movable door at the front side of the box body, then opening a second exhaust fan, sucking external cold air into an exhaust end through an air inlet pipe by the second exhaust fan, conveying the cold air to an inner cavity of the filter box through a fifth vent pipe, filtering impurities such as dust in the cold air by a non-woven fabric filter layer in the inner cavity of the filter box, drying moisture in the cold air by a plurality of calcium chloride drying layers, blowing the dried cold air into the inner cavity of the box body through a fourth vent pipe, and cooling the integrated circuit board in the inner cavity of the box body;

s5: and rotating the threaded column by the knob again to enable the threaded column to be far away from the inner wall of the sliding groove, moving the sliding rod upwards to enable the silica gel pad to be far away from the integrated circuit board, and screwing the threaded column at the moment to enable the threaded column to be in close contact with the inner wall of the sliding groove.

Preferably, the temperature of the baking component in S2 is 110-140 ℃, and the baking time is 40-80 min.

Preferably, the cooling time in S4 is 2-8 h.

Compared with the prior art, the invention has the beneficial effects that:

1. the integrated circuit board placed well can be pressed down through a pressing mechanism consisting of the pressing plate, the sliding rod, the telescopic column and the moving block, so that the situation that the integrated circuit board is toppled in the baking process is avoided, and the integrated circuit board is prevented from being damaged due to toppling;

2. when the drying mechanism is used for baking, moisture evaporated from the integrated circuit board is pumped into the inner cavity of the drying mechanism, and is dried by the anhydrous calcium chloride dry cotton filling block and then sent into the inner cavity of the baking oven body to finish drying, so that the condition that the baked moisture is accumulated in the inner cavity of the oven body is avoided;

3. through cooling body, can inhale the cold air among the external environment, filter the cold air and trade and blow in the inner chamber of box after the drying to integrated circuit board's cooling is accelerated, and then effectively improve cooling efficiency.

Drawings

FIG. 1 is a schematic structural diagram of a baking apparatus for manufacturing a system-level integrated circuit according to the present invention;

FIG. 2 is a schematic cross-sectional view of the baking oven body according to the present invention;

FIG. 3 is a partial cross-sectional view of the structure of the first and second support posts and the sliding rod;

FIG. 4 is a schematic top view of a cross-sectional structure of a second supporting pillar and a moving block according to the present invention;

FIG. 5 is a schematic cross-sectional view of the drying mechanism of the present invention;

FIG. 6 is a schematic cross-sectional view of the cooling mechanism of the present invention;

FIG. 7 is a schematic cross-sectional view of the telescopic column of the present invention;

FIG. 8 is a flow chart illustrating the operation of the baking apparatus for manufacturing a system-level integrated circuit according to the present invention.

In the figure: 1. a baking oven body; 2. a PLC controller; 3. a drying mechanism; 4. a cooling mechanism; 11. a box body; 12. a movable door; 13. a handle; 14. pressing a plate; 15. a second support column; 16. a slide bar; 17. a first support column; 18. a base plate; 19. a silica gel pad; 110. a sliding groove; 111. a telescopic column; 112. a moving block; 113. a threaded post; 114. a thread groove; 115. grooving; 116. a knob; 117. a baking assembly; 31. a first vent pipe; 32. a second vent pipe; 33. a first case; 34. a first exhaust fan; 35. pipe passing; 36. drying the cotton filling blocks by using anhydrous calcium chloride; 37. a third vent pipe; 41. a fourth air vent pipe; 42. a second case; 43. a filter box; 44. a plurality of calcium chloride dry layers; 45. a non-woven fabric filter layer; 46. an insect-proof net; 47. an air inlet pipe; 48. a second exhaust fan; 49. a fifth ventilation pipe; 1111. a movable post; 1112. a movable block; 1113. a fixed cylinder; 1114. a spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 8, the present invention provides a technical solution:

a bake apparatus for system-in-a-line integrated circuit fabrication, comprising: toast case body 1, the top fixed mounting who toasts case body 1 has drying mechanism 3, toasts the left side fixed mounting on 1 positive surfaces of case body and has PLC controller 2, toasts the bottom fixed mounting that case body 1 kept away from PLC controller 2 one side and has cooling body 4.

The baking box body 1 comprises a box body 11, a movable door 12 is rotatably connected to the front surface of the box body 11, a handle 13 is welded to one side, far away from a PLC (programmable logic controller) 2, of the front surface of the movable door 12, a baking assembly 117 is fixedly installed at one side, far away from a cooling mechanism 4, of an inner cavity of the box body 11, bottom plates 18 are welded to the bottoms and the centers of the inner cavity of the box body 11, close to one side of the cooling mechanism 4, of the bottom plate 18, first supporting columns 17 are welded to the two sides of the top of each bottom plate 18, a second supporting column 15 is welded to the center of the top of each bottom plate 18, a groove 115 is formed in the front side of each second supporting column 15, a knob 116 penetrates through the groove 115 and is welded to the front end of each threaded column 113, the groove 115 is slidably connected with the threaded column 113, the knob 116 can increase torque when the threaded column 113 is rotated, labor saving is achieved, sliding grooves 110 are formed in, a moving block 112 is welded at one end of the sliding rod 16 close to the sliding groove 110, a threaded groove 114 is formed in the inner cavity of the moving block 112, a threaded post 113 is connected to the inner cavity of the threaded groove 114 in a threaded manner, the purpose of enabling the moving block 112 to slide in the inner cavity of the sliding groove 110 can be achieved by screwing and unscrewing the threaded post 113, and further the position of the sliding rod 16 is changed, the moving block 112 is located in the inner cavity of the sliding groove 110 and is in sliding connection with the sliding groove 110, a telescopic post 111 is fixedly installed at the bottom of the sliding rod 16, the telescopic post 111 comprises a fixed cylinder 1113, a movable block 1112 is connected to the inner cavity of the fixed cylinder 1113 in a sliding manner, a spring 1114 is welded at one side of the movable block 1112 close to the sliding rod 16, a movable post 1111 is welded at one side close to the pressing plate 14, one end of the movable post 1111 close to the pressing plate 14 penetrates through the fixed cylinder 1113 and is welded with the pressing plate 14, the, and then carry out spacing to integrated circuit board, the bottom welding of flexible post 111 has clamp plate 14, and the bottom of clamp plate 14 bonds there is the silica gel pad 19, and the thickness of silica gel pad 19 is five to one centimetre at zero point, can avoid clamp plate 14 directly to carry out rigid contact with integrated circuit board, has avoided clamp plate 14 to cause the situation of integrated circuit board wearing and tearing.

Drying mechanism 3 includes first box 33, the center department fixed mounting of first box 33 bottom has first air exhauster 34, the convulsions end intercommunication of first air exhauster 34 has first breather pipe 31, the air-out end intercommunication of first air exhauster 34 has third breather pipe 37, the one end intercommunication that first air exhauster 34 was kept away from to third breather pipe 37 has siphunculus 35, the inner chamber packing of siphunculus 35 has anhydrous calcium chloride dry cotton filling block 36, the one end intercommunication that first air exhauster 34 was kept away from to siphunculus 35 has second breather pipe 32, first breather pipe 31 is kept away from the one end of first air exhauster 34 and is run through first box 33 and box 11 in proper order and communicate with box 11, the one end that siphunculus 35 was kept away from to second breather pipe 32 runs through first box 33 and box 11 in proper order and communicates with box 11, can make the circulation circuit that forms a intercommunication between drying mechanism 3 and the baking box body 1.

The cooling mechanism 4 comprises a second box body 42, a filter box 43 is fixedly arranged at the center of the inner cavity of the second box body 42, a non-woven fabric filter layer 45 is fixedly arranged at the top of the inner cavity of the filter box 43, a plurality of calcium chloride drying layers 44 are fixedly arranged at the bottom of the inner cavity of the filter box 43, a fourth vent pipe 41 is communicated with the center of the bottom of the filter box 43, a fifth vent pipe 49 is communicated with the center of the top of the filter box 43, a second exhaust fan 48 is fixedly arranged at one side of the top of the filter box 43, the air outlet end of the second exhaust fan 48 is communicated with the fifth vent pipe 49, the air inlet end of the second exhaust fan 48 is communicated with an air inlet pipe 47, one end of the air inlet pipe 47, which is far away from the second exhaust fan 48, penetrates through the second box body 42 and is sleeved with an insect-proof net 46, the aperture of the insect-proof net 46 is three millimeters, the cooling mechanism 4 can make cold air enter the inner cavity of the box body 11, so that the integrated circuit board in the inner cavity of the box body 11 is cooled in an accelerated way.

Through adopting above-mentioned technical scheme, can push down the integrated circuit board of putting through clamp plate 14, slide bar 16, flexible post 111, the pushing down mechanism that movable block 112 constitutes, avoid the situation that integrated circuit board emptys, integrated circuit board's stability has been improved, simultaneously when can will toast through drying mechanism 3, the moisture suction that evaporates from integrated circuit board is to drying mechanism 3's inner chamber, through the dry cotton filling block 36 of anhydrous calcium chloride after with moisture drying, send into the inner chamber of toasting case body 1 again, accomplish the drying, the situation of moisture accumulation in the box 11 inner chamber after having avoided toasting, through cooling mechanism 4, can inhale the cold air in the external environment, filter the cold air and trade and blow in the inner chamber of box 11 after the drying, thereby integrated circuit board's cooling is accelerated.

The invention also provides a use method of the baking device for manufacturing the system-level integrated circuit, which comprises the following steps:

s1: the integrated circuit board is placed on the top of the bottom plate 18 by opening the movable door 12, the circuit boards are accumulated to 40 layers, then the threaded column 113 is screwed by the knob 116, so that one end of the threaded column 113, far away from the knob 116, is not contacted with the second supporting column 15, at the moment, the sliding rod 16 slides downwards, the sliding rod 16 presses the pressing plate 14 downwards through the telescopic column 111, the silica gel pad 19 at the bottom of the pressing plate 14 is contacted with the integrated circuit board, a proper force is applied, the sliding rod 16 presses the fixing cylinder 1113 downwards, the fixing cylinder 1113 compresses the spring 1114, at the moment, the fixing of the integrated circuit board can be completed, at the moment, the threaded column 113 is screwed, and one end of the threaded column 113, far away from the knob 116, is tightly contacted with the inner;

s2: setting parameters through the PLC 2 to enable the baking assembly 117 to work, wherein the temperature of the baking assembly 117 is 140 ℃, and the baking time is 80 min;

s3: the first exhaust fan 34 is started, the first exhaust fan 34 pumps air containing moisture out of the inner cavity of the box body 11 through the first vent pipe 31, meanwhile, the air containing the moisture is conveyed to the inner cavity of the through pipe 35 through the third vent pipe 37, and is conveyed to the inner cavity of the box body 11 through the second vent pipe 32 after being dried by the anhydrous calcium chloride dry cotton filling block 36 in the inner cavity of the through pipe 35, so that the aim of drying the air in the inner cavity of the box body 11 is fulfilled;

s4: simultaneously closing the baking component 117 and the first exhaust fan 34, opening the movable door 12 at the front side of the box body 11, then opening the second exhaust fan 48, sucking external cold air into the air suction end through an air inlet pipe 47 by the second exhaust fan 48, conveying the cold air to the inner cavity of the filter box 43 through a fifth through air pipe 49, filtering impurities such as dust in the cold air by a non-woven fabric filter layer 45 in the inner cavity of the filter box 43, then drying moisture in the cold air by a plurality of calcium chloride drying layers 44, blowing the dried cold air into the inner cavity of the box body 11 through a fourth through air pipe 41, and cooling the integrated circuit board in the inner cavity of the box body 11 for 2-8 hours;

s5: the screw post 113 is screwed by the knob 116 again to make the screw post 113 far away from the inner wall of the sliding groove 110, the sliding rod 16 is moved upward to make the silicone pad 19 far away from the ic board, and at this time, the screw post 113 is screwed to make the screw post 113 tightly contact with the inner wall of the sliding groove 110.

The parts not involved in the present invention are the same as or can be implemented by the prior art. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A bake apparatus for system-in-a-line integrated circuit fabrication, comprising: the drying oven comprises an oven body (1), wherein a drying mechanism (3) is fixedly mounted at the top of the oven body (1), a PLC (programmable logic controller) is fixedly mounted on the left side of the front surface of the oven body (1), and a cooling mechanism (4) is fixedly mounted at the bottom of one side, far away from the PLC (2), of the oven body (1);

the baking oven body (1) comprises an oven body (11), a movable door (12) is rotatably connected to the front surface of the oven body (11), a handle (13) is welded to one side, away from a PLC (programmable logic controller) (2), of the front surface of the movable door (12), a baking assembly (117) is fixedly installed at one side, away from a cooling mechanism (4), of an inner cavity of the oven body (11), a bottom plate (18) is welded to the bottom and the center of the inner cavity of the oven body (11), which are close to one side of the cooling mechanism (4), first supporting columns (17) are welded to the two sides of the top of the bottom plate (18), a second supporting column (15) is welded to the center of the top of the bottom plate (18), sliding grooves (110) are formed in the inner sides, opposite to the bottom plate (18) and the second supporting column (15), and sliding rods (16) are slidably connected to the inner sides, opposite to the bottom plate, a moving block (112) is welded at one end, close to the sliding groove (110), of the sliding rod (16), the moving block (112) is located in the inner cavity of the sliding groove (110) and is in sliding connection with the sliding groove (110), a telescopic column (111) is fixedly installed at the bottom of the sliding rod (16), and a pressing plate (14) is welded at the bottom of the telescopic column (111);

cooling body (4) include second box (42), fixed mounting is located at the center of second box (42) inner chamber has rose box (43), the top fixed mounting of rose box (43) inner chamber has non-woven fabrics filter layer (45), the bottom fixed mounting of rose box (43) inner chamber has a plurality of calcium chloride drying layer (44), the center department intercommunication of rose box (43) bottom has fourth breather pipe (41), the center department intercommunication at rose box (43) top has fifth breather pipe (49), one side fixed mounting at rose box (43) top has second air exhauster (48), the air-out end and the fifth breather pipe (49) intercommunication of second air exhauster (48), the air inlet end intercommunication of second air exhauster (48) has intake pipe (47).

2. The bake apparatus for manufacturing system-in-package integrated circuits as claimed in claim 1, wherein: a threaded groove (114) is formed in the inner cavity of the moving block (112), and a threaded column (113) is connected to the inner cavity of the threaded groove (114) in a threaded mode.

3. The bake apparatus for manufacturing system-in-package integrated circuits as claimed in claim 2, wherein: the front side of the second supporting column (15) is provided with a slot (115), the front end of the threaded column (113) penetrates through the slot (115) and is welded with a knob (116), and the slot (115) is connected with the threaded column (113) in a sliding mode.

4. The bake apparatus for manufacturing system-in-package integrated circuits as claimed in claim 1, wherein: flexible post (111) is including fixed section of thick bamboo (1113), the inner chamber sliding connection of fixed section of thick bamboo (1113) has movable block (1112), one side welding that movable block (1112) are close to slide bar (16) has spring (1114), one side welding that movable block (1112) are close to clamp plate (14) has movable post (1111), one end that activity post (1111) are close to clamp plate (14) runs through fixed section of thick bamboo (1113) and welds with clamp plate (14).

5. The bake apparatus for manufacturing system-in-package integrated circuits as claimed in claim 1, wherein: the bottom of the pressing plate (14) is bonded with a silica gel pad (19), and the thickness of the silica gel pad (19) is five to one centimeter at zero point.

6. The bake apparatus for manufacturing system-in-package integrated circuits as claimed in claim 1, wherein: drying mechanism (3) include first box (33), fixed mounting is located at the center of first box (33) bottom has first air exhauster (34), the convulsions end intercommunication of first air exhauster (34) has first breather pipe (31), the air-out end intercommunication of first air exhauster (34) has third breather pipe (37), the one end intercommunication that first air exhauster (34) were kept away from in third breather pipe (37) has siphunculus (35), the inner chamber packing of siphunculus (35) has anhydrous calcium chloride dry cotton filling block (36), the one end intercommunication that first air exhauster (34) were kept away from in siphunculus (35) has second breather pipe (32), the one end that first air exhauster (34) were kept away from in first breather pipe (31) runs through first box (33) and box (11) in proper order and communicates with box (11), the one end that siphunculus (35) were kept away from in second breather pipe (32) runs through first box (33) and box (11) in proper order and communicates with box (11).

7. The bake apparatus for manufacturing system-in-package integrated circuits as claimed in claim 1, wherein: the one end that second air exhauster (48) were kept away from in intake pipe (47) runs through second box (42) and cover and is equipped with fly net (46), the aperture of fly net (46) is three millimeters, the one end that rose box (43) were kept away from in fourth breather pipe (41) runs through second box (42) and box (11) in proper order and communicates with box (11).

8. The use method of the baking device for manufacturing the system-level integrated circuit is characterized in that: the method comprises the following steps:

s1: opening the movable door, placing the integrated circuit board on the top of the bottom plate, accumulating the circuit boards to 20-40 layers, then rotating the threaded column through the knob, enabling one end, away from the knob, of the threaded column to be not in contact with the second supporting column any more, sliding the sliding rod downwards at the moment, enabling the sliding rod to press the pressing plate downwards through the telescopic column, enabling the silica gel pad at the bottom of the pressing plate to be in contact with the integrated circuit board, applying a force to enable the sliding rod to press the fixing cylinder downwards, enabling the fixing cylinder to compress the spring, completing the fixing of the integrated circuit board at the moment, and rotating the threaded column at the moment to enable one end, away from the knob, of the threaded column;

9. The method of claim 8, wherein the baking step comprises: the temperature of the baking component in the S2 is 110-140 ℃, and the baking time is 40-80 min.

10. The method of claim 8, wherein the baking step comprises: the cooling time in the S4 is 2-8 h.