CN112536738A - Diamond roller rapid electroplating device and process - Google Patents
Diamond roller rapid electroplating device and process Download PDFInfo
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- CN112536738A CN112536738A CN202011434147.3A CN202011434147A CN112536738A CN 112536738 A CN112536738 A CN 112536738A CN 202011434147 A CN202011434147 A CN 202011434147A CN 112536738 A CN112536738 A CN 112536738A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
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Abstract
The invention provides a diamond roller rapid electroplating device and a process, which comprises a plating bath, wherein a plating bath circulating device and a female die dynamic rotating device are arranged in the plating bath, the female die dynamic rotating device comprises a cathode conductive supporting rod and a female die fixing device, the female die fixing device comprises an upper rotating cover plate connected with the cathode conductive supporting rod, an anode titanium basket is arranged on the upper rotating cover plate, a lower rotating cover plate is arranged below the upper rotating cover plate, a female die is arranged on the lower rotating cover plate, and the anode titanium basket is inserted into the female die. The invention adopts the female die dynamic rotation and plating solution directional flow electroplating process, combines a high-speed ammonia nickel plating solution formula system, improves the upper limit of the cathode current density by 6 times, shortens the electroplating manufacturing period by more than 10 days, improves the electroplating loading capacity by 4-8 times, and effectively solves the technical problem of overlong manufacturing period of diamond roller products.
Description
Technical Field
The invention relates to the technical field of manufacturing of superhard material grinding tools, in particular to a device and a process for quickly electroplating a diamond roller.
Background
The manufacturing method of the internally plated diamond dressing roller is characterized in that a temporary female die is utilized, diamond particles are arrayed and electroplated by taking the inner surface of the female die as a reference surface, and the temporary female die is removed through machining procedures such as grinding and peeling after electroplating is finished to form the working surface of the roller.
At present, the roller electroplating solution is a mature nickel sulfate system, the electroplating solution is not circulated during electroplating, a female die is not subjected to single-chip electroplating, and the current density of sand electroplating is 0.2A/dm2And 12H, thickening until the diamond particles are fully covered by the electroplated metal layer, and gradually increasing the current density to 1.0A/dm2The electroforming is started, and the female die electroplating time is about 15 days.
The electroplating process of the internally plated diamond dressing roller has the following defects:
because the inner cavity space of the female die is narrow, the plating solution is not stirred, and the female die does not move, the plating solution in the cavity of the female die flows insufficiently, the component concentration of the plating solution is reduced unstably along with the progress of the electroplating reaction, and the upper limit of the cathode current density of the plating solution is seriously reduced. Meanwhile, the nickel sulfate system is adopted for low-speed electroplating, so that the upper limit of the cathode current density of the electroplating solution is further reduced, the electroplating efficiency is low, and the electroplating manufacturing period is long. The single female die is produced by electroplating, the loading capacity is small, and the output in unit time is small.
Disclosure of Invention
The invention provides a device and a process for quickly electroplating a diamond roller, which solve the problems of low electroplating speed, no flowing of a plating solution and low electroplating efficiency in the prior art.
The technical scheme for realizing the invention is as follows:
the utility model provides a diamond roller quick electroplating device, includes the coating bath, be equipped with plating bath circulating device and female mould dynamic rotation device in the coating bath, female mould dynamic rotation device includes negative pole electrically conductive support pole and female mould fixing device, female mould fixing device includes the last rotation apron that is connected with negative pole electrically conductive support pole, be equipped with positive pole titanium basket on the last rotation apron, go up rotation apron below and be equipped with down the rotatory apron, be equipped with the female mould on the lower rotation apron, set up in the positive pole titanium basket inserts the female mould.
The upper rotating cover plate is fixedly connected with the lower rotating cover plate through a supporting nut, the female die is arranged between the upper rotating cover plate and the lower rotating cover plate, a through hole is formed in the lower rotating cover plate, and the lower end of the anode titanium basket penetrates through the through hole.
The upper part of the cathode conductive support rod is connected with the cathode conductive rotating hook, and the cathode conductive rotating hook is connected with the electroplating conductive rotating head.
An anode conducting rod outer cavity is further arranged in the plating tank, a conducting rod is arranged in the anode conducting rod outer cavity and connected with an anode mercury slip ring arranged at the top end of the anode conducting rod outer cavity, and an anode conducting wire is arranged on the anode mercury slip ring and connected with an anode titanium basket.
The anode mercury slip ring is characterized in that the upper end of the anode mercury slip ring is provided with a rotating end and a fixed end at the lower end, a slip ring cavity is arranged between the rotating end and the fixed end, mercury is hermetically arranged in the slip ring cavity, the fixed end is connected with the conducting rod, and the rotating end is connected with the anode conducting wire.
And a cathode lead is arranged on the cathode conductive support rod and is connected with the female die.
The plating solution circulating device comprises a circulating pipe support arranged at the bottom of the plating tank, a plating solution circulating pipe is arranged on the circulating pipe support, a circulating pipe liquid outlet is arranged on the plating solution circulating pipe, a return pipe is also arranged at the bottom of the plating tank, a circulating pump is arranged outside the plating tank, and the circulating pump is connected with the plating solution circulating pipe and the return pipe.
This patent adopts ripe sulfamic acid nickel plating solution system to electroplate, every volume of hanging 4 ~ 8 bed dies, materials such as bed die material steel, graphite, copper.
And a heating pipe is also arranged in the plating tank.
The electroplating process by using the electroplating device comprises the following steps:
a. assembling a fixture: fixing the sand-coated female die on a lower-layer rotating disc, fixing and supporting an upper rotating cover plate and a lower rotating cover plate through a support nut, penetrating an anode titanium basket through the inner cavity of the female die, and fixing the upper part of the anode titanium basket on the upper-layer rotating disc;
b. the assembled fixture is hung on an electroplating conductive rotating head at the upper part of the plating tank through a cathode conductive rotating hook, the rotating head hook is connected with a power supply cathode, and a female die is communicated with the power supply cathode, so that the cathode conductive rotating head at the top of the plating tank drives the rotating disk, the female die and the titanium basket to rotate simultaneously, and plating solution in the female die is further exchanged through cathode rotation. Adjusting the height of the electroplating conductive rotating head to enable the plating solution to be positioned between the female die and the upper rotating cover plate, connecting an anode conductive wire with an anode mercury slip ring conductive contact extending out of the center of the plating bath, and connecting a cathode lead with a cathode conductive support rod for conduction;
c. opening a motor connected with the electroplating conductive rotating head at the upper part of the plating tank, simultaneously opening a circulating pump, pumping out the plating solution at the bottom of the plating tank by nickel sulfamic acid through a pump and a pipeline, then pumping out the plating solution from the center of a female die at the bottom of the tank, realizing the exchange of the plating solution in the cavity of the female die with the outside, soaking and rotating the female die in the plating solution for 5min, then starting an electroplating power supply, removing a female die cathode and anode lead at one time after the sanding is completed, then quickly taking out the female die from the plating solution for unloading the sand, then continuously placing the female die into the plating tank, fixing the female die and connecting the cathode and anode lead, and sequentially and;
d. and (4) after sand unloading is finished, carrying out electroplating thickening process, and after electroplating is finished, detaching the female die.
In the step c, the upper sand electroplating technological parameter is cathode current density of 0.4A/dm26H; the initial thickening current density in step d is 1A/dm26H, thickening until the diamond particles are fully covered by the electroplated metal layer, and gradually increasing the current density to 6.0A/dm2Then, electroforming is started to a thickness of 4mm or more.
The invention has the beneficial effects that:
according to the invention, 4-8 diamond rollers can be electroplated in batch at the same time by using the circulating mechanism with directional flow of the plating solution and the dynamic rotating mechanism of the female die cavity.
The invention adopts the female die dynamic rotation and plating solution directional flow electroplating process, combines a high-speed ammonia nickel plating solution formula system, improves the upper limit of the cathode current density by 6 times, shortens the electroplating manufacturing period by more than 10 days, improves the electroplating loading capacity by 4-8 times, and effectively solves the technical problem of overlong manufacturing period of diamond roller products.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of an electroplating apparatus according to the present invention.
FIG. 2 is a top view of the female die dynamic rotation apparatus.
Fig. 3 is a schematic structural diagram of the anode mercury slip ring.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
As shown in fig. 1, a diamond roller rapid electroplating device comprises a plating bath 14, a plating bath circulating device and a female die dynamic rotation device are arranged in the plating bath 14, the female die dynamic rotation device comprises a cathode conductive support rod 3 and a female die fixing device, the female die fixing device comprises an upper rotation cover plate 6 connected with the cathode conductive support rod 3, an anode titanium basket 5 is arranged on the upper rotation cover plate 6, a lower rotation cover plate 9 is arranged below the upper rotation cover plate 6, a female die 8 is arranged on the lower rotation cover plate 9, the upper rotation cover plate 6 and the lower rotation cover plate 9 are fixedly connected through a support nut 7, the female die 8 is arranged between the upper rotation cover plate 6 and the lower rotation cover plate 9, a perforation 16 is arranged on the lower rotation cover plate 9, the lower end of the anode titanium basket 5 passes through the perforation 16,
preferably, as shown in fig. 2, the upper part of the cathode conductive support rod 3 is connected with a cathode conductive rotating hook 2, the cathode conductive rotating hook 2 is connected with an electroplating conductive rotating head 1, a cathode lead 18 is arranged on the cathode conductive support rod 3, and the cathode lead 18 is connected with the female die 8; an anode conducting rod outer cavity 12 is further arranged in the plating tank 14, a conducting rod 17 is arranged in the anode conducting rod outer cavity 12, the conducting rod 17 penetrates through the centers of the two rotating disks and is higher than the liquid level, the conducting rod 17 is connected with an anode mercury slip ring 4 arranged at the top end of the anode conducting rod outer cavity 12, and an anode conducting wire 41 arranged on the anode mercury slip ring 4 is connected with an anode titanium basket 5.
As shown in fig. 3, the upper end of the anode mercury slip ring 4 is set to be a rotating end 42, the lower end is set to be a fixed end 43, a slip ring cavity 44 is arranged between the rotating end 42 and the fixed end 43, mercury is hermetically arranged in the slip ring cavity 44, the fixed end 43 is connected with the conducting rod 17, and the rotating end 42 is connected with the anode conducting wire 41, so that the anode conducting wire is not wound in the rotating process of the anode titanium basket.
Preferably, the anode mercury slip ring 4 is a conductive rotating device using mercury as a fluid medium, mercury is sealed in the slip ring, a fixed end and a rotating end are integrated, and current is directly conducted and transmitted through mercury during rotation. The mercury-free high-efficiency wear-resistant sealing ring mainly has the advantages of very small wear, small resistance, long service life and the like due to internal friction of mercury molecules and friction between special sealing pieces during rotation.
The plating solution circulating device comprises a circulating pipe support 11 arranged at the bottom of a plating tank 14, a plating solution circulating pipe 10 is arranged on the circulating pipe support 11, a circulating pipe liquid outlet 101 is arranged on the plating solution circulating pipe 10, a return pipe 19 is also arranged at the bottom of the plating tank 14, a circulating pump 15 is arranged outside the plating tank 14, and the circulating pump 15 is connected with the plating solution circulating pipe 10 and the return pipe 19.
A heating pipe 13 is also arranged in the plating tank 14.
The electroplating process by using the electroplating device comprises the following steps:
a. assembling a fixture: fixing the sand-coated female die 8 on a lower-layer rotating disc 9, fixing, supporting and adjusting an upper rotating cover plate 6 and a lower rotating cover plate 9 through a support nut 7, penetrating an anode titanium basket 5 through the inner cavity of the female die 8, and fixing the upper part of the anode titanium basket 5 on the upper-layer rotating disc 6;
b. hanging the assembled fixture on an electroplating conductive rotating head 1 at the upper part of a plating bath through a cathode conductive rotating hook 2, adjusting the height of the electroplating conductive rotating head 1 to enable plating solution to be positioned between a female die 8 and an upper rotating cover plate 6, connecting an anode conductive wire 41 with a conductive contact of an anode mercury slip ring 4 extending out of the center of the plating bath, and connecting a cathode lead 18 with a cathode conductive support rod 3 for conduction;
c. opening a motor connected with the electroplating conductive rotating head 1 at the upper part of the plating tank, simultaneously opening a circulating pump 15, soaking and rotating a female die 8 in the plating solution for 5min, then starting an electroplating power supply, removing a female die cathode and anode lead at one time after finishing sanding, then quickly taking out the female die 8 from the plating solution, unloading the sand, then continuously putting the female die 8 into the plating tank, fixing the female die 8, connecting the cathode and anode leads, and sequentially and quickly finishing the sand unloading work according to the sand unloading sequence;
d. after the sand is removed, the electroplating thickening process is carried out, and after the electroplating is finished, the female die 8 is detached.
In the step c, the upper sand electroplating technological parameter is cathode current density of 0.4A/dm26H; the initial thickening current density in step d is 1A/dm26H, thickening until the diamond particles are fully covered by the electroplated metal layer, and gradually increasing the current density to 6.0A/dm2Then, electroforming is started to a thickness of 4mm or more.
Example 1
Quick electroplating internal plating diamond trimming roller
Parameters of the female die: diameter 200mm 100mm
Coating thickness: 4mm
Base material: 45 steel
Abrasive grade: SMD 30/35
The method comprises the following specific steps:
(1) pretreatment and sand distribution: the prior conventional pretreatment and sand distribution process is adopted for operation;
(2) assembling a fixture: fixing a sand-coated roller (female die 8) on a lower-layer rotating disk 9, fixing, supporting and adjusting an upper rotating cover plate 6 and a lower rotating cover plate 9 through a support nut 7, penetrating each anode titanium basket 5 through the inner cavity of the female die 8, and fixing the upper part of each anode titanium basket 5 on the upper-layer rotating disk 6;
(3) electroplating (Sand coating, thickening)
Hanging the assembled fixture on an electroplating conductive rotating head 1 at the upper part of a plating bath through a cathode conductive rotating hook 2, adjusting the height of the electroplating conductive rotating head 1 to enable plating solution to be positioned between a female die 8 and an upper rotating cover plate 6, connecting an anode conductive wire 41 with a conductive contact of an anode mercury slip ring 4 extending out of the center of the plating bath, and connecting a cathode lead 18 with a cathode conductive support rod 3 for conduction;
c. the motor connected with the electroplating conductive rotating head 1 at the upper part of the plating bath is started, the circulating pump 15 is started at the same time, the female die 8 is soaked in the plating solution and rotates for 5min, then the electroplating power supply is started, and the sand-feeding electroplating technological parameter is that the cathode current density is 0.4A/dm26H, after the sand feeding is finished, removing a female die cathode and anode lead at a time, then quickly taking out the female die 8 from the plating solution, unloading the sand, then continuously placing the female die 8 into a plating bath, fixing the female die 8 and connecting the cathode and anode leads, and sequentially and quickly finishing the sand unloading work according to the sand unloading sequence;
after sand unloading is finished, electroplating thickening process is carried out, and initial thickening current density is 1A/dm26H, thickening until the diamond particles are fully covered by the electroplated metal layer, and gradually increasing the current density to 6.0A/dm2And (3) beginning to carry out electroforming, wherein the electroforming thickness reaches more than 4mm, and the electroplating time of the female die is shortened to 5 days.
d. After the electroplating is finished, the female die is detached from the rotary disc jig, and the nickel layer on the surface of the female die is inspected to have no nickel nodules or peeling defects.
e. And (3) electroplating post-treatment: and (3) the electroplated female die shielding assembly jig and the wire are detached, the product is sent to a processing procedure to perform core pouring and reference conversion on the female die, then the female die cavity is ground and peeled, and the grinding material is checked to be uniformly distributed without the defect of sand shortage after the grinding and peeling are completed.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The utility model provides a quick electroplating device of diamond gyro wheel, includes coating bath (14), its characterized in that: be equipped with plating bath circulating device and female mould dynamic rotation device in coating bath (14), female mould dynamic rotation device includes negative pole conductive support pole (3) and female mould fixing device, female mould fixing device includes last rotation apron (6) that are connected with negative pole conductive support pole (3), be equipped with positive pole titanium basket (5) on last rotation apron (6), go up rotation apron (6) below and be equipped with down rotatory apron (9), be equipped with female mould (8) on lower rotation apron (9), set up in positive pole titanium basket (5) insert female mould (8).
2. The diamond roller rapid plating device according to claim 1, wherein: go up rotatory apron (6) and lower rotatory apron (9) through supporting nut (7) fixed connection, last rotatory apron (6) and lower rotatory apron (9) are arranged in between female mould (8), be equipped with on the rotatory apron (9) down and perforate (16), the setting of perforation (16) is passed to positive pole titanium basket (5) lower extreme.
3. The diamond roller rapid plating device according to claim 1, wherein: the upper part of the cathode conductive support rod (3) is connected with the cathode conductive rotating hook (2), and the cathode conductive rotating hook (2) is connected with the electroplating conductive rotating head (1).
4. The diamond roller rapid plating device according to claim 1, wherein: an anode conducting rod outer cavity (12) is further arranged in the plating tank (14), a conducting rod (17) is arranged in the anode conducting rod outer cavity (12), the conducting rod (17) is connected with an anode mercury slip ring (4) arranged at the top end of the anode conducting rod outer cavity (12), and an anode conducting wire (41) is arranged on the anode mercury slip ring (4) and connected with an anode titanium basket (5).
5. The diamond roller rapid plating device according to claim 4, wherein: the anode mercury slip ring is characterized in that the upper end of the anode mercury slip ring (4) is provided with a rotating end (42), the lower end of the anode mercury slip ring is provided with a fixed end (43), a slip ring cavity (44) is arranged between the rotating end (42) and the fixed end (43), mercury is hermetically arranged in the slip ring cavity (44), the fixed end (43) is connected with the conducting rod (17), and the rotating end (42) is connected with the anode conducting wire (41).
6. The diamond roller rapid plating device according to claim 3, wherein: and a cathode lead (18) is arranged on the cathode conductive support rod (3), and the cathode lead (18) is connected with the female die (8).
7. The diamond roller rapid plating device according to claim 1, wherein: the plating solution circulating device comprises a circulating pipe support (11) arranged at the bottom of a plating tank (14), a plating solution circulating pipe (10) is arranged on the circulating pipe support (11), a circulating pipe liquid outlet (101) is arranged on the plating solution circulating pipe (10), a return pipe (19) is further arranged at the bottom of the plating tank (14), a circulating pump (15) is arranged outside the plating tank (14), and the circulating pump (15) is connected with the plating solution circulating pipe (10) and the return pipe (19).
8. The diamond roller rapid plating device according to claim 1, wherein: a heating pipe (13) is also arranged in the plating tank (14).
9. A process of electroplating using the electroplating apparatus according to any one of claims 1 to 8, comprising the steps of:
a. assembling a fixture: fixing the sand-coated female die (8) on a lower-layer rotating disk (9), fixing, supporting and adjusting an upper rotating cover plate (6) and a lower rotating cover plate (9) through a support nut (7), penetrating an anode titanium basket (5) through the inner cavity of the female die (8), and fixing the upper part of the anode titanium basket (5) on the upper-layer rotating disk (6);
b. hanging the assembled fixture on an electroplating conductive rotating head (1) at the upper part of a plating bath through a cathode conductive rotating hook (2), adjusting the height of the electroplating conductive rotating head (1) to enable plating solution to be positioned between a female die (8) and an upper rotating cover plate (6), connecting an anode conductive wire (41) with a conductive contact of an anode mercury slip ring (4) extending out of the center of the plating bath, and connecting a cathode lead (18) with a cathode conductive support rod (3) for conduction;
c. opening a motor connected with the electroplating conductive rotating head (1) at the upper part of the plating tank, simultaneously opening a circulating pump (15), soaking and rotating a female die (8) in the plating solution for 5min, then starting an electroplating power supply, removing a female die cathode and anode lead at one time after finishing sanding, then quickly taking out the female die (8) from the plating solution for sanding, then continuously putting the female die (8) into the plating tank, fixing the female die (8) and connecting the cathode and anode leads, and sequentially and quickly finishing sanding unloading according to the sanding unloading sequence;
d. after sand unloading is finished, electroplating thickening process is carried out, and after electroplating is finished, the female die (8) is detached.
10. The process according to claim 9, characterized in that: in the step c, the upper sand electroplating technological parameter is cathode current density of 0.4A/dm26H; the initial thickening current density in step d is 1A/dm26H, thickening until the diamond particles are fully covered by the electroplated metal layer, and gradually increasing the current density to 6.0A/dm2Then, electroforming is started to a thickness of 4mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011434147.3A CN112536738B (en) | 2020-12-10 | 2020-12-10 | Diamond roller rapid electroplating device and process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011434147.3A CN112536738B (en) | 2020-12-10 | 2020-12-10 | Diamond roller rapid electroplating device and process |
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| CN112536738A true CN112536738A (en) | 2021-03-23 |
| CN112536738B CN112536738B (en) | 2022-05-27 |
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| CN208995626U (en) * | 2018-09-06 | 2019-06-18 | 东莞市希锐自动化科技股份有限公司 | A kind of internal and external anode rack plating apparatus of rotatable cathode |
| CN110744449A (en) * | 2019-09-13 | 2020-02-04 | 苏州志纳精密科技有限公司 | Diamond roller cavity curved surface machining method |
| CN110952114A (en) * | 2019-12-20 | 2020-04-03 | 浙江道明光电科技有限公司 | High-uniformity electroforming equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136692A (en) * | 1984-12-07 | 1986-06-24 | Toshiba Silicone Co Ltd | Formation of metallic layer |
| CN1809445A (en) * | 2003-06-23 | 2006-07-26 | 卡博特微电子公司 | Polishing pad for electrochemical-mechanical polishing |
| CN202089896U (en) * | 2011-06-11 | 2011-12-28 | 蚌埠玻璃工业设计研究院 | Surface chemical coating device for hollow glass microspheres |
| CN105648479A (en) * | 2016-03-22 | 2016-06-08 | 中南大学 | Micro electroforming device with double cathodes vertically rotating |
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| CN110744449A (en) * | 2019-09-13 | 2020-02-04 | 苏州志纳精密科技有限公司 | Diamond roller cavity curved surface machining method |
| CN110952114A (en) * | 2019-12-20 | 2020-04-03 | 浙江道明光电科技有限公司 | High-uniformity electroforming equipment |
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| CN112536738B (en) | 2022-05-27 |
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