CN112533440A - Cooling fin installation device - Google Patents
Cooling fin installation device Download PDFInfo
- Publication number
- CN112533440A CN112533440A CN202011138728.2A CN202011138728A CN112533440A CN 112533440 A CN112533440 A CN 112533440A CN 202011138728 A CN202011138728 A CN 202011138728A CN 112533440 A CN112533440 A CN 112533440A
- Authority
- CN
- China
- Prior art keywords
- plate
- pressing
- heat sink
- bin
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 14
- 238000009434 installation Methods 0.000 title description 19
- 238000003825 pressing Methods 0.000 claims abstract description 65
- 230000006835 compression Effects 0.000 claims abstract description 10
- 238000007906 compression Methods 0.000 claims abstract description 10
- 239000000523 sample Substances 0.000 claims description 11
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 6
- 230000000903 blocking effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000011900 installation process Methods 0.000 description 5
- 230000008439 repair process Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 206010033372 Pain and discomfort Diseases 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000012958 reprocessing Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Abstract
The invention provides a heat radiating fin mounting device, belongs to the technical field of mainboard production, and aims to solve the technical problem that component damage is easily caused in the mounting process of the existing PCB heat radiating fin. The cooling fin mounting device is used for mounting a cooling fin of the PCB and comprises a pressing plate, a pressing column, a stock bin plate, a spring and a bearing; the pressing plate is movably connected with the bin plate through a spring and a bearing, and the relative distance between the pressing plate and the bin plate can be changed through compression and rebound of the spring; the pressing plate is provided with a plurality of pressing columns, and the bin plate is provided with through holes corresponding to the plurality of pressing columns; the bin plate is provided with a bin for accommodating the cooling fins, and the positions of the pressing columns correspond to the positions of the fixed plugs of the cooling fins in the bin.
Description
Technical Field
The invention relates to the technical field of mainboard production, in particular to a radiating fin mounting device.
Background
With the development of electronic information technology, the production requirements of servers and computers are gradually increasing. In the manufacturing process, a process of mounting a heat sink on a Printed Circuit Board (PCB) is generally performed.
The prior method for installing the radiating fin is to place the radiating fin on a PCB, align a fixed plug of the radiating fin with an installation through hole of the PCB and press the fixed plug of the radiating fin by hands or a jig. In the whole installation process, though manual installation is more accurate, pain and discomfort easily occur when hands are pressed for a long time. The problem of improper installation or position deviation often can appear in the installation of using the tool, and such condition often can cause the components and parts to damage. Manpower and material resources are consumed for repair, and the production cost is increased.
Therefore, the existing installation process of the PCB radiating fin has the technical problem of easily causing the damage of the element device, thereby increasing the repair rate and improving the production cost.
Disclosure of Invention
The invention aims to provide a heat sink mounting device to solve the technical problem that component damage is easily caused in the mounting process of the existing PCB heat sink.
In a first aspect, a heat sink mounting device for mounting a heat sink of a PCB includes a pressing plate, a pressing post, a magazine plate, a spring, and a bearing;
the pressing plate is movably connected with the bin plate through a spring and a bearing, and the relative distance between the pressing plate and the bin plate can be changed through compression and rebound of the spring;
the pressing plate is provided with a plurality of pressing columns, and the bin plate is provided with through holes corresponding to the plurality of pressing columns;
the bin plate is provided with a bin for accommodating the cooling fins, and the positions of the pressing columns correspond to the positions of the fixed plugs of the cooling fins in the bin.
Furthermore, the bin plate also comprises a clamping slide block and a clamping spring for clamping the radiating fins;
the screens slider passes through screens spring and feed bin inner wall swing joint.
Furthermore, the screens slider is provided with the direction slope.
Furthermore, the material storage device further comprises a step screw, wherein a top cap of the step screw is buckled on the top surface of the pressing plate, and the lower end of the step screw is fixed on the material storage plate.
Furthermore, a pressing handle is arranged on the top surface of the pressing plate.
Further, the number of the pressing columns is 2 or 4; the number of the springs is 4 to 8.
Further, the bearing is a linear bearing.
Further, the bin plate is provided with a probe supported on the PCB; and a polyurethane contact is arranged at the tail end of the probe.
Furthermore, the material storage bin further comprises a blocking block, and the blocking block is connected to one side of the material storage bin plate through a turnover hinge.
Furthermore, a handheld handle is arranged on one side of the stock bin plate.
The invention provides a heat sink mounting device for mounting a heat sink of a PCB (printed circuit board), which comprises a pressing plate, a pressing column, a bin plate, a spring and a bearing. The pressing plate and the bin plate are movably connected through the spring and the bearing, the spring is compressed to rebound, the relative distance between the pressing plate and the bin plate can be changed, and the setting of the bearing ensures that the compression rebounds in-process to keep smooth and smooth linear motion. According to the pressure board and be provided with a plurality of posts of pressing, the feed bin board corresponds a plurality of posts of pressing and is provided with the through-hole, also when pressing the spring compression between pressure board and the feed bin board, is also fixed in and presses the through-hole that corresponds the position on the pressure board on the post can pass the feed bin board just. The feed bin board is provided with the feed bin that holds the fin, and the position of a plurality of posts of pressing corresponds with the fixed plug position of fin in the feed bin, when the spring compression, presses the post and can press just in the feed bin on the fixed plug of fin.
By adopting the cooling fin mounting device provided by the invention, the pressing column can be utilized to just press the position of the cooling fin fixing plug when the spring is compressed, so that the cooling fin can be easily and accurately mounted on the PCB under the pressing action of the pressing column. Both avoided the painful discomfort of artifical manual installation, guaranteed the accurate nature of pressing the position again, solved the problem that causes component damage easily in the installation, reduced the rate of reprocessing, and then improved holistic production efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of a 2 pin fin mounting arrangement according to an embodiment of the present invention;
FIG. 2 is a first schematic view of a 4-pin heat sink mounting apparatus according to an embodiment of the present invention;
FIG. 3 is a second schematic view of a 4-pin heat sink mounting apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic view of a heat sink with 2 fixed plugs according to an embodiment of the present invention;
fig. 5 is a schematic view of a heat sink with 4 fixed plugs according to an embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "comprising" and "having," and any variations thereof, as referred to in embodiments of the present invention, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The prior method for installing the radiating fin is to place the radiating fin on a PCB, align a fixed plug of the radiating fin with an installation through hole of the PCB and press the fixed plug of the radiating fin by hands or a jig. In the whole installation process, though manual installation is more accurate, pain and discomfort easily occur when hands are pressed for a long time. The problem of improper installation or position deviation often can appear in the installation of using the tool, and such condition often can cause the components and parts to damage. Manpower and material resources are consumed for repair, and the production cost is increased.
Therefore, the existing installation process of the PCB radiating fin has the technical problem of easily causing the damage of the element device, thereby increasing the repair rate and improving the production cost.
Example 1:
the heat sink mounting device provided by the embodiment of the invention is used for mounting the heat sink 14 of the PCB, and as shown in fig. 4 and 5, the heat sink is divided into two types, one type is a heat sink with 2 fixed plugs, and the other type is a heat sink with 4 fixed plugs. As shown in fig. 1 to 3, the heat sink mounting device includes a pressing plate 1, a pressing column 2, a magazine plate 3, a spring 4, and a bearing 5. Wherein fig. 1 is a 2-plug-fixed heat sink mounting device, and fig. 2 and 3 are 4-plug-fixed heat sink mounting devices. According to pressing board 1 and feed bin board 3 through spring 4 and bearing 5 swing joint, kick-back through the compression of spring 4, can change the relative distance who presses board 1 and feed bin board 3, the setting up of bearing 5 has guaranteed that the compression is kick-backed in-process and has kept in the same direction as smooth and fluent linear motion. According to the pressure board 1 and be provided with a plurality of pressing post 2, feed bin board 3 corresponds a plurality of pressing post 2 and is provided with the through-hole, also when pressing the spring 4 compression between pressure board 1 and the feed bin board 3, is fixed in and presses the through-hole that the post 2 that presses on the pressure board 1 can pass corresponding position on the feed bin board 3 just. The magazine plate 3 is provided with a magazine 13 accommodating heat sinks 14, and a plurality of pressing columns 2 are positioned corresponding to the positions of fixing plugs 15 of the heat sinks 14 in the magazine 13, and when the springs 4 are compressed, the pressing columns 2 can just press on the fixing plugs 15 of the heat sinks 14 in the magazine 13.
By adopting the heat sink mounting device provided by the invention, the pressing column 2 can be just pressed on the position of the heat sink 14 for fixing the plug 15 when the spring 4 is compressed, so that the heat sink 14 can be easily and accurately mounted on the PCB under the pressing action of the pressing column 2. Both avoided the painful discomfort of artifical manual installation, guaranteed the accurate nature of pressing the position again, solved the problem that causes component damage easily in the installation, reduced the rate of reprocessing, and then improved holistic production efficiency.
In a possible embodiment, the silo plate 3 further comprises a blocking slide 6 for blocking the heat sink 14 and a blocking spring (not shown in the figure), and the blocking slide 6 is movably connected with the inner wall of the silo 13 through the blocking spring. The clamping slide block 6 is matched with a clamping spring on the inner wall of the bin 13 to fix the radiating fins 14 in the bin 13, so that the radiating fins 14 can be stably clamped in the bin 13, and the position accuracy of the radiating fins 14 in the bin 13 is improved.
In one possible embodiment, the detent slide 6 is provided with a guide ramp. The arrangement of the guide slope facilitates the clamping of the radiating fins 14 into the stock bin 13, provides convenience for the operation of placing the radiating fins 14, and improves the operating efficiency of installing the radiating fins 14.
In a possible embodiment, the heat sink mounting device further comprises a step screw 7, the step screw 7 is capped on the top surface of the pressing plate 1, and the lower end of the step screw 7 is fixed on the material bin plate 3. The farthest distance restriction that can press down board 1 and feed bin board 3 in fixed position is prevented to setting up of step screw 7 when spring 4 resets because of the effort of resilience is too big, and will press down the problem that board 1 popped out installation device, has improved overall device's stability.
In a possible embodiment, the pressing plate 1 is provided with a pressing handle 8 on its top surface. The operating personnel can be through pressing handle 8 for spring 4 compression between pressure board 1 and the feed bin board 3, thereby the installation of convenient completion fin 14, the convenience of installation operation has been improved to the setting of pressing handle 8.
In one possible embodiment, the number of pressing studs 2 is 2 or 4. As shown in fig. 4 and 5, the number of fixing pins 15 of the heat sink 14, which is most common at present, is 2 or 4, respectively, and thus the number of pressing posts 2 provided is 2 or 4. The number of the springs 4 is 4 to 8, and the springs 4 arranged between the pressing plate 1 and the stock bin plate 3 are 4 to 8, so that the appropriate resilience force is met, and the stability of the whole device is ensured.
In one possible embodiment, the bearing 5 is a linear bearing. The linear bearing has the advantages that the bearing ball of the linear bearing is in point contact with the shaft, the steel ball rotates with extremely small friction resistance, and therefore high-precision stable motion can be achieved.
In a possible embodiment, the magazine plate 3 is provided with probes 9 supported on the PCB; the end of the probe 9 is provided with a polyurethane contact. During the installation of the heat sink 14, the probes 9 directly contact the PCB, and the probes 9 are required to support the whole device, so the position of the probes 9 can be set to avoid the position of important components on the PCB. The polyurethane contact is arranged at the tail end of the probe 9, so that a buffering effect is achieved in the press fitting process, and the damage caused by accidents of the PCB in the installation process is avoided to the maximum extent. The arrangement of the probe 9 also has a fixing effect on the PCB, and ensures that the fixing plug 15 of the radiating fin 14 can be stably and vertically pressed on the PCB.
In a possible implementation manner, the heat sink mounting device provided by the embodiment of the invention further comprises a stop block 10, and the stop block 10 is connected to one side of the bin plate 3 through a turnover hinge 11. Stop block 10 and can overturn in 3 one sides of feed bin board through the hinge, when need put into fin 14 in feed bin board 3, need will stop block 10 and overturn the outside of feed bin board 3, fin 14 puts into the completion back, it is inboard to need to stop block 10 and overturn feed bin board 3, block that this moment block 10 can play the effect that blocks to fin 14 in the feed bin 13 just, prevent the pressure equipment in-process, the problem of the fin 14 landing that appears because of the screens trouble, also avoided the too big fin 14 unstability that leads to of pressure equipment in-process pressing force and the problem of installation failure, the steadiness of fin 14 in feed bin 13 has been improved.
In a possible embodiment, the magazine plate 3 is provided with a hand-held handle 12 on one side. The handheld handle 12 is arranged, so that the portability of the cooling fin mounting device is improved, and convenience is provided for operators to carry the device.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The apparatus provided by the embodiment of the present invention may be specific hardware on the device, or software or firmware installed on the device, etc. The device provided by the embodiment of the present invention has the same implementation principle and technical effect as the method embodiments, and for the sake of brief description, reference may be made to the corresponding contents in the method embodiments without reference to the device embodiments.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; and the modifications, changes or substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Are intended to be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A heat sink mounting device is characterized in that a heat sink for mounting a PCB comprises a pressing plate, a pressing column, a stock bin plate, a spring and a bearing;
the pressing plate is movably connected with the bin plate through a spring and a bearing, and the relative distance between the pressing plate and the bin plate can be changed through compression and rebound of the spring;
the pressing plate is provided with a plurality of pressing columns, and the bin plate is provided with through holes corresponding to the plurality of pressing columns;
the bin plate is provided with a bin for accommodating the cooling fins, and the positions of the pressing columns correspond to the positions of the fixed plugs of the cooling fins in the bin.
2. The heat sink mounting apparatus according to claim 1, wherein the magazine plate further comprises a locking slider and a locking spring for locking the heat sink;
the screens slider passes through screens spring and feed bin inner wall swing joint.
3. The heat sink mounting apparatus of claim 2, wherein the detent slider is provided with a guide ramp.
4. The heat sink mounting apparatus as claimed in claim 1, further comprising a step screw, wherein a top cap of the step screw is fastened to the top surface of the pressing plate, and a lower end of the step screw is fixed to the magazine plate.
5. The heat sink mounting apparatus according to claim 1, wherein the pressing plate is provided with a pressing handle on a top surface thereof.
6. The heat sink mounting apparatus according to claim 1, wherein the number of pressing posts is 2 or 4; the number of the springs is 4 to 8.
7. The heat sink mounting apparatus of claim 1, wherein the bearing is a linear bearing.
8. The heat sink mounting apparatus according to claim 1, wherein the magazine plate is provided with probes supported to a PCB; and a polyurethane contact is arranged at the tail end of the probe.
9. The fin mounting device according to claim 1, further comprising a stopper connected to one side of the hopper plate by a flip hinge.
10. The heat sink mounting apparatus according to claim 1, wherein a hand-held handle is provided on one side of the magazine plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011138728.2A CN112533440B (en) | 2020-10-22 | 2020-10-22 | Cooling fin installation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011138728.2A CN112533440B (en) | 2020-10-22 | 2020-10-22 | Cooling fin installation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112533440A true CN112533440A (en) | 2021-03-19 |
| CN112533440B CN112533440B (en) | 2022-06-03 |
Family
ID=74980268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011138728.2A Active CN112533440B (en) | 2020-10-22 | 2020-10-22 | Cooling fin installation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112533440B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208141282U (en) * | 2018-04-02 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of server board radiation fin assembly tool |
| CN210670716U (en) * | 2019-07-22 | 2020-06-02 | 深圳市翔智达科技有限公司 | High heat dissipation type PCB mainboard |
| CN211090407U (en) * | 2019-11-22 | 2020-07-24 | 苏州浪潮智能科技有限公司 | Radiating fin fixing structure |
| CN211090387U (en) * | 2019-10-31 | 2020-07-24 | 苏州浪潮智能科技有限公司 | Novel radiating fin fixing device |
-
2020
- 2020-10-22 CN CN202011138728.2A patent/CN112533440B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208141282U (en) * | 2018-04-02 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of server board radiation fin assembly tool |
| CN210670716U (en) * | 2019-07-22 | 2020-06-02 | 深圳市翔智达科技有限公司 | High heat dissipation type PCB mainboard |
| CN211090387U (en) * | 2019-10-31 | 2020-07-24 | 苏州浪潮智能科技有限公司 | Novel radiating fin fixing device |
| CN211090407U (en) * | 2019-11-22 | 2020-07-24 | 苏州浪潮智能科技有限公司 | Radiating fin fixing structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112533440B (en) | 2022-06-03 |
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