CN112531446A - Missile-borne laser module - Google Patents
Missile-borne laser module Download PDFInfo
- Publication number
- CN112531446A CN112531446A CN201910829994.0A CN201910829994A CN112531446A CN 112531446 A CN112531446 A CN 112531446A CN 201910829994 A CN201910829994 A CN 201910829994A CN 112531446 A CN112531446 A CN 112531446A
- Authority
- CN
- China
- Prior art keywords
- metal sheet
- light source
- laser light
- laser
- electric switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000005357 flat glass Substances 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000003721 gunpowder Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Lasers (AREA)
Abstract
The utility model provides a missile-borne laser module, includes window glass, encapsulation casing, laser light source, anodal connecting wire, anodal sheetmetal, negative pole connecting wire, cylindrical battery, negative pole sheetmetal, electric switch, apron and set screw. The invention supplies power to the laser light source through the columnar battery, realizes the switch of laser emission through the on-off of the connection of the electric switch and the negative metal sheet, greatly improves the capabilities of high temperature resistance, high air pressure resistance and high impact resistance, and has the advantages of compact structure, convenient assembly and adjustment, high reliability and the like.
Description
Technical Field
The invention belongs to the field of photoelectric devices, and relates to a missile-borne laser module.
Background
The laser module has wide application in the fields of laser communication, laser ranging, sensing and the like, and in the military field, a laser component on a gun is used as a collimation emission light source and is the most key component of a semi-constrained-period projectile motion attitude (rotation and shaking) parameter measurement system, and the performance of the device directly determines the accuracy and reliability of measurement parameters. The shot launching of the conventional artillery is based on a driving mechanism of high impact force (acceleration) generated by high temperature and high air pressure caused by ignition and instantaneous explosion of gunpowder in a shell case of a gun bore, so that the laser module is determined to work in three-high and strong vibration environments, and high requirements are provided for the structure and the reliability of the laser module.
Disclosure of Invention
The invention provides a laser module for missile loading, aims to meet the use requirements under high temperature, high air pressure and high impact force, and has the advantages of compact structure, convenience in assembly and adjustment operation, high reliability and the like.
The technical solution of the invention is as follows:
a missile-borne laser module is characterized by comprising window glass, a packaging shell, a laser light source, a positive connecting wire, a positive metal sheet, a negative connecting wire, a columnar battery, a negative metal sheet, a cover plate, an electric switch and a positioning screw, wherein the window glass is adhered to the front end of the packaging shell, and the laser light source is placed into the packaging shell to the bottom; the anode connecting wire of the laser light source is welded with the anode metal sheet, and the cathode connecting wire of the laser light source is welded with the electric switch; placing the positive metal sheet, the columnar battery and the negative metal sheet into the packaging shell, so that the positive electrode of the columnar battery is in close contact with the positive metal sheet, and the negative electrode of the columnar battery is in close contact with the negative metal sheet; the electric switch is embedded into the central hole of the cover plate, and then the cover plate is fixed on the rear end of the packaging shell through the positioning screw; and moving the electric switch, and when the electric switch is contacted with the negative metal sheet, the laser light source emits laser through the window glass.
The light emitting chip of the laser light source is a single semiconductor laser chip.
The laser light source is provided with a collimating lens.
The packaging shell and the cover plate are made of electric insulating materials.
A missile-borne laser module is characterized in that the installation and adjustment method comprises the following steps:
firstly, adhering window glass to the front end of a packaging shell;
secondly, placing a laser light source into the packaging shell;
connecting the positive connecting wire of the laser light source with the positive metal sheet;
fourthly, connecting the negative connecting wire of the laser light source with the electric switch;
putting the positive pole metal sheet, the columnar battery and the negative pole metal sheet into the packaging shell to enable the positive pole of the columnar battery to be in close contact with the positive pole metal sheet and the negative pole metal sheet to be in close contact with the negative pole of the columnar battery;
sixthly, the electric switch is embedded into the central hole of the cover plate;
the cover plate is fixed on the rear end surface of the packaging shell by a positioning screw;
moving the electric switch inwards, and emitting laser by the laser source when the electric switch is in close contact with the cathode metal sheet; and moving the electric switch outwards, and disconnecting the power supply of the laser light source after the electric switch leaves the negative metal sheet, wherein no laser is emitted.
The invention has the advantages that: the module supplies power to the laser light source through the columnar battery, realizes the laser emission switch through the on-off of the electric switch connected with the negative metal sheet, has the advantages of compact structure, convenient assembly and adjustment and the like, greatly improves the capabilities of high temperature resistance, high air pressure resistance and high impact resistance, and meets the requirement of high reliability.
Drawings
FIG. 1 is a schematic structural diagram of a laser module according to an embodiment 1 of the present invention;
Detailed Description
Referring to fig. 1, fig. 1 is a schematic structural diagram of a missile-borne laser module in an embodiment 1 of the present invention, and it can be seen from the diagram that the missile-borne laser module in the embodiment includes a window glass 11, a package housing 12, a laser light source 13, an anode connection line 14, an anode metal sheet 15, a cathode connection line 16, a cylindrical battery 17, a cathode metal sheet 18, a cover plate 19, an electric switch 20, and a positioning screw 21. Firstly, adhering quartz window glass 11 to the front end of a packaging shell 12 by using optical epoxy glue, and putting a laser light source 13 into the packaging shell 12 to the bottom; welding the positive connecting wire 14 on the laser light source 13 on the positive metal sheet 15 by using an electric iron, and welding the negative connecting wire 16 on the laser light source 13 with the electric switch 20 by using the electric iron; placing the positive pole metal sheet 15, the columnar battery 17 and the negative pole metal sheet 18 into the packaging shell 12, so that the positive pole of the columnar battery 17 is tightly contacted with the positive pole metal sheet 15, and the negative pole of the columnar battery 17 is tightly contacted with the negative pole metal sheet 18; the electric switch 20 is inserted into the central hole of the cover plate 19, and the cover plate 19 is fixed to the rear end of the package housing 12 by the set screw 21.
The light emitting chip of the laser light source 13 is a single semiconductor laser chip.
The laser light source 13 has a collimating lens.
The package housing 12 and the cover plate 19 are made of an electrically insulating material.
When the electric switch 20 is moved and the electric switch 20 is in contact with the negative metal plate 18, the laser light source 13 emits laser light through the window glass 11.
When the electric switch 20 is moved outwards and leaves the negative metal sheet 18, the power supply of the laser light source 13 is disconnected, and no laser is emitted.
Experiments show that the missile-borne laser module supplies power to a laser light source through the columnar battery, realizes laser emission through the contact of the movable electric switch and the negative metal sheet, has the advantages of compact structure, convenience in assembly and adjustment and the like, greatly improves the high temperature resistance, high air pressure resistance and high impact resistance, and meets the requirement of high reliability.
Claims (4)
1. A missile-borne laser module is characterized by comprising window glass (11), a packaging shell (12), a laser light source (13), an anode connecting wire (14), an anode metal sheet (15), a cathode connecting wire (16), a columnar battery (17), a cathode metal sheet (18), a cover plate (19), an electric switch (20) and a positioning screw (21), wherein the window glass (11) is bonded to the front end of the packaging shell (12), and the laser light source (13) is placed in the packaging shell (12) to the bottom; the positive connecting wire (14) of the laser light source (13) is welded with the positive metal sheet (15), and the negative connecting wire (16) of the laser light source (13) is welded with the electric switch (20); placing the positive pole metal sheet (15), the columnar battery (17) and the negative pole metal sheet (18) into the packaging shell (12), so that the positive pole of the columnar battery (17) is tightly contacted with the positive pole metal sheet (15), and the negative pole of the columnar battery (17) is tightly contacted with the negative pole metal sheet (18); the electric switch (20) is embedded into the central hole of the cover plate (19), and then the cover plate (19) is fixed on the rear end of the packaging shell (12) through the positioning screw (21); and moving the electric switch (20), and when the electric switch (20) is contacted with the negative metal sheet (18), the laser light source (13) emits laser through the window glass (11).
2. The missile-borne laser module as claimed in claim 1, wherein the light emitting chip of the laser light source (13) is a single semiconductor laser chip.
3. The missile-borne laser module according to claim 1, wherein the laser light source (13) is provided with a collimating lens.
4. A missile-borne laser module according to any one of claims 1 to 3, wherein the encapsulating housing (12) and the cover plate (19) are made of an electrically insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910829994.0A CN112531446A (en) | 2019-09-04 | 2019-09-04 | Missile-borne laser module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910829994.0A CN112531446A (en) | 2019-09-04 | 2019-09-04 | Missile-borne laser module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112531446A true CN112531446A (en) | 2021-03-19 |
Family
ID=74974339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910829994.0A Pending CN112531446A (en) | 2019-09-04 | 2019-09-04 | Missile-borne laser module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112531446A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203763675U (en) * | 2014-01-27 | 2014-08-13 | 重庆虹腾纤宝科技有限公司 | Red-light therapeutic pen |
| CN104377542A (en) * | 2014-12-04 | 2015-02-25 | 中国科学院半导体研究所 | Pin type packaging structure and method for semiconductor laser |
| CN204584540U (en) * | 2015-03-31 | 2015-08-26 | 西安炬光科技有限公司 | A kind of high-power semiconductor laser light source for processing system |
| CN105204167A (en) * | 2014-06-30 | 2015-12-30 | 山东华光光电子有限公司 | Edge emission laser illumination module group with insulated shell |
| CN109631693A (en) * | 2019-01-25 | 2019-04-16 | 泉州信息工程学院 | A kind of high-performance missile-borne laser |
-
2019
- 2019-09-04 CN CN201910829994.0A patent/CN112531446A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203763675U (en) * | 2014-01-27 | 2014-08-13 | 重庆虹腾纤宝科技有限公司 | Red-light therapeutic pen |
| CN105204167A (en) * | 2014-06-30 | 2015-12-30 | 山东华光光电子有限公司 | Edge emission laser illumination module group with insulated shell |
| CN104377542A (en) * | 2014-12-04 | 2015-02-25 | 中国科学院半导体研究所 | Pin type packaging structure and method for semiconductor laser |
| CN204584540U (en) * | 2015-03-31 | 2015-08-26 | 西安炬光科技有限公司 | A kind of high-power semiconductor laser light source for processing system |
| CN109631693A (en) * | 2019-01-25 | 2019-04-16 | 泉州信息工程学院 | A kind of high-performance missile-borne laser |
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