CN112530704A - Solid-state capacitor and manufacturing method thereof - Google Patents

Solid-state capacitor and manufacturing method thereof Download PDF

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Publication number
CN112530704A
CN112530704A CN202011433946.9A CN202011433946A CN112530704A CN 112530704 A CN112530704 A CN 112530704A CN 202011433946 A CN202011433946 A CN 202011433946A CN 112530704 A CN112530704 A CN 112530704A
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manufacturing
core
capacitor
solid
core bag
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何东石
刘泳澎
伍小军
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Zhaoqing Beryl Electronic Technology Co ltd
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Zhaoqing Beryl Electronic Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029Processes of manufacture
    • H01G9/0036Formation of the solid electrolyte layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/04Drying; Impregnating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15Solid electrolytic capacitors
    • H01G9/151Solid electrolytic capacitors with wound foil electrodes

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The invention discloses a solid-state capacitor and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a core package by the anode foil, the cathode foil and the electrolytic paper; then sequentially impregnating the core bag with a monomer and an oxidant, and forming a conductive polymer in the core bag by heating and polymerizing; immersing the polymerized core bag into absolute ethyl alcohol, and drying after immersing for a period of time; and (5) putting the dried core bag into an aluminum shell for sealing and aging. The manufacturing method can avoid the problems that when the product is subjected to high-temperature reflow soldering, the substances volatilize to generate a large amount of gas, so that the internal pressure of the capacitor is too high, protruding colloidal particles and even colloidal particles are easy to crack, and the leakage current of the product is increased along with the cracking, so that the product meets the requirement of the high-temperature reflow soldering; meanwhile, the damage of high-temperature treatment to the oxide film of the capacitor can be avoided, and the characteristics and the service life of the product can be ensured not to be influenced or even better.

Description

Solid-state capacitor and manufacturing method thereof
Technical Field
The invention relates to the technical field of electrolytic capacitors, in particular to a solid-state capacitor and a manufacturing method thereof.
Background
More and more solid capacitors need to be subjected to reflow soldering when being applied, but when the solid capacitors are manufactured by the prior art, because raw materials are not completely reacted and a large amount of byproducts are generated after in-situ polymerization reaction, when the solid capacitors are subjected to high-temperature reflow soldering, the substances are volatilized to generate a large amount of gas, so that the internal pressure of the capacitors is overlarge, the problem that convex colloidal particles or even colloidal particles are cracked is easily caused, and the leakage current of products is increased.
In order to solve the above problems, chinese patent 201711440213.6 discloses a method for manufacturing a solid capacitor, which includes the following steps: s1, winding into a core package; numbering each core package; s2, detecting whether the core packages are short-circuited one by one, and immersing the core packages qualified in detection into formation liquid for formation repair treatment; during the formation repair treatment, the positive electrode guide pin and the negative electrode guide pin of the core package are respectively and electrically connected with the positive electrode and the negative electrode of the power supply; detecting residual currents of the core packages one by one after formation repair treatment; s3, drying the core bag; s4, dipping the core wrap in a monomer solution for impregnation treatment; s5, after the impregnation treatment is finished, drying the core wrap; s6, injecting a quantitative oxidant into the core bag; s7, heating to carry out polymerization reaction, and generating a conductive polymer in the core bag; s8, carrying out high-temperature treatment on the polymerized product, wherein the temperature is between 190 ℃ and 210 ℃, and the time is about 30-50 min; s8, assembling and sealing; s10, aging. However, there are the following problems: although the unreacted materials can be cracked and volatilized at high temperature, the unreacted materials are cracked and simultaneously damage the oxide film of the capacitor at the high temperature of 190-210 ℃, so that the leakage current of the product is increased, and the defective product or the potential safety hazard is easily caused.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides a solid capacitor and a manufacturing method thereof, which can solve the problems of reflow soldering resistance and electric leakage rise resistance of the solid capacitor, avoid the damage of high-temperature treatment on an oxide film of the capacitor and simultaneously avoid influencing the service life of a product.
The technical problem to be solved by the invention is realized by the following technical scheme:
a method for manufacturing a solid capacitor comprises the following steps: forming a core package by the anode foil, the cathode foil and the electrolytic paper; then sequentially impregnating the core bag with a monomer and an oxidant, and forming a conductive polymer in the core bag by heating and polymerizing; immersing the polymerized core bag into absolute ethyl alcohol, and drying after immersing for a period of time; and (5) putting the dried core bag into an aluminum shell for sealing and aging.
As a preferred embodiment of the method for manufacturing the solid-state capacitor provided by the present invention, when the core package after polymerization is immersed in the absolute ethyl alcohol, the absolute ethyl alcohol is in a room temperature state.
In a preferred embodiment of the method for manufacturing a solid-state capacitor provided by the present invention, the soaking time is 5 to 30 min.
As a preferred embodiment of the manufacturing method of the solid-state capacitor provided by the invention, the drying temperature is 90-120 ℃, and the drying time is 30-120 min.
In a preferred embodiment of the method for manufacturing a solid capacitor according to the present invention, the core package further includes a pretreatment agent before impregnation with the monomer.
In a preferred embodiment of the method for manufacturing a solid capacitor according to the present invention, the pretreatment agent is an organic solvent solution of polydimethylsiloxane.
In a preferred embodiment of the method for manufacturing a solid capacitor according to the present invention, the step of treating with a pre-impregnation agent further includes a chemical conversion treatment of the core pack to repair an oxide film on the surface of the anode foil.
In a preferred embodiment of the method for manufacturing a solid-state capacitor according to the present invention, the monomer and/or the oxidizing agent is impregnated into the core pack or injected into the core pack.
As a preferred embodiment of the method for manufacturing a solid-state capacitor provided by the present invention, the step of forming the core package by combining the anode foil, the cathode foil and the electrolytic paper refers to folding or winding the anode foil, the cathode foil and the electrolytic paper into the core package.
A solid capacitor is prepared by the manufacturing method.
The invention has the following beneficial effects:
the invention firstly proposes that the core bag after polymerization is immersed in absolute ethyl alcohol for a period of time and then dried, so that the solubility of unreacted substances (monomers and oxidants) in the absolute ethyl alcohol is extremely high, and the cleaning effect on the unreacted substances is stronger; the absolute ethyl alcohol can not damage the capacitor polymer; the absolute ethyl alcohol has low boiling point, and is easy to dry after being cleaned. The manufacturing method can avoid the problems that when the product is subjected to high-temperature reflow soldering, the substances volatilize to generate a large amount of gas, so that the internal pressure of the capacitor is too high, protruding colloidal particles and even colloidal particles are easy to crack, and the leakage current of the product is increased along with the cracking, so that the product meets the requirement of the high-temperature reflow soldering; meanwhile, the damage of high-temperature treatment to the oxide film of the capacitor can be avoided, and the characteristics and the service life of the product can be ensured not to be influenced or even better.
Drawings
FIG. 1 is a graph showing the results of reflow tests conducted in examples 1 to 3 of the present invention and comparative examples 1 to 7.
FIG. 2 is a graph showing the tendency of capacity fade after high temperature life tests at 105 ℃ were carried out for examples 1 to 3 and comparative examples 1 to 7 of the present invention.
Detailed Description
The present invention will be described in detail with reference to examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention.
Example 1
A method for manufacturing a solid capacitor, the specification of the capacitor is 1000uF/6.3V and 6.3mm x 11mm, and the manufacturing method comprises the following steps:
(1) cutting the anode foil, the cathode foil and the electrolytic paper into preset sizes, and fixedly connecting an anode lead and a cathode lead on the anode foil and the cathode foil; winding the anode foil, the electrolytic paper and the cathode foil into a core package;
(2) performing chemical conversion treatment on the core package to repair an oxide film on the surface of the anode foil;
(3) impregnating with a pretreatment agent, and drying; the pretreatment agent is an organic solvent solution of polydimethylsiloxane;
(4) polymerizing, namely, impregnating the core wrap in the step (3) with a monomer solution, and drying; soaking in oxidant; heating and polymerizing to form a conductive polymer in the core cladding;
(5) immersing the polymerized core bag into absolute ethyl alcohol at room temperature for 5 min; drying the core bag, keeping the temperature of an oven at 90 ℃ and controlling the time at 30 min;
(6) and (5) putting the dried core bag into an aluminum shell for sealing and aging.
The capacitor of this example was subjected to a 105 ℃ high temperature life test, and the test results are shown in Table 1.
Figure 739102DEST_PATH_IMAGE002
Example 2
The present embodiment is different from embodiment 1 in that: the dipping time in the step (5) is 15 min.
The capacitor of this example was subjected to a 105 ℃ high temperature life test, and the test results are shown in Table 2.
Figure 764564DEST_PATH_IMAGE004
Example 3
The present embodiment is different from embodiment 1 in that: the dipping time in the step (5) is 30 min.
The capacitor of this example was subjected to a 105 ℃ high temperature life test, and the test results are shown in Table 3.
Figure 747564DEST_PATH_IMAGE006
Example 4
The present embodiment is different from embodiment 1 in that: the step (4) is specifically changed into the following steps: injecting a monomer solution into the core bag in the step (3), and drying; secondly, continuously injecting an oxidizing agent; heating and polymerizing to form the conductive polymer in the core bag.
Comparative example 1
This comparative example differs from example 1 in that: step (5) is removed.
The comparative example capacitor was subjected to a high temperature life test at 105 ℃ and the test results are shown in Table 4, respectively.
Figure 457287DEST_PATH_IMAGE008
Comparative example 2
This comparative example differs from example 1 in that: the step (5) is modified as follows: and (3) treating the polymerized core package at the high temperature of 200 ℃ for 30 min.
The comparative example capacitor was subjected to a high temperature life test at 105 ℃ and the test results are shown in Table 5, respectively.
Figure DEST_PATH_IMAGE010
Comparative example 3
This comparative example differs from example 1 in that: the step (5) is modified as follows: and (3) treating the polymerized core package at the high temperature of 200 ℃ for 40 min.
The comparative example capacitor was subjected to a high temperature life test at 105 ℃ and the test results are shown in Table 6, respectively.
Figure DEST_PATH_IMAGE012
Comparative example 4
This comparative example differs from example 1 in that: the step (5) is modified as follows: and (3) treating the polymerized core package at the high temperature of 200 ℃ for 50 min.
The comparative example capacitor was subjected to a high temperature life test at 105 ℃ and the test results are shown in Table 7, respectively.
Figure DEST_PATH_IMAGE014
Comparative example 5
This comparative example differs from example 1 in that: the step (5) is modified as follows: immersing the polymerized core bag into water at the temperature of 40 ℃ for 5 min; and drying the core bag, and keeping the temperature of an oven at 120 ℃ for 60 min.
The comparative example capacitor was subjected to a high temperature life test at 105 ℃ and the test results are shown in Table 8, respectively.
Figure DEST_PATH_IMAGE016
Comparative example 6
This comparative example differs from example 1 in that: the step (5) is modified as follows: immersing the polymerized core bag into water at the temperature of 40 ℃ for 15 min; and drying the core bag, and keeping the temperature of an oven at 120 ℃ for 60 min.
The comparative example capacitor was subjected to a high temperature life test at 105 ℃ and the test results are shown in Table 9, respectively.
Figure DEST_PATH_IMAGE018
Comparative example 7
This comparative example differs from example 1 in that: the step (5) is modified as follows: immersing the polymerized core bag into water at the temperature of 40 ℃ for 30 min; and drying the core bag, and keeping the temperature of an oven at 120 ℃ for 60 min.
The comparative example capacitor was subjected to a high temperature life test at 105 ℃ and the test results are shown in Table 10, respectively.
Figure DEST_PATH_IMAGE020
Examples 1 to 3 and comparative examples 1 to 7 were subjected to reflow testing, and the test results are shown in FIG. 1. FIG. 2 is a graph showing the tendency of capacity fade after high temperature life tests at 105 ℃ were carried out for examples 1 to 3 and comparative examples 1 to 7. In order to solve the technical problems that in the prior art, unreacted materials are cracked at a high temperature of 190-210 ℃ and simultaneously great damage is caused to an oxide film of a capacitor, so that leakage current of a product is increased, and a defective product or potential safety hazards are easily caused, the inventor firstly proposes that a core cladding after polymerization is immersed into absolute ethyl alcohol to dissolve the unreacted materials so as to clean the unreacted materials as far as possible, and then the absolute ethyl alcohol used as a cleaning agent is vaporized and evaporated through drying. Unreacted materials are completely dissolved in the absolute ethyl alcohol and are carried away along with the absolute ethyl alcohol. After cleaning, the core bag inevitably has residual anhydrous ethanol, unreacted substances are dissolved in the anhydrous ethanol, and then the anhydrous ethanol is evaporated through drying, so that the unreacted substances cannot be evaporated, and the unreacted substances in the anhydrous ethanol can remain in the core bag, but the amount is very small, and the problem of gas drum of a product during high-temperature reflow soldering cannot be caused, so that the unreacted substances can be ignored, the problem of damage of high temperature to an oxide film is solved, and the problem of overlarge capacity attenuation is greatly improved. The water is used for dissolving the unreacted materials and then drying, so that the problem that the oxide film is damaged by high temperature is solved to a certain extent, but the water is easy to remain after a plurality of drying or the immersion is not enough for a long time, so that the unreacted materials are not thoroughly cleaned, and the problem that the convex colloidal particles or the burst colloidal particles appear after the high-temperature reflow soldering is easily caused.
The above-mentioned embodiments only express the embodiments of the present invention, and the description is more specific and detailed, but not understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by using the equivalent substitution or the equivalent transformation should fall within the protection scope of the present invention.

Claims (9)

1. A method for manufacturing a solid capacitor is characterized by comprising the following steps: forming a core package by the anode foil, the cathode foil and the electrolytic paper; then sequentially impregnating the core bag with a monomer and an oxidant, and forming a conductive polymer in the core bag by heating and polymerizing; immersing the polymerized core bag into absolute ethyl alcohol, and drying after immersing for a period of time; and (5) putting the dried core bag into an aluminum shell for sealing and aging.
2. The method of claim 1, wherein the polymeric core package is immersed in the absolute ethanol, and the absolute ethanol is at room temperature.
3. A method of fabricating a solid state capacitor according to any one of claims 1 or 2 wherein the period of immersion is 5 to 30 minutes.
4. The method for manufacturing a solid capacitor as claimed in claim 3, wherein the drying temperature is 90-120 ℃ and the drying time is 30-120 min.
5. The method of manufacturing a solid capacitor as claimed in claim 1, further comprising a pre-impregnation treatment step before the core pack is impregnated with the monomer.
6. The method of manufacturing a solid capacitor as claimed in claim 5, wherein the pretreatment agent is an organic solvent solution of polydimethylsiloxane.
7. The method of manufacturing a solid capacitor according to claim 5 or 6, wherein the step of treating with a pre-impregnation agent further comprises a chemical conversion treatment of the core pack to repair an oxide film on the surface of the anode foil.
8. The method of manufacturing a solid capacitor as claimed in claim 1, wherein the monomer and/or the oxidant is impregnated into the core pack or injected into the core pack.
9. A solid-state capacitor produced by the production method according to any one of claims 1 to 8.
CN202011433946.9A 2020-12-10 2020-12-10 Solid-state capacitor and manufacturing method thereof Pending CN112530704A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373509A (en) * 1989-08-15 1991-03-28 Marcon Electron Co Ltd Manufacture of solid electrolytic capacitor
US20110119879A1 (en) * 2009-11-20 2011-05-26 Sanyo Electric Co., Ltd. Method of manufacturing solid electrolytic capacitor
CN110993354A (en) * 2019-12-02 2020-04-10 湖南艾华集团股份有限公司 Manufacturing method of solid-state aluminum electrolytic capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373509A (en) * 1989-08-15 1991-03-28 Marcon Electron Co Ltd Manufacture of solid electrolytic capacitor
US20110119879A1 (en) * 2009-11-20 2011-05-26 Sanyo Electric Co., Ltd. Method of manufacturing solid electrolytic capacitor
CN110993354A (en) * 2019-12-02 2020-04-10 湖南艾华集团股份有限公司 Manufacturing method of solid-state aluminum electrolytic capacitor

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