CN112509960B - Positioning method for 3D wafer ring after cutting - Google Patents
Positioning method for 3D wafer ring after cutting Download PDFInfo
- Publication number
- CN112509960B CN112509960B CN202011239336.5A CN202011239336A CN112509960B CN 112509960 B CN112509960 B CN 112509960B CN 202011239336 A CN202011239336 A CN 202011239336A CN 112509960 B CN112509960 B CN 112509960B
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- wafer
- positioning
- cutting
- long side
- short side
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- 238000000034 method Methods 0.000 title claims abstract description 12
- 230000002159 abnormal effect Effects 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a positioning method after 3D wafer ring cutting, which comprises the steps of firstly carrying out ring cutting on a wafer, removing abnormal thickness parts of an outer ring of the wafer, carrying out two-step flat cutting on the wafer after ring cutting, and processing a short side and a long side; positioning one side of the short side in a physical mode, identifying the long side by a photosensitive sensor, and positioning one side of the long side; the scheme cancels positioning points of the edge of the wafer and provides possibility for secondary circular cutting processing of the edge of the 3D wafer; and the long side and the short side are machined on the edge of the wafer after circular cutting, the long side is identified by the equipment lens, and meanwhile, the physical positioning is realized by utilizing the other short side, so that the detectable inspection area is increased, the positioning difficulty is reduced, the advantages of optical positioning and physical positioning are combined, and the positioning precision is improved.
Description
Technical Field
The invention relates to a positioning method for a 3D wafer ring after cutting, and belongs to the technical field of semiconductor processing.
Background
When the wafer is processed, the positioning is needed by the identification sensor, a small positioning point is made on the outer edge of the wafer in the existing method, but the peripheral thickness of the wafer changes due to the implementation of the existing 3D wafer, so that the equipment frequently generates a poor positioning alarm when the wafer is positioned, and the production efficiency is seriously influenced.
Disclosure of Invention
Aiming at the technical problems, the invention aims at: a positioning method for a 3D wafer ring after cutting is provided.
The technical solution of the invention is realized as follows: the positioning method after the circular ring cutting of the 3D wafer comprises the steps of firstly carrying out circular cutting on the wafer, removing abnormal thickness parts of the outer ring of the wafer, carrying out two-step flat cutting on the wafer after circular cutting, and processing a short side and a long side; one side of the short side is positioned in a physical mode, the long side is identified through the photosensitive sensor, and one side of the long side is positioned.
Preferably, the central lines of the short side and the long side are perpendicular to each other.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
the scheme cancels positioning points of the edge of the wafer and provides possibility for secondary circular cutting processing of the edge of the 3D wafer; and the long side and the short side are machined on the edge of the wafer after circular cutting, the long side is identified by the equipment lens, and meanwhile, the physical positioning is realized by utilizing the other short side, so that the detectable inspection area is increased, the positioning difficulty is reduced, the advantages of optical positioning and physical positioning are combined, and the positioning precision is improved.
Drawings
The technical scheme of the invention is further described below with reference to the accompanying drawings:
fig. 1 is a schematic diagram of a positioning method after a 3D wafer ring is cut according to the present invention.
Detailed Description
The invention is described below with reference to the accompanying drawings.
As shown in figure 1, in the positioning method after the 3D wafer ring cutting, firstly, ring cutting is carried out on a wafer 1, abnormal thickness parts 2 on the outer ring of the wafer 1 are removed, then, two layers of flat cutting are carried out on the wafer 1 after ring cutting, and a short side 3 and a long side 4 are processed; the short side 3 and the long side 4 are processed by laser or physical cutting, and the central lines of the short side 3 and the long side 4 are perpendicular to each other.
Positioning one side of the short side 3 in a physical way, such as a platform butt joint way; and the long side 3 is identified by a photosensitive sensor such as a lens, and the positioning of one side of the long side is performed.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and to implement the same, but are not intended to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (2)
1. The positioning method after the 3D wafer ring is cut is characterized by comprising the following steps of: firstly, carrying out circular cutting on a wafer (1), removing a thickness abnormal part (2) of an outer ring of the wafer (1), and then carrying out two-step flat cutting on the circular-cut wafer (1) to process a short side (3) and a long side (4); one side of the short side (3) is positioned in a physical mode, and the long side (3) is identified by a photosensitive sensor to position one side of the long side.
2. The method for positioning a 3D wafer after dicing according to claim 1, wherein: the central lines of the short side (3) and the long side (4) are mutually perpendicular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011239336.5A CN112509960B (en) | 2020-11-09 | 2020-11-09 | Positioning method for 3D wafer ring after cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011239336.5A CN112509960B (en) | 2020-11-09 | 2020-11-09 | Positioning method for 3D wafer ring after cutting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112509960A CN112509960A (en) | 2021-03-16 |
| CN112509960B true CN112509960B (en) | 2024-04-09 |
Family
ID=74955692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011239336.5A Active CN112509960B (en) | 2020-11-09 | 2020-11-09 | Positioning method for 3D wafer ring after cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112509960B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09213771A (en) * | 1996-01-31 | 1997-08-15 | Tamagawa Mach Kk | Wafer direction setter |
| CN101459102A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Wafer positioning method |
| CN103426786A (en) * | 2012-05-23 | 2013-12-04 | 旺矽科技股份有限公司 | Method for angularly positioning a wafer carrier ring assembly and mechanism for implementing the method |
| CN107622963A (en) * | 2017-09-25 | 2018-01-23 | 武汉新芯集成电路制造有限公司 | A kind of wafer direction identifying system and wafer transfer box |
| JP2019195015A (en) * | 2018-05-01 | 2019-11-07 | 株式会社ディスコ | Processing device |
-
2020
- 2020-11-09 CN CN202011239336.5A patent/CN112509960B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09213771A (en) * | 1996-01-31 | 1997-08-15 | Tamagawa Mach Kk | Wafer direction setter |
| CN101459102A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Wafer positioning method |
| CN103426786A (en) * | 2012-05-23 | 2013-12-04 | 旺矽科技股份有限公司 | Method for angularly positioning a wafer carrier ring assembly and mechanism for implementing the method |
| CN107622963A (en) * | 2017-09-25 | 2018-01-23 | 武汉新芯集成电路制造有限公司 | A kind of wafer direction identifying system and wafer transfer box |
| JP2019195015A (en) * | 2018-05-01 | 2019-11-07 | 株式会社ディスコ | Processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112509960A (en) | 2021-03-16 |
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