CN112504475A - Infrared detector - Google Patents
Infrared detector Download PDFInfo
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- CN112504475A CN112504475A CN202011143572.7A CN202011143572A CN112504475A CN 112504475 A CN112504475 A CN 112504475A CN 202011143572 A CN202011143572 A CN 202011143572A CN 112504475 A CN112504475 A CN 112504475A
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- cold
- detector
- stage
- infrared detector
- finger
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- 230000013011 mating Effects 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 230000008646 thermal stress Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000002076 thermal analysis method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention discloses an infrared detector, comprising: the device comprises a detector chip, a frame, a cold finger and a cold platform; the detector chip is arranged on the frame, and the cold stage is arranged between the frame and the cold finger; the matching surface of the cold platform and the cold finger is of a non-planar structure. According to the embodiment of the invention, the matching surface of the cold stage and the cold finger is set to be a non-planar structure, so that the refrigerating area of the cold stage is increased, and the thermal stress and thermal deformation effects of the detector chip are reduced.
Description
Technical Field
The invention relates to the technical field of infrared detectors, in particular to an infrared detector.
Background
The infrared detector assembly has the characteristics of high detection precision, strong environmental adaptability and the like, and is widely applied to the fields of night vision, astronomical observation and the like. With the rapid development of infrared detectors, the size of infrared detector devices is also getting larger and larger. As the size of the detector chip is larger and larger, the chip is more easily damaged after being impacted by temperature, the performance of the detector is directly influenced, and even the chip is failed.
In the prior art, the large-array infrared focal plane detector chip has concentrated stress after temperature impact and is easy to damage.
Disclosure of Invention
The embodiment of the invention provides an infrared detector which is used for optimizing a cold stage structure, increasing the refrigerating area of a cold stage and achieving the effects of reducing the thermal stress and thermal deformation of a detector chip.
An embodiment of the present invention provides an infrared detector, including: the device comprises a detector chip, a frame, a cold finger and a cold platform;
the detector chip is arranged on the frame, and the cold stage is arranged between the frame and the cold finger;
the matching surface of the cold platform and the cold finger is of a non-planar structure.
Optionally, a silicon readout circuit is further disposed between the detector chip and the frame, and the detector chip is connected to the indium column of the silicon readout circuit.
Optionally, the cold stage is fixedly connected with the cold finger, and the cold stage and the inner cavity of the cold finger form a closed cavity through the matching surface.
Optionally, the matching surface of the cold stage and the cold finger is of an arc surface structure or a spherical surface structure.
Optionally, the matching surface of the cold platform and the cold finger is of an inward concave arc surface structure or an outward convex arc surface structure.
Optionally, the arc-shaped surface structure is determined according to a cold stage of the planar structure and a preset radius excircle.
Optionally, the cooling table is made of at least one of the following materials: kovar alloys, titanium alloys, and expansion alloys.
Optionally, the cold finger protective cover further comprises a cover component, and the cover component is sleeved on the cold finger.
According to the embodiment of the invention, the matching surface of the cold stage and the cold finger is set to be a non-planar structure, so that the refrigerating area of the cold stage is increased, and the thermal stress and thermal deformation effects of the detector chip are reduced.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic structural diagram of an infrared detector according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of an outer convex mating surface according to an embodiment of the present invention;
FIG. 3 is an enlarged schematic view of an infrared detector with a convex mating surface according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a concave mating surface according to an embodiment of the present invention;
FIG. 5 is an enlarged schematic view of an infrared detector with a concave mating surface according to an embodiment of the invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Example one
An embodiment of the present invention provides an infrared detector, as shown in fig. 1, including: the detector comprises a detector chip 1, a frame 2, a cold finger 4 and a cold platform 3;
the detector chip 1 is arranged on the frame 2, and the cold stage 3 is arranged between the frame 2 and the cold finger 4;
the matching surface of the cold platform 3 and the cold finger 4 is a non-planar structure.
Specifically, in this embodiment, the detector assembly structure is a metal package, and mainly includes a detector chip 1, a frame 2, a cold finger 4, and a cold stage 3, where the frame 2 may be a multilayer composite frame. In the embodiment, the matching surface of the cold stage 3 and the cold finger 4 is set to be a non-planar structure, so that the refrigerating area of the cold stage is increased, and the thermal stress and thermal deformation effects of the detector chip are reduced.
Optionally, the matching surface of the cold stage 3 and the cold finger 4 is an arc surface structure or a spherical surface structure.
Specifically, in order to further increase the cooling area of the cold stage, the matching surface between the cold stage 3 and the cold finger 4 in this embodiment may be an arc surface structure or a spherical surface structure, and the spherical surface structure in this embodiment may also be an ellipsoidal surface mechanism.
Optionally, a silicon readout circuit is further disposed between the detector chip 1 and the frame 2, and the detector chip 1 is connected to an indium column of the silicon readout circuit.
Specifically, in this embodiment, the silicon readout circuit and the detector chip may be formed by interconnection of indium columns and glue, and the detector hybrid chip is used to receive optical signals to complete photoelectric conversion.
Optionally, the cold stage 3 is fixedly connected with the cold finger 4, and the cold stage 3 forms a closed cavity with the inner cavity of the cold finger 4 through the matching surface.
The concrete fixing mode can be a welding or bonding mode. Further, in order to ensure the refrigeration effect, the frame 2 and the cold stage 3 can be bonded by low-temperature glue. The detector chip 1 can thus be supported by the cold plate 3. When the infrared detector works, the infrared detector can be externally connected with a refrigerator, and the refrigerator is matched with the closed cavity to supply cold energy to the detector chip 1. Wherein the cold provided by the refrigerator is conducted to the detector chip 1 by the cold stage 3, the frame 2 and the read-out circuit.
Optionally, the matching surface of the cold platform and the cold finger is of an inward concave arc surface structure or an outward convex arc surface structure.
Specifically, as shown in fig. 3 and 5, the mating surface of the cold stage and the cold finger may be a concave arc structure or a convex arc structure. As shown in fig. 3, the mating surface of the cold platform and the cold finger is a convex arc surface structure, which may be a convex spherical surface structure or a convex ellipsoidal surface structure. For example, as shown in fig. 5, the matching surface of the cold stage and the cold finger is an inward concave arc surface structure, but may also be an inward concave spherical surface structure or an inward concave ellipsoidal surface structure. That is, in the embodiment, the cooling area is increased by increasing the matching surface of the cold stage and the cold finger, so that the thermal mass of the cold head of the detector is not increased and the vacuum performance of the detector can be ensured because the basic structural parameters of the infrared detector are not changed.
Optionally, the arc-shaped surface structure is determined according to a cold stage of the planar structure and a preset radius excircle.
Specifically, as shown in fig. 2 and 4, in this embodiment, the structural parameters of the arc structure may be determined according to the cold stage 3 of the planar structure and the excircle with the preset radius, and referring to fig. 2 and 3, the matching surface of the cold stage and the cold finger is an outward convex arc structure, which may increase the matching surface outward to a set arc, a spherical arc or an ellipsoid arc on the basis of the planar structure cold stage. Referring to fig. 4 and 5, the matching surface of the cold stage and the cold finger is a concave arc surface structure, which can cut the matching surface inward to a set arc, spherical arc or ellipsoid arc on the basis of the planar structure cold stage. Therefore, the area of the matching surface is increased, and the refrigerating area is also increased.
Optionally, the cooling table is made of at least one of the following materials: kovar alloys, titanium alloys, and expansion alloys.
Specifically, in this embodiment, the material for preparing the cooling platform may be: kovar alloys, titanium alloys or expansion alloys. The material of the cold plate 3 is thermally matched to the material of the frame 2.
Optionally, the solar water heater further comprises a housing part 5, and the housing part 5 is sleeved on the cold finger 4.
Specifically, as shown in fig. 1, the housing member 5 is fitted over an end of the cold finger 4 away from the cold stage.
In the embodiment, the full-size finite element simulation model is constructed according to the actual process technical state, and ANSYS software is used for simulation comparison analysis on the scheme of the invention and the scheme that the matching surface of the cold table is of a planar structure.
The method comprises the following specific steps:
the influence of the thermal effect on the chip caused by packaging under the condition that the matching surface of the cold stage is of a planar structure is analyzed through ANSYS software. In this embodiment, the detector chip size is 36.26mm × 30.6mm, and the frame size is 45mm × 42.6mm (the frame boss size is 36.26mm × 30.6 mm). In the present embodiment, the dewar cold head mainly comprises a multilayer composite frame, a detector mixed chip and a cold platform. Wherein, each part is fixed by low-temperature glue. The multilayer composite frame is made of aluminum nitride materials, and the cold stage is made of Invar materials.
Thermal analysis and steady state analysis were performed by using simulation software. The thermal stress of the detector chip of the embodiment is 41.9MPa, and the deformation of the chip is 13.9 μm.
The influence of the thermal effect caused by encapsulation on the chip under the condition that the matching surface of the cold stage shown in fig. 2 and 3 is of the convex cambered surface structure is adopted. Except for the structure of the matching surface, the rest structures are the same as the cold table implementation case of the planar structure, and thermal analysis and steady state analysis are carried out by using simulation software. The thermal stress of the detector chip of the embodiment is 37.4MPa (reduced by 10.7% compared with a cold stage of a planar structure), and the deformation of the chip is 10.4 μm (reduced by 25.2% compared with the cold stage of the planar structure).
The influence of the thermal effect caused by packaging on the chip under the condition that the matching surface of the cold stage shown in fig. 4 and 5 is of a concave cambered surface structure is adopted. The rest structure is the same as the cold stage embodiment of the plane structure except the structure of the matching surface. Thermal analysis and steady state analysis were performed by using simulation software. The thermal stress of the detector chip of the embodiment is 44.9MPa (7.2% increase compared with a cold stage of a planar structure), and the deformation of the chip is 12.2 μm (12.2% decrease compared with the cold stage of the planar structure).
In conclusion, the structure of the cooling table is optimized by increasing the area of the contact surface of the cooling table and the refrigerating machine, so that lower thermal stress and thermal deformation of the chip can be achieved, and the reliability of a packaged product is improved. The thermal stress and the thermal deformation of the chip are reduced, and meanwhile, the thermal mass of a cold head of the detector is not increased, and the vacuum performance of the detector is guaranteed.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. An infrared detector, comprising: the device comprises a detector chip, a frame, a cold finger and a cold platform;
the detector chip is arranged on the frame, and the cold stage is arranged between the frame and the cold finger;
the matching surface of the cold platform and the cold finger is of a non-planar structure.
2. The infrared detector as set forth in claim 1, wherein a silicon readout circuit is further disposed between said detector chip and said frame, said detector chip being connected to said silicon readout circuit indium studs.
3. The infrared detector as set forth in claim 1, wherein said cold stage is fixedly attached to said cold finger, said cold stage forming a closed cavity with an inner cavity of said cold finger through said mating surface.
4. The infrared detector as set forth in claim 1, wherein the mating surface of said cold stage and said cold finger is of a cambered or spherical configuration.
5. The infrared detector as set forth in claim 4, wherein the mating surface of said cold stage and said cold finger is an inner concave arc structure or an outer convex arc structure.
6. The infrared detector as set forth in claim 4, wherein said curved surface structure is defined by a cold stage of a planar structure and a predetermined radius outer circle.
7. The infrared detector as set forth in any one of claims 1-6, wherein said cold stage is made of at least one of the following materials: kovar alloys, titanium alloys, and expansion alloys.
8. The infrared detector as claimed in any of claims 1 to 6, further comprising a housing member that fits over said cold finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011143572.7A CN112504475B (en) | 2020-10-23 | 2020-10-23 | Infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011143572.7A CN112504475B (en) | 2020-10-23 | 2020-10-23 | Infrared detector |
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| Publication Number | Publication Date |
|---|---|
| CN112504475A true CN112504475A (en) | 2021-03-16 |
| CN112504475B CN112504475B (en) | 2023-03-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011143572.7A Active CN112504475B (en) | 2020-10-23 | 2020-10-23 | Infrared detector |
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| Country | Link |
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| CN (1) | CN112504475B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113351951A (en) * | 2021-06-18 | 2021-09-07 | 中国科学院上海技术物理研究所 | Packaging structure of integrated ceramic cold platform and implementation method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5610389A (en) * | 1995-03-23 | 1997-03-11 | Rockwell International Corporation | Stabilized hybrid focal plane array structure |
| US20070029067A1 (en) * | 2005-03-09 | 2007-02-08 | Thomas Perkowski | Coaxial-flow heat transfer structures for use in diverse applications |
| CN101144738A (en) * | 2007-10-31 | 2008-03-19 | 中国科学院上海技术物理研究所 | Low temperature dewar cool platform support device for focal plane detector |
| CN103078439A (en) * | 2013-01-23 | 2013-05-01 | 无锡锡山安达防爆电气设备有限公司 | Steel-plate machine shell |
| CN205491412U (en) * | 2016-03-09 | 2016-08-17 | 东莞中子科学中心 | Proton window |
| CN207703339U (en) * | 2017-09-15 | 2018-08-07 | 武汉高芯科技有限公司 | Refrigeration mode Dewar component |
| CN210237755U (en) * | 2019-07-31 | 2020-04-03 | 威海世高光电子有限公司 | Crucible for optical coating |
| CN111595463A (en) * | 2020-05-22 | 2020-08-28 | 中国科学院上海技术物理研究所 | Split type Dewar cold platform with low contact thermal resistance and coupling stress isolation |
-
2020
- 2020-10-23 CN CN202011143572.7A patent/CN112504475B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5610389A (en) * | 1995-03-23 | 1997-03-11 | Rockwell International Corporation | Stabilized hybrid focal plane array structure |
| US20070029067A1 (en) * | 2005-03-09 | 2007-02-08 | Thomas Perkowski | Coaxial-flow heat transfer structures for use in diverse applications |
| CN101144738A (en) * | 2007-10-31 | 2008-03-19 | 中国科学院上海技术物理研究所 | Low temperature dewar cool platform support device for focal plane detector |
| CN103078439A (en) * | 2013-01-23 | 2013-05-01 | 无锡锡山安达防爆电气设备有限公司 | Steel-plate machine shell |
| CN205491412U (en) * | 2016-03-09 | 2016-08-17 | 东莞中子科学中心 | Proton window |
| CN207703339U (en) * | 2017-09-15 | 2018-08-07 | 武汉高芯科技有限公司 | Refrigeration mode Dewar component |
| CN210237755U (en) * | 2019-07-31 | 2020-04-03 | 威海世高光电子有限公司 | Crucible for optical coating |
| CN111595463A (en) * | 2020-05-22 | 2020-08-28 | 中国科学院上海技术物理研究所 | Split type Dewar cold platform with low contact thermal resistance and coupling stress isolation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113351951A (en) * | 2021-06-18 | 2021-09-07 | 中国科学院上海技术物理研究所 | Packaging structure of integrated ceramic cold platform and implementation method |
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| CN112504475B (en) | 2023-03-03 |
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