CN112499580B - 非制冷红外探测器、芯片以及芯片的制作方法 - Google Patents
非制冷红外探测器、芯片以及芯片的制作方法 Download PDFInfo
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- CN112499580B CN112499580B CN202011221554.6A CN202011221554A CN112499580B CN 112499580 B CN112499580 B CN 112499580B CN 202011221554 A CN202011221554 A CN 202011221554A CN 112499580 B CN112499580 B CN 112499580B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 25
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000000151 deposition Methods 0.000 claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 238000001459 lithography Methods 0.000 claims description 4
- 229910052702 rhenium Inorganic materials 0.000 claims description 4
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 7
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000005457 optimization Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007725 thermal activation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0083—Temperature control
- B81B7/009—Maintaining a constant temperature by heating or cooling
- B81B7/0093—Maintaining a constant temperature by heating or cooling by cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/05—Arrays
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
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CN202011221554.6A CN112499580B (zh) | 2020-11-05 | 2020-11-05 | 非制冷红外探测器、芯片以及芯片的制作方法 |
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CN202011221554.6A CN112499580B (zh) | 2020-11-05 | 2020-11-05 | 非制冷红外探测器、芯片以及芯片的制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN112499580A CN112499580A (zh) | 2021-03-16 |
CN112499580B true CN112499580B (zh) | 2024-03-26 |
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CN202011221554.6A Active CN112499580B (zh) | 2020-11-05 | 2020-11-05 | 非制冷红外探测器、芯片以及芯片的制作方法 |
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Families Citing this family (1)
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CN114203744B (zh) * | 2022-02-15 | 2022-06-10 | 武汉高芯科技有限公司 | 一种吸气剂悬空的非制冷红外探测器及其制作方法 |
Citations (7)
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CN101022071A (zh) * | 2006-02-16 | 2007-08-22 | 乐金电子(南京)等离子有限公司 | 等离子显示器 |
US7315115B1 (en) * | 2000-10-27 | 2008-01-01 | Canon Kabushiki Kaisha | Light-emitting and electron-emitting devices having getter regions |
CN106441595A (zh) * | 2016-09-28 | 2017-02-22 | 杭州大立微电子有限公司 | 红外探测器阵列级封装结构及其制造方法 |
CN206095436U (zh) * | 2016-10-21 | 2017-04-12 | 云南北方昆物光电科技发展有限公司 | 非制冷焦平面红外探测器芯片真空封装结构 |
CN106898579A (zh) * | 2015-12-18 | 2017-06-27 | 三星电机株式会社 | 晶圆级封装件及其制造方法 |
CN108313973A (zh) * | 2017-12-27 | 2018-07-24 | 武汉高德红外股份有限公司 | 一种非制冷红外探测器的像素级封装结构及加工方法 |
CN108358158A (zh) * | 2017-12-19 | 2018-08-03 | 武汉高芯科技有限公司 | 一种晶圆级封装结构、制备方法及其吸气剂的激活方法 |
-
2020
- 2020-11-05 CN CN202011221554.6A patent/CN112499580B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7315115B1 (en) * | 2000-10-27 | 2008-01-01 | Canon Kabushiki Kaisha | Light-emitting and electron-emitting devices having getter regions |
CN101022071A (zh) * | 2006-02-16 | 2007-08-22 | 乐金电子(南京)等离子有限公司 | 等离子显示器 |
CN106898579A (zh) * | 2015-12-18 | 2017-06-27 | 三星电机株式会社 | 晶圆级封装件及其制造方法 |
CN106441595A (zh) * | 2016-09-28 | 2017-02-22 | 杭州大立微电子有限公司 | 红外探测器阵列级封装结构及其制造方法 |
CN206095436U (zh) * | 2016-10-21 | 2017-04-12 | 云南北方昆物光电科技发展有限公司 | 非制冷焦平面红外探测器芯片真空封装结构 |
CN108358158A (zh) * | 2017-12-19 | 2018-08-03 | 武汉高芯科技有限公司 | 一种晶圆级封装结构、制备方法及其吸气剂的激活方法 |
CN108313973A (zh) * | 2017-12-27 | 2018-07-24 | 武汉高德红外股份有限公司 | 一种非制冷红外探测器的像素级封装结构及加工方法 |
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CN112499580A (zh) | 2021-03-16 |
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