CN112492772B - Welding prevention device and welding prevention method for packaging substrate - Google Patents
Welding prevention device and welding prevention method for packaging substrate Download PDFInfo
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- CN112492772B CN112492772B CN202110021218.5A CN202110021218A CN112492772B CN 112492772 B CN112492772 B CN 112492772B CN 202110021218 A CN202110021218 A CN 202110021218A CN 112492772 B CN112492772 B CN 112492772B
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- packaging substrate
- clamping
- inserting frame
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Abstract
The invention discloses a welding prevention device and a welding prevention method for a packaging substrate, which comprise an automatic plate clamping machine, wherein the length of a main structure of the automatic plate clamping machine is 767mm, the height of the automatic plate clamping machine is 825mm, and the width of the automatic plate clamping machine is 640 mm; the top of the main body of the automatic plate clamping machine is provided with an inserting frame; the automatic clamping machine is used for fixing the technical edge, the problem of plate bending of the baking plate is thoroughly solved, particularly in the ultrathin packaging substrate industry, the improvement of warping degree can be improved to be within 0.5% from 1%, the yield of products is improved, the problem that the plate edge is difficult to dry due to the original intensive plate inserting frame is solved, and the problem of product defect scrapping caused by the problem of non-drying in the production process is avoided due to the fact that the distance between U-shaped slots is enlarged.
Description
Technical Field
The invention relates to the technical field of packaging substrate processing, in particular to a welding prevention device and a welding prevention method for a packaging substrate.
Background
In the circuit board industry, after traditional solder mask and screen printing oil is directly placed into a plug board frame, one plug board frame can be inserted into 10-30 printed boards, and a base board inserted into the plug board frame is intentionally bent towards the direction of the printing oil because one side of the base board is not printed with the printing oil, so that the phenomenon of bending after one side of the base board is printed with the printing oil is reduced.
In the processing procedure of a packaging substrate, silk printing, baking, flattening and exposure of a welding-proof procedure need to be baked by using a plugboard frame, the plugboard frame used at present adopts two sides of a fixed plate in a U-shaped slot positioning mode, the edges of the plugboard are difficult to dry due to the fact that the U-shaped slot is positioned and is not ventilated, the edges of the plugboard are not dried, product defects are easily caused in the production process, and the problem of plate bending of the plugboard is solved.
The common plug board frame in market has the base plate direct contact to plug board frame U type slot, has that flange edge printing ink glues plug board frame slot or printing ink has the contact problem.
The invention relates to a welding prevention device and a welding prevention method of a packaging substrate, aiming at solving the problems of plate bending and no drying.
Disclosure of Invention
The present invention is directed to a solder mask apparatus and a solder mask method for a package substrate, so as to solve the problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme:
a welding prevention device of a packaging substrate comprises an automatic plate clamping machine, wherein the length of a main body structure of the automatic plate clamping machine is 767mm, the height of the automatic plate clamping machine is 825mm, and the width of the automatic plate clamping machine is 640 mm; the top of the main body of the automatic plate clamping machine is provided with an inserting frame; an upper material taking bottom plate and a lower material taking bottom plate are arranged below the inserting frame, the size of the upper material taking bottom plate is 450mm plus 350mm, the materials are plastic materials, an upper material taking bottom plate and a lower material taking bottom plate are arranged on the main body structure of the automatic plate clamping machine, the upper material taking bottom plate and the lower material taking bottom plate are in a concave-convex shape, inserting frame positioning blocks are arranged on four corners of the edges of the upper material taking bottom plate and the lower material taking bottom plate, an inserting frame is arranged on the inserting frame positioning blocks, the height of each inserting frame positioning block is 2cm, each inserting frame positioning block is connected with an inserting frame positioning stop block, the height of each inserting frame is 3.5 cm; the top surface of the automatic clamping plate machine is provided with a screw fixing structure; an upper clamping cylinder and a lower clamping cylinder are connected below the screw fixing structure, and the bottom of the automatic plate clamping machine is connected with the upper cylinder and the lower cylinder through upper and lower sliding column bearings; the upper and lower clamp opening cylinders are connected with upper and lower movable clamp plate bolts, the tops of the upper and lower movable clamp plate bolts are provided with rotatable clamps with the length of 70mm, and clamp contact points are arranged on the rotatable clamps.
As a further scheme of the invention: the utility model discloses a plug board frame, including the main part framework of plug board frame, length is 500mm, the width is 429mm, highly be 499mm, the plug board frame both sides are provided with U type slot respectively, U type slot is equipped with 16 positions, and every adjacent U type slot is 25mm with U type slot central distance, the plug board frame bottom is equipped with first bracing piece and second bracing piece, first bracing piece is located groove edge 139mm, second bracing piece and first bracing piece distance 182mm, the plug board frame top has 2 portable poles, the plug board frame material is whole to be 304 stainless steel, the plug board frame bottom is fixed by 304 stainless steel pipes.
A solder mask method of a solder mask device of a package substrate comprises the following steps:
the method comprises the following steps: printing single-sided ink by a screen printing machine;
1) the packaging substrate is pretreated, foreign matters on the surface of the packaging substrate are removed, the surface of the packaging substrate is cleaned, the roughness of a copper surface is increased, and the adhesive force of the printing ink on the surface of the packaging substrate is enhanced;
2) uniformly attaching printing ink to one surface of the packaging substrate by using a screen plate of a solder mask screen printing machine, wherein the printing ink can be added into the holes through the holes of the backing plate during screen printing;
3) baking the ink to a cured state;
step two: putting a clamping plate of an automatic plate clamping machine;
1) placing the packaging substrate printed with the single-sided ink on an automatic plate clamping machine, wherein the ink side of the packaging substrate is placed on the top surface, and the side without the ink is contacted with an upper material taking bottom plate and a lower material taking bottom plate;
2) in the clamping process, the inner part of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, only the clamping point contacts the edge of the process plate, and the thickness of the ink surface is inconsistent with that of the two surfaces without the ink surface, so that the problem of plate warping exists in the baking of the product;
step three: taking out the inserting frame;
1) the inserting frame is hollow, the packaging substrate is arranged at the center of the inserting frame, and the contact between the inserting frame and the substrate is a process edge clamping point of peripheral plate edges;
2) taking out the inserting frame clamped with the packaging substrate under the starting of an unlocking key of the automatic plate clamping machine;
step four: inserting the inserting frame into the inserting plate frame;
inserting the plug frames with the package substrates from the U-shaped slots into the plug frame in the vertical direction for positioning, wherein the size of the plug frames is smaller than the opening of the U-shaped slots, the plug frame can be inserted into 16 plug frames at one time, the distance between every two adjacent U-shaped slots is 25mm, and the width of each U-shaped slot is 8 mm;
step five: placing the plugboard frame into an oven for baking;
the plugboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame plate is 10-15cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the plugboard frame, the temperature of the baking plate is 100-150 ℃, and the time of baking the plate is 20-30 minutes for baking the ink at high temperature;
step six: taking out the plugboard frame;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
step seven: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step eight: printing ink on the second surface of the packaging substrate in a silk-screen manner;
placing the taken-out packaging substrate below a screen plate of a screen printing machine, and uniformly attaching printing ink to the second surface of the packaging substrate;
step nine: putting the packaging substrate into a clamping plate of an automatic plate clamping machine for the second time;
placing the packaging substrate printed with the ink on the other side on an automatic plate clamping machine, wherein the newly printed ink side of the packaging substrate is placed on the top surface, and the side which is baked with the ink is contacted with the upper and lower material taking bottom plates; in the clamping process, the interior of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, and only the clamping points contact the edges of the process plate;
step ten: taking out the inserting frame for the second time;
the inserting frame is hollow, the packaging substrate is arranged in the center of the inserting frame, the inserting frame is in contact with the substrate to form a technical edge clamping point of peripheral edges, and the inserting frame with the packaging substrate is taken out when an unlocking key of the automatic plate clamping machine is started;
step eleven: inserting the inserting frame into the inserting plate frame for the second time;
inserting the inserting frame into the inserting frame in the vertical direction in the same way;
step twelve: placing the plugboard frame into an oven for secondary baking;
the flashboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame board is 10cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the flashboard frame, the baking temperature is 120 ℃, and the baking time is 20 minutes;
step thirteen: taking out the plugboard frame again;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
fourteen steps: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step fifteen: exposure operation and subsequent operation;
sixthly, the steps are as follows: and placing the front surface of the packaging substrate on a flat marble or glass table surface, and measuring the warping degree of the table surface by using a hole ruler, and if the warping degree is required to be less than or equal to 0.75%, the length of the long edge of the packaging substrate or the diagonal length of the packaging substrate is multiplied by the allowable warping degree.
Compared with the prior art, the invention has the beneficial effects that:
the automatic board clamping machine is adopted to fix the process edge, so that the problem of bending of the baked board is thoroughly solved, especially in the ultrathin packaging substrate industry, the improvement on the warping degree can be improved from 1% to within 0.5%, the yield of products is improved, the problem that the board edge is difficult to dry due to the original dense board inserting frame is solved, the distance between the U-shaped slots is enlarged, and the product defect scrap caused by the problem of non-drying in the production process is avoided.
Drawings
FIG. 1 is a front plan view of a solder mask apparatus and a solder mask method for a package substrate;
FIG. 2 is a top plan view of a solder mask apparatus and method for packaging a substrate;
FIG. 3 is a side plan view of a solder mask apparatus and a solder mask method for a package substrate;
FIG. 4 is a plan view of a clamp plate for a solder mask apparatus and a solder mask method for a package substrate;
FIG. 5 is a schematic diagram of a interposer frame for a solder mask apparatus and a solder mask method of a package substrate;
FIG. 6 is a top plan view of a interposer frame for use in the solder mask apparatus and method of solder mask assembly of a package substrate;
FIG. 7 is a side plan view of a interposer frame for use in a solder mask apparatus and method for packaging a substrate;
FIG. 8 is a front plan view of a interposer frame for use in a solder mask apparatus and method for packaging a substrate;
fig. 9 is a front view of a frame in a solder mask apparatus and a solder mask method for a package substrate.
Shown in the figure: the automatic plate clamping device comprises an M8 screw 1, an inserting frame 2, an upper and lower clamping opening cylinder 3, an upper and lower sliding column bearing 4, an upper and lower cylinder 5, an automatic plate clamping machine 6, an electric cabinet 7, an inserting frame positioning stop block 8, an inserting frame positioning block 9, an upper and lower material taking bottom plate 10, an upper and lower movable clamping plate bolt 11, a rotary movable clamping head 12, a clamping head contact point 13, a U-shaped slot 14, a first supporting rod 15 and a second supporting rod 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 9, in an embodiment of the present invention, a solder mask apparatus and a solder mask method for a package substrate include an automatic board clamping machine 6, wherein a main structure of the automatic board clamping machine 6 has a length of 767mm, a height of 825mm, and a width of 640 mm; the top of the main body of the automatic plate clamping machine 6 is provided with an inserting frame 2; an upper material taking bottom plate 10 and a lower material taking bottom plate 10 are arranged below the inserting frame 2, the size of the upper material taking bottom plate is 450mm plus 350mm, the materials are plastic materials, the upper material taking bottom plate 10 and the lower material taking bottom plate are in a concave-convex design, inserting frame positioning blocks 9 are arranged at four corners of the edge of the upper material taking bottom plate 10 and the lower material taking bottom plate 10, an inserting frame positioning block 9 is arranged on the inserting frame positioning block 9, the height of the inserting frame positioning block is 2cm, the inserting frame positioning block 9 is connected with an inserting frame positioning stop block 8, the height of the inserting frame positioning stop block is 3.5cm, a supporting plate with the thickness of 15mm is; the top surface of the automatic clamping plate machine is provided with a screw fixing structure; an upper clamping cylinder 3 and a lower clamping cylinder 3 are connected below the screw fixing structure, and the bottom of an automatic plate clamping machine 6 is connected with an upper cylinder 5 and a lower cylinder 5 through upper and lower sliding column bearings 4; the upper and lower clamping opening cylinder 3 is connected with an upper and lower movable clamping plate bolt 11, the top of the upper and lower movable clamping plate bolt is provided with a rotary movable clamping head 12 with the length of 70mm, and a clamping head contact point 13 is arranged on the rotary movable clamping head;
the length of a main body frame body of the plugboard frame is 500mm, the width of the main body frame body is 429mm, the height of the main body frame body is 499mm, U-shaped slots are respectively arranged on two sides of the plugboard frame, 16 positions are arranged on the U-shaped slots 14, the distance between each adjacent U-shaped slot and the center of the U-shaped slot is 25mm, a first support rod 15 and a second support rod 16 are arranged at the bottom of the plugboard frame, the first support rod 15 is located 139mm at the slot edge, the distance between the second support rod 16 and the first support rod 15 is 182mm, 2 hand-held rods are arranged at the top of the plugboard frame, and the plugboard frame is; the plug board frame is used for thoroughly solving the problem that the packaging substrate is not dried, the distance between the positioning U-shaped slots is increased, the distance between the packaging substrates is large, the packaging substrates can be fully baked, and the high-temperature-resistant and corrosion-resistant effects are achieved; the bottom of the plugboard frame is fixed by a 304 stainless steel pipe, so that the bearing strength can be enhanced; the handle is not separately designed, but the lifting frame rod is directly designed on the plugboard frame, so that the space outside the plugboard frame is saved.
The method comprises the following steps:
the method comprises the following steps: printing single-sided ink by a screen printing machine;
1) the packaging substrate is pretreated, foreign matters on the surface of the packaging substrate are removed, the surface of the packaging substrate is cleaned, the roughness of a copper surface is increased, and the adhesive force of the printing ink on the surface of the packaging substrate is enhanced;
2) uniformly attaching printing ink to one surface of the packaging substrate by using a screen plate of a solder mask screen printing machine, wherein the printing ink can be added into the holes through the holes of the backing plate during screen printing;
3) baking the ink to a cured state;
step two: putting a clamping plate of an automatic plate clamping machine;
1) placing the packaging substrate printed with the single-sided ink on an automatic plate clamping machine, wherein the ink side of the packaging substrate is placed on the top surface, and the side without the ink is contacted with the upper and lower material taking bottom plates 10;
2) in the clamping process, the inner part of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, only the clamping point contacts the edge of the process plate, and the thickness of the ink surface is inconsistent with that of the two surfaces without the ink surface, so that the problem of plate warping exists in the baking of the product;
step three: taking out the inserting frame;
1) the inserting frame is hollow, the packaging substrate is arranged at the center of the inserting frame, and the contact between the inserting frame and the substrate is a process edge clamping point of peripheral plate edges;
2) taking out the inserting frame clamped with the packaging substrate under the starting of an unlocking key of the automatic plate clamping machine;
step four: inserting the inserting frame into the inserting plate frame;
inserting the plug frames with the package substrates from the U-shaped slots into the plug frame in the vertical direction for positioning, wherein the size of the plug frames is smaller than the opening of the U-shaped slots, the plug frame can be inserted into 16 plug frames at one time, the distance between every two adjacent U-shaped slots is 25mm, and the width of each U-shaped slot is 8 mm;
step five: placing the plugboard frame into an oven for baking;
the plugboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame plate is 10-15cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the plugboard frame, the temperature of the baking plate is 100-150 ℃, and the time of baking the plate is 20-30 minutes for baking the ink at high temperature;
step six: taking out the plugboard frame;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
step seven: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step eight: printing ink on the second surface of the packaging substrate in a silk-screen manner;
placing the taken-out packaging substrate below a screen plate of a screen printing machine, and uniformly attaching printing ink to the second surface of the packaging substrate;
step nine: putting the packaging substrate into a clamping plate of an automatic plate clamping machine for the second time;
placing the packaging substrate printed with the ink on the other side on an automatic plate clamping machine, wherein the newly printed ink side of the packaging substrate is placed on the top surface, and the side which is baked with the ink is contacted with the upper and lower material taking bottom plates 10; in the clamping process, the interior of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, and only the clamping points contact the edges of the process plate;
step ten: taking out the inserting frame for the second time;
the inserting frame is hollow, the packaging substrate is arranged in the center of the inserting frame, the inserting frame is in contact with the substrate to form a technical edge clamping point of peripheral edges, and the inserting frame with the packaging substrate is taken out when an unlocking key of the automatic plate clamping machine is started;
step eleven: inserting the inserting frame into the inserting plate frame for the second time;
inserting the inserting frame into the inserting frame in the vertical direction in the same way;
step twelve: placing the plugboard frame into an oven for secondary baking;
the flashboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame board is 10cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the flashboard frame, the baking temperature is 120 ℃, and the baking time is 20 minutes;
step thirteen: taking out the plugboard frame again;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
fourteen steps: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step fifteen: exposure operation and subsequent operation;
sixthly, the steps are as follows: and placing the front surface of the packaging substrate on a flat marble or glass table surface, and measuring the warping degree of the table surface by using a hole ruler, and if the warping degree is required to be less than or equal to 0.75%, the length of the long edge of the packaging substrate or the diagonal length of the packaging substrate is multiplied by the allowable warping degree.
The automatic plate clamping machine is arranged, so that the warping degree of the packaging substrate is improved from the bending degree of less than or equal to 1% to less than or equal to 0.5%, and the quality and yield of products are improved.
Example one
A welding-proof device and welding-proof method of the packaging substrate, including the automatic plate clamping machine 6, the said automatic plate clamping machine 6 main structure length is 767mm, the height is 825mm, the width is 640 mm; the top of the main body of the automatic plate clamping machine 6 is provided with an inserting frame 2; an upper material taking bottom plate 10 and a lower material taking bottom plate 10 are arranged below the inserting frame 2, the size of the upper material taking bottom plate is 450mm plus 350mm, the materials are plastic materials, the upper material taking bottom plate 10 and the lower material taking bottom plate are in a concave-convex design, inserting frame positioning blocks 9 are arranged at four corners of the edge of the upper material taking bottom plate 10 and the lower material taking bottom plate 10, an inserting frame positioning block 9 is arranged on the inserting frame positioning block 9, the height of the inserting frame positioning block is 2cm, the inserting frame positioning block 9 is connected with an inserting frame positioning stop block 8, the height of the inserting frame positioning stop block is 3.5cm, a supporting plate with the thickness of 15mm is; the top surface of the automatic clamping plate machine is provided with a screw fixing structure; an upper clamping cylinder 3 and a lower clamping cylinder 3 are connected below the screw fixing structure, and the bottom of an automatic plate clamping machine 6 is connected with an upper cylinder 5 and a lower cylinder 5 through upper and lower sliding column bearings 4; an upper clamping cylinder 3 and a lower clamping cylinder 3 are connected with an upper movable clamping plate bolt 11 and a lower movable clamping plate bolt 11, a rotary movable clamping head 12 with the length of 70mm is arranged at the top of the upper movable clamping plate bolt and the lower movable clamping plate bolt, a clamping head contact point 13 is arranged on the rotary movable clamping head, the length of a main body frame body of the plug-in plate frame is 500mm, the width of the main body frame body is 429mm, the height of the main body frame body is 499mm, U-shaped slots are respectively arranged on two sides of the plug-in plate frame, 16 positions are arranged on the U-shaped slots 14, the distance between each adjacent U-shaped slot and the center of the U-shaped slot is 25mm, a first supporting rod 15 and a second supporting rod 16 are arranged at the bottom of the plug-in plate frame, the first supporting rod 15 is located on the side; the plug board frame is used for thoroughly solving the problem that the packaging substrate is not dried, the distance between the positioning U-shaped slots is increased, the distance between the packaging substrates is large, the packaging substrates can be fully baked, and the high-temperature-resistant and corrosion-resistant effects are achieved; the bottom of the plugboard frame is fixed by a 304 stainless steel pipe, so that the bearing strength can be enhanced; the handle is not separately designed, but the lifting frame rod is directly designed on the plugboard frame, so that the space outside the plugboard frame is saved.
The combination method comprises the following steps:
the method comprises the following steps: printing single-sided ink by a screen printing machine;
1) the packaging substrate is pretreated, foreign matters on the surface of the packaging substrate are removed, the surface of the packaging substrate is cleaned, the roughness of a copper surface is increased, and the adhesive force of the printing ink on the surface of the packaging substrate is enhanced;
2) uniformly attaching printing ink to one surface of the packaging substrate by using a screen plate of a solder mask screen printing machine, wherein the printing ink can be added into the holes through the holes of the backing plate during screen printing;
3) baking the ink to a cured state;
step two: putting a clamping plate of an automatic plate clamping machine;
1) placing the packaging substrate printed with the single-sided ink on an automatic plate clamping machine, wherein the ink side of the packaging substrate is placed on the top surface, and the side without the ink is contacted with the upper and lower material taking bottom plates 10;
2) in the clamping process, the inner part of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, only the clamping point contacts the edge of the process plate, and the thickness of the ink surface is inconsistent with that of the two surfaces without the ink surface, so that the problem of plate warping exists in the baking of the product;
step three: taking out the inserting frame;
1) the inserting frame is hollow, the packaging substrate is arranged at the center of the inserting frame, and the contact between the inserting frame and the substrate is a process edge clamping point of peripheral plate edges;
2) taking out the inserting frame clamped with the packaging substrate under the starting of an unlocking key of the automatic plate clamping machine;
step four: inserting the inserting frame into the inserting plate frame;
inserting the plug frames with the package substrates from the U-shaped slots into the plug frame in the vertical direction for positioning, wherein the size of the plug frames is smaller than the opening of the U-shaped slots, the plug frame can be inserted into 16 plug frames at one time, the distance between every two adjacent U-shaped slots is 25mm, and the width of each U-shaped slot is 8 mm;
step five: placing the plugboard frame into an oven for baking;
the plugboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame plate is 15cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the plugboard frame, the baking temperature is 150 ℃, and the baking time is 30 minutes for baking the printing ink at high temperature;
step six: taking out the plugboard frame;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
step seven: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step eight: printing ink on the second surface of the packaging substrate in a silk-screen manner;
placing the taken-out packaging substrate below a screen plate of a screen printing machine, and uniformly attaching printing ink to the second surface of the packaging substrate;
step nine: putting the packaging substrate into a clamping plate of an automatic plate clamping machine for the second time;
placing the packaging substrate printed with the ink on the other side on an automatic plate clamping machine, wherein the newly printed ink side of the packaging substrate is placed on the top surface, and the side which is baked with the ink is contacted with the upper and lower material taking bottom plates 10; in the clamping process, the interior of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, and only the clamping points contact the edges of the process plate;
step ten: taking out the inserting frame for the second time;
the inserting frame is hollow, the packaging substrate is arranged in the center of the inserting frame, the inserting frame is in contact with the substrate to form a technical edge clamping point of peripheral edges, and the inserting frame with the packaging substrate is taken out when an unlocking key of the automatic plate clamping machine is started;
step eleven: inserting the inserting frame into the inserting plate frame for the second time;
inserting the inserting frame into the inserting frame in the vertical direction in the same way;
step twelve: placing the plugboard frame into an oven for secondary baking;
the flashboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame board is 10cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the flashboard frame, the baking temperature is 120 ℃, and the baking time is 20 minutes;
step thirteen: taking out the plugboard frame again;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
fourteen steps: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step fifteen: exposure operation and subsequent operation.
Sixthly, the steps are as follows: and placing the front surface of the packaging substrate on a flat marble or glass table surface, and measuring the warping degree of the table surface by using a hole ruler, and if the warping degree is required to be less than or equal to 0.75%, the length of the long edge of the packaging substrate or the diagonal length of the packaging substrate is multiplied by the allowable warping degree.
The automatic plate clamping machine is arranged, so that the warping degree of the packaging substrate is improved from the bending degree of less than or equal to 1% to less than or equal to 0.5%, and the quality and yield of products are improved.
Example two
A welding-proof device and welding-proof method of the packaging substrate, including the automatic plate clamping machine 6, the said automatic plate clamping machine 6 main structure length is 767mm, the height is 825mm, the width is 640 mm; the top of the main body of the automatic plate clamping machine 6 is provided with an inserting frame 2; an upper material taking bottom plate 10 and a lower material taking bottom plate 10 are arranged below the inserting frame 2, the size of the upper material taking bottom plate is 450mm plus 350mm, the materials are plastic materials, the upper material taking bottom plate 10 and the lower material taking bottom plate are in a concave-convex design, inserting frame positioning blocks 9 are arranged at four corners of the edge of the upper material taking bottom plate 10 and the lower material taking bottom plate 10, an inserting frame positioning block 9 is arranged on the inserting frame positioning block 9, the height of the inserting frame positioning block is 2cm, the inserting frame positioning block 9 is connected with an inserting frame positioning stop block 8, the height of the inserting frame positioning stop block is 3.5cm, a supporting plate with the thickness of 15mm is; the top surface of the automatic clamping plate machine is provided with a screw fixing structure; an upper clamping cylinder 3 and a lower clamping cylinder 3 are connected below the screw fixing structure, and the bottom of an automatic plate clamping machine 6 is connected with an upper cylinder 5 and a lower cylinder 5 through upper and lower sliding column bearings 4; an upper clamping cylinder 3 and a lower clamping cylinder 3 are connected with an upper movable clamping plate bolt 11 and a lower movable clamping plate bolt 11, a rotary movable clamping head 12 with the length of 70mm is arranged at the top of the upper movable clamping plate bolt and the lower movable clamping plate bolt, a clamping head contact point 13 is arranged on the rotary movable clamping head, the length of a main body frame body of the plug-in plate frame is 500mm, the width of the main body frame body is 429mm, the height of the main body frame body is 499mm, U-shaped slots are respectively arranged on two sides of the plug-in plate frame, 16 positions are arranged on the U-shaped slots 14, the distance between each adjacent U-shaped slot and the center of the U-shaped slot is 25mm, a first supporting rod 15 and a second supporting rod 16 are arranged at the bottom of the plug-in plate frame, the first supporting rod 15 is located on the side; the plug board frame is used for thoroughly solving the problem that the packaging substrate is not dried, the distance between the positioning U-shaped slots is increased, the distance between the packaging substrates is large, the packaging substrates can be fully baked, and the high-temperature-resistant and corrosion-resistant effects are achieved; the bottom of the plugboard frame is fixed by a 304 stainless steel pipe, so that the bearing strength can be enhanced; the handle is not separately designed, but the lifting frame rod is directly designed on the plugboard frame, so that the space outside the plugboard frame is saved.
The combination method comprises the following steps:
the method comprises the following steps: printing single-sided ink by a screen printing machine;
1) the packaging substrate is pretreated, foreign matters on the surface of the packaging substrate are removed, the surface of the packaging substrate is cleaned, the roughness of a copper surface is increased, and the adhesive force of the printing ink on the surface of the packaging substrate is enhanced;
2) uniformly attaching printing ink to one surface of the packaging substrate by using a screen plate of a solder mask screen printing machine, wherein the printing ink can be added into the holes through the holes of the backing plate during screen printing;
3) baking the ink to a cured state;
step two: putting a clamping plate of an automatic plate clamping machine;
1) placing the packaging substrate printed with the single-sided ink on an automatic plate clamping machine, wherein the ink side of the packaging substrate is placed on the top surface, and the side without the ink is contacted with the upper and lower material taking bottom plates 10;
2) in the clamping process, the inner part of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, only the clamping point contacts the edge of the process plate, and the thickness of the ink surface is inconsistent with that of the two surfaces without the ink surface, so that the problem of plate warping exists in the baking of the product;
step three: taking out the inserting frame;
1) the inserting frame is hollow, the packaging substrate is arranged at the center of the inserting frame, and the contact between the inserting frame and the substrate is a process edge clamping point of peripheral plate edges;
2) taking out the inserting frame clamped with the packaging substrate under the starting of an unlocking key of the automatic plate clamping machine;
step four: inserting the inserting frame into the inserting plate frame;
inserting the plug frames with the package substrates from the U-shaped slots into the plug frame in the vertical direction for positioning, wherein the size of the plug frames is smaller than the opening of the U-shaped slots, the plug frame can be inserted into 16 plug frames at one time, the distance between every two adjacent U-shaped slots is 25mm, and the width of each U-shaped slot is 8 mm;
step five: placing the plugboard frame into an oven for baking;
the plugboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame plate is 10cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the plugboard frame, the baking temperature is 100 ℃, and the baking time is 20 minutes for baking the printing ink at high temperature;
step six: taking out the plugboard frame;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
step seven: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step eight: printing ink on the second surface of the packaging substrate in a silk-screen manner;
placing the taken-out packaging substrate below a screen plate of a screen printing machine, and uniformly attaching printing ink to the second surface of the packaging substrate;
step nine: putting the packaging substrate into a clamping plate of an automatic plate clamping machine for the second time;
placing the packaging substrate printed with the ink on the other side on an automatic plate clamping machine, wherein the newly printed ink side of the packaging substrate is placed on the top surface, and the side which is baked with the ink is contacted with the upper and lower material taking bottom plates 10; in the clamping process, the interior of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, and only the clamping points contact the edges of the process plate;
step ten: taking out the inserting frame for the second time;
the inserting frame is hollow, the packaging substrate is arranged in the center of the inserting frame, the inserting frame is in contact with the substrate to form a technical edge clamping point of peripheral edges, and the inserting frame with the packaging substrate is taken out when an unlocking key of the automatic plate clamping machine is started;
step eleven: inserting the inserting frame into the inserting plate frame for the second time;
inserting the inserting frame into the inserting frame in the vertical direction in the same way;
step twelve: placing the plugboard frame into an oven for secondary baking;
the flashboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame board is 10cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the flashboard frame, the baking temperature is 120 ℃, and the baking time is 20 minutes;
step thirteen: taking out the plugboard frame again;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
fourteen steps: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step fifteen: exposure operation and subsequent operation;
sixthly, the steps are as follows: and placing the front surface of the packaging substrate on a flat marble or glass table surface, and measuring the warping degree of the table surface by using a hole ruler, and if the warping degree is required to be less than or equal to 0.75%, the length of the long edge of the packaging substrate or the diagonal length of the packaging substrate is multiplied by the allowable warping degree.
The automatic plate clamping machine is arranged, so that the warping degree of the packaging substrate is improved from the bending degree of less than or equal to 1% to less than or equal to 0.5%, and the quality and yield of products are improved.
EXAMPLE III
A welding-proof device and welding-proof method of the packaging substrate, including the automatic plate clamping machine 6, the said automatic plate clamping machine 6 main structure length is 767mm, the height is 825mm, the width is 640 mm; the top of the main body of the automatic plate clamping machine 6 is provided with an inserting frame 2; an upper material taking bottom plate 10 and a lower material taking bottom plate 10 are arranged below the inserting frame 2, the size of the upper material taking bottom plate is 450mm plus 350mm, the materials are plastic materials, the upper material taking bottom plate 10 and the lower material taking bottom plate are in a concave-convex design, inserting frame positioning blocks 9 are arranged at four corners of the edge of the upper material taking bottom plate 10 and the lower material taking bottom plate 10, an inserting frame positioning block 9 is arranged on the inserting frame positioning block 9, the height of the inserting frame positioning block is 2cm, the inserting frame positioning block 9 is connected with an inserting frame positioning stop block 8, the height of the inserting frame positioning stop block is 3.5cm, a supporting plate with the thickness of 15mm is; the top surface of the automatic clamping plate machine is provided with a screw fixing structure; an upper clamping cylinder 3 and a lower clamping cylinder 3 are connected below the screw fixing structure, and the bottom of an automatic plate clamping machine 6 is connected with an upper cylinder 5 and a lower cylinder 5 through upper and lower sliding column bearings 4; an upper clamping cylinder 3 and a lower clamping cylinder 3 are connected with an upper movable clamping plate bolt 11 and a lower movable clamping plate bolt 11, a rotary movable clamping head 12 with the length of 70mm is arranged at the top of the upper movable clamping plate bolt and the lower movable clamping plate bolt, a clamping head contact point 13 is arranged on the rotary movable clamping head, the length of a main body frame body of the plug-in plate frame is 500mm, the width of the main body frame body is 429mm, the height of the main body frame body is 499mm, U-shaped slots are respectively arranged on two sides of the plug-in plate frame, 16 positions are arranged on the U-shaped slots 14, the distance between each adjacent U-shaped slot and the center of the U-shaped slot is 25mm, a first supporting rod 15 and a second supporting rod 16 are arranged at the bottom of the plug-in plate frame, the first supporting rod 15 is located on the side; the plug board frame is used for thoroughly solving the problem that the packaging substrate is not dried, the distance between the positioning U-shaped slots is increased, the distance between the packaging substrates is large, the packaging substrates can be fully baked, and the high-temperature-resistant and corrosion-resistant effects are achieved; the bottom of the plugboard frame is fixed by a 304 stainless steel pipe, so that the bearing strength can be enhanced; the handle is not separately designed, but the lifting frame rod is directly designed on the plugboard frame, so that the space outside the plugboard frame is saved;
the method comprises the following steps:
the method comprises the following steps: printing single-sided ink by a screen printing machine;
1) the packaging substrate is pretreated, foreign matters on the surface of the packaging substrate are removed, the surface of the packaging substrate is cleaned, the roughness of a copper surface is increased, and the adhesive force of the printing ink on the surface of the packaging substrate is enhanced;
2) uniformly attaching printing ink to one surface of the packaging substrate by using a screen plate of a solder mask screen printing machine, wherein the printing ink can be added into the holes through the holes of the backing plate during screen printing;
3) baking the ink to a cured state;
step two: putting a clamping plate of an automatic plate clamping machine;
1) placing the packaging substrate printed with the single-sided ink on an automatic plate clamping machine, wherein the ink side of the packaging substrate is placed on the top surface, and the side without the ink is contacted with the upper and lower material taking bottom plates 10;
2) in the clamping process, the inner part of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, only the clamping point contacts the edge of the process plate, and the thickness of the ink surface is inconsistent with that of the two surfaces without the ink surface, so that the problem of plate warping exists in the baking of the product;
step three: taking out the inserting frame;
1) the inserting frame is hollow, the packaging substrate is arranged at the center of the inserting frame, and the contact between the inserting frame and the substrate is a process edge clamping point of peripheral plate edges;
2) taking out the inserting frame clamped with the packaging substrate under the starting of an unlocking key of the automatic plate clamping machine;
step four: inserting the inserting frame into the inserting plate frame;
inserting the plug frames with the package substrates from the U-shaped slots into the plug frame in the vertical direction for positioning, wherein the size of the plug frames is smaller than the opening of the U-shaped slots, the plug frame can be inserted into 16 plug frames at one time, the distance between every two adjacent U-shaped slots is 25mm, and the width of each U-shaped slot is 8 mm;
step five: placing the plugboard frame into an oven for baking;
the plugboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame plate is 12cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the plugboard frame, the baking temperature is 130 ℃, and the baking time is 25 minutes for baking the printing ink at high temperature;
step six: taking out the plugboard frame;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
step seven: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step eight: printing ink on the second surface of the packaging substrate in a silk-screen manner;
placing the taken-out packaging substrate below a screen plate of a screen printing machine, and uniformly attaching printing ink to the second surface of the packaging substrate;
step nine: putting the packaging substrate into a clamping plate of an automatic plate clamping machine for the second time;
placing the packaging substrate printed with the ink on the other side on an automatic plate clamping machine, wherein the newly printed ink side of the packaging substrate is placed on the top surface, and the side which is baked with the ink is contacted with the upper and lower material taking bottom plates 10; in the clamping process, the interior of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, and only the clamping points contact the edges of the process plate;
step ten: taking out the inserting frame for the second time;
the inserting frame is hollow, the packaging substrate is arranged in the center of the inserting frame, the inserting frame is in contact with the substrate to form a technical edge clamping point of peripheral edges, and the inserting frame with the packaging substrate is taken out when an unlocking key of the automatic plate clamping machine is started;
step eleven: inserting the inserting frame into the inserting plate frame for the second time;
inserting the inserting frame into the inserting frame in the vertical direction in the same way;
step twelve: placing the plugboard frame into an oven for secondary baking;
the flashboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame board is 10cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the flashboard frame, the baking temperature is 120 ℃, and the baking time is 20 minutes;
step thirteen: taking out the plugboard frame again;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
fourteen steps: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step fifteen: exposure operation and subsequent operation;
sixthly, the steps are as follows: and placing the front surface of the packaging substrate on a flat marble or glass table surface, and measuring the warping degree of the table surface by using a hole ruler, and if the warping degree is required to be less than or equal to 0.75%, the length of the long edge of the packaging substrate or the diagonal length of the packaging substrate is multiplied by the allowable warping degree.
The automatic plate clamping machine is arranged, so that the warping degree of the packaging substrate is improved from the bending degree of less than or equal to 1% to less than or equal to 0.5%, and the quality and yield of products are improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes, modifications, equivalents and improvements can be made therein without departing from the spirit and scope of the invention.
Claims (4)
1. The utility model provides a packaging substrate's solderability preservative device, includes automatic plate clamping machine, its characterized in that: the length of the main structure of the automatic plate clamping machine is 767mm, the height of the main structure of the automatic plate clamping machine is 825mm, and the width of the main structure of the automatic plate clamping machine is 640 mm; the top of the main body of the automatic plate clamping machine is provided with an inserting frame; an upper material taking bottom plate and a lower material taking bottom plate are arranged below the inserting frame, the size of the upper material taking bottom plate and the lower material taking bottom plate is 450mm plus 350mm, the upper material taking bottom plate and the lower material taking bottom plate are in a concave-convex design, inserting frame positioning blocks are arranged at four corners of the edges of the upper material taking bottom plate and the lower material taking bottom plate, an inserting frame is arranged on the inserting frame positioning blocks, the height of each inserting frame positioning block is 2cm, each inserting frame positioning block is connected with an inserting frame positioning stop block, the height of each inserting frame positioning stop block is 3.5cm, a supporting plate with the thickness of 15mm is arranged; the top surface of the automatic clamping plate machine is provided with a screw fixing structure; an upper clamping cylinder and a lower clamping cylinder are connected below the screw fixing structure, and the bottom of the automatic plate clamping machine is connected with the upper cylinder and the lower cylinder through upper and lower sliding column bearings; the upper and lower clamping opening cylinder is connected with an upper and lower movable clamping plate bolt, the top of the upper and lower movable clamping plate bolt is provided with a rotary movable clamping head with the length of 70mm, and a clamping head contact point is arranged on the rotary movable clamping head.
2. The solder resist apparatus of the package substrate according to claim 1, wherein: the length of inserting the frame is 590mm, and the width is 483mm, and thickness is 5mm, and the material is 304 stainless steel.
3. The solder resist apparatus of the package substrate according to claim 1, wherein: the utility model discloses a plug board frame, including the main part framework length of plug board frame, the U type slot is equipped with 16 positions, and every adjacent U type slot is 25mm with U type slot central distance, plug board frame bottom is equipped with first bracing piece and second bracing piece, first bracing piece is located slot edge 139mm, second bracing piece and first bracing piece distance 182mm, plug board frame top has 2 portable poles, the plug board frame material is whole to be 304 stainless steel, the plug board frame bottom is fixed by 304 stainless steel pipes.
4. The solder resist method of the solder resist apparatus of the package substrate according to any one of claims 1 to 3, characterized in that: the method comprises the following steps:
the method comprises the following steps: printing single-sided ink by a screen printing machine;
1) the packaging substrate is pretreated, foreign matters on the surface of the packaging substrate are removed, the surface of the packaging substrate is cleaned, the roughness of a copper surface is increased, and the adhesive force of the printing ink on the surface of the packaging substrate is enhanced;
uniformly attaching printing ink to one surface of the packaging substrate by using a screen plate of a solder mask screen printing machine, wherein the printing ink can be added into the holes through the holes of the backing plate during screen printing;
2) baking the ink to a cured state;
step two: putting a clamping plate of an automatic plate clamping machine;
1) placing the packaging substrate printed with the single-sided ink on an automatic plate clamping machine, wherein the ink side of the packaging substrate is placed on the top surface, and the side without the ink is contacted with an upper material taking bottom plate and a lower material taking bottom plate;
2) in the clamping process, the inner part of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, only the clamping point contacts the edge of the process plate, and the thickness of the ink surface is inconsistent with that of the two surfaces without the ink surface, so that the problem of plate warping exists in the baking of the product;
step three: taking out the inserting frame;
1) the inserting frame is hollow, the packaging substrate is arranged at the center of the inserting frame, and the contact between the inserting frame and the substrate is a process edge clamping point of peripheral plate edges;
2) taking out the inserting frame clamped with the packaging substrate under the starting of an unlocking key of the automatic plate clamping machine;
step four: inserting the inserting frame into the inserting plate frame;
inserting the plug frames with the package substrates from the U-shaped slots into the plug frame in the vertical direction for positioning, wherein the size of the plug frames is smaller than the opening of the U-shaped slots, the plug frame can be inserted into 16 plug frames at one time, the distance between every two adjacent U-shaped slots is 25mm, and the width of each U-shaped slot is 8 mm;
step five: placing the plugboard frame into an oven for baking;
the plugboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame plate is 10-15cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the plugboard frame, the temperature of the baking plate is 100-150 ℃, and the time of baking the plate is 20-30 minutes for baking the ink at high temperature;
step six: taking out the plugboard frame;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
step seven: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step eight: printing ink on the second surface of the packaging substrate in a silk-screen manner;
placing the taken-out packaging substrate below a screen plate of a screen printing machine, and uniformly attaching printing ink to the second surface of the packaging substrate;
step nine: putting the packaging substrate into a clamping plate of an automatic plate clamping machine for the second time;
placing the packaging substrate printed with the ink on the other side on an automatic plate clamping machine, wherein the newly printed ink side of the packaging substrate is placed on the top surface, and the side which is baked with the ink is contacted with the upper and lower material taking bottom plates; in the clamping process, the interior of the packaging substrate plate is not in contact with the upper material taking bottom plate and the lower material taking bottom plate, and only the clamping points contact the edges of the process plate;
step ten: taking out the inserting frame for the second time;
the inserting frame is hollow, the packaging substrate is arranged in the center of the inserting frame, the inserting frame is in contact with the substrate to form a technical edge clamping point of peripheral edges, and the inserting frame with the packaging substrate is taken out when an unlocking key of the automatic plate clamping machine is started;
step eleven: inserting the inserting frame into the inserting plate frame for the second time;
inserting the inserting frame into the inserting frame in the vertical direction in the same way;
step twelve: placing the plugboard frame into an oven for secondary baking;
the flashboard frame is placed in the direction of the oven, the direction of the packaging substrate is transverse, each frame board is 10cm away from the oven wall, the inner wall of the oven is prevented from directly contacting the flashboard frame, the baking temperature is 120 ℃, and the baking time is 20 minutes;
step thirteen: taking out the plugboard frame again;
cooling for half an hour after baking, wearing the high-temperature-resistant gloves, and taking out the plugboard frame;
fourteen steps: placing the inserting frame into an automatic plate clamping machine for plate loosening;
taking out the inserting frame in the inserting frame and putting the inserting frame on a working table of an automatic clamping machine, pressing a starting key to loosen the clamping point position of the inserting frame and the packaging substrate, and taking out the packaging substrate;
step fifteen: exposure operation and subsequent operation;
sixthly, the steps are as follows: and placing the front surface of the packaging substrate on a flat marble or glass table surface, and measuring the warping degree of the table surface by using a hole ruler, and if the warping degree is required to be less than or equal to 0.75%, the length of the long edge of the packaging substrate or the diagonal length of the packaging substrate is multiplied by the allowable warping degree.
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| CN202110021218.5A CN112492772B (en) | 2021-01-08 | 2021-01-08 | Welding prevention device and welding prevention method for packaging substrate |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177389A (en) * | 1988-12-27 | 1990-07-10 | Mitsubishi Electric Corp | Manufacture of printed wiring board |
| CN202379241U (en) * | 2011-12-19 | 2012-08-15 | 株洲南车时代电气股份有限公司 | Plugboard rack |
| CN106535485A (en) * | 2017-01-04 | 2017-03-22 | 南昌浩牛科技有限公司 | Efficient baking equipment for solder resist ink for circuit board |
-
2021
- 2021-01-08 CN CN202110021218.5A patent/CN112492772B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177389A (en) * | 1988-12-27 | 1990-07-10 | Mitsubishi Electric Corp | Manufacture of printed wiring board |
| CN202379241U (en) * | 2011-12-19 | 2012-08-15 | 株洲南车时代电气股份有限公司 | Plugboard rack |
| CN106535485A (en) * | 2017-01-04 | 2017-03-22 | 南昌浩牛科技有限公司 | Efficient baking equipment for solder resist ink for circuit board |
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