CN112485185A - Device and method for simulating and monitoring atmospheric corrosion behavior evolution of lead-free solder alloy - Google Patents
Device and method for simulating and monitoring atmospheric corrosion behavior evolution of lead-free solder alloy Download PDFInfo
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- 229910021641 deionized water Inorganic materials 0.000 claims description 13
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 12
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- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/65—Raman scattering
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Abstract
The invention relates to the field of metal corrosion behavior monitoring and characterization, in particular to a device and a method for simulating and monitoring atmospheric corrosion behavior evolution of a lead-free solder alloy. The device for simulating and monitoring the evolution of the atmospheric corrosion behavior of the lead-free solder alloy comprises a cabin, a temperature control component, a humidity control component, a monitoring probe, an insulating component, an electrochemical impedance spectrum measuring instrument, a Raman spectrometer and a processor; the chamber has a monitoring chamber and a monitoring window. The temperature control component is used for adjusting and monitoring the temperature in the cavity; the humidity control component is used for adjusting and monitoring the humidity in the cavity. The monitoring probe made of the lead-free solder alloy is exposed in the monitoring cavity and connected to the electrochemical impedance spectrum measuring instrument, and the electrochemical impedance spectrum measuring instrument is used for measuring the evolution of the impedance spectrum of the monitoring probe and is connected to the processor; the Raman spectrometer is used for monitoring the corrosion appearance of the probe and the representation of the evolution of the composition of the product phase and is also connected with the processor. The method is suitable for simulation monitoring and characterization of atmospheric corrosion behavior evolution of the lead-free solder in different environments, and has high reliability.
Description
Technical Field
The invention relates to the field of metal corrosion behavior monitoring and characterization, in particular to a device and a method for simulating and monitoring atmospheric corrosion behavior evolution of a lead-free solder alloy.
Background
After the lead-free solder alloy is subjected to a remelting-resolidification welding process, due to the randomness of eutectic phase nucleation and the heterogeneity of phase sizes, galvanic corrosion effects between eutectic phases and beta-Sn matrixes in the lead-free solder alloy are different, so that different welding spots show atmosphere environment corrosion behaviors with larger differences in the actual service process. When the atmospheric corrosion evolution behavior of the traditional evaluation material is evaluated, a parallel sample method is mostly adopted, namely, a plurality of parallel samples are sampled and represented after different corrosion time intervals, and then the evolution rule of the atmospheric corrosion behavior along with the corrosion time is formed. However, because the quantity and size difference of eutectic phases between parallel samples of the lead-free solder after remelting and resolidification is large, the parallel sample method is not reliable in representing atmospheric corrosion evolution behaviors of the lead-free solder. Therefore, the development of the simulation monitoring device and method suitable for representing the atmospheric corrosion behavior evolution of the lead-free solder alloy is of great significance.
Disclosure of Invention
Based on the above, the invention aims to provide a device and a method for simulating and monitoring the evolution of the atmospheric corrosion behavior of the lead-free solder alloy, which are suitable for monitoring the corrosion evolution behavior of the lead-free solder alloy in the atmospheric environment, can represent the corrosion morphology and the evolution of the product phase composition, and have high reliability; meanwhile, the method is also suitable for monitoring and characterizing the corrosion evolution behavior of other metal materials with obvious galvanic corrosion characteristics due to uneven phase composition or tissue distribution.
The technical scheme of the invention is as follows:
the utility model provides a lead-free solder alloy atmospheric corrosion action evolution simulation monitoring devices, includes cabin, accuse temperature part, accuse wet part, monitor probe, electrochemistry impedance spectroscopy measuring apparatu, Raman spectrometer, treater, and the concrete structure is as follows:
the cabin is provided with a monitoring cavity and a monitoring window, the inner cavity of the cabin is the monitoring cavity, the monitoring window is positioned at the top of the cabin, and the monitoring window is communicated with the monitoring cavity; the Raman spectrometer is arranged above the monitoring window, the monitoring probe is arranged right below the monitoring window and at the bottom of the monitoring cavity, the measuring probe of the Raman spectrometer corresponds to the monitoring probe, and the Raman spectrometer is connected with the processor; the temperature control component is fixed in the cabin, is communicated through a reserved opening of the cabin and is exposed in the monitoring cavity, and the humidity control component is positioned in the monitoring cavity; one side of the cabin is reserved with a gap for a lead of the monitoring probe to pass through, the monitoring probe is electrically connected with the electrochemical impedance spectrum measuring instrument through the lead, and the electrochemical impedance spectrum measuring instrument is connected with the processor.
The temperature control component is used for regulating and controlling the temperature of the environment in the monitoring cavity to be consistent with the actual service atmospheric environment temperature of the lead-free solder alloy; the humidity control component is used for regulating and controlling the humidity of the environment in the monitoring cavity to be consistent with the humidity of the actual service atmospheric environment of the lead-free solder alloy, and the humidity in the monitoring cavity is regulated and controlled by the relative proportion of glycerin/water in the humidity control component so as to simulate the humidity change of the atmospheric environment; the monitoring cavity is used for simulating the actual service atmospheric environment of the lead-free solder alloy; the monitoring window is used when the Raman spectrometer works, and the monitoring window is covered by a glass sheet when the Raman spectrometer is in a non-working state.
The monitoring probe is exposed in the monitoring cavity and is positioned on the same vertical line with the monitoring window and the Raman spectrometer measuring probe.
The monitoring probe is of a columnar structure, a first monitoring electrode and a second monitoring electrode which are made of lead-free solder alloy are arranged on the monitoring probe, the space between the first monitoring electrode and the second monitoring electrode and the outer side of the first monitoring electrode and the outer side of the second monitoring electrode are filled and fixed by the insulating part, the upper end surface of the monitoring probe is a monitoring surface, the upper surfaces of the first monitoring electrode and the second monitoring electrode are exposed and flush with the monitoring surface, and a probe lead is respectively led out from the first monitoring electrode and the second monitoring electrode to be connected with the electrochemical impedance spectrum measuring instrument; the electrochemical impedance spectrum measuring instrument is used for measuring the electrochemical impedance spectrum of the monitoring probe under the coverage of the corrosion simulation liquid and transmitting the measured electrochemical impedance spectrum to the processor.
Lead-free solder alloy atmosphere corrosion behavior evolution simulation monitoring devices, first monitoring electrode with the second monitoring electrode all has more than two broach, makes first monitoring electrode with the second monitoring electrode all is the pectination, the broach of first monitoring electrode with the broach of second monitoring electrode is crisscross each other, and is adjacent first monitoring electrode broach with the clearance has between the second monitoring electrode broach, in order to avoid first monitoring electrode with the direct contact of second monitoring electrode, this clearance size is between 0.1 ~ 0.5 mm.
The device for simulating and monitoring atmospheric corrosion behavior evolution of the lead-free solder alloy comprises a measuring probe of a Raman spectrometer, a processor and a monitoring window, wherein the measuring probe is positioned at the top end of the cabin and is reserved right above the monitoring window, and the measuring probe is used for representing surface corrosion morphology evolution and Raman spectrum characteristic evolution of the monitoring probe in a corrosion process and transmitting measured morphology information and Raman spectrum information to the processor.
A simulation monitoring method for atmospheric corrosion behavior evolution of lead-free solder alloy comprises the following steps:
(1) the temperature and the humidity in the monitoring cavity are respectively adjusted to be consistent with the temperature and the humidity in the actual environment through the temperature control component and the humidity control component; the ambient humidity in the monitoring cavity is regulated and controlled to be consistent with the actual atmospheric environment through the relative proportion of glycerin/water;
(2) preparing a monitoring probe, manufacturing a first monitoring electrode and a second monitoring electrode by adopting lead-free solder alloy, polishing the surfaces of one end of the first monitoring electrode and one end of the second monitoring electrode of the monitoring probe, including monitoring surfaces, until the surfaces of the two monitoring electrodes are exposed, cleaning the surfaces with alcohol to remove oil, and placing the surfaces in a dryer for 24 days for experiments;
(3) placing the monitoring probe in a monitoring cavity, so that the center of a monitoring surface of the monitoring probe, the center of a monitoring window and a measuring probe of the Raman spectrometer are on the same vertical line;
(4) coating corrosion simulation liquid on a monitoring surface of the monitoring probe, wherein the monitoring probe is in a wetting stage after the corrosion simulation liquid is coated on the monitoring probe, and the monitoring probe enters a drying stage after the corrosion simulation liquid is volatilized, wherein the wetting stage and the drying stage are respectively 12 hours; coating deionized water on the monitoring probe until the deionized water is completely volatilized, wherein the time from the coating of the deionized water on the monitoring probe to the volatilization of the deionized water is 12 hours, and circulating;
(5) measuring the electrochemical impedance spectrum evolution of the monitoring probe under the coverage of the corrosion simulation liquid by the electrochemical impedance spectrum measuring instrument, measuring the full frequency from high frequency to low frequency of 100kHz to 0.01Hz, transmitting the measured electrochemical impedance spectrum to the processor, and calculating the measured impedance value Z at 0.01Hz by the processorLAnd an impedance value Z at 100kHzHAnd calculating the polarization resistance value Rp＝ZL-ZHFurther, the corrosion rate V of the lead-free solder alloy was calculated to be 1/Rp(ii) a The time required for measuring the full-frequency impedance spectrum for one time is 10min, after one-time measurement is finished, the electrochemical impedance spectrum measuring instrument automatically enters the next measurement, and the measurement is circulated.
The atmospheric corrosion behavior evolution simulation monitoring method of the lead-free solder alloy is characterized in that the corrosion rate 1/R after multiple coatings drawn by the processor is usedpAnd predicting the corrosion rate evolution trend of the lead-free solder alloy in the actual service environment by a two-dimensional relation graph of the curve along with the evolution of the coating times.
According to the method for simulating and monitoring atmospheric corrosion behavior evolution of the lead-free solder alloy, a Raman spectrometer shoots the evolution of the corrosion morphology on the surface of the monitoring probe or detects the laser Raman spectrum of a corrosion product in an interested area and transmits the measured spectrogram to the processor under the coverage of the corrosion simulation liquid of the monitoring probe or after the corrosion simulation liquid of the monitoring probe completely volatilizes according to requirements.
The simulation monitoring method for atmospheric corrosion behavior evolution of the lead-free solder alloy is used for simulating and monitoring the environment according to the simulated environment obtained by processing the lead-free solder alloy by the processorCorrosion rate 1/R of medium lead-free solder alloypAnd (3) predicting corrosion rate evolution, morphology evolution and product component evolution rules of the lead-free solder alloy in the actual service environment by using the curve, the corrosion product morphology evolution diagram and the component evolution diagram.
The invention has the advantages and beneficial effects that:
1. the invention relates to a lead-free solder alloy atmospheric corrosion behavior evolution simulation monitoring device, which is suitable for lead-free solder alloy corrosion behavior evolution monitoring in different atmospheric environments, such as: monitoring, characterization, corrosion resistance evaluation and the like of corrosion evolution behaviors of the lead-free solder alloy under the coverage of the thin liquid film in environments such as a marine atmospheric environment, an acid rain atmospheric environment, a coast/acid rain mixed atmospheric environment and the like.
2. The device for simulating and monitoring atmospheric corrosion behavior evolution of the lead-free solder alloy can determine the composition and concentration of different simulation solutions according to the types and concentrations of pollutants in different actual service atmospheric environments, and can set a reasonable test period and monitoring frequency according to the corrosion condition of the lead-free solder alloy.
3. The device for simulating and monitoring atmospheric corrosion behavior evolution of the lead-free solder alloy has the advantages of simple structure, reliable experimental method, reasonable steps, strong operability, convenience and practicability.
4. The device for simulating and monitoring the evolution of the atmospheric corrosion behavior of the lead-free solder alloy is suitable for monitoring the corrosion of the lead-free solder alloy and representing the phase composition and the morphology evolution of a product caused by the condensation of a thin liquid film due to the change of atmospheric temperature and humidity in different service environments, and has the characteristics of strong operability and high reliability.
5. The invention is also suitable for monitoring and characterizing the corrosion evolution behavior of other metal materials with obvious galvanic corrosion characteristics due to uneven phase composition or tissue distribution.
Drawings
FIG. 1 is a schematic view of an atmospheric corrosion behavior evolution simulation monitoring device for a lead-free solder alloy according to an embodiment of the present invention;
fig. 2 is a schematic view showing the structure of the lead-free solder alloy monitoring probe of fig. 1.
Description of reference numerals:
10. an atmospheric corrosion behavior evolution simulation monitoring device for the lead-free solder alloy; 100. a cabin; 110. monitoring the cavity; 120. monitoring a window; 200. a temperature control component; 300. a moisture control component; 400. a glass sheet; 500. monitoring the probe; 510. an insulating member; 521. a first monitoring electrode; 522. a second monitoring electrode; 530. monitoring the surface; 600. a probe wire; 700. an electrochemical impedance spectroscopy meter; 800. a Raman spectrometer; 900. a processor.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the present embodiment relates to a device 10 for simulating and monitoring atmospheric corrosion behavior evolution of a lead-free solder alloy. The device 10 for simulating and monitoring atmospheric corrosion behavior evolution of the lead-free solder alloy comprises a cabin 100, a temperature control component 200, a humidity control component 300, a glass sheet 400, a monitoring probe 500, a probe lead 600, an electrochemical impedance spectroscopy measuring instrument 700, a Raman spectrometer 800 and a processor 900.
The chamber 100 has a monitoring chamber 110 and a monitoring window 120. The cabin 100 is made of an organic glass plate, and the organic glass plate are fused and bonded by trichloromethane; a response gap reserved on the side surface of the cabin 100 is used for the probe lead 600 to pass through; a monitoring window 120 is reserved at the top of the cabin 100, the raman spectrometer 800 is arranged above the monitoring window 120, the monitoring window 120 is used by the raman spectrometer 800 when working, and the monitoring window 120 is covered by the glass sheet 400 when not working; the chamber 100 has a monitoring chamber 110 therein, and the monitoring chamber 110 is used for simulating an atmospheric corrosion environment.
Referring to fig. 1, the temperature control member 200 is fixed on one side of the top of the cabin 100 and is communicated with the monitoring cavity 110 through a cabin reserved gap for adjusting the temperature in the cavity to be consistent with the temperature of the actual atmospheric environment; the humidity control component 300 is located in the monitoring cavity 110 and is used for adjusting the humidity in the cavity to be consistent with the temperature of the actual atmospheric environment; the humidity of the environment of the monitoring chamber 110 is regulated by a ratio of glycerin/water.
Referring to fig. 1, the monitoring probe 500 is disposed at the bottom of the monitoring cavity 110 and right below the monitoring window 120, the monitoring probe 500 is exposed to the simulated atmosphere environment of the monitoring cavity 110, and is connected to the electrochemical impedance spectrum measuring instrument 700 through a notch reserved in the chamber 100 by a probe wire 600, the electrochemical impedance spectrum measuring instrument 700 is configured to measure an electrochemical impedance spectrum of the monitoring probe 500 covered by the corrosion simulation solution, and transmit information of the measured electrochemical impedance spectrum to the processor 900.
Referring to fig. 1, the measuring probe of the raman spectrometer 800 is located right above the reserved monitoring window 120 at the top end of the chamber 100, and is configured to measure the characteristics of the surface corrosion product morphology and the raman spectrum evolution in the simulated corrosion process of the monitoring probe 500 located inside the monitoring cavity 110 right below the monitoring window 120, and transmit the measured morphology information and raman spectrum information to the processor 900.
Referring to fig. 2, the monitoring probe 500 is a columnar structure, and has a first monitoring electrode 521 and a second monitoring electrode 522 made of a lead-free solder alloy thereon, the first monitoring electrode 521 and the second monitoring electrode 522 are fixed between and outside by a filling insulator 510, the insulator 510 may be an epoxy resin insulating filling material, the upper end surface of the monitoring probe 500 is a monitoring surface 530, the upper surfaces of the first monitoring electrode 521 and the second monitoring electrode 522 are exposed and flush with the monitoring surface 530, and a probe lead 600 is led out from each of the first monitoring electrode 521 and the second monitoring electrode 522 and connected to the electrochemical impedance spectroscopy apparatus 700. The first monitoring electrode 521 and the second monitoring electrode 522 both have more than two comb teeth, so that the first monitoring electrode 521 and the second monitoring electrode 522 are both comb-shaped, the comb teeth of the first monitoring electrode 521 and the comb teeth of the second monitoring electrode 522 are mutually staggered, and a gap is formed between the adjacent first monitoring electrode 521 and the second monitoring electrode 522 so as to avoid direct contact between the first monitoring electrode 521 and the second monitoring electrode 522, and the size of the gap is preferably 0.1-0.5 mm.
The embodiment relates to a simulation monitoring device for evolution of atmospheric corrosion behavior of lead-free solder alloy, which relates to a simulation monitoring method for evolution of atmospheric corrosion behavior of lead-free solder alloy when the simulation monitoring device is used for evolution of atmospheric corrosion behavior of solder alloy.
A simulation monitoring method for atmospheric corrosion behavior evolution of lead-free solder alloy comprises the following steps:
referring to fig. 1, the temperature and humidity of the environment in the monitoring cavity 110 are respectively adjusted to be consistent with the temperature and humidity of the actual atmospheric environment by the temperature control component 200 and the humidity control component 300; the humidity of the environment within the monitoring chamber 110 is adjusted to be consistent with the actual atmospheric environment by a ratio of glycerin/water.
A monitoring probe 500 is prepared, wherein the monitoring probe 500 has a first monitoring electrode 521 and a second monitoring electrode 522 made of a lead-free solder alloy. Referring to fig. 2, the surfaces of the first and second monitoring electrodes 521 and 522 at one end (including the monitoring surface 530) of the monitoring surface 530 of the monitoring probe 500 are slightly polished until the surfaces of the two monitoring electrodes are exposed, and after the oil is removed by cleaning with alcohol, the surface is placed in a desiccator 24 for use in an experiment.
Referring to fig. 1, the monitoring probe 500 is placed within the monitoring cavity 110 such that the center of the monitoring probe monitoring face 530 is on the same vertical line as the center of the monitoring window 120 and the measurement probe of the raman spectrometer 800.
By NaCl with NaHSO3Preparing corrosion simulation liquid, wherein NaCl and NaHSO in the corrosion simulation liquid3Should be consistent with the settlement of the corresponding pollutants in the actual atmospheric corrosion environment.
Coating the corrosion simulation liquid on the monitoring surface 530 of the monitoring probe 500, wherein the coating amount of the corrosion simulation liquid on the monitoring surface 530 is 25 muL/cm2。
The electrochemical impedance spectrum measuring instrument 700 measures the electrochemical impedance spectrum of the monitoring probe 500 covered by the corrosion simulation liquid, the full frequency range from high frequency to low frequency is 100kHz to 0.01Hz, the measured electrochemical impedance spectrum is transmitted to the processor 900, and the processor 900 calculates the measured impedance value Z at 0.01HzLAnd an impedance value Z at 100kHzHAnd calculating a polarization resistance value Rp＝ZL-ZHFurther, the corrosion rate V of the lead-free solder alloy was calculated to be 1/Rp. The time required for measuring the full-frequency impedance spectrum for one time is 10min, after one measurement is finished, the electrochemical impedance spectrum measuring instrument 700 automatically enters the next measurement, and the measurement is circulated in the way, when the impedance value measured by the electrochemical impedance spectrum measuring instrument 700 exceeds 1 multiplied by 108Ω·cm2It indicates that the corrosion-simulating fluid has been volatilized.
After the corrosion simulation liquid is coated on the monitoring probe 500, the monitoring probe 500 is in a wetting stage, and the monitoring probe 500 enters a drying stage after the corrosion simulation liquid is volatilized, wherein the time of the wetting stage and the time of the drying stage are 12 hours respectively. And coating deionized water on the monitoring probe 500 until the deionized water is completely volatilized, wherein the time from the step of coating the deionized water on the monitoring probe 500 to the step of volatilizing the deionized water is 12 hours, and the coating times of the deionized water can be adjusted according to requirements.
Multiple post-coating corrosion rate 1/R plotted against the processor 900pPredicting lead-free welding in actual service environment by using two-dimensional relation graph of curve along with evolution of coating timesThe corrosion rate of the material alloy changes.
The raman spectrometer 800 may photograph the evolution of the corrosion morphology of the surface of the monitoring probe under the coverage of the corrosion simulation liquid of the monitoring probe or after complete volatilization as required, or may detect the laser raman spectrum of the corrosion product in the region of interest and transmit the measured spectrogram to the processor 900.
According to the corrosion rate 1/R of the lead-free solder alloy in the simulated environment obtained by the processing of the processor 900pAnd (3) predicting corrosion rate evolution, morphology evolution and product component evolution rules of the lead-free solder alloy in the actual service environment by using the curve, the corrosion product morphology evolution diagram and the component evolution diagram.
The result shows that the invention combines and cooperates the temperature control component, the humidity control component, the monitoring probe, the electrochemical impedance spectrum measuring instrument, the processor, the Raman spectrometer and the like, wherein: the temperature control component is used for adjusting and monitoring the temperature in the cavity; the humidity control component is used for adjusting and monitoring the humidity in the cavity. The monitoring probe made of the lead-free solder alloy is exposed in the monitoring cavity and connected to the electrochemical impedance spectrum measuring instrument, and the electrochemical impedance spectrum measuring instrument is used for measuring the evolution of the impedance spectrum of the monitoring probe and is connected to the processor; the Raman spectrometer is used for monitoring the corrosion appearance of the probe and the representation of the evolution of the composition of the product phase and is also connected with the processor. Therefore, the method is suitable for simulation monitoring and characterization of atmospheric corrosion behavior evolution of the lead-free solder in different environments, and has high reliability.
Various technical features of the above embodiments may be combined arbitrarily, and for brevity, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between combinations of these technical features, the scope of the present specification should be considered as being described.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The device for simulating and monitoring evolution of atmospheric corrosion behavior of the lead-free solder alloy is characterized by comprising a cabin, a temperature control component, a humidity control component, a monitoring probe, an electrochemical impedance spectrum measuring instrument, a Raman spectrometer and a processor, and has the following specific structure:
the cabin is provided with a monitoring cavity and a monitoring window, the inner cavity of the cabin is the monitoring cavity, the monitoring window is positioned at the top of the cabin, and the monitoring window is communicated with the monitoring cavity; the Raman spectrometer is arranged above the monitoring window, the monitoring probe is arranged right below the monitoring window and at the bottom of the monitoring cavity, the measuring probe of the Raman spectrometer corresponds to the monitoring probe, and the Raman spectrometer is connected with the processor; the temperature control component is fixed in the cabin, is communicated through a reserved opening of the cabin and is exposed in the monitoring cavity, and the humidity control component is positioned in the monitoring cavity; one side of the cabin is reserved with a gap for a lead of the monitoring probe to pass through, the monitoring probe is electrically connected with the electrochemical impedance spectrum measuring instrument through the lead, and the electrochemical impedance spectrum measuring instrument is connected with the processor.
2. The device for simulating and monitoring atmospheric corrosion behavior evolution of lead-free solder alloy as claimed in claim 1, wherein the temperature control component is used for regulating and controlling the environmental temperature in the monitoring cavity to be consistent with the actual service atmospheric environmental temperature of the lead-free solder alloy; the humidity control component is used for regulating and controlling the humidity of the environment in the monitoring cavity to be consistent with the humidity of the actual service atmospheric environment of the lead-free solder alloy, and the humidity in the monitoring cavity is regulated and controlled by the relative proportion of glycerin/water in the humidity control component so as to simulate the humidity change of the atmospheric environment; the monitoring cavity is used for simulating the actual service atmospheric environment of the lead-free solder alloy; the monitoring window is used when the Raman spectrometer works, and the monitoring window is covered by a glass sheet when the Raman spectrometer is in a non-working state.
3. The device for simulating and monitoring atmospheric corrosion behavior evolution of lead-free solder alloy as claimed in claim 1, wherein the monitoring probe is exposed in the monitoring cavity and is on the same vertical line with the monitoring window and the Raman spectrometer measuring probe.
4. The device for simulating and monitoring atmospheric corrosion behavior evolution of lead-free solder alloy as claimed in claim 1, wherein the monitoring probe is of a columnar structure, and has a first monitoring electrode and a second monitoring electrode made of lead-free solder alloy thereon, the first monitoring electrode and the second monitoring electrode are fixed and filled with the insulating member between the first monitoring electrode and the second monitoring electrode, the upper end surface of the monitoring probe is a monitoring surface, the upper surfaces of the first monitoring electrode and the second monitoring electrode are exposed and flush with the monitoring surface, and a probe lead is respectively led out from the first monitoring electrode and the second monitoring electrode to be connected with the electrochemical impedance spectroscopy meter; the electrochemical impedance spectrum measuring instrument is used for measuring the electrochemical impedance spectrum of the monitoring probe under the coverage of the corrosion simulation liquid and transmitting the measured electrochemical impedance spectrum to the processor.
5. The device for simulating and monitoring atmospheric corrosion behavior evolution of lead-free solder alloy as claimed in claim 4, wherein the first and second monitoring electrodes have two or more comb teeth, so that the first and second monitoring electrodes are comb-shaped, the comb teeth of the first monitoring electrode and the comb teeth of the second monitoring electrode are interlaced with each other, and a gap is formed between adjacent comb teeth of the first and second monitoring electrodes to avoid direct contact between the first and second monitoring electrodes, and the gap is 0.1-0.5 mm.
6. The device for simulating and monitoring atmospheric corrosion behavior evolution of lead-free solder alloy as claimed in claim 1, wherein the measuring probe of the raman spectrometer is located at the top of the cabin and vertically above the monitoring window reserved for characterizing surface corrosion morphology evolution and raman spectrum characteristic evolution of the monitoring probe in the corrosion process, and transmits the measured morphology information and raman spectrum information to the processor.
7. A simulation monitoring method for atmospheric corrosion behavior evolution of lead-free solder alloy as claimed in any one of claims 1 to 6, characterized by comprising the following steps:
(1) the temperature and the humidity in the monitoring cavity are respectively adjusted to be consistent with the temperature and the humidity in the actual environment through the temperature control component and the humidity control component; the ambient humidity in the monitoring cavity is regulated and controlled to be consistent with the actual atmospheric environment through the relative proportion of glycerin/water;
(2) preparing a monitoring probe, manufacturing a first monitoring electrode and a second monitoring electrode by adopting lead-free solder alloy, polishing the surfaces of one end of the first monitoring electrode and one end of the second monitoring electrode of the monitoring probe, including monitoring surfaces, until the surfaces of the two monitoring electrodes are exposed, cleaning the surfaces with alcohol to remove oil, and placing the surfaces in a dryer for 24 days for experiments;
(3) placing the monitoring probe in a monitoring cavity, so that the center of a monitoring surface of the monitoring probe, the center of a monitoring window and a measuring probe of the Raman spectrometer are on the same vertical line;
(4) coating corrosion simulation liquid on a monitoring surface of the monitoring probe, wherein the monitoring probe is in a wetting stage after the corrosion simulation liquid is coated on the monitoring probe, and the monitoring probe enters a drying stage after the corrosion simulation liquid is volatilized, wherein the wetting stage and the drying stage are respectively 12 hours; coating deionized water on the monitoring probe until the deionized water is completely volatilized, wherein the time from the coating of the deionized water on the monitoring probe to the volatilization of the deionized water is 12 hours, and circulating;
(5) measuring the electrochemical impedance spectrum evolution of the monitoring probe under the coverage of the corrosion simulation liquid by the electrochemical impedance spectrum measuring instrument, measuring the full frequency from high frequency to low frequency of 100kHz to 0.01Hz, transmitting the measured electrochemical impedance spectrum to the processor, and calculating the measured impedance value Z at 0.01Hz by the processorLAnd an impedance value Z at 100kHzHAnd calculating the polarization resistance value Rp＝ZL-ZHFurther, the corrosion rate V of the lead-free solder alloy was calculated to be 1/Rp(ii) a The time required for measuring the full-frequency impedance spectrum for one time is 10min, after one-time measurement is finished, the electrochemical impedance spectrum measuring instrument automatically enters the next measurement, and the measurement is circulated.
8. The method for simulatively monitoring atmospheric corrosion behavior evolution of lead-free solder alloy as recited in claim 7, wherein the corrosion rate 1/R after multiple coating is plotted according to the processorpAnd predicting the corrosion rate evolution trend of the lead-free solder alloy in the actual service environment by a two-dimensional relation graph of the curve along with the evolution of the coating times.
9. The method for simulating and monitoring atmospheric corrosion behavior evolution of lead-free solder alloy as claimed in claim 7, wherein the Raman spectrometer shoots the evolution of the corrosion morphology on the surface of the monitoring probe or detects the laser Raman spectrum of the corrosion product in the region of interest and transmits the measured spectrogram to the processor as required under the coverage of the corrosion simulation solution of the monitoring probe or after the corrosion simulation solution is completely volatilized.
10. The method for simulatively monitoring atmospheric corrosion behavior evolution of lead-free solder alloy as recited in claim 7, wherein the corrosion rate 1/R of the lead-free solder alloy in the simulated environment processed by the processor is used as a basispAnd (3) predicting corrosion rate evolution, morphology evolution and product component evolution rules of the lead-free solder alloy in the actual service environment by using the curve, the corrosion product morphology evolution diagram and the component evolution diagram.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114088613A (en) * | 2021-10-22 | 2022-02-25 | 武汉科思特仪器股份有限公司 | Tidal environment metal corrosion monitoring device and testing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114088613A (en) * | 2021-10-22 | 2022-02-25 | 武汉科思特仪器股份有限公司 | Tidal environment metal corrosion monitoring device and testing method |
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