CN112477402A - A heat-conducting glue printing jig for 5G communication product - Google Patents
A heat-conducting glue printing jig for 5G communication product Download PDFInfo
- Publication number
- CN112477402A CN112477402A CN202011547700.4A CN202011547700A CN112477402A CN 112477402 A CN112477402 A CN 112477402A CN 202011547700 A CN202011547700 A CN 202011547700A CN 112477402 A CN112477402 A CN 112477402A
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- Prior art keywords
- product
- groove
- heat
- base
- movable
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- 239000003292 glue Substances 0.000 title claims abstract description 19
- 238000004891 communication Methods 0.000 title claims abstract description 18
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 7
- 230000001680 brushing effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat-conducting glue printing jig for a 5G communication product, which comprises: the upper mechanism and the lower mechanism are detachably connected to fix a product. Through the mode, the heat-conducting glue printing jig for the 5G communication product, disclosed by the invention, has the advantages that the radiating fins are quickly and accurately positioned, the operation is convenient, and the time and the labor are saved; the quantity and the volume of the heat-conducting glue are ensured, the material scrap is reduced, the production efficiency is low, and the production cost is reduced.
Description
Technical Field
The invention relates to the field of electronic industry assembly, in particular to a heat-conducting glue printing jig for a 5G communication product.
Background
In recent years, with the development of 5G communication, 5G communication products are more and more attracted by people, and the demand is also rapidly increased, but corresponding production and processing equipment is lacked, and many processes can only be completed by manual operation, so that the working efficiency is reduced, the operation precision is low, and unified control cannot be realized.
Disclosure of Invention
The invention mainly solves the technical problem of providing the heat-conducting glue printing jig for the 5G communication product, which has the advantages of high reliability, accurate positioning, compact structure and the like, and has wide market prospect in the application and popularization of the assembly equipment in the electronic industry.
In order to solve the technical problems, the invention adopts a technical scheme that:
the utility model provides a heat-conducting glue printing jig for 5G communication product, it includes: the concrete structure includes: an upper mechanism and a lower mechanism, the upper mechanism and the lower mechanism are detachably connected to fix a product,
the upper mechanism comprises an upper connecting frame, a fixed support, a printing steel sheet, an upper positioning hole, a first movable through groove and a second movable through groove, the printing steel sheet is arranged on the fixed support by matching with a product printing part, the fixed support, the first movable through groove and the second movable through groove are arranged in the upper connecting frame, the first movable through groove and the second movable through groove which allow protruding parts which do not need to be printed on two sides of a product to pass through are arranged on two sides of the fixed support,
the lower mechanism comprises a base and a positioning pin, the lower part of the positioning pin is connected with the base, and the upper part of the positioning pin penetrates through a positioning hole in the product and is movably connected with the upper positioning hole so as to fix the product between the base and the upper connecting frame.
In a preferred embodiment of the present invention, the base is provided with a plurality of positioning pins.
In a preferred embodiment of the present invention, the lower positioning hole is disposed on the base.
In a preferred embodiment of the present invention, the lower end of the positioning pin is detachably connected to the lower positioning hole.
In a preferred embodiment of the present invention, the base is provided with a fixing groove for matching with the product structure.
The invention has the beneficial effects that: the radiating fins are quickly and accurately positioned, the operation is convenient, and time and labor are saved; the quantity and the volume of the heat-conducting glue are ensured, the material scrap is reduced, the production efficiency is low, and the production cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic structural diagram of an upper mechanism of a thermal conductive paste printing jig for 5G communication products according to the present invention;
fig. 2 is a schematic structural diagram of a lower-middle mechanism of a thermal conductive adhesive printing jig for a 5G communication product according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, an embodiment of the present invention includes:
the utility model provides a heat-conducting glue printing jig for 5G communication product, its mainly used fin 9's printing is fixed to ensure printing quality, concrete structure includes: the upper mechanism and the lower mechanism are detachably connected.
The upper mechanism includes: the device comprises an upper connecting frame 1, a fixed support 2, a printing steel sheet 3, an upper positioning hole 4, a first movable through groove 5 and a second movable through groove 6.
The printing steel sheet set up in on the fixed bolster, through the position, weight and the volume that the printing steel sheet can control the heat-conducting glue, control cost and material are scrapped, promote production efficiency, fixed bolster, first activity lead to groove and second activity lead to the groove and set up in last link, just first activity lead to the groove with the second activity lead to the groove set up in the both sides of fixed bolster, first activity lead to the groove with the second activity lead to the groove and allow the protruding portion that the product both sides need not print to pass, not only can play the effect of dodging, can further fix a position moreover, go up the locating hole set up in on the last link.
The lower mechanism includes: the positioning device comprises a base 7, a positioning pin and a lower positioning hole 8, wherein the lower positioning hole is formed in the base, the lower portion of the positioning pin is movably connected with the lower positioning hole, and the upper portion of the positioning pin penetrates through the positioning hole in the product and is movably connected with the upper positioning hole so as to fix the product between the base and the upper connecting frame.
The specific operation steps of the heat-conducting glue printing jig for the 5G communication product comprise:
the first step is as follows: preparing a printing jig, a radiating fin 1 and heat conducting glue;
the second step is that: the base and the upper connecting frame are disassembled, and the radiating fins are fixed on the base through the positioning pins;
the third step: aligning an upper positioning hole on the upper connecting frame with the positioning pin, and then pressing down the upper connecting frame to enable the upper connecting frame and the base to fix the radiating fin in the middle;
the fourth step: uniformly brushing the heat-conducting glue on the printing steel sheet by using a small brush;
the fourth step: after brushing, the upper connecting frame is taken away, the radiating fins are taken out, whether the required quantity is met or not is weighed and verified, and the glue brushing and the assembling are completed.
The heat-conducting glue printing jig for the 5G communication product has the beneficial effects that:
1. the radiating fins are quickly and accurately positioned, the operation is convenient, and time and labor are saved;
2. the quantity and the volume of the heat-conducting glue are ensured, the material scrap is reduced, the production efficiency is low, and the production cost is reduced.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. The utility model provides a heat-conducting glue printing jig for 5G communication product which characterized in that includes: the concrete structure includes: an upper mechanism and a lower mechanism, the upper mechanism and the lower mechanism are detachably connected to fix a product,
the upper mechanism comprises an upper connecting frame, a fixed support, a printing steel sheet, an upper positioning hole, a first movable through groove and a second movable through groove, the printing steel sheet is arranged on the fixed support by matching with a product printing part, the fixed support, the first movable through groove and the second movable through groove are arranged in the upper connecting frame, the first movable through groove and the second movable through groove which allow protruding parts which do not need to be printed on two sides of a product to pass through are arranged on two sides of the fixed support,
the lower mechanism comprises a base and a positioning pin, the lower part of the positioning pin is connected with the base, and the upper part of the positioning pin penetrates through a positioning hole in the product and is movably connected with the upper positioning hole so as to fix the product between the base and the upper connecting frame.
2. A heat conductive adhesive printing jig for 5G communication products according to claim 1, wherein a plurality of said positioning pins are provided on said base.
3. The tool of claim 1, wherein the lower positioning holes are disposed on the base.
4. A heat-conducting glue printing jig for a 5G communication product according to claim 3, wherein the lower ends of the positioning pins are detachably connected with the lower positioning holes.
5. A heat conductive adhesive printing jig for 5G communication products as claimed in claim 1, wherein the base is provided with fixing grooves for fitting with the product structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011547700.4A CN112477402A (en) | 2020-12-24 | 2020-12-24 | A heat-conducting glue printing jig for 5G communication product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011547700.4A CN112477402A (en) | 2020-12-24 | 2020-12-24 | A heat-conducting glue printing jig for 5G communication product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112477402A true CN112477402A (en) | 2021-03-12 |
Family
ID=74915524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011547700.4A Pending CN112477402A (en) | 2020-12-24 | 2020-12-24 | A heat-conducting glue printing jig for 5G communication product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112477402A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200324855Y1 (en) * | 2003-06-11 | 2003-08-27 | 주식회사 대영테크 | Jig for multi-face printer |
| CN200974358Y (en) * | 2006-11-29 | 2007-11-14 | 比亚迪精密制造有限公司 | Printing instrument |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN103179793A (en) * | 2011-12-26 | 2013-06-26 | 芯讯通无线科技（上海）有限公司 | Printing jig |
| CN107567205A (en) * | 2017-10-23 | 2018-01-09 | 伟创力电子技术(苏州)有限公司 | Connector brush tin tool |
| CN208113082U (en) * | 2018-03-27 | 2018-11-16 | 广东欧珀移动通信有限公司 | Printing apparatus for circuit board |
| CN214395908U (en) * | 2020-12-24 | 2021-10-15 | 伟创力电子技术(苏州)有限公司 | A heat-conducting glue printing jig for 5G communication product |
-
2020
- 2020-12-24 CN CN202011547700.4A patent/CN112477402A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200324855Y1 (en) * | 2003-06-11 | 2003-08-27 | 주식회사 대영테크 | Jig for multi-face printer |
| CN200974358Y (en) * | 2006-11-29 | 2007-11-14 | 比亚迪精密制造有限公司 | Printing instrument |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN103179793A (en) * | 2011-12-26 | 2013-06-26 | 芯讯通无线科技（上海）有限公司 | Printing jig |
| CN107567205A (en) * | 2017-10-23 | 2018-01-09 | 伟创力电子技术(苏州)有限公司 | Connector brush tin tool |
| CN208113082U (en) * | 2018-03-27 | 2018-11-16 | 广东欧珀移动通信有限公司 | Printing apparatus for circuit board |
| CN214395908U (en) * | 2020-12-24 | 2021-10-15 | 伟创力电子技术(苏州)有限公司 | A heat-conducting glue printing jig for 5G communication product |
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