CN112466827A - Cooling device, control equipment and rail train - Google Patents
Cooling device, control equipment and rail train Download PDFInfo
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- CN112466827A CN112466827A CN202011398984.5A CN202011398984A CN112466827A CN 112466827 A CN112466827 A CN 112466827A CN 202011398984 A CN202011398984 A CN 202011398984A CN 112466827 A CN112466827 A CN 112466827A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention belongs to the technical field of cooling devices, and particularly relates to a cooling device, control equipment and a rail train. The invention aims to solve the problem of low heat exchange efficiency between a refrigerant close to a liquid outlet and the base plate and the cover plate. The cooling device comprises a base plate and a cover plate, wherein a liquid inlet and a liquid outlet are formed in the end part of the base plate, a groove is formed in the sealing side surface of the base plate, the groove is provided with a first groove wall and a second groove wall which are oppositely arranged, a first partition plate extending towards the second groove wall is arranged on the first groove wall, a second partition plate extending towards the first groove wall is arranged on the second groove wall, and a second preset gap is formed between the second partition plate and the first groove wall; and a drainage hole is formed in the position, opposite to the second preset gap, of the first partition plate. The coolant of upper reaches is partly direct to be followed the second and preset the clearance and then flow to low reaches from the drainage hole flow direction, compares with the cooling device who does not set up the drainage hole, has reduced the temperature of low reaches coolant, and then has improved the heat exchange efficiency between low reaches coolant and base plate and the apron.
Description
Technical Field
The embodiment of the invention relates to the technical field of cooling devices, in particular to a cooling device, control equipment and a rail train.
Background
With the continuous enlargement of the urban rail transit road network and the sharp increase of passenger capacity, an Insulated Gate Bipolar Transistor (IGBT) is used as a key component in a main converter of an urban motor train unit, and generates a large amount of heat during working, so that the IGBT needs to be radiated to ensure the normal working of the IGBT.
In the related art, the temperature of the insulated gate bipolar transistor device is usually reduced by a cooling device. The cooling device comprises a substrate and a cover plate, wherein the substrate is provided with a liquid inlet, a liquid outlet and a flow groove communicated with the liquid inlet and the liquid outlet, and the flow groove is bent and extended on the substrate; the cover plate covers the base plate, so that a flow channel is enclosed between the cover plate and the flow groove; the insulated gate bipolar transistor device is mounted on a substrate or a cover plate. During operation, a refrigerant is conveyed into the flow channel through the liquid inlet, heat exchange is carried out between the refrigerant and the cover plate and between the refrigerant and the base plate, heat generated by the insulated gate bipolar transistor device is absorbed, and then the refrigerant carrying heat flows out of the liquid outlet, so that the insulated gate bipolar transistor device is cooled.
However, the temperature of the refrigerant in the flow channel close to the liquid inlet is low, and the temperature of the refrigerant close to the liquid outlet is high, so that the heat exchange efficiency between the refrigerant close to the liquid outlet and the substrate and the cover plate is low, and the cooling effect of the insulated gate bipolar transistor devices on the substrate close to the liquid outlet and the cover plate is poor.
Disclosure of Invention
In view of this, embodiments of the present invention provide a cooling device, a control device, and a rail train, so as to solve the technical problem of low heat exchange efficiency between a refrigerant close to a liquid outlet and a base plate and a cover plate.
The embodiment of the invention provides a cooling device, which comprises a substrate and a cover plate, wherein a liquid inlet and a liquid outlet are arranged at the end part of the substrate, a groove is arranged on the sealing side surface of the substrate, the groove is provided with a first groove wall and a second groove wall which are oppositely arranged, a first partition plate extending to the second groove wall is arranged on the first groove wall, a first preset gap is formed between the first partition plate and the second groove wall, a second partition plate extending to the first groove wall is arranged on the second groove wall, and a second preset gap is formed between the second partition plate and the first groove wall; the first partition plate and the second partition plate divide the groove into a flow channel, one end of the flow channel is communicated with the liquid inlet, and the other end of the flow channel is communicated with the liquid outlet;
the first partition plate is arranged close to the liquid inlet, and a drainage hole is formed in the position, opposite to the second preset gap, of the first partition plate; part of the refrigerant in the flow channel at one side of the drainage hole close to the liquid inlet flows to the second preset gap from the drainage hole; the cover plate covers the sealing side face.
Through the arrangement, the drainage holes are formed in the first partition plate, so that most of the refrigerant at the upstream flows downstream along the flow channel, and the residual refrigerant with less compensation enters the second preset gap at the downstream through the drainage holes and further enters the downstream flow channel; the temperature of the refrigerant flowing into the downstream flow channel through the drainage holes is low, so that the temperature of the refrigerant in the downstream flow channel is prevented from being too high, compared with the case that the drainage holes are not arranged, the temperature of the refrigerant in the downstream flow channel is reduced, the heat exchange efficiency between the refrigerant in the downstream flow channel and the base plate and between the refrigerant in the downstream flow channel and the cover plate is improved, the cooling effect on the insulated gate bipolar transistor device is improved, the temperature uniformity of the surface of the cooling device is improved through the drainage holes, and the temperature difference of the insulated gate bipolar transistor device is reduced. Meanwhile, the flow of the refrigerant in the flow channel is reduced by the drainage holes, so that the flow resistance of the refrigerant in the flow channel is reduced, and the heat exchange effect of the cooling device is further improved.
In some embodiments which may include the above embodiments, the first partition plate and the second partition plate are multiple, the multiple first partition plates and the multiple second partition plates are sequentially arranged in a staggered manner, the multiple first partition plates except for the first partition plate close to the liquid outlet are all provided with drainage holes, and each drainage hole is arranged opposite to the second preset gap on the downstream.
So set up, the length of runner can be prolonged to a plurality of first baffles and second baffle, and then has increased the time that the refrigerant flowed in the runner, has improved the heat exchange efficiency of refrigerant. The first baffle that is close to the liquid outlet does not set up the drainage hole, avoids being close to the partial refrigerant of liquid outlet and directly flows from the liquid outlet through the drainage hole.
In some embodiments, which may include the above embodiments, both the liquid inlet and the liquid outlet are disposed on the mounting end proximate the first slot wall.
So set up, inlet and liquid outlet are located same terminal surface, have made things convenient for laying of pipeline.
In some embodiments that may include the above-mentioned embodiments, a plurality of heat exchange fins are provided in the flow channel, the plurality of heat exchange fins are arranged in parallel and at intervals, and the heat exchange fins are arranged along the extending direction of the flow channel.
So set up, heat transfer fin has increased the area of contact of refrigerant, has strengthened the heat transfer effect.
In some embodiments, which may include the above embodiments, the heat exchanging fins are integral with the base plate.
So set up, make overall structure simpler, the installation of being convenient for.
In some embodiments, which may include the above embodiments, the cooling device further includes a heat exchange plate disposed within the flow channel, the heat exchange fins being disposed on the heat exchange plate.
So set up, the heat transfer board has further increased the area of contact of refrigerant, has further strengthened the heat transfer effect.
In some embodiments, which may include the above-described embodiments, a plurality of heat exchange fins are provided on both the side of the heat exchange plate facing the groove bottom of the groove and the side of the heat exchange plate facing away from the groove bottom of the groove.
So set up, the both sides face of heat transfer board all sets up a plurality of heat transfer fins, makes the refrigerant equal with the heat exchange efficiency of apron and base plate to make apron and base plate surface to the cooling of insulated gate bipolar transistor device more even.
In some embodiments, which may include the above embodiments, the heat exchange fin has a plurality of heat exchange protrusions disposed on a surface thereof, and the heat exchange protrusions extend along an extending direction of the flow channel.
So set up, the heat transfer is protruding to have increased the area of contact of refrigerant with heat transfer fin to make full use of refrigerant has improved heat exchange efficiency.
The embodiment of the invention also provides control equipment which comprises an insulated gate bipolar transistor device and the cooling device, wherein the insulated gate bipolar transistor device is arranged at the bottom of the substrate and/or at the top of the cover plate.
The embodiment of the invention also provides a rail train, which comprises a train body and the control equipment, wherein the train body is provided with an equipment bin, and the control equipment is arranged in the equipment bin.
The rail train provided by the embodiment of the invention comprises a train body, wherein control equipment is arranged in an equipment bin, the control equipment comprises an insulated gate bipolar transistor device and a cooling device in the embodiment, the insulated gate bipolar transistor device is arranged at the bottom of a base plate and/or the top of a cover plate, the cooling device comprises a base plate and a cover plate, a liquid inlet and a liquid outlet are arranged at the end part of the base plate, a groove is arranged on the sealing side surface of the base plate, the groove is provided with a first groove wall and a second groove wall which are oppositely arranged, a first partition plate extending towards the second groove wall is arranged on the first groove wall, a first preset gap is formed between the first partition plate and the second groove wall, a second partition plate extending towards the first groove wall is arranged on the second groove wall, and a second preset gap is formed between the second partition plate and; the first partition plate and the second partition plate divide the groove into a flow channel, one end of the flow channel is communicated with the liquid inlet, and the other end of the flow channel is communicated with the liquid outlet; the first partition plate is arranged close to the liquid inlet, and a drainage hole is formed in the position, opposite to the second preset gap, of the first partition plate. Most of the refrigerant at the upstream flows downstream along the flow channel by arranging the drainage holes on the first partition plate, and the residual refrigerant with less compensation enters a second preset gap at the downstream through the drainage holes and further enters the downstream flow channel; the temperature of the refrigerant flowing into the downstream flow channel through the drainage holes is low, so that the temperature of the refrigerant in the downstream flow channel is prevented from being too high, compared with the case that the drainage holes are not arranged, the temperature of the refrigerant in the downstream flow channel is reduced, the heat exchange efficiency between the refrigerant in the downstream flow channel and the base plate and between the refrigerant in the downstream flow channel and the cover plate is improved, the cooling effect on the insulated gate bipolar transistor device is improved, the temperature uniformity of the surface of the cooling device is improved through the drainage holes, and the temperature difference of the insulated gate bipolar transistor device is reduced. Meanwhile, the flow of the refrigerant in the flow channel is reduced by the drainage holes, so that the flow resistance of the refrigerant in the flow channel is reduced, and the heat exchange effect of the cooling device is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a first schematic structural diagram of a cooling device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a cooling device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram three of a cooling device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a cooling device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heat exchange fin provided in an embodiment of the present invention.
Description of reference numerals:
10. a substrate; 20. a cover plate; 30. a liquid inlet; 40. a liquid outlet; 50. heat exchange fins; 101. a groove; 102. a first slot wall; 103. a second slot wall; 104. a first separator; 105. a first preset gap; 106. a second separator; 107. a second preset gap; 108. a flow channel; 109. a drainage hole; 501. a heat exchange plate; 502. and heat exchange bulges.
Detailed Description
First, it should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present invention, and are not intended to limit the scope of the present invention. And can be adjusted as needed by those skilled in the art to suit particular applications.
Next, it should be noted that in the description of the embodiments of the present invention, the terms of direction or positional relationship indicated by the terms "inside", "outside", and the like are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or member must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. Specific meanings of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
With the continuous enlargement of the urban rail transit road network and the sharp increase of passenger capacity, an Insulated Gate Bipolar Transistor (IGBT) is used as a key component in a main converter of an urban motor train unit, and generates a large amount of heat during working, so that the IGBT needs to be radiated to ensure the normal working of the IGBT.
In the related art, the temperature of the insulated gate bipolar transistor device is usually reduced by a cooling device. The cooling device comprises a substrate and a cover plate, wherein the substrate is provided with a liquid inlet, a liquid outlet and a flow groove communicated with the liquid inlet and the liquid outlet, and the flow groove is bent and extended on the substrate; the cover plate covers the base plate, so that a flow channel is enclosed between the cover plate and the flow groove; the insulated gate bipolar transistor device is mounted on a substrate or a cover plate. During operation, a refrigerant is conveyed into the flow channel through the liquid inlet, heat exchange is carried out between the refrigerant and the cover plate and between the refrigerant and the base plate, heat generated by the insulated gate bipolar transistor device is absorbed, and then the refrigerant carrying heat flows out of the liquid outlet, so that the insulated gate bipolar transistor device is cooled.
However, the temperature of the refrigerant in the flow channel close to the liquid inlet is low, and the temperature of the refrigerant close to the liquid outlet is high, so that the heat exchange efficiency between the refrigerant close to the liquid outlet and the substrate and the cover plate is low, and the cooling effect of the insulated gate bipolar transistor devices on the substrate close to the liquid outlet and the cover plate is poor.
The embodiment provides a cooling device, controlgear and rail train, cooling device includes base plate and apron, be provided with the runner that supplies the refrigerant to flow through on the base plate, the refrigerant in the runner that will be close to the inlet is introduced in the runner that is close to the liquid outlet, make the refrigerant partly of upper reaches flow to low reaches along the runner, with the high temperature of the refrigerant in the runner of avoiding the low reaches, compare with the cooling device who does not introduce the refrigerant in the runner that is close to the inlet in the runner that is close to the liquid outlet, the temperature of low reaches refrigerant has been reduced, and then the heat exchange efficiency between low reaches refrigerant and base plate and apron has been improved.
Fig. 1 is a first schematic structural diagram of a cooling device according to an embodiment of the present invention. Fig. 2 is a schematic structural diagram of a cooling device according to an embodiment of the present invention. As shown in fig. 1 and fig. 2, the embodiment provides a cooling apparatus, which includes a substrate 10 and a cover plate 20, wherein a liquid inlet 30 and a liquid outlet 40 are disposed at ends of the substrate 10, and the liquid inlet 30 and the liquid outlet 40 may be vertically disposed on the same side surface of the substrate 10, or may be vertically disposed on a top surface or a bottom surface of the substrate 10 at the same time; a groove 101 is formed in the sealing side surface of the substrate 10, the groove 101 has a first groove wall 102 and a second groove wall 103 which are oppositely arranged, the first groove wall 102 is close to the liquid inlet 30, a first partition plate 104 which extends towards the second groove wall 103 is arranged on the first groove wall 102, a first preset gap 105 is formed between the first partition plate 104 and the second groove wall 103, a second partition plate 106 which extends towards the first groove wall 102 is arranged on the second groove wall 103, and a second preset gap 107 is formed between the second partition plate 106 and the first groove wall 102; the first partition 104 and the second partition 106 divide the groove 101 into a flow passage 108 having one end communicating with the inlet port 30 and the other end communicating with the outlet port 40.
The heights of the first partition 104 and the second partition 106 in the direction perpendicular to the bottom of the groove 101 are equal to the depth of the groove 101. The base plate 10, the first partition plate 104 and the second partition plate 106 may be an integral structure, and of course, the first partition plate 104 and the second partition plate 106 may also be connected to the base plate 10 by means of bolts or clamping.
The first partition plate 104 is disposed close to the liquid inlet 30, the position of the first partition plate 104 facing the second preset gap 107 is provided with a drainage hole 109, the drainage hole 109 penetrates through the first partition plate 104, the drainage hole 109 may include a cylindrical hole or a prismatic hole, and the height of the drainage hole 109 in the direction perpendicular to the extending direction of the substrate 10 is less than or equal to the height of the first partition plate 104 in the direction perpendicular to the extending direction of the substrate 10. Most of the refrigerant entering the flow channel 108 from the liquid inlet 30 flows downstream in sequence through the flow channel 108, and the remaining part of the refrigerant directly flows into the downstream second preset gap 107 through the drainage hole 109, and then enters the downstream flow channel 108.
The cover plate 20 is overlaid on the sealing side surface, and the cover plate 20 may be welded to the sealing side surface of the base plate 10 by means of vacuum brazing. The width of second baffle 106 in a direction parallel to the direction of extension of first slot wall 102 is greater than the width of first baffle 104 in a direction parallel to the direction of extension of first slot wall 102 to facilitate attachment of cover plate 20 to the top surface of second baffle 106.
The end of the liquid inlet 30 away from the substrate 10 and the end of the liquid outlet 40 away from the substrate 10 may be connected to a delivery pump through a pipeline, and a heat dissipation device may be disposed outside the cooling device and between the liquid outlet 40 and the delivery pump, where the heat dissipation device may include a fan or a heat sink. The coolant carrying heat flows out of the liquid outlet 40, is cooled by the heat sink and then flows to the delivery pump, and the cooled coolant is delivered to the liquid inlet 30 by the delivery pump.
The rail train is provided with a main converter or a main and auxiliary integrated traction converter, the main converter or the main and auxiliary integrated traction converter is provided with an insulated gate bipolar transistor device, and in order to cool the insulated gate bipolar transistor device, the insulated gate bipolar transistor device can be arranged at the top of the cover plate 20 and/or at the bottom of the base plate 10; the insulated gate bipolar transistor device can generate a large amount of heat during working, the temperature of a refrigerant in the cooling device is low, and the refrigerant and the insulated gate bipolar transistor device carry out heat exchange, so that the insulated gate bipolar transistor device is cooled. Of course, the cooling device in this embodiment can also be used for cooling other electronic devices.
In this embodiment, the cooling device includes a base plate 10 and a cover plate 20, a liquid inlet 30 and a liquid outlet 40 are disposed at an end of the base plate 10, a groove 101 is disposed on a sealing side surface of the base plate 10, the groove 101 has a first groove wall 102 and a second groove wall 103 which are disposed opposite to each other, a first partition plate 104 extending to the second groove wall 103 is disposed on the first groove wall 102, a first preset gap 105 is disposed between the first partition plate 104 and the second groove wall 103, a second partition plate 106 extending to the first groove wall 102 is disposed on the second groove wall 103, and a second preset gap 107 is disposed between the second partition plate 106 and the first groove wall 102; the first partition plate 104 and the second partition plate 106 divide the groove 101 into a flow passage 108 having one end communicating with the liquid inlet 30 and the other end communicating with the liquid outlet 40; the first partition plate 104 is disposed close to the liquid inlet 30, and a drainage hole 109 is disposed at a position of the first partition plate 104 facing the second preset gap 107. Most of the refrigerant at the upstream flows downstream along the flow channel 108 by arranging the drainage hole 109 on the first partition plate 104, and the residual refrigerant with less compensation enters the second preset gap 107 at the downstream through the drainage hole 109 and further enters the downstream flow channel 108; the temperature of the refrigerant flowing into the downstream flow channel 108 through the drainage holes 109 is low, so that the temperature of the refrigerant in the downstream flow channel 108 is prevented from being too high, compared with the case that the drainage holes 109 are not arranged, the temperature of the refrigerant in the downstream flow channel 108 is reduced, the heat exchange efficiency between the downstream refrigerant and the base plate and the cover plate is improved, the cooling effect on the insulated gate bipolar transistor device is improved, the temperature uniformity of the surface of the cooling device is improved through the drainage holes 109, and the temperature difference of the insulated gate bipolar transistor device is reduced. Meanwhile, the flow of the refrigerant in the flow channel 108 is reduced by the drainage holes 109, so that the flow resistance of the refrigerant in the flow channel 108 is reduced, and the heat exchange effect of the cooling device is further improved.
In some embodiments, the first partition 104 and the second partition 106 are plural, the plural first partitions 104 and the plural second partitions 106 are sequentially arranged in a staggered manner, the plural first partitions 104 except the first partition 104 near the liquid outlet 40 are provided with the drainage holes 109, and each drainage hole 109 is arranged opposite to the downstream second preset gap 107.
The lengths of the flow channels can be prolonged by the first partition plates 104 and the second partition plates 106, so that the flowing time of the refrigerant in the flow channel 108 is prolonged, and the heat exchange efficiency of the refrigerant is improved. In addition, the plurality of first partition plates 104 except for the first partition plate 104 close to the liquid outlet 40 are provided with the drainage holes 109, and a part of the refrigerant with lower upstream temperature directly flows to the downstream second preset gap 107 from the drainage holes 109, so that compared with the refrigerant flowing to the downstream along the flow passage 108, the temperature of the refrigerant is reduced, and the heat exchange efficiency between the downstream refrigerant and the base plate 10 and the cover plate 20 is further improved.
It should be noted that the first partition 104 near the liquid outlet 40 is not provided with the drainage hole 109, so as to prevent a portion of the refrigerant near the liquid outlet 40 from directly flowing out of the liquid outlet 40 through the drainage hole 109.
In some embodiments, both inlet port 30 and outlet port 40 are disposed on a mounting end proximate first slot wall 102.
Fig. 3 is a schematic structural diagram of a cooling device according to an embodiment of the present invention. Fig. 4 is a schematic structural diagram of a cooling device according to an embodiment of the present invention. With continued reference to fig. 2, as well as fig. 3 and 4, in some embodiments, a plurality of heat exchanging fins 50 are disposed within the flow channel 108, the plurality of heat exchanging fins 50 being disposed in parallel and spaced apart relation, the heat exchanging fins 50 being disposed along the extending direction of the flow channel 108.
The heat exchange fins 50 increase the contact area of the refrigerant, and enhance the heat exchange effect. Two ends of the heat exchange fin 50 along the extending direction are respectively flush with the tail end of the first partition plate 104 and the tail end of the second partition plate 106, and the heat exchange fin 50 is not arranged in the flow channel 108 opposite to the first preset gap 105 or the second preset gap 107, so that the heat exchange fin 50 is prevented from influencing the refrigerant reversing.
In some embodiments, the heat exchanging fins 50 are of unitary construction with the base plate 10.
The heat exchange fins 50 include a plurality of partition plates arranged along the extending direction of the flow channel 108, the bottoms of the plurality of partition plates are integrally arranged with the base plate 10, channels extending along the extending direction of the flow channel 108 are arranged among the plurality of partition plates, and the refrigerant flows along the plurality of channels of the heat exchange fins 50, so that the temperature of the refrigerant is fully utilized, and the heat exchange effect is enhanced. The heat exchange fins 50 and the base plate 10 are of an integral structure, so that the integral structure is simpler and the installation is convenient.
Fig. 5 is a schematic structural diagram of a heat exchange fin provided in an embodiment of the present invention. As shown in fig. 5, in some embodiments, the cooling device further comprises a heat exchange plate 501, the heat exchange plate 501 is arranged in the flow channel 108, and the heat exchange fins 50 are arranged on the heat exchange plate 501.
The extending direction of the heat exchange plate 501 is parallel to the extending direction of the base plate 10, in some embodiments, the heat exchange plate 501 may be disposed at the bottom of the groove 101, and the heat exchange fins 50 are disposed at the top of the heat exchange plate 501; in other embodiments, the heat exchanging fins 50 may also be disposed at the bottom of the heat exchanging plate 501. The heat exchange plate 501 and the heat exchange fins 50 can be of an integrated structure, the heat exchange plate 501 and the base plate 10 can be connected in a brazing mode, and the heat exchange fins 50 are connected with the base plate 10 through the heat exchange plate 501, so that the heat exchange fins are convenient to install.
The heat exchange plate 501 further increases the contact area of the refrigerant, and further enhances the heat exchange effect.
In some embodiments, a plurality of heat exchange fins 50 are provided on both the side of heat exchange plate 501 facing the bottom of groove 101 and the side of heat exchange plate 501 facing away from the bottom of groove 101.
When the igbt device is disposed on the top of the cover plate 20 or the bottom of the substrate 10, the heat exchange fins 50 are disposed on both sides of the heat exchange plate 501, so that the contact area of the refrigerant is increased, and the heat exchange effect between the refrigerant and the igbt device is enhanced.
When the igbt devices are disposed on the top of the cover plate 20 and the bottom of the substrate 10, the heat exchange fins 50 are disposed on both sides of the heat exchange plate 501, so that the heat exchange efficiency of the refrigerant is equivalent to that of the cover plate 20 and the substrate 10, and the surface of the cover plate 20 and the surface of the substrate 10 can cool the igbt devices more uniformly.
In some embodiments, a plurality of heat exchanging protrusions 502 are disposed on the surface of the heat exchanging fin 50, and the heat exchanging protrusions 502 extend along the extending direction of the flow channel 108.
The heat exchanging fin 50 may include a staggered corrugated fin or a staggered zigzag fin, and the heat exchanging fin 50 has a plurality of channels along the extending direction of the flow channel 108 to enhance the heat exchanging effect. The heat exchange protrusions 502 increase the contact area between the refrigerant and the heat exchange fins 50, so that the refrigerant is fully utilized, and the heat exchange efficiency is improved.
The embodiment of the present application further provides a control device, which includes an insulated gate bipolar transistor device and the cooling apparatus in the foregoing embodiments, where the insulated gate bipolar transistor device is disposed at the bottom of the substrate 10 and/or at the top of the cover plate 20.
The control device in this embodiment may be a main converter or a main-auxiliary integrated traction converter, and the control device includes an igbt device and the cooling apparatus in the above embodiment, the igbt device is disposed at the bottom of the substrate 10 and/or at the top of the cover plate 20, the cooling apparatus includes the substrate 10 and the cover plate 20, the end of the substrate 10 is provided with the liquid inlet 30 and the liquid outlet 40, the sealed side of the substrate 10 is provided with a groove 101, the groove 101 has a first groove wall 102 and a second groove wall 103 which are disposed oppositely, the first groove wall 102 is provided with a first partition plate 104 extending to the second groove wall 103, a first preset gap 105 is provided between the first partition plate 104 and the second groove wall 103, the second groove wall 103 is provided with a second partition plate 106 extending to the first groove wall 102, and a second preset gap 107 is provided between the second partition plate 106 and the first groove wall 102; the first partition plate 104 and the second partition plate 106 divide the groove 101 into a flow passage 108 having one end communicating with the liquid inlet 30 and the other end communicating with the liquid outlet 40; the first partition plate 104 is disposed close to the liquid inlet 30, and a drainage hole 109 is disposed at a position of the first partition plate 104 facing the second preset gap 107. Most of the refrigerant at the upstream flows downstream along the flow channel 108 by arranging the drainage hole 109 on the first partition plate 104, and the residual refrigerant with less compensation enters the second preset gap 107 at the downstream through the drainage hole 109 and further enters the downstream flow channel 108; the temperature of the refrigerant flowing into the downstream flow channel 108 through the drainage holes 109 is low, so that the temperature of the refrigerant in the downstream flow channel 108 is prevented from being too high, compared with the case that the drainage holes 109 are not arranged, the temperature of the refrigerant in the downstream flow channel 108 is reduced, the heat exchange efficiency between the downstream refrigerant and the base plate and the cover plate is improved, the cooling effect on the insulated gate bipolar transistor device is improved, the temperature uniformity of the surface of the cooling device is improved through the drainage holes 109, and the temperature difference of the insulated gate bipolar transistor device is reduced. Meanwhile, the flow of the refrigerant in the flow channel 108 is reduced by the drainage holes 109, so that the flow resistance of the refrigerant in the flow channel 108 is reduced, and the heat exchange effect of the cooling device is further improved.
The embodiment of the application further provides a rail train, which comprises a train body and the control equipment, wherein the control equipment is arranged in the train body, and the control equipment is arranged in the equipment bin.
The rail train in the embodiment comprises a train body, wherein an equipment bin is arranged on the train body, the equipment bin can be arranged at the bottom of the train body or at the top of the train body or inside the train body, a control device is arranged in the equipment bin, the control device can be a main converter or a main-auxiliary integrated traction converter, the control device comprises an insulated gate bipolar transistor device and a cooling device in the embodiment, the insulated gate bipolar transistor device is arranged at the bottom of a base plate 10 and/or at the top of a cover plate 20, the cooling device comprises a base plate 10 and a cover plate 20, a liquid inlet 30 and a liquid outlet 40 are arranged at the end part of the base plate 10, a groove 101 is arranged on the sealing side surface of the base plate 10, the groove 101 is provided with a first groove wall 102 and a second groove wall 103 which are oppositely arranged, a first partition plate 104 extending towards the second groove wall 103 is arranged on the first groove wall 102, and, second groove wall 103 is provided with second baffle 106 extending to first groove wall 102, and second baffle 106 and first groove wall 102 are provided with second preset gap 107; the first partition plate 104 and the second partition plate 106 divide the groove 101 into a flow passage 108 having one end communicating with the liquid inlet 30 and the other end communicating with the liquid outlet 40; the first partition plate 104 is disposed close to the liquid inlet 30, and a drainage hole 109 is disposed at a position of the first partition plate 104 facing the second preset gap 107. Most of the refrigerant at the upstream flows downstream along the flow channel 108 by arranging the drainage hole 109 on the first partition plate 104, and the residual refrigerant with less compensation enters the second preset gap 107 at the downstream through the drainage hole 109 and further enters the downstream flow channel 108; the temperature of the refrigerant flowing into the downstream flow channel 108 through the drainage holes 109 is low, so that the temperature of the refrigerant in the downstream flow channel 108 is prevented from being too high, compared with the case that the drainage holes 109 are not arranged, the temperature of the refrigerant in the downstream flow channel 108 is reduced, the heat exchange efficiency between the downstream refrigerant and the base plate and the cover plate is improved, the cooling effect on the insulated gate bipolar transistor device is improved, the temperature uniformity of the surface of the cooling device is improved through the drainage holes 109, and the temperature difference of the insulated gate bipolar transistor device is reduced. Meanwhile, the flow of the refrigerant in the flow channel 108 is reduced by the drainage holes 109, so that the flow resistance of the refrigerant in the flow channel 108 is reduced, and the heat exchange effect of the cooling device is further improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A cooling device is characterized by comprising a base plate and a cover plate, wherein a liquid inlet and a liquid outlet are arranged at the end part of the base plate, a groove is arranged on the sealing side surface of the base plate, the groove is provided with a first groove wall and a second groove wall which are oppositely arranged, a first partition plate extending to the second groove wall is arranged on the first groove wall, a first preset gap is formed between the first partition plate and the second groove wall, a second partition plate extending to the first groove wall is arranged on the second groove wall, and a second preset gap is formed between the second partition plate and the first groove wall; the first partition plate and the second partition plate divide the groove into a flow channel, one end of the flow channel is communicated with the liquid inlet, and the other end of the flow channel is communicated with the liquid outlet;
the first partition plate is arranged close to the liquid inlet, and a drainage hole is formed in the position, opposite to the second preset gap, of the first partition plate; part of refrigerant in the flow channel at one side of the drainage hole close to the liquid inlet flows to the second preset gap from the drainage hole; the cover plate covers the sealing side face.
2. The cooling device as claimed in claim 1, wherein the first partition and the second partition are plural, the plural first partitions and the plural second partitions are sequentially arranged in a staggered manner, the plural first partitions except the first partition near the liquid outlet are provided with the drainage holes, and each drainage hole is arranged opposite to the downstream second preset gap.
3. The cooling apparatus as claimed in claim 2, wherein the liquid inlet and the liquid outlet are both provided on a mounting end adjacent to the first slot wall.
4. A cooling device according to any one of claims 1-3, wherein a plurality of heat exchanging fins are arranged in the flow passage, the plurality of heat exchanging fins are arranged in parallel and at intervals, and the heat exchanging fins are arranged along the extending direction of the flow passage.
5. The cooling device of claim 4, wherein the heat exchanging fins are of unitary construction with the base plate.
6. The cooling device of claim 4, further comprising a heat exchange plate disposed within the flow passage, the heat exchange fins being disposed on the heat exchange plate.
7. The cooling apparatus of claim 6, wherein a plurality of said heat exchange fins are provided on both a side of said heat exchange plate facing toward a floor of said groove and a side of said heat exchange plate facing away from said floor of said groove.
8. The cooling device as claimed in claim 6, wherein a plurality of heat exchanging protrusions are provided on a surface of the heat exchanging fin, and the heat exchanging protrusions extend in an extending direction of the flow passage.
9. A control device comprising an insulated gate bipolar transistor device and a cooling apparatus as claimed in any of claims 1 to 8, said insulated gate bipolar transistor device being disposed on the bottom of said base plate and/or on top of said cover plate.
10. A rail train, characterized by comprising a vehicle body and the control device of claim 9, wherein the vehicle body is provided with a device cabin, and the control device is arranged in the device cabin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011398984.5A CN112466827A (en) | 2020-12-04 | 2020-12-04 | Cooling device, control equipment and rail train |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011398984.5A CN112466827A (en) | 2020-12-04 | 2020-12-04 | Cooling device, control equipment and rail train |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112466827A true CN112466827A (en) | 2021-03-09 |
Family
ID=74805454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011398984.5A Pending CN112466827A (en) | 2020-12-04 | 2020-12-04 | Cooling device, control equipment and rail train |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112466827A (en) |
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2020
- 2020-12-04 CN CN202011398984.5A patent/CN112466827A/en active Pending
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