CN112463503A - Method and system for testing heat dissipation capacity of ARM architecture complete machine server - Google Patents
Method and system for testing heat dissipation capacity of ARM architecture complete machine server Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 78
- 238000012360 testing method Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 29
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- 230000009286 beneficial effect Effects 0.000 description 2
- 239000008358 core component Substances 0.000 description 2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/2273—Test methods
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The application discloses a method and a system for testing the heat dissipation capacity of an ARM architecture complete machine server, wherein the method comprises the following steps: setting the fan rotating speed according to the target value of the fan rotating speed; after the rotating speed of the fan is successfully set, continuously pressurizing the whole server by running a linpack program according to the set pressurizing time; after pressurization is finished, continuously grabbing the temperature of the CPU every 1 minute within the set cycle number and reading the temperature of the UI board; and finally, judging whether the temperature of the CPU and the temperature difference between the CPU and the UI board simultaneously meet the following conditions: the CPU temperature is less than or equal to a set CPU temperature threshold value, and the CPU temperature-UI board temperature is less than or equal to a set temperature difference threshold value; if so, judging that the heat dissipation capacity of the whole server is qualified; and if not, judging that the heat dissipation capacity of the whole server is unqualified. The system comprises: the device comprises a fan rotating speed setting module, a pressurizing module, a CPU temperature and UI plate temperature acquisition module and a first judgment module. Through the method and the device, the accuracy and the efficiency of the test of the heat dissipation capacity of the whole server can be effectively improved.
Description
Technical Field
The application relates to the technical field of server heat dissipation, in particular to a method and a system for testing heat dissipation capacity of an ARM architecture complete machine server.
Background
In a server architecture, a CPU is a core component, and the CPU is also an important component that needs attention in a server heat dissipation technology. Therefore, how to collect the temperature of the CPU in the server architecture and test the testing capability of the server architecture is an important issue.
At present, a method for detecting heat dissipation capacity of a whole server architecture generally reads a current temperature of a CPU in the server architecture. Specifically, a Linux system runs a linpack program to perform a pressure test on the CPU, the current temperature of the CPU is obtained according to a test result, and then the current heat dissipation condition of the whole server framework is determined according to the current temperature of the CPU.
However, in the existing method for detecting the heat dissipation capacity of the whole server framework, because only the current temperature of the CPU can be acquired, the upper limit temperature of the CPU is not concerned, and the influence of environmental changes on the temperature change of the whole server cannot be considered, the heat dissipation capacity of the whole server framework is not detected comprehensively, and the accuracy of the obtained detection result is not high enough.
Disclosure of Invention
The application provides a method and a system for testing the heat dissipation capacity of an ARM architecture complete machine server, and aims to solve the problem that the accuracy of a test result of the heat dissipation capacity of the server in the prior art is not high enough.
In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:
a method for testing the heat dissipation capability of an ARM architecture complete machine server comprises the following steps:
setting the fan rotating speed according to the target value of the fan rotating speed;
after the rotating speed of the fan is successfully set, continuously pressurizing the whole server by running a linpack program according to the set pressurizing time;
after pressurization is finished, continuously grabbing the temperature of the CPU every 1 minute within the set cycle number and reading the temperature of the UI board;
judging whether the temperature of the CPU and the temperature difference between the CPU and a UI board simultaneously satisfy: the CPU temperature is less than or equal to a set CPU temperature threshold value, and the CPU temperature-UI board temperature is less than or equal to a set temperature difference threshold value;
if so, judging that the heat dissipation capacity of the whole server is qualified;
and if not, judging that the heat dissipation capacity of the whole server is unqualified.
Optionally, the number of times of continuously capturing the CPU temperature and reading the UI board temperature every 1 minute within the set number of cycles is 8.
Optionally, the CPU temperature threshold is set at 78 ℃.
Optionally, the set temperature difference threshold is 53 ℃.
Optionally, the set pressurization time is 5 minutes.
Optionally, after the heat dissipation capability of the whole server is judged to be qualified, the method further includes:
reading the rotating speed of the fan every 1 minute within the set cycle number;
judging whether the rotating speed of the fan meets the following conditions: the highest rotating speed-the lowest rotating speed is more than or equal to 30 percent of the highest rotating speed;
if yes, judging that hidden danger exists in the heat dissipation capacity of the whole server;
if not, the heat dissipation capacity of the whole server is judged to have no hidden danger.
Optionally, the set number of cycles is greater than or equal to 30.
A test system for the heat dissipation capability of an ARM architecture complete machine server comprises:
the fan rotating speed setting module is used for setting the rotating speed of the fan according to the target value of the rotating speed of the fan;
the pressurization module is used for continuously pressurizing the whole server by running a linpack program according to the set pressurization time after the fan rotating speed is successfully set;
the CPU temperature and UI board temperature acquisition module is used for continuously capturing the CPU temperature every 1 minute within the set cycle number and reading the UI board temperature after the pressurization is finished;
the first judgment module is used for judging whether the temperature of the CPU and the temperature difference between the CPU and the UI board simultaneously meet the following conditions: the CPU temperature is less than or equal to a set CPU temperature threshold, and the CPU temperature-UI board temperature is less than or equal to a set temperature difference threshold, if yes, the heat dissipation capacity of the whole server is judged to be qualified, and if not, the heat dissipation capacity of the whole server is judged to be unqualified.
Optionally, the test system further includes:
the fan rotating speed reading module is used for reading the rotating speed of the fan every 1 minute within the set cycle times;
the second judging module is used for judging whether the rotating speed of the fan meets the following requirements: and if the highest rotating speed-the lowest rotating speed is more than or equal to 30% of the highest rotating speed, judging that hidden danger exists in the heat dissipation capacity of the whole server, and otherwise, judging that hidden danger does not exist in the heat dissipation capacity of the whole server.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
the application provides a method for testing the heat dissipation capacity of an ARM architecture complete machine server, which comprises the steps of firstly setting the rotating speed of a fan according to a target rotating speed value of the fan; after the rotating speed of the fan is successfully set, continuously pressurizing the whole server by running a linpack program according to the set pressurizing time; after pressurization is finished, continuously grabbing the temperature of the CPU every 1 minute within the set cycle number and reading the temperature of the UI board; and finally, judging whether the temperature of the CPU and the temperature difference between the CPU and the UI board simultaneously meet the following conditions: the CPU temperature is less than or equal to a set CPU temperature threshold value, and the CPU temperature-UI board temperature is less than or equal to a set temperature difference threshold value; if so, judging that the heat dissipation capacity of the whole server is qualified; and if not, judging that the heat dissipation capacity of the whole server is unqualified. According to the embodiment, the upper limit of the temperature is set for the CPU temperature through the set CPU temperature threshold, the temperature difference between the CPU temperature high point and the edge position of the UI plate serving as the whole server is fully considered through the set temperature difference threshold, the heat dissipation capacity of the whole server can be more comprehensively considered, and a more client and accurate heat dissipation test result can be obtained. And the set CPU temperature threshold is 78 ℃ and the set temperature difference threshold is 53 ℃, so that a clear reference target can be provided for the heat dissipation test of the whole server, and the accuracy and the test efficiency of the test result can be further improved.
The present application further provides a system for testing heat dissipation capability of an ARM architecture complete machine server, the system mainly includes: the device comprises a fan rotating speed setting module, a pressurizing module, a CPU temperature and UI plate temperature acquisition module and a first judgment module. The CPU temperature and the UI board temperature acquisition module are used for acquiring the temperatures of the core part and the edge position of the whole server and providing comprehensive data for the subsequent heat dissipation capability test. Through the first judgment module, the upper temperature limit is set for the temperature of the CPU, and the standard is set for the temperature difference between the CPU and the edge position of the server, so that the heat dissipation capacity of the whole server can be comprehensively and objectively evaluated, and the accuracy and the test efficiency of test results can be improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flowchart of a method for testing a heat dissipation capability of an ARM architecture complete server according to an embodiment of the present application;
fig. 2 is a schematic diagram of test data of a method for testing a heat dissipation capability of an ARM architecture complete machine server according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a system for testing a heat dissipation capability of an ARM architecture complete server according to an embodiment of the present application.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
For a better understanding of the present application, embodiments of the present application are explained in detail below with reference to the accompanying drawings.
Example one
The whole server in this embodiment takes an ARM (Advanced RISC Machine, a RISC microprocessor designed by Acorn limited in the united kingdom) architecture domestic dual-control storage server as an example, and the CPU is a soar 2000 +. Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a method for testing a heat dissipation capability of an ARM architecture complete server according to an embodiment of the present application. As shown in fig. 1, the method for testing the heat dissipation capability of the ARM architecture complete server in the embodiment mainly includes the following steps:
s0: the fan speed is set according to the fan speed target value.
In this embodiment, an OSES (Organic SCSI Enclosure Service, which is a management program of a storage server and is responsible for monitoring operating states of voltage, temperature, fan speed, and the like of the whole device) may be used to set the fan speed, that is: the fan speed is set at a target value, which in this embodiment is 45%, by sending a fan speed setting command to the OSES. SCSI is Small Computer System Interface, a Small Computer System Interface, is an independent processor standard for System-level interfaces between computers and their peripherals, such as: hard disk, floppy drive, optical drive, printer, scanner, etc.
Specifically, step S0 includes the following processes:
s01: reading the rotating speed of the fan once every 5 seconds according to the acquired command, and continuously reading for three times;
s02: judging whether the three fan rotating speeds are all larger than or equal to a set fan rotating speed target value;
if the three fan speeds are all greater than or equal to the set fan speed target value, executing step S03: judging that the fan speed setting is successful, and continuing to execute the step S1;
if the fan speed is less than the set fan speed target value for 1-3 times, executing step S04: and judging that the fan rotating speed setting fails, and sending error report information.
With continued reference to fig. 1, after the fan speed is successfully set, step S1 is executed: and continuously pressurizing the whole server by operating a linpack program according to the set pressurizing time.
In this embodiment, the method for continuously pressurizing the whole server is to run the linpack program, and the pressurizing time is preferably 5 minutes, that is, the ARM CPU is continuously pressurized for 5 minutes by using the linpack. The pressure pressurization of the CPU of the ARM framework is a linear increasing process, the CPU can be continuously pressurized and kept at 95% within 5 minutes, at the moment, the CPU generates certain heat, and the heat dissipation capacity of the CPU starts to be started. The set pressurizing time can meet the test requirement and is beneficial to saving system resources.
S2: after the pressurization is finished, the CPU temperature is continuously grabbed every 1 minute within the set cycle number and the UI plate temperature is read.
This embodiment snatchs CPU temperature and UI board temperature 8 times in succession every 1 minute, and this frequency setting can detect the CPU temperature condition more comprehensively, is favorable to improving the accuracy of test result. The temperature acquisition operation may be continuously performed more than 30 times, at least 30 times, that is, the operation of continuously acquiring the CPU temperature and the UI board temperature 8 times every 1 minute, and continuously performed 30 times. The cycle number setting can reduce the interference factors in the external environment and greatly improve the stability and accuracy of the test result.
After continuously capturing the CPU temperature and reading the UI board temperature every 1 minute within the set number of cycles, step S3 is executed: judging whether the temperature of the CPU and the temperature difference between the CPU and the UI board simultaneously satisfy the following conditions: the CPU temperature is less than or equal to a set CPU temperature threshold value, and the CPU temperature-UI board temperature is less than or equal to a set temperature difference threshold value.
In the embodiment, the upper temperature limit is set for the CPU temperature by comparing the current CPU temperature with the set CPU temperature threshold, so that the heat dissipation condition of the whole server can be effectively reflected according to the CPU which is a core component. The UI board is located at the edge position of the whole server, the temperature difference between the temperature high point of the CPU and the edge of the whole server is fully considered by judging the difference value between the temperature of the CPU and the temperature of the UI board, and the heat dissipation data of the whole server can be more comprehensively acquired, so that the heat dissipation capacity of the whole server is more comprehensively evaluated, and the accuracy of the heat dissipation capacity test result of the whole server is favorably improved.
S4: if so, judging that the heat dissipation capacity of the whole server is qualified.
S5: and if not, judging that the heat dissipation capacity of the whole server is unqualified.
According to the steps S3-S5, when the CPU temperature is less than or equal to the set CPU temperature threshold and the CPU temperature-UI board temperature is less than or equal to the set temperature difference threshold, the heat dissipation capability of the whole server is judged to be qualified. Otherwise, when the CPU temperature is larger than the set CPU temperature threshold, the CPU temperature-UI board temperature is larger than the set temperature difference threshold, or the CPU temperature is larger than the set CPU temperature threshold and the CPU temperature-UI board temperature is larger than the set temperature difference threshold, the heat dissipation capacity of the whole server is judged to be unqualified under the three conditions.
The CPU temperature threshold set in this embodiment is 78 ℃, and the CPU temperature threshold can be set to reserve a certain margin for the CPU so as to cope with situations such as delay of fan intervention, and the set temperature difference threshold is 53 ℃. The threshold values are creatively provided by the inventor through a large amount of experimental data, and the setting of the threshold values can provide a clearer reference standard for the heat dissipation capability test of the whole server, so that the accuracy of the test result and the test efficiency are improved.
Further, in this embodiment, the step S4 is followed by the step S6: the fan speed was read every 1 minute for the set number of cycles. In this embodiment, the number of cycles for reading the fan speed may be 30.
S7: judging whether the rotating speed of the fan meets the following conditions: the maximum rotating speed-the minimum rotating speed is more than or equal to 30 percent of the maximum rotating speed.
If the highest rotation speed-the lowest rotation speed is not less than 30% of the highest rotation speed, executing step S8: and judging the hidden danger of the heat dissipation capacity of the whole server. When the highest rotating speed-the lowest rotating speed is larger than or equal to 30% of the highest rotating speed, the balance of the rotating speed of the fan is unqualified, the heat dissipation of the whole server is further influenced by the unqualified balance of the rotating speed, and namely the heat dissipation capacity of the whole server is judged to have hidden danger.
Otherwise, if the highest rotation speed-lowest rotation speed < highest rotation speed x 30%, the step S9 is executed: and judging that no hidden danger exists in the heat dissipation capacity of the whole server.
It can be known from the above steps S6-S9 that, in the aspect of the heat dissipation capability of the whole server, in addition to determining whether the heat dissipation capability of the whole server is qualified according to the CPU temperature and the relationship between the CPU temperature and the UI board temperature, it is further determined whether there is a hidden danger in the heat dissipation capability of the whole server.
The test data schematic diagram of the method for testing the heat dissipation capacity of the ARM architecture complete machine server provided by the embodiment of the application can be seen in fig. 2. As can be seen from FIG. 2, at normal temperature 25 deg.C, 45% (115) rotation speed, 100% loading, the CPU temperature is lower than 70 deg.C, the lower curve in the test data represents the CPU temperature, the temperature minus 20 deg.C of the lower curve is the actual CPU temperature, and the upper line represents the fan rotation speed.
Example two
Referring to fig. 3 based on the embodiments shown in fig. 1 and fig. 2, fig. 3 is a schematic structural diagram of a system for testing a heat dissipation capability of an ARM architecture complete machine server provided in the embodiments of the present application. As can be seen from fig. 3, the system for testing the heat dissipation capability of the whole server of the ARM architecture in this embodiment mainly includes: the device comprises a fan rotating speed setting module, a pressurizing module, a CPU temperature and UI plate temperature acquisition module and a first judgment module. The fan rotating speed setting module is used for setting the rotating speed of the fan according to the target value of the rotating speed of the fan. And the pressurizing module is used for continuously pressurizing the whole server by operating a linepack program according to the set pressurizing time after the rotating speed of the fan is successfully set. And the CPU temperature and UI board temperature acquisition module is used for continuously acquiring the CPU temperature and reading the UI board temperature every 1 minute within the set cycle number after the pressurization is finished. The first judgment module is used for judging whether the temperature of the CPU and the temperature difference between the CPU and the UI board simultaneously meet the following conditions: the CPU temperature is less than or equal to a set CPU temperature threshold, and the CPU temperature-UI board temperature is less than or equal to a set temperature difference threshold, if yes, the heat dissipation capacity of the whole server is judged to be qualified, and if not, the heat dissipation capacity of the whole server is judged to be unqualified.
Furthermore, the test system also comprises a fan rotating speed reading module and a second judgment module. The fan rotating speed reading module is used for reading the rotating speed of the fan every 1 minute within the set cycle times; the second judging module is used for judging whether the rotating speed of the fan meets the following requirements: and if the highest rotating speed-the lowest rotating speed is more than or equal to 30% of the highest rotating speed, judging that hidden danger exists in the heat dissipation capacity of the whole server, and otherwise, judging that hidden danger does not exist in the heat dissipation capacity of the whole server.
The working principle and the working method of the system for testing the heat dissipation capability of the whole server of the ARM architecture in this embodiment have been explained in detail in the embodiments shown in fig. 1 and fig. 2, and are not described herein again.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A method for testing the heat dissipation capability of an ARM architecture complete machine server is characterized by comprising the following steps:
setting the fan rotating speed according to the target value of the fan rotating speed;
after the rotating speed of the fan is successfully set, continuously pressurizing the whole server by operating an I inpack program according to the set pressurizing time;
after pressurization is finished, continuously grabbing the temperature of the CPU every 1 minute within the set cycle number and reading the temperature of the UI board;
judging whether the temperature of the CPU and the temperature difference between the CPU and the UI board simultaneously satisfy the following conditions: the CPU temperature is less than or equal to a set CPU temperature threshold value, and the CPU temperature-UI board temperature is less than or equal to a set temperature difference threshold value;
if so, judging that the heat dissipation capacity of the whole server is qualified;
and if not, judging that the heat dissipation capacity of the whole server is unqualified.
2. The method of claim 1, wherein the number of times the CPU temperature is continuously captured and the UI board temperature is read every 1 minute within a set number of cycles is 8.
3. The method of claim 1, wherein the CPU temperature threshold is 78 ℃.
4. The method of claim 1, wherein the temperature difference threshold is 53 ℃.
5. The method of claim 1, wherein the predetermined pressing time is 5 minutes.
6. The method for testing the heat dissipation capability of the ARM architecture complete machine server as claimed in any one of claims 1 to 5, wherein after the heat dissipation capability of the complete machine server is judged to be qualified, the method further comprises:
reading the rotating speed of the fan every 1 minute within the set cycle number;
judging whether the rotating speed of the fan meets the following conditions: the highest rotating speed-the lowest rotating speed is more than or equal to 30 percent of the highest rotating speed;
if yes, judging that hidden danger exists in the heat dissipation capacity of the whole server;
if not, the heat dissipation capacity of the whole server is judged to have no hidden danger.
7. The method for testing the heat dissipation capability of the ARM architecture complete machine server as claimed in claim 6, wherein the set number of cycles is greater than or equal to 30.
8. A test system for the heat dissipation capability of an ARM architecture complete machine server is characterized by comprising:
the fan rotating speed setting module is used for setting the rotating speed of the fan according to the target value of the rotating speed of the fan;
the pressurization module is used for continuously pressurizing the whole server by running a linpack program according to the set pressurization time after the fan rotating speed is successfully set;
the CPU temperature and UI board temperature acquisition module is used for continuously capturing the CPU temperature every 1 minute within the set cycle number and reading the UI board temperature after the pressurization is finished;
the first judgment module is used for judging whether the temperature of the CPU and the temperature difference between the CPU and the UI board simultaneously meet the following conditions: the CPU temperature is less than or equal to a set CPU temperature threshold, and the CPU temperature-UI board temperature is less than or equal to a set temperature difference threshold, if yes, the heat dissipation capacity of the whole server is judged to be qualified, and if not, the heat dissipation capacity of the whole server is judged to be unqualified.
9. The system of claim 8, wherein the testing system further comprises:
the fan rotating speed reading module is used for reading the rotating speed of the fan every 1 minute within the set cycle times;
the second judging module is used for judging whether the rotating speed of the fan meets the following requirements: and if the highest rotating speed-the lowest rotating speed is more than or equal to 30% of the highest rotating speed, judging that hidden danger exists in the heat dissipation capacity of the whole server, and otherwise, judging that hidden danger does not exist in the heat dissipation capacity of the whole server.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105909545A (en) * | 2016-04-12 | 2016-08-31 | 浪潮电子信息产业股份有限公司 | Whole cabinet fan speed regulation method based on CPU Margin temperature |
| CN109376047A (en) * | 2018-12-06 | 2019-02-22 | 郑州云海信息技术有限公司 | A kind of CPU heat dissipation performance test method and system |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105909545A (en) * | 2016-04-12 | 2016-08-31 | 浪潮电子信息产业股份有限公司 | Whole cabinet fan speed regulation method based on CPU Margin temperature |
| CN109376047A (en) * | 2018-12-06 | 2019-02-22 | 郑州云海信息技术有限公司 | A kind of CPU heat dissipation performance test method and system |
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