CN112449692A - Flexible electronic device and bending position determining method thereof - Google Patents
Flexible electronic device and bending position determining method thereof Download PDFInfo
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- CN112449692A CN112449692A CN201880093888.4A CN201880093888A CN112449692A CN 112449692 A CN112449692 A CN 112449692A CN 201880093888 A CN201880093888 A CN 201880093888A CN 112449692 A CN112449692 A CN 112449692A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Abstract
The application discloses flexible electron device, including the flexible substrate, flexible display module, piezoelectricity response subassembly and treater, flexible display module stacks up and sets up on the flexible substrate, the portion is established along flexible display module's peripheral direction to the concave portion of establishing to two at least adjacent lateral walls of flexible display module, piezoelectricity response subassembly includes two at least piezoelectricity induction element, it sets up in the portion of establishing to the concave, and every lateral wall corresponds at least one piezoelectricity induction element, when flexible electron device buckles, the piezoelectricity induction element that corresponds produces the corresponding position identification signal of buckling, the treater is according to the position of buckling that the position identification signal confirms the position of buckling, and show according to the content of the position adjustment flexible display module of buckling. The application also discloses a bending position determining method. This application is through the real-time position of buckling of obtaining flexible electronic device in optional position of piezoelectric induction subassembly, thereby the content that the treater can adjust flexible electronic device according to the position of buckling shows.
Description
The application relates to the technical field of flexible display, in particular to a flexible electronic device and a bending position determining method thereof.
At present, most of flexible displays on the market are flexible displays with fixed bent curved surfaces, but not flexible displays which can be bent at any position in the true sense. When a flexible display capable of being bent at any position is developed, corresponding content display and touch control on and off can be carried out only by obtaining the bending position of the flexible display, so that the determination of the bending position is very important, and otherwise, a wrong touch condition can occur. However, the prior art cannot determine the bending position of any bending of the flexible display to display the corresponding content.
Disclosure of Invention
The embodiment of the application discloses a flexible electronic device and a bending position determining method thereof, which aim to solve the problems.
The embodiment of the application discloses a flexible electronic device, which comprises a flexible substrate, a flexible display component, a piezoelectric sensing component and a processor, the flexible display assembly is arranged on the flexible substrate in a stacked mode, at least two adjacent side walls of the flexible display assembly are provided with concave portions along the peripheral direction of the flexible display assembly, the piezoelectric sensing component comprises at least two piezoelectric sensing units which are arranged in the concave part, and each side wall corresponds to at least one piezoelectric sensing unit, when the flexible electronic device is bent, the piezoelectric sensing unit corresponding to the bending position of the flexible electronic device generates a corresponding bending position identification signal, and the processor determines the bending position according to the bending position identification signal and adjusts the content display of the flexible display component according to the bending position.
The embodiment of the application discloses a bending position determining method, which is applied to a flexible electronic device. The bending position determining method comprises the following steps: when the flexible electronic device is bent, the piezoelectric sensing unit corresponding to the bending position of the flexible electronic device generates a corresponding bending position identification signal; determining a bending position according to the bending position identification signal; and adjusting the content display of the flexible electronic device according to the bending position.
According to the flexible electronic device and the bending position determining method thereof, the bending position of the flexible electronic device at any position can be determined through the piezoelectric sensing assembly, so that the flexible electronic device can adjust display content according to the bending position, and better user experience is achieved.
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic cross-sectional structure diagram of a flexible electronic device in a first embodiment of the present application.
Fig. 2 is a schematic structural diagram of a flexible electronic device according to an embodiment of the present application.
Fig. 3 is a schematic cross-sectional structure diagram of a flexible electronic device in a second embodiment of the present application.
Fig. 4 is a schematic cross-sectional structure diagram of a flexible electronic device in a third embodiment of the present application.
Fig. 5 is a schematic cross-sectional structure diagram of a flexible electronic device in a fourth embodiment of the present application.
Fig. 6a and 6b are equivalent circuit diagrams of a piezoelectric sensing unit in an embodiment of the present application.
Fig. 7 is a schematic structural diagram of the flexible electronic device 1 after all the stacked structures on the anode layer are removed in the embodiment of the present application.
Fig. 8 is a schematic view of a bending position of a flexible display module according to an embodiment of the present application.
Fig. 9 is a schematic cross-sectional structure diagram of a solder joint in an embodiment of the present application.
Fig. 10 is a flowchart illustrating a bending position determining method applied to a flexible electronic device according to an embodiment of the present application.
Description of the main elements
Flexible |
1 |
|
10 |
|
30 |
|
50 |
Processor with a memory having a plurality of memory cells | 70 |
|
301 |
|
302 |
|
51 |
Display area | X1 |
Non-display area | F1 |
|
31 |
|
32 |
|
33 |
|
34 |
|
35 |
|
30a、30b、30c |
Thin film transistor array | 36 |
A first |
37 |
|
38 |
Second |
39 |
|
311 |
|
80 |
|
81 |
Location of bending | H1、H2、H3、V1、V2、 |
Insulating layer | |
811 | |
Metal |
812 |
|
813 |
Opening of |
8131 |
|
814 |
Opening of |
8141 |
|
815 |
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic cross-sectional structure diagram of a flexible electronic device 1 according to a first embodiment of the present disclosure. Fig. 2 is a schematic structural diagram of a flexible electronic device according to an embodiment of the present application. The flexible electronic device 1 comprises a flexible substrate 10, a flexible display assembly 30, a piezoelectric sensing assembly 50 and a processor 70. The flexible display assembly 30 is arranged on top of the flexible substrate 10. The flexible substrate 10 is used to provide support for the flexible display assembly 30. The flexible display assembly 30 is used to provide a content display. At least two adjacent side walls 301 of the flexible display module 30 are provided with recessed portions 302 along the peripheral direction of the flexible display module 30. The piezoelectric sensing assembly 50 includes at least two piezoelectric sensing units 51. The at least two piezoelectric sensing units 51 are disposed in the recessed portion 302, and at least one piezoelectric sensing unit 51 is disposed on each of the sidewalls 301. When the flexible electronic device 1 is bent, the piezoelectric sensing unit 51 corresponding to the bent position of the flexible electronic device 1 generates a corresponding bent position identification signal. The processor 70 determines a bending position according to the bending position identification signal, and adjusts the content display of the flexible display assembly 30 according to the bending position.
Therefore, the processor 70 can determine the bending position on the flexible electronic device 1 through the bending position identification signal generated by the piezoelectric sensing component 50, and can adjust the content display of the flexible display component 30 according to the bending position, thereby providing better user experience.
Specifically, the flexible substrate 10 may be, but is not limited to, a polymer plastic substrate, a metal foil substrate, an ultra-thin glass substrate, a paper substrate, and the like. The polymer plastic substrate may be made of, but not limited to, Polyethylene (PE), polypropylene (PP), Polystyrene (PS), polyethylene terephthalate (PET), Polysulfone Ether (PEs), polyethylene naphthalate (PEN), Polyimide (PI), and the like.
Referring to fig. 2 again, the flexible display module 30 has a display area X1 and a non-display area F1 disposed around the periphery of the display area X1. The display area X1 is used to provide content display. The recessed portion 302 is located in the non-display area F1. Thus, the arrangement of the at least two piezoelectric sensing units 51 does not affect the content display of the display area X1 of the flexible display assembly 30.
Specifically, the extending direction of the recessed portion 302 may be parallel to the surface of the flexible display assembly 30, or may be non-parallel wavy.
In particular, the flexible display assembly 30 comprises an anode layer 31, a light emitting layer 32 and a cathode layer 33. The anode layer 31 is stacked on the flexible substrate 10. The light emitting layer 32 is stacked on the anode layer 31. The cathode layer 33 is stacked on the light emitting layer 32. The anode layer 31 is generally made of a conductive material with a high work function and good light transmittance, and for example, the anode layer 31 is a metal conductive film made of Indium Tin Oxide (ITO). The light emitting layer 32 is typically prepared by doping a fluorescent dopant of several percent in a fluorescent host material. The cathode layer 33 is generally made of an organic metal having a low work function, and the cathode layer 33 is an organic thin-film metal electrode prepared by an evaporation method, for example. When a positive direct voltage of 2-10V is applied to the anode layer 31 and the cathode layer 33 is grounded, holes generated in the anode layer 31 and electrons generated in the cathode layer 33 move to each other and meet each other in the light-emitting layer 32. When the holes and electrons meet at the light emitting layer 32, energy excitons are generated, thereby exciting light emitting molecules to finally generate visible light.
The recessed portion 302 may be provided in a region corresponding to the non-display region F1 in a stacked structure including any one of the anode layer 31, the light-emitting layer 32, and the cathode layer 33, any two adjacent layers, or three adjacent layers. Referring to fig. 1, in the present embodiment, the recessed portion 302 is disposed in an area of the anode layer 31 corresponding to the non-display area F1. The at least two piezoelectric sensing units 51 are sequentially disposed in the recessed portion 302. Therefore, when the flexible electronic device 1 is bent, the piezoelectric sensing unit 51 corresponding to the bending position of the flexible electronic device 1 can sense the bending behavior of the flexible electronic device 1 and generate a corresponding bending position identification signal. The processor 70 can determine the bend location based on the bend location identification signal.
Referring to fig. 3, fig. 3 is a schematic cross-sectional structure diagram of a flexible electronic device 1 according to a second embodiment of the present application. The flexible display assembly 30a shown in fig. 3 is similar to the flexible display assembly 30 shown in fig. 1, except that the flexible display assembly 30a further comprises a hole transport layer 34 and an electron transport layer 35. The hole transport layer 34 is disposed between the anode layer 31 and the light emitting layer 32. The electron transport layer 35 is disposed between the light emitting layer 32 and the cathode layer 33. The hole transport layer 34 is generally made of an aromatic amine compound, and has good thermal stability, which can help holes generated from the anode layer 31 to move to the light emitting layer 32. The electron transport layer 35 is generally made of a fluorescent dye compound, and has good thermal stability and surface stability, which can help the electrons released by the cathode layer 33 to be smoothly transported to the light emitting layer 32. Therefore, the light emitting efficiency of the flexible display assembly 30a can be improved, and the imbalance of the injection of holes and electrons in the light emitting layer 32 caused by the difference of the mobility of holes in the anode layer 31 and the mobility of electrons in the cathode layer 33 can be avoided, thereby further reducing the light emitting efficiency.
The recessed portion 302 may be provided in a region corresponding to the non-display region F1 in a laminated structure including any one, two, three, four, or five of the anode layer 31, the hole transport layer 34, the light emitting layer 32, the electron transport layer 35, and the cathode layer 33. Referring to fig. 3 again, in the present embodiment, the recessed portion 302 is disposed in an area of the anode layer 31 corresponding to the non-display area F1. The at least two piezoelectric sensing units 51 are sequentially disposed in the recessed portion 302. Therefore, when the flexible electronic device 1 is bent, the piezoelectric sensing unit 51 corresponding to the bending position of the flexible electronic device 1 can sense the bending behavior of the flexible electronic device 1 and generate a corresponding bending position identification signal. The processor 70 can determine the bend location based on the bend location identification signal.
Referring to fig. 4, fig. 4 is a schematic cross-sectional structure view of a flexible electronic device 1 according to a third embodiment of the present application. The flexible display assembly 30b shown in fig. 4 is similar to the flexible display assembly 30a shown in fig. 3, except that in this embodiment, the flexible display assembly 30 is driven actively, that is, the flexible display assembly 30b further includes a thin film transistor array 36, the thin film transistor array 36 is disposed between the flexible substrate 10 and the anode layer 31, each thin film transistor in the thin film transistor array 36 corresponds to a pixel in the light emitting layer 32, and when a corresponding pixel in the light emitting layer 32 needs to be lit, the thin film transistor in the thin film transistor array 36 corresponding to the pixel is turned on to drive the pixel and make it emit light continuously. Compared with a passive driving mode, the active driving mode does not need scanning, has constant power supply current, does not need high peak current and has lower power consumption.
The recessed portion 302 may be provided in a region corresponding to the non-display region F1 in a stacked structure including any one, two, three, four, five, or six adjacent layers of the thin film transistor array 36, the anode layer 31, the hole transport layer 34, the light-emitting layer 32, the electron transport layer 35, and the cathode layer 33. Referring to fig. 4 again, in the present embodiment, the recessed portion 302 is disposed in an area of the anode layer 31 corresponding to the non-display area F1. The at least two piezoelectric sensing units 51 are sequentially disposed in the recessed portion 302. Therefore, when the flexible electronic device 1 is bent, the piezoelectric sensing unit 51 corresponding to the bending position of the flexible electronic device 1 can sense the bending behavior of the flexible electronic device 1 and generate a corresponding bending position identification signal. The processor 70 is thus able to determine the bend location from the bend location identification signal.
Referring to fig. 5, fig. 5 is a schematic cross-sectional structure view of a flexible electronic device 1 according to a fourth embodiment of the present application. The flexible display assembly 30c shown in fig. 5 is similar to the flexible display assembly 30b shown in fig. 4, except that in this embodiment, the flexible display assembly 30c further comprises a first inorganic layer 37, an organic layer 38, and a second inorganic layer 39. The first inorganic layer 37 is arranged stacked on the side of the cathode layer 33 facing away from the anode layer 31. The organic layer 38 is arranged on top of the first inorganic layer 37 on the side facing away from the anode layer 31. The second inorganic layer 39 is arranged on the side of the organic layer 38 facing away from the anode layer 31. The first inorganic layer 37, the organic layer 38, and the second inorganic layer 39 integrally form an encapsulation layer, and the first inorganic layer 37, the organic layer 38, and the second inorganic layer 39 provide protection for the flexible display assembly 30 c.
The recessed portion 302 is provided in a region corresponding to the non-display region F1 in a stacked structure including any one, any two adjacent layers, any three adjacent layers, any four adjacent layers, any five adjacent layers, any six adjacent layers, any seven adjacent layers, any 8 adjacent layers, or any nine adjacent layers of the thin film transistor array 36, the anode layer 31, the hole transport layer 34, the light-emitting layer 32, the electron transport layer 35, the cathode layer 33, the first inorganic layer 37, the organic layer 38, and the second inorganic layer 39. In this embodiment, the recessed portion 302 is provided in a region of the anode layer 31 corresponding to the non-display region F1. The at least two piezoelectric sensing units 51 are sequentially arranged in the concave portion 302, so that when the flexible electronic device 1 is bent, the piezoelectric sensing units 51 corresponding to the bending positions of the flexible electronic device 1 can sense the bending behaviors of the flexible electronic device 1 and generate corresponding bending position identification signals. The processor 70 is thus able to determine the bend location from the bend location identification signal.
It is understood that, in other embodiments, the recessed portion 302 may also be disposed in a region corresponding to the non-display region F1 in other layers included in the flexible display assembly 30, for example, a hole injection layer, an electron injection layer, or the like.
Specifically, please refer to fig. 6a and 6b together, wherein fig. 6a and 6b are equivalent circuit diagrams of the piezoelectric sensing unit 51. The piezoelectric sensing unit 51 is a piezoelectric sensor, when the piezoelectric sensing unit is compressed/stretched, a piezoelectric material generates a piezoelectric effect, and charges with opposite polarities but equal electric quantity appear on two polar surfaces of the piezoelectric sensing unit 51. The capacitance Ca of the piezoelectric sensing unit 51 is: ca ═ es/d, where e is the piezoelectric constant, S is the force-receiving area, and d is the distance between the two plates of the piezoelectric sensing unit 51. When the two plates of the piezoelectric sensing unit 51 collect opposite charges, the two plates present a certain voltage Ua, which is: ua is q/Ca, where q is the charge amount and Ca is the capacitance. That is, the piezoelectric sensing unit 51 generates a voltage when bending, and thus, whether the position of the flexible display assembly 30 is bent can be determined according to whether the piezoelectric sensing unit 51 at the corresponding position of the flexible display assembly 30 generates a voltage. Specifically, the piezoelectric sensing unit 51 generates a voltage when bending, and the processor 70 determines that the position of the flexible display assembly 30 is bent when the piezoelectric sensing unit 51 at the position corresponding to the flexible display assembly 30 generates a voltage; the piezoelectric sensing unit 51 does not generate a voltage when not bent, and the processor 70 determines that the position of the flexible display assembly 30 is not bent when the piezoelectric sensing unit 51 at the corresponding position of the flexible display assembly 30 does not generate a voltage.
Further specifically, each piezoelectric sensing unit 51 is disposed corresponding to one bending position, and the bending position is stored, specifically, in the form of a correspondence table between the piezoelectric sensing unit and the bending position. When the piezoelectric sensing unit 51 generates a voltage, the processor 70 determines that the bending position corresponding to the piezoelectric sensing unit 51 is bent according to the correspondence table between the piezoelectric sensing unit and the bending position.
Referring to fig. 7, fig. 7 is a schematic structural diagram of the flexible electronic device 1 according to an embodiment of the present disclosure after all the stacked structures on the anode layer 31 are removed. In the flexible electronic device 1 shown in fig. 7, the anode layer 31 includes at least two anode units 311, and is arranged in an array. The recessed portions 302 are only disposed at positions corresponding to the non-display area F1 on two adjacent sides of the flexible display assembly 30. It is understood that, in other embodiments, the recessed portions 302 may also be disposed at positions corresponding to the non-display areas F1 on four sides of the flexible display assembly 30. Since the piezoelectric sensing units 51 are correspondingly disposed on all edges of the flexible display assembly 30, when any two piezoelectric sensing units 51 of the flexible display assembly 30 generate a voltage, it can be determined that the bending position of the flexible display assembly 30 is a bending line. The processor 70 adjusts the content display of the flexible display assembly 30 according to the bend line, for example, adjusts the flexible display assembly 30 according to the bend line to display in a split screen manner.
In an embodiment, the piezoelectric sensing units 51 are in a strip shape, and the at least two piezoelectric sensing units 51 are disposed at intervals and sequentially accommodated in the recessed portion 302, and respectively adapted to the structures of the corresponding positions of the recessed portion 302. It is understood that, in other embodiments, the voltage sensing units 51 may be provided in other shapes, and any two adjacent piezoelectric sensing units 51 of the at least two piezoelectric sensing units 51 may be closely arranged.
The flexible electronic device 1 comprises a pad region 80. The pad area 80 is provided with at least two welding spots 81, the at least two welding spots 81 are respectively electrically connected with the processor 70, and the at least two piezoelectric sensing units 51 are correspondingly connected with the at least two welding spots 81.
Specifically, the front surface and the back surface of each piezoelectric sensing unit 51 are provided with metal leads 511, and the metal leads 511 electrically connect the piezoelectric sensing units 51 with the corresponding solder joints 81. And each welding point 81 is electrically connected to the processor 70, so that the processor 70 can determine the bending position of the flexible display assembly 30 according to the bending position identification signal generated by the piezoelectric sensing unit 51.
Referring to fig. 7 and 8, in the present embodiment, the number of the at least one piezoelectric sensing unit 51 is six, three of the at least one piezoelectric sensing unit correspond to the transverse bending positions H1, H2, and H3, and the other three correspond to the vertical bending positions V1, V2, and V3. The number of the metal leads 511 is also six. The number of the welding spots 81 is also six. Each metal lead 511 electrically connects the corresponding piezoelectric sensing unit 51 with the corresponding solder joint 81.
When the flexible electronic device 1 is not bent laterally, the voltages of the piezoelectric sensing units 51 corresponding to the three bending positions H1, H2, and H3 are equal. When the flexible electronic device 1 is bent at the bending position H2, the voltage of the piezoelectric sensing unit 51 corresponding to the bending position H2 is greater than the voltages of the piezoelectric sensing units 51 corresponding to the other two bending positions H1 and H3. Therefore, whether the corresponding bending position of the flexible electronic device 1 is bent can be determined according to whether the piezoelectric sensing unit 51 generates a voltage.
It is understood that in other embodiments, the number, length, spacing length between adjacent piezoelectric sensing units 51, etc. can be determined according to the bending radius of the flexible electronic device 1 and the sensitivity requirement.
Referring to fig. 9, fig. 9 is a schematic cross-sectional structure diagram of a solder joint 81 according to an embodiment of the present disclosure. The pad 81 includes an insulating layer 811, a metal conductive layer 812, a protective layer 813, a planarization layer 814, and a bonding layer 815, which are stacked, wherein the metal conductive layer 812 is disposed on the insulating layer 811. The protective layer 813 is disposed on the metal conductive layer 812 and surrounds the metal conductive layer 812, a protective layer opening 8131 is disposed on the protective layer 813, the metal conductive layer 812 is exposed from the protective layer opening 8131, the planarization layer 814 is disposed on the protective layer 813 and surrounds the protective layer 813, a planarization layer opening 8141 is disposed at a position of the planarization layer 814 corresponding to the protective layer opening 8131, the bonding layer 815 is bonded to one of the planarization layer 814, the planarization layer opening 8141 and the protective layer opening 8131, the metal lead 511 of the piezoelectric sensing unit 51 is bonded to the bonding layer 815, and the metal conductive layer 812 is electrically connected to the processor 70.
Referring to fig. 10, fig. 10 is a schematic flow chart illustrating a bending position determining method according to an embodiment of the present application. The bending position determining method is applied to the flexible electronic device 1, and the execution sequence is not limited to the sequence shown in fig. 10. The method comprises the following steps:
Specifically, the piezoelectric sensing unit 51 is a piezoelectric sensor, which generates a piezoelectric effect when compressed/stretched, and charges with opposite polarities but equal electric quantities appear on two polar surfaces. That is, the piezoelectric sensing unit 51 generates a voltage when it is bent.
And 102, determining a bending position according to the bending position identification signal.
Specifically, the processor 70 determines the bending position according to the bending position identification signal.
Specifically, the processor 70 determines whether the position of the flexible display assembly 30 is bent according to whether the piezoelectric sensing unit 51 at the corresponding position of the flexible display assembly 30 generates a voltage.
Specifically, the piezoelectric sensing unit 51 generates a voltage when bending, and the processor 70 determines that the position of the flexible display assembly 30 is bent when the piezoelectric sensing unit 51 at the position corresponding to the flexible display assembly 30 generates a voltage; the piezoelectric sensing unit 51 does not generate a voltage when not bent, and the processor 70 determines that the position of the flexible display assembly 30 is not bent when the piezoelectric sensing unit 51 at the corresponding position of the flexible display assembly 30 does not generate a voltage.
Further specifically, each piezoelectric sensing unit 51 is disposed corresponding to one bending position, and the bending position is stored, specifically, in the form of a correspondence table between the piezoelectric sensing unit and the bending position. When the piezoelectric sensing unit 51 generates a voltage, the processor 70 determines that the bending position corresponding to the piezoelectric sensing unit 51 is bent according to the correspondence table between the piezoelectric sensing unit and the bending position.
Specifically, the processor 70 adjusts the content display of the flexible electronic device 1 according to the bending position, for example, adjusts the split screen according to the bending position.
According to the flexible electronic device and the bending position determining method thereof, the bending position on any position of the flexible electronic device can be determined in real time through the piezoelectric sensing assembly, so that the flexible electronic device can adjust display content according to bending surrounding, and better user experience is achieved.
The Processor 70 may be a Central Processing Unit (CPU), other general-purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, a discrete hardware component, or the like. The general purpose processor may be a microprocessor or the processor may be any conventional processor or the like, the processor being the control center of the flexible electronic device 1, various interfaces and lines connecting the various parts of the entire flexible electronic device 1.
It is understood that the flexible electronic device 1 further includes a memory (not shown), and various data of the flexible electronic device 1 can be stored in the memory. Wherein the memory is specifically used for storing the computer programs and/or modules, and the processor 70 implements various functions of the flexible electronic device 1 by running or executing the computer programs and/or modules stored in the memory and calling the data stored in the memory. The memory may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, application programs (such as a sound playing function, an image playing function, etc.) required by a plurality of functions, and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the cellular phone, and the like. In addition, the memory may include high speed random access memory, and may also include non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), a plurality of magnetic disk storage devices, a Flash memory device, or other volatile solid state storage devices.
The foregoing is a preferred embodiment of the present application and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present application, and such improvements and modifications are also considered as the scope of the present application.
Claims (14)
- A flexible electronic device, comprising a flexible substrate, a flexible display component, a piezoelectric sensing component, and a processor, the flexible display assembly is arranged on the flexible substrate in a stacked mode, at least two adjacent side walls of the flexible display assembly are provided with concave portions along the peripheral direction of the flexible display assembly, the piezoelectric sensing component comprises at least two piezoelectric sensing units which are arranged in the concave part, and each side wall corresponds to at least one piezoelectric sensing unit, when the flexible electronic device is bent, the piezoelectric sensing unit corresponding to the bending position of the flexible electronic device generates a corresponding bending position identification signal, and the processor determines the bending position according to the bending position identification signal and adjusts the content display of the flexible display component according to the bending position.
- The flexible electronic device of claim 1, wherein the flexible display assembly has a display area and a non-display area disposed around a periphery of the display area, the recessed portion being disposed within the non-display area.
- The flexible electronic device according to claim 1, wherein the at least two piezoelectric sensing units are disposed in the recessed portion at intervals and respectively fit with inner walls of corresponding positions of the recessed portion.
- The flexible electronic device according to any one of claims 1 to 3, wherein the piezoelectric sensing unit generates a voltage when bending, and the processor determines that the position of the flexible display element is bent when the piezoelectric sensing unit at the corresponding position of the flexible display element generates a voltage; the processor determines that the position of the flexible display assembly is not bent when the piezoelectric sensing unit at the position corresponding to the flexible display assembly does not generate voltage.
- The flexible electronic device according to claim 4, wherein each piezoelectric sensing unit is disposed corresponding to a bending position, and when the piezoelectric sensing unit generates a voltage, the flexible electronic device determines that the bending position corresponding to the piezoelectric sensing unit is bent.
- The flexible electronic device according to claim 1, wherein the flexible electronic device comprises a pad area, the pad area is provided with at least two solder points, the at least two solder points are respectively electrically connected with the processor, and the at least two piezoelectric sensing units are connected with the at least two solder points in a one-to-one correspondence manner.
- The flexible electronic device according to claim 6, wherein a front surface and a back surface of each of the piezoelectric sensing units are provided with metal leads, and the metal leads electrically connect the piezoelectric sensing units with the corresponding pads.
- The flexible electronic device according to any one of claims 6 to 7, wherein each of the pads comprises an insulating layer, a metal conductive layer, a protective layer, a planarization layer, and a bonding layer disposed in a stack, the protective layer is arranged on the metal conductive layer and surrounds the metal conductive layer, a protective layer opening is arranged on the protective layer, the metal conductive layer is exposed from the protective layer opening, the planarization layer is disposed on and surrounds the protective layer, a planarization layer opening is arranged on the planarization layer at the position corresponding to the protective layer opening, the lapping layer is lapped on one of the planarization layers and the planarization layer opening and the protective layer opening, the metal lead of the piezoelectric sensing unit is lapped on the lapping layer, and the metal conducting layer is electrically connected with the processor.
- The flexible electronic device according to claim 2, wherein the flexible display module includes at least an anode layer, a light emitting layer, and a cathode layer, the anode layer is stacked on the flexible substrate, the light emitting layer is stacked on the anode layer, the cathode layer is stacked on the light emitting layer, and the recessed portion is provided in a region corresponding to the non-display region of a stacked structure formed by any one of the anode layer, the light emitting layer, and the cathode layer, any adjacent two layers, or adjacent three layers.
- The flexible electronic device according to claim 9, wherein the flexible display module further comprises a hole transport layer provided between the anode layer and the light emitting layer, and an electron transport layer provided between the light emitting layer and the cathode layer, the hole transport layer being configured to facilitate movement of holes generated in the anode layer to the light emitting layer, the electron transport layer being configured to facilitate smooth transport of electrons released in the cathode layer to the light emitting layer, and the recessed portion being provided in a region corresponding to the non-display region of a stacked structure formed by any one of the anode layer, the hole transport layer, the light emitting layer, the electron transport layer, and the cathode layer, any two adjacent layers, any three adjacent layers, any four adjacent layers, or five adjacent layers.
- The flexible electronic device of claim 10, wherein the flexible display assembly further comprises a thin film transistor array, the thin film transistor array is arranged between the flexible substrate and the anode layer, each thin film transistor in the thin film transistor array corresponds to a pixel in the light-emitting layer, when the corresponding pixel in the light-emitting layer needs to be lightened, the thin film transistor corresponding to the pixel in the thin film transistor array is turned on to drive the pixel, the concave part is arranged in a region corresponding to the non-display region of a laminated structure formed by any one, any two adjacent layers, any three adjacent layers, any four adjacent layers, any five adjacent layers or six adjacent layers of the thin film transistor array, the anode layer, the hole transport layer, the light emitting layer, the electron transport layer and the cathode layer.
- The flexible electronic device of claim 11, wherein the flexible display assembly further comprises a first inorganic layer, an organic layer, and a second inorganic layer, the first inorganic layer is stacked on a side of the cathode layer facing away from the anode layer, the organic layer is stacked on a side of the first inorganic layer facing away from the anode layer, the second inorganic layer is disposed on a side of the organic layer facing away from the anode layer, and the recess is disposed on a side of the thin film transistor array facing away from the anode layer, wherein the recess is formed by any one of the thin film transistor array, the anode layer, the hole transport layer, the light emitting layer, the electron transport layer, the cathode layer, the first inorganic layer, the organic layer, and the second inorganic layer, any two adjacent layers, any three adjacent layers, any four adjacent layers, any five adjacent layers, any six adjacent layers, any seven adjacent layers, And any adjacent eight layers or nine layers form a laminated structure in the area corresponding to the non-display area.
- A bending position determining method applied to the flexible electronic device according to any one of claims 1 to 12, wherein the bending position determining method comprises the steps of:when the flexible electronic device is bent, the piezoelectric sensing unit corresponding to the bending position of the flexible electronic device generates a corresponding bending position identification signal;determining a bending position according to the bending position identification signal; andand adjusting the content display of the flexible electronic device according to the bending position.
- The method of determining a bend position according to claim 13, wherein the method of determining a bend position comprises the steps of:judging whether the piezoelectric sensing unit generates voltage or not;when the piezoelectric sensing unit generates voltage, determining that the position corresponding to the piezoelectric sensing unit of the flexible display assembly is bent;and when the piezoelectric sensing unit does not generate voltage, determining that the position corresponding to the piezoelectric sensing unit of the flexible display assembly is not bent.
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