CN112446181B - Method, system and test board for detecting failure rate of single-board component - Google Patents
Method, system and test board for detecting failure rate of single-board component Download PDFInfo
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- CN112446181B CN112446181B CN202011217459.9A CN202011217459A CN112446181B CN 112446181 B CN112446181 B CN 112446181B CN 202011217459 A CN202011217459 A CN 202011217459A CN 112446181 B CN112446181 B CN 112446181B
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- 238000012360 testing method Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004088 simulation Methods 0.000 claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/33—Design verification, e.g. functional simulation or model checking
- G06F30/3308—Design verification, e.g. functional simulation or model checking using simulation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
Abstract
The invention discloses a method, a system and a test board for detecting failure rate of a veneer element, comprising the following steps: the method comprises the following steps of (1) checking a high-failure component device from the aspect of a hardware circuit, importing a single-board PCB structure into reliability prediction software, replacing components with high failure rate, replacing components which do not meet derating, and recording components which cannot be replaced as high-failure components; simulating a layout structure of the single-board PCB, and recording components of which the layout cannot be changed due to structural limitation and board card area limitation as high-failure components; simulating the heat dissipation of the single-board PCB, marking components close to a heating part after simulation, modifying the layout and wiring of the marked components, and recording the marked components which cannot be modified as high-failure components; carrying out back plate actual measurement on the high-failure component; the invention can solve the problems that the reliability of the device is not accurately predicted and the test of the substitute material is not comprehensive in the product design process.
Description
Technical Field
The invention relates to the field of system board card design, in particular to a method, a system and a test board for detecting failure rate of a single-board component.
Background
With the advent of the big data era, servers with high-speed computing capability, long-time reliable operation and strong external data throughput capacity are greatly required by various industries; in recent years, with the iterative update and mass shipment of various server products, the reliability problem of electronic products has become a hot spot concerned by server manufacturers and customers; for design and manufacture manufacturers, the reliability of the product can be guaranteed and distinguished from a plurality of manufacturers, and the expected reliability of the product is the failure rate and MTBF of the product.
In the reliability prediction of the electronic equipment, a large number of electronic components are analyzed and calculated one by one, if manual calculation is used, the workload of manual calculation for a user can be reduced by software, the reliability prediction software is developed based on the reliability prediction standard, and the purpose of software development is to provide a more convenient and faster tool for the user of the software; at present, a common method for predicting the reliability of a single board by a server manufacturer is to use Windchil Quality Solutions of American companies to perform static prediction, specifically, a single board BOM is introduced into reliability prediction software, and the MTBF value of the whole server product is calculated by calculating the MTBF value of the single board; there are problems with this approach: the current reliability of the product cannot be reflected in real time; the data source is single and has low reliability; the reliability of the static calculation electronic product cannot dynamically reflect the influence of the environment on the product; according to the non-uniformity of the design standard and the application range of each manufacturer, the reliability difference points of similar or same products cannot be reflected, the current test method does not consider the factors such as the single board operation environment and the like, the reliability prediction is not combined with the actual measurement, and the single board systematized reliability prediction cannot be carried out on some components with higher failure rate.
Disclosure of Invention
The invention mainly solves the technical problem of providing a method, a system and a test board for detecting the failure rate of a single-board component, which can solve the problems that the reliability of the component is not accurately predicted and the test of a substitute material is not comprehensive in the product design process.
In order to solve the technical problems, the invention adopts a technical scheme that: the method for detecting the failure rate of the single-board component comprises the following steps:
high failure components are checked from the aspects of hardware circuits, single-board PCB layout structures and single-board PCB heat dissipation;
the method comprises the following steps of searching a high failure component device from the aspect of a hardware circuit, wherein a single-board PCB structure is led into reliability prediction software, components with high failure rate and components which do not meet derating are found out through the reliability prediction software, the components with high failure rate and the components which do not meet derating are replaced, and the components which cannot be replaced are recorded as high failure components;
the method comprises the steps of simulating the single-board PCB layout structure, marking the part which is easy to deform and causes the failure of the component after the simulation, modifying the wiring layout of a design drawing after the marking, and recording the component which cannot be modified in layout due to structural limitation and board card area limitation as the high-failure component after the wiring layout is modified;
the method comprises the steps of carrying out simulation on the heat dissipation of the single-board PCB, marking the components which are close to a heating part and are easy to influence after the simulation, modifying the layout and the layout wiring of the marked components, and recording the marked components which cannot be modified as the high-failure components;
and carrying out back plate actual measurement on the high-failure component.
Further, the finding out the components with high failure rates through the reliability prediction software comprises:
setting parameters of each component;
checking the single board failure rate predicted by the reliability prediction software and the predicted average non-failure working time;
and finding out the components of the first items of failure rate through the predicted failure rate ranking.
Further, the finding out the components not meeting the derating through the reliability prediction software comprises:
setting derating parameters of all components through a data table according to derating specifications;
calculating derating parameters of the components according to the application scenes of the components;
and comparing the calculated derating parameters of the components with the derating parameters of all the components set in the data table, and finding out the components which do not meet the derating requirements.
Further, the return board actual measurement is to simulate the test environment according to the actual application scene, and the high-failure component is tested by using the test board.
Further, the using the test board for testing includes:
leading signals of high-failure components in the single-board PCB to a test board through a probe and a lead;
the single-board PCB is electrified and normally works in a simulation test environment;
and after the test time is shorter than the specified test time, when the logic chip on the test board cannot receive the signal of the high failure component, the high failure component is judged to be failed, a warning is sent out, a log is recorded, and the failed high failure component is recorded.
Further, the log records the time of the pin conversion state in the logic chip.
A system for detecting failure rate of a veneer element comprises: the system comprises a reliability prediction replacement component module, a derating replacement component module, a simulation layout replacement component module, a simulation heat dissipation replacement component module and a return board test module;
the reliability prediction replacement component module finds out components with high failure rate through reliability prediction software, performs sequencing analysis on the components with high failure rate, replaces the replaceable components with high failure rate, and transmits the components with high failure rate to the return board test module;
the derating replacement component module performs derating analysis, finds out components which do not meet derating, replaces the components which do not meet derating, and transmits the components which cannot be replaced to the return board testing module;
the simulation layout replacement component module simulates a single-board PCB layout structure, marks parts which are easy to deform and cause component failure after simulation, modifies the wiring layout of a design drawing after marking, and transmits components which cannot be modified in layout due to structural limitation and board card area limitation to the board returning test module after the wiring layout is modified;
the simulation heat dissipation replacement component module simulates the heat dissipation of the single-board PCB, marks easily-influenced components close to a heating part after simulation, modifies the layout and layout wiring of the marked components, and transmits the marked components which cannot be modified to the return board testing module;
and the return board testing module simulates a testing environment according to an actual application scene, and tests the components transmitted by the reliability prediction replacement component module, the derating replacement component module, the simulation layout replacement component module and the simulation heat dissipation replacement component module by using a testing board.
A test board for detecting failure rate of single board component includes: measuring points and a logic chip; a plurality of measuring points are arranged in the test board; the measuring point is connected with the logic chip; the measuring points are connected with signal ends of high-failure components in the single-board PCB through signal lines or probes.
The invention has the beneficial effects that: the invention solves the problems that the reliability of the device is not accurately predicted and the test of the substitute material is not comprehensive in the product design process, and detects the single-plate high-failure-risk components, thereby checking the product design risk as early as possible.
Drawings
FIG. 1 is a flow chart of a method for detecting failure rate of a single board device of a server according to a preferred embodiment of the present invention;
FIG. 2 is a diagram of a system architecture for detecting failure rates of single-board components of a server according to the present invention;
fig. 3 is a diagram of a test board architecture for detecting failure rate of a single board device of a server according to the present invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Referring to fig. 1 to 3, an embodiment of the present invention includes:
referring to fig. 1, a method for detecting failure rate of a single-board device includes:
high failure components are checked from the aspects of hardware circuits, single-board PCB layout structures and single-board PCB heat dissipation;
the method comprises the steps of searching a high-failure component device from the aspect of a hardware circuit, wherein a single-board PCB structure is led into reliability prediction software, components with high failure rate and components which do not meet the derating are found out through the reliability prediction software, the components with high failure rate and the components which do not meet the derating are replaced, and the components which cannot be replaced are recorded as the high-failure components;
the method comprises the steps of checking high-failure components from the aspect of a single-board PCB layout structure, simulating the single-board PCB layout structure, marking parts which are easy to deform and cause component failure after simulation, modifying layout after marking, and recording components of which the layout cannot be changed due to structural limitation and board card area limitation as the high-failure components after the layout modification;
the method for checking the high-failure components from the aspect of heat dissipation of the single-board PCB comprises the steps of simulating the heat dissipation of the single-board PCB, marking the components which are close to a heating part and are easy to influence after simulation, modifying the layout and layout of the marked components and layout of layout, and recording the marked components which cannot be modified as the high-failure components;
and carrying out back plate actual measurement on the high-failure component.
Finding out the components with high failure rate through reliability prediction software comprises the following steps:
s10, setting parameters of each component, wherein the parameters include but are not limited to component types, component quality grades and mean time between failures provided by suppliers;
s20, checking the predicted failure rate of the single board and the predicted average non-failure working time of the system;
and S30, finding out the components of N items before the failure rate through the predicted failure rate ranking.
The method for carrying out derating analysis on the components in the BOM through the reliability prediction software to find out the components which do not meet the derating comprises the following steps:
s11, setting derating parameters of all components through a data table according to derating specifications set by national military standards;
s21, calculating derating parameters of the components according to the application scenes of the components;
and S31, comparing the calculated derating parameters of the components with the derating parameters of all the components set in the data table, and finding out the components which do not meet the derating requirements.
The return board actual measurement is used for simulating a test environment according to an actual application scene, and the test board is used for testing the components which are prone to failure.
Firstly, leading signals of high-failure components in a single-board PCB to the test board through a probe and a lead; secondly, the single-board PCB is electrified and normally works in a simulation test environment; and after a plurality of times, the plurality of times are less than the specified test time, when the logic chip on the test board cannot receive the signal of the high failure component, the high failure component is judged to be failed, a warning is sent out, a log is recorded, and the failed high failure component is recorded.
The log records the time of the pin conversion state (corresponding to the register change value) in the logic chip.
And the time of converting the state of the pin minus the time of starting to test is equal to the failure time of the element when the single board runs in the simulation environment.
Wherein, the Mean Time Between Failures (MTBF) is a Mean Time Between failures (MTWEEN Failure) in English, which is a reliability index for measuring a product (especially an electric product); in "hours"; it reflects the time quality of the product and is a capability of embodying the function of the product to be kept in a specified time. In particular, the average working time between two adjacent faults is also called the average fault interval;
the single board BOM is a file describing a structure of the single board PCB, which includes all components in the single board PCB.
Referring to fig. 2, based on the same inventive concept as the method for detecting the failure rate of the single board component in the foregoing embodiment, an embodiment of the present specification further provides a system for detecting the failure rate of the single board component, including: the device comprises a reliability prediction replacement component module, a derating replacement component module, a simulation layout replacement component module, a simulation heat dissipation replacement component module and a return board test module;
the reliability prediction replacement component module finds out components with high failure rate through reliability prediction software, performs sequencing analysis on the components with high failure rate, replaces some replaceable components with high failure rate, and transmits the components with high failure rate to the return board test module;
the derating replacement component module performs derating analysis to find out components which do not meet derating, replaces the components which do not meet derating, and transmits the components which cannot be replaced to the return board testing module;
the simulation layout replacement component module simulates a single-board PCB layout structure, marks parts which are easy to deform and cause component failure after simulation, modifies layout wiring layout after marking, and transmits components which cannot be modified in layout due to structural limitation and board card area limitation to the board returning test module after wiring layout modification;
the simulation heat dissipation replacement component module simulates the heat dissipation of the single-board PCB, marks easily-influenced components close to a heating part after simulation, modifies the layout and layout of the marked components and layout wiring, and transmits the marked components which cannot be modified to the return board testing module;
the return board testing module simulates a testing environment according to an actual application scene, and predicts the reliability to replace the component module and derate the component module; the components transmitted by the simulation layout replacement component module and the simulation heat dissipation replacement component module are tested by using the test board.
Referring to fig. 3, an embodiment of the present specification provides a test board for detecting failure rate of a single-board device, including: measuring points and a logic chip; a plurality of measuring points are arranged in the test board; the measuring point is connected with the logic chip; the measuring points are connected with signal ends of high-failure components in the single-board PCB through signal lines or probes.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes performed by the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (8)
1. A method for detecting failure rate of a single-board component is characterized by comprising the following steps:
the method comprises the following steps of (1) checking high-failure components from the aspects of hardware circuits, single-board PCB layout structures and single-board PCB heat dissipation;
the method comprises the steps of leading a single-board PCB structure into reliability prediction software, finding out components with high failure rate and components which do not meet the derating through the reliability prediction software, replacing the components with high failure rate and the components which do not meet the derating, and recording the components which cannot be replaced as high failure components;
the method comprises the steps of checking a high-failure component from the aspect of a single-board PCB layout structure, simulating the single-board PCB layout structure, marking a part which is easy to deform and causes component failure after simulation, modifying the layout of a design drawing after marking, and recording the component which cannot be modified in layout due to structural limitation and board card area limitation as the high-failure component after the layout of the component is modified;
the method comprises the following steps of checking high-failure components from the aspect of heat dissipation of a single-board PCB, simulating the heat dissipation of the single-board PCB, marking the components which are close to a heating part and are susceptible to influence after simulation, modifying the layout and the layout wiring of the marked components, and recording the marked components which cannot be modified as the high-failure components;
and carrying out back plate actual measurement on the high-failure component.
2. The method for detecting the failure rate of a single-board component according to claim 1, wherein: finding out the components with high failure rate through reliability prediction software comprises the following steps:
setting parameters of each component;
checking the single board failure rate predicted by the reliability prediction software and the predicted average non-failure working time;
and finding out the components of a plurality of items before the failure rate through the predicted failure rate ranking.
3. The method for detecting the failure rate of a single-board component according to claim 1, wherein: finding out the components which do not meet the derating requirement through reliability prediction software comprises the following steps:
setting derating parameters of each component through a data table according to derating specifications;
calculating derating parameters of the components according to the application scenes of the components;
and comparing the calculated derating parameters of the components with derating parameters of all the components set in the data table, and finding out the components which do not meet the derating requirements.
4. The method for detecting the failure rate of a single-board component according to claim 1, wherein: and the return plate actual measurement is to simulate the test environment according to the actual application scene, and test the high-failure component by using the test plate.
5. The method for detecting the failure rate of a single-board component according to claim 4, wherein: the using a test board for testing includes:
leading signals of high-failure components in the single-board PCB to a test board through a probe and a lead;
the single-board PCB is electrified and normally works in a simulation test environment;
and after the test time is shorter than the specified test time, when the logic chip on the test board cannot receive the signal of the high failure component, the high failure component is judged to be failed, a warning is sent out, a log is recorded, and the failed high failure component is recorded.
6. The method for detecting the failure rate of a single-board component according to claim 5, wherein:
and recording the time of the pin conversion state in the logic chip in the log.
7. A system for detecting failure rate of a veneer component is characterized by comprising: the device comprises a reliability prediction replacement component module, a derating replacement component module, a simulation layout replacement component module, a simulation heat dissipation replacement component module and a return board test module;
the reliability prediction replacement component module finds out components with high failure rate through reliability prediction software, performs sequencing analysis on the components with high failure rate, replaces the replaceable components with high failure rate, and transmits the irreplaceable components with high failure rate to the return board test module;
the derating replacement component module performs derating analysis, finds out components which do not meet the derating, replaces the components which do not meet the derating, and then transmits the components which cannot be replaced to the return board testing module;
the simulation layout replacement component module simulates a single-board PCB layout structure, marks parts which are easy to deform and cause component failure after simulation, modifies the wiring layout of a design drawing after marking, and transmits components which cannot be modified in layout due to structural limitation and board card area limitation to the board returning test module after the wiring layout is modified;
the simulation heat dissipation replacement component module simulates the heat dissipation of the single-board PCB, marks easily-influenced components close to a heating part after simulation, modifies the layout and the layout wiring of the marked components, and transmits the marked components which cannot be modified to the return board testing module;
and the return board testing module simulates a testing environment according to an actual application scene, and tests the components transmitted by the reliability prediction replacement component module, the derating replacement component module, the simulation layout replacement component module and the simulation heat dissipation replacement component module by using a testing board.
8. A test board for detecting failure rate of single-board components, based on the method for detecting failure rate of single-board components in any one of claims 1 to 6, comprising: measuring points and a logic chip; a plurality of measuring points are arranged in the test board; the measuring point is connected with the logic chip; the measuring points are connected with signal ends of high-failure components in the single-board PCB through signal lines or probes.
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| CN105630618A (en) * | 2015-12-17 | 2016-06-01 | 浪潮电子信息产业股份有限公司 | Method for improving MTBF (Mean Time Between Failure) of complete server product |
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