CN112443883A - Electronic expansion valve control method and device and heat pump unit - Google Patents
Electronic expansion valve control method and device and heat pump unit Download PDFInfo
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- CN112443883A CN112443883A CN201910800161.1A CN201910800161A CN112443883A CN 112443883 A CN112443883 A CN 112443883A CN 201910800161 A CN201910800161 A CN 201910800161A CN 112443883 A CN112443883 A CN 112443883A
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- expansion valve
- electronic expansion
- opening degree
- air suction
- suction superheat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D15/00—Other domestic- or space-heating systems
- F24D15/04—Other domestic- or space-heating systems using heat pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/01—Timing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2513—Expansion valves
Abstract
The invention belongs to the technical field of heat pump control, and particularly relates to a method and a device for controlling an electronic expansion valve and a heat pump unit. The invention provides a control method of an electronic expansion valve, which comprises the following steps: the method comprises the steps of firstly obtaining an ambient temperature TA, determining an initial opening degree of an electronic expansion valve according to the ambient temperature TA and a preset initial opening degree rule, then calculating air suction superheat degree deviation between a theoretical air suction superheat degree SH and a target air suction superheat degree SHT and an air suction superheat degree deviation change rate after the electronic expansion valve operates for a first preset time, and finally determining an opening degree adjustment quantity of the electronic expansion valve according to the superheat degree deviation, the superheat degree deviation change rate and a preset opening degree change table so that the electronic expansion valve can adjust the opening degree according to the opening degree adjustment quantity. The electronic expansion valve control method, the electronic expansion valve control device and the heat pump unit can enable the electronic expansion valve to be rapidly matched with the target opening after entering automatic adjustment, so that the opening adjustment efficiency of the electronic expansion valve is improved.
Description
Technical Field
The invention belongs to the technical field of heat pump control, and particularly relates to a method and a device for controlling an electronic expansion valve and a heat pump unit.
Background
With the rapid popularization of coal-to-electricity heating in recent years and the vigorous development of air source heat pump units for heating, the traditional high-power heating fixed-frequency heat pump units gradually quit the household heating market due to the characteristics of difficult starting, high noise, frequent starting and the like, and the variable-frequency heat pump units are more and more favored by users.
The heat pump unit is usually used for household heating, and terminal heating equipment can generally be for heating ground or radiator, and heat pump unit and terminal heating equipment carry out energy transfer through water for the medium, and wherein, heat pump unit directly heats water. In the operation process of the heat pump unit, when variables such as the frequency of the compressor, the rotating speed of the fan and the like change, the electronic expansion valve needs to adjust the opening degree and adapt to the system in time, so that the heating capacity of the heat pump unit and the reliability of the system operation are ensured.
However, when the conventional electronic expansion valve is just started, the opening degree of the conventional electronic expansion valve is gradually adjusted from a very small opening degree, and it usually takes a long time to adjust the opening degree to a proper opening degree. On the other hand, if the electronic expansion valve is not controlled to have an appropriate opening degree for a long time, the problem of high back-flow or high exhaust of the device is likely to occur.
Disclosure of Invention
The invention provides a method and a device for controlling an electronic expansion valve and a heat pump unit, so that the electronic expansion valve can be quickly matched with a target opening after entering automatic adjustment, and the opening adjustment efficiency of the electronic expansion valve is improved.
In a first aspect, the present invention provides a method for controlling an electronic expansion valve, which is applied to a heat pump unit, the method comprising:
acquiring an ambient temperature TA, and determining an initial opening degree of the electronic expansion valve according to the ambient temperature TA and a preset initial opening degree rule;
after the electronic expansion valve operates for a first preset time, calculating the air suction superheat deviation between a theoretical air suction superheat SH and a target air suction superheat SHT and the air suction superheat deviation change rate, wherein the theoretical air suction superheat SH is the difference between the air suction temperature at an air suction pipe of the heat pump unit and the pipe temperature at a coil pipe of the heat pump unit, and the target air suction superheat SHT is determined according to the ambient temperature TA;
and determining the opening degree adjustment quantity of the electronic expansion valve according to the superheat degree deviation, the superheat degree deviation change rate and a preset opening degree change table, so that the electronic expansion valve performs opening degree adjustment according to the opening degree adjustment quantity.
In one possible design, before determining the opening degree adjustment amount of the electronic expansion valve according to the superheat degree deviation, the change rate of the superheat degree deviation and a preset opening degree change table, the method further includes:
determining a target air suction superheat correction value according to the exhaust protection temperature TDP and the exhaust temperature TD of the heat pump unit;
and correcting the target suction superheat according to the target suction superheat correction value, wherein the suction superheat deviation is the difference between the theoretical suction superheat SH and the corrected target suction superheat.
In one possible design, the preset opening degree rule is that the initial opening degree increases with an increase in the TA.
In one possible design, the determining an initial opening degree of the electronic expansion valve according to the ambient temperature TA and a preset initial opening degree rule includes:
when the temperature is-15 ℃ and is more than or equal to TA, the initial opening degree is a first opening degree;
when the temperature is minus 15 ℃ and TA is less than or equal to 5 ℃, the initial opening degree is a second opening degree;
when the temperature is 5 ℃ and TA is less than or equal to 25 ℃, the initial opening is a third opening;
when the temperature is 25 ℃ and is less than TA, the initial opening degree is a fourth opening degree;
wherein the first opening degree, the second opening degree, the third opening degree and the fourth opening degree are sequentially increased.
In one possible design, the first opening is 150 steps, the second opening is 200 steps, the third opening is 270 steps, and the fourth opening is 350 steps.
In one possible design, the target suction superheat correction value increases as the TDP increases.
In one possible design, before the obtaining the ambient temperature, the method further includes:
and controlling the electronic expansion valve to close a first preset step number, wherein the first preset step number is greater than the step number corresponding to the maximum opening degree of the electronic expansion valve.
In one possible design, when the state of the heat pump unit is a standby state or a shutdown state, the opening degree of the electronic expansion valve is controlled to be kept open for a second preset step number, and the second preset step number is smaller than the first preset step number.
In one possible design, after determining the opening degree adjustment amount of the electronic expansion valve according to the superheat degree deviation, the change rate of the superheat degree deviation and a preset opening degree change table, the method further includes:
when the temperature is not more than (TDP-6 ℃) and TD < (TDP-10 ℃), if the opening adjustment amount corresponds to opening operation, the electronic expansion valve is opened according to the opening adjustment amount, and if the opening adjustment amount corresponds to closing operation, the opening of the electronic expansion valve is kept unchanged;
and when the temperature (TDP-10 ℃) is less than or equal to TD, controlling the electronic expansion valve to increase the opening TD- (TDP-8) step every second preset time interval.
In a second aspect, the present invention also provides an electronic expansion valve control apparatus comprising:
the electronic expansion valve control system comprises an acquisition module, a control module and a control module, wherein the acquisition module is used for acquiring an ambient temperature TA and determining an initial opening of the electronic expansion valve according to the ambient temperature TA and a preset initial opening rule;
the processing module is used for calculating the air suction superheat deviation between a theoretical air suction superheat SH and a target air suction superheat SHT and the air suction superheat deviation change rate after the electronic expansion valve operates for a first preset time, wherein the theoretical air suction superheat SH is the difference value between the air suction temperature at an air suction pipe of a heat pump unit and the pipe temperature at a coil pipe of the heat pump unit, and the target air suction superheat SHT is determined according to the ambient temperature TA;
the processing module is further used for determining the opening degree adjustment quantity of the electronic expansion valve according to the superheat degree deviation, the superheat degree deviation change rate and a preset opening degree change table, so that the electronic expansion valve can adjust the opening degree according to the opening degree adjustment quantity.
In a possible design, the processing module is further configured to determine a target suction superheat correction value according to a discharge protection temperature TDP and a discharge temperature TD of the heat pump unit; and
and correcting the target suction superheat according to the target suction superheat correction value, wherein the suction superheat deviation is the difference between the theoretical suction superheat SH and the corrected target suction superheat.
In one possible design, the preset opening degree rule is that the initial opening degree increases with an increase in the TA.
In one possible design, when the temperature of minus 15 ℃ is more than or equal to TA, the initial opening degree is a first opening degree;
when the temperature is minus 15 ℃ and TA is less than or equal to 5 ℃, the initial opening degree is a second opening degree;
when the temperature is 5 ℃ and TA is less than or equal to 25 ℃, the initial opening is a third opening;
when the temperature is 25 ℃ and is less than TA, the initial opening degree is a fourth opening degree;
wherein the first opening degree, the second opening degree, the third opening degree and the fourth opening degree are sequentially increased.
In one possible design, the target suction superheat correction value increases as the TDP increases.
In a possible design, the processing module is further configured to control the electronic expansion valve to close a first preset number of steps, where the first preset number of steps is greater than a number of steps corresponding to a maximum opening degree of the electronic expansion valve.
In a possible design, when the state of the heat pump unit is a standby state or a shutdown state, the processing module is further configured to control the opening degree of the electronic expansion valve to keep opening a second preset step number, where the second preset step number is smaller than the first preset step number.
In a possible design, when the opening degree adjustment amount is greater than or equal to TD < (TDP-10 ℃), if the opening degree adjustment amount corresponds to an opening operation, the processing module is further configured to control the electronic expansion valve to open according to the opening degree adjustment amount, and if the opening degree adjustment amount corresponds to a closing operation, the processing module is further configured to control the opening degree of the electronic expansion valve to remain unchanged;
and when the TD (TDP-10 ℃) is less than or equal to TD, the processing module is also used for controlling the electronic expansion valve to increase the opening TD- (TDP-8) step at every second preset time interval.
The invention also provides a heat pump unit, which comprises a processor; and the number of the first and second groups,
a memory for storing executable instructions of the processor;
wherein the processor is configured to execute any one of the possible electronic expansion valve control methods of the first aspect via execution of the executable instructions.
According to the electronic expansion valve control method, the electronic expansion valve control device and the heat pump unit, the environment temperature is obtained firstly, the initial opening degree of the electronic expansion valve is determined according to the environment temperature, and the opening degree adjustment quantity of the electronic expansion valve is determined according to the superheat degree deviation, the superheat degree deviation change rate and the preset opening degree change table, so that the electronic expansion valve can be rapidly matched with the target opening degree after entering automatic adjustment, and the opening degree adjustment efficiency of the electronic expansion valve is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic flow diagram illustrating an electronic expansion valve control method according to an exemplary embodiment of the present disclosure;
FIG. 2 is a flow chart illustrating a method of electronic expansion valve control according to another exemplary embodiment of the present disclosure;
FIG. 3 is a schematic illustration of an electronic expansion valve control apparatus according to an exemplary embodiment of the present invention;
fig. 4 is a schematic diagram of a heat pump unit according to an exemplary embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Next, it should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "inside", "outside", and the like are based on the direction or positional relationship shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or member must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Fig. 1 is a flow chart illustrating a method for controlling an electronic expansion valve according to an exemplary embodiment of the present invention. As shown in fig. 1, the method for controlling an electronic expansion valve according to this embodiment includes:
And 102, determining the initial opening degree of the electronic expansion valve according to the environment temperature TA and a preset initial opening degree rule.
Specifically, after the control system corresponding to the electronic expansion valve is powered on, the electronic expansion valve may be closed by a first preset number of steps, where the first preset number of steps is greater than the number of steps corresponding to the maximum opening degree of the electronic expansion valve, for example, the number of steps corresponding to the maximum opening degree of the electronic expansion valve may be 480 steps, the minimum opening degree may be 80 steps, and the first preset number of steps may be 540 steps.
By closing the steps exceeding the maximum opening degree before operation, the opening degree control error generated in the previous control process can be eliminated, so that the electronic expansion valve is in a closed state before opening degree adjustment, namely, the electronic expansion valve is reset to zero.
Then, the initial opening degree of the electronic expansion valve may be determined according to the ambient temperature TA and a preset initial opening degree rule. Optionally, the preset opening degree rule is that the initial opening degree increases with the increase of TA
In a possible implementation manner, for the preset initial opening rule, when TA is greater than or equal to-15 ℃, the initial opening is the first opening; when the temperature is less than-15 ℃ and less than or equal to TA and less than or equal to 5 ℃, the initial opening degree is a second opening degree; when the temperature is 5 ℃ and TA is less than or equal to 25 ℃, the initial opening degree is a third opening degree; when the temperature is 25 ℃ and is less than TA, the initial opening degree is a fourth opening degree; wherein the first opening degree, the second opening degree, the third opening degree and the fourth opening degree are sequentially increased. In one possible design, the specific setting of the preset initial opening rule can be as shown in the following table:
| ambient temperature TA | -15℃≥TA | -15℃<TA≤5℃ | 5℃<TA≤25℃ | 25℃<TA |
| Initial opening degree | 80 to 180 steps | 181 to 250 steps | 251 to 300 |
301 to 400 steps |
It should be noted that the initial opening degrees corresponding to the respective environmental temperatures may be obtained through experiments, and specifically, may be opening degrees that are stable after the conventional electronic expansion valve is automatically adjusted at the environmental temperatures.
Therefore, by combining the current environment temperature, the opening degree of the electronic expansion valve is directly adjusted to be close to the stable opening degree value corresponding to the environment temperature, and compared with the prior art in which the adjustment is started from zero, the adjustment time can be effectively shortened, and the adjustment efficiency is improved.
And 103, calculating the suction superheat deviation between the theoretical suction superheat SH and the target suction superheat SHT and the suction superheat deviation change rate.
Specifically, after the electronic expansion valve operates for a first preset time period, wherein the first preset time period may be 120 seconds, then calculating the air suction superheat deviation between the theoretical air suction superheat SH and the target air suction superheat SHT, and the air suction superheat deviation change rate, wherein the theoretical air suction superheat SH is a difference between an air suction temperature at an air suction pipe of the heat pump unit and a pipe temperature at a coil pipe of the heat pump unit, and the target air suction superheat SHT is determined according to the ambient temperature TA.
And step 104, determining the opening degree adjustment quantity of the electronic expansion valve according to the superheat degree deviation, the change rate of the superheat degree deviation and a preset opening degree change table.
And 105, adjusting the opening degree of the electronic expansion valve according to the opening degree adjustment amount.
Specifically, the opening degree adjustment amount of the electronic expansion valve may be determined according to the superheat degree deviation, the change rate of the superheat degree deviation, and a preset opening degree change table, so that the electronic expansion valve performs opening degree adjustment according to the opening degree adjustment amount.
In the embodiment, the environmental temperature is obtained firstly, then the initial opening degree of the electronic expansion valve is determined according to the environmental temperature, and then the opening degree adjustment amount of the electronic expansion valve is determined according to the superheat degree deviation, the superheat degree deviation change rate and the preset opening degree change table, so that the electronic expansion valve can be quickly matched with the target opening degree after entering the automatic adjustment, and the opening degree adjustment efficiency of the electronic expansion valve is greatly improved.
Fig. 2 is a flow chart illustrating a method for electronic expansion valve control according to another exemplary embodiment of the present invention. As shown in fig. 2, the method for controlling an electronic expansion valve according to this embodiment includes:
It should be noted that, in this embodiment, steps 201 to 202 may refer to descriptions in steps 101 to 102 in the embodiment shown in fig. 1, and are not described herein again.
And step 203, calculating the suction superheat deviation between the theoretical suction superheat SH and the target suction superheat SHT and the suction superheat deviation change rate.
And step 204, determining a target air suction superheat correction value according to the exhaust protection temperature TDP and the exhaust temperature TD of the heat pump unit.
And step 205, correcting the target suction superheat according to the target suction superheat correction value.
Specifically, the theoretical suction superheat SH can be calculated from a difference between a suction temperature TS at a suction pipe of the heat pump unit and a pipe temperature TC at a coil pipe of the heat pump unit:
SH＝TS-TC。
then, the target suction superheat SHT is determined according to the ambient temperature TA, which may specifically be:
when TA is more than or equal to 10 ℃, SHT is 3-10 ℃;
when the temperature is minus 5 ℃ and TA is less than 10 ℃, the SHT is 1-2 ℃;
when TA is less than or equal to-5 ℃, SHT is-5-0 ℃.
And determining a target air suction superheat correction value according to the exhaust protection temperature TDP and the exhaust temperature TD of the heat pump unit, wherein the target air suction superheat correction value is increased along with the increase of the TDP.
In one possible implementation, the relationship between the target suction superheat correction value and the TDP may be:
when the temperature (TDP-10 ℃) is less than or equal to TD, the corrected value of the target air suction superheat degree is-3.0 ℃;
when TD (TDP-10 ℃) is less than or equal to (TDP-15 ℃), the corrected value of the target air suction superheat degree is-2.5 ℃;
when TD (TDP-15 ℃) is less than or equal to (TDP-20 ℃), the corrected value of the target air suction superheat degree is-2.0 ℃;
when TD (TDP-20 ℃) is less than or equal to (TDP-25 ℃), the corrected value of the target air suction superheat degree is-1.0 ℃;
when TD (TDP-25 ℃) is less than or equal to (TDP-30 ℃), the corrected value of the target air suction superheat degree is-0.5 ℃;
when TD (TDP-30 ℃) is less than or equal to (TDP-40 ℃), the corrected value of the target suction superheat degree is-0.0 ℃;
when TD (TDP-40 ℃) is less than or equal to (TDP-45 ℃), the corrected value of the target suction superheat degree is 0.5 ℃;
when TD (TDP-45 ℃) is less than or equal to (TDP-50 ℃), the corrected value of the target air suction superheat degree is 1.0 ℃;
when TD (TDP-50 ℃) is less than or equal to (TDP-55 ℃), the corrected value of the target suction superheat degree is 1.5 ℃;
when TD (TDP-55 ℃) is less than or equal to (TDP-60 ℃), the corrected value of the target suction superheat degree is 2.0 ℃;
when TD (TDP-60 ℃) is less than or equal to (TDP-65 ℃), the corrected value of the target suction superheat degree is 2.5 ℃;
when TD < (TDP-65 ℃), the corrected value of the target suction superheat is 3.0 ℃.
Then, the target intake air superheat is corrected based on the target intake air superheat correction value, and the intake air superheat deviation is the difference between the theoretical intake air superheat SH and the corrected target intake air superheat. Can be as follows:
corrected target suction superheat degree: SHT1 is SHT + target intake superheat correction value.
And determining the deviation of the suction superheat degree according to the difference between the theoretical suction superheat degree SH and the corrected target suction superheat degree. Can be as follows:
ΔSH＝SH-SHT1。
further, for the rate of change of the degree of superheat deviation, it may be calculated once every preset time, for example, it may be 40 seconds per interval, and for the calculation of the rate of change of the degree of superheat deviation, it may be:
Δ SH' is SH at the current time — last SH.
And step 206, determining the opening degree adjustment quantity of the electronic expansion valve according to the superheat degree deviation, the change rate of the superheat degree deviation and a preset opening degree change table.
And step 207, adjusting the opening of the electronic expansion valve according to the opening adjustment amount.
After determining the superheat deviation and the rate of change of the superheat deviation, the opening degree adjustment amount of the electronic expansion valve may be determined according to a preset opening degree change table. The preset opening degree change table is shown as the following table:
it should be noted that, in the above table, positive numbers represent the number of steps that the electronic expansion valve needs to be opened, and negative numbers represent the number of steps that the electronic expansion valve is closed.
In the embodiment, the environmental temperature is obtained first, then the initial opening degree of the electronic expansion valve is determined according to the environmental temperature, and then the opening degree adjustment quantity of the electronic expansion valve is determined according to the superheat degree deviation, the superheat degree deviation change rate and the preset opening degree change table, so that the electronic expansion valve can be quickly matched with the target opening degree after entering the automatic adjustment, and after the electronic expansion valve enters the automatic adjustment, the adjustment quantity of the opening degree of the electronic expansion valve is determined by adopting the target air suction superheat degree correction value, the air suction superheat degree deviation and the air suction superheat degree deviation change rate, the sensor error and the temperature detection hysteresis error can be effectively eliminated, the opening degree control of the electronic expansion valve is more accurate, the opening degree change is small, and the system stability and reliability are greatly improved.
On the basis of the above embodiment, when the obtained state of the heat pump unit is a standby state or a shutdown state, the opening degree of the electronic expansion valve is controlled to be kept open for a second preset step number, where the second preset step number is smaller than the first preset step number, and the second preset step number may be 120 steps. When the electronic expansion valve is in a standby state or a shutdown state, the electronic expansion valve is kept to be opened to a certain degree, so that the electronic expansion valve can be quickly decompressed, and extra load on the compressor when the electronic expansion valve is restarted is avoided. In addition, the electronic expansion valve is completely reset to zero only when the acquired state of the heat pump unit is a shutdown state.
In addition, when the exhaust temperature TD is higher, such as when TD is less than or equal to (TDP-6 ℃) and less than (TDP-10 ℃), if the opening adjustment amount corresponds to opening operation, the electronic expansion valve is opened according to the opening adjustment amount, and if the opening adjustment amount corresponds to closing operation, the opening of the electronic expansion valve is kept unchanged, so that the cooling effect is ensured.
And when the temperature (TDP-10 ℃) is less than or equal to TD, controlling the electronic expansion valve to increase the opening TD- (TDP-8) step at intervals of a second preset time so as to further improve the cooling effect.
FIG. 3 is a schematic diagram of an electronic expansion valve control apparatus according to an exemplary embodiment of the present invention. As shown in fig. 3, the electronic expansion valve control apparatus according to the present embodiment includes:
an obtaining module 301, configured to obtain an ambient temperature TA, and determine an initial opening of the electronic expansion valve according to the ambient temperature TA and a preset initial opening rule;
the processing module 302 is configured to calculate a suction superheat deviation between a theoretical suction superheat SH and a target suction superheat SHT and a variation rate of the suction superheat deviation after the electronic expansion valve operates for a first preset time period, where the theoretical suction superheat SH is a difference between a suction temperature at a suction pipe of a heat pump unit and a pipe temperature at a coil pipe of the heat pump unit, and the target suction superheat SHT is determined according to the ambient temperature TA;
the processing module 302 is further configured to determine an opening adjustment amount of the electronic expansion valve according to the superheat deviation, the change rate of the superheat deviation, and a preset opening change table, so that the electronic expansion valve performs opening adjustment according to the opening adjustment amount.
In a possible design, the processing module 302 is further configured to determine a target suction superheat correction value according to the discharge protection temperature TDP and the discharge temperature TD of the heat pump unit; and
and correcting the target suction superheat according to the target suction superheat correction value, wherein the suction superheat deviation is the difference between the theoretical suction superheat SH and the corrected target suction superheat.
In one possible design, the preset opening degree rule is that the initial opening degree increases with an increase in the TA.
In one possible design, when the temperature of minus 15 ℃ is more than or equal to TA, the initial opening degree is a first opening degree;
when the temperature is minus 15 ℃ and TA is less than or equal to 5 ℃, the initial opening degree is a second opening degree;
when the temperature is 5 ℃ and TA is less than or equal to 25 ℃, the initial opening is a third opening;
when the temperature is 25 ℃ and is less than TA, the initial opening degree is a fourth opening degree;
wherein the first opening degree, the second opening degree, the third opening degree and the fourth opening degree are sequentially increased.
In a possible design, the first opening is 80-180 steps, the second opening is 181-250 steps, the third opening is 251-300 steps, and the fourth opening is 301-400 steps.
In a possible design, the preset opening degree rule is that the initial opening degree increases with the increase of the TA
In one possible design, the target suction superheat correction value is-3.0 ℃ when TD is ≦ TDP (TDP-10 ℃);
when TD (TDP-10 ℃) is less than or equal to (TDP-15 ℃), the corrected value of the target air suction superheat degree is-2.5 ℃;
when TD (TDP-15 ℃) is less than or equal to (TDP-20 ℃), the corrected value of the target air suction superheat degree is-2.0 ℃;
when TD (TDP-20 ℃) is less than or equal to (TDP-25 ℃), the corrected value of the target air suction superheat degree is-1.0 ℃;
when TD (TDP-25 ℃) is less than or equal to (TDP-30 ℃), the corrected value of the target air suction superheat degree is-0.5 ℃;
when TD (TDP-30 ℃) is less than or equal to (TDP-40 ℃), the corrected value of the target air suction superheat degree is-0.0 ℃;
when TD (TDP-40 ℃) is less than or equal to (TDP-45 ℃), the corrected value of the target air suction superheat degree is 0.5 ℃;
when TD (TDP-45 ℃) is less than or equal to (TDP-50 ℃), the corrected value of the target air suction superheat degree is 1.0 ℃;
when TD (TDP-50 ℃) is less than or equal to (TDP-55 ℃), the corrected value of the target air suction superheat degree is 1.5 ℃;
when TD (TDP-55 ℃) is less than or equal to (TDP-60 ℃), the corrected value of the target air suction superheat degree is 2.0 ℃;
when TD (TDP-60 ℃) is less than or equal to (TDP-65 ℃), the corrected value of the target air suction superheat degree is 2.5 ℃;
when TD < (TDP-65 ℃), the corrected value of the target suction superheat is 3.0 ℃.
In a possible design, the processing module 302 is further configured to control the electronic expansion valve to close a first preset number of steps, where the first preset number of steps is greater than a number of steps corresponding to a maximum opening degree of the electronic expansion valve.
In a possible design, when the state of the heat pump unit is a standby state or a shutdown state, the processing module 302 is further configured to control the opening degree of the electronic expansion valve to be kept open for a second preset number of steps, where the second preset number of steps is smaller than the first preset number of steps.
In a possible design, when the opening degree adjustment amount is greater than or equal to TD < (TDP-10 ℃), if the opening degree adjustment amount corresponds to an opening operation, the processing module 302 is further configured to control the electronic expansion valve to open according to the opening degree adjustment amount, and if the opening degree adjustment amount corresponds to a closing operation, the processing module 302 is further configured to control the opening degree of the electronic expansion valve to remain unchanged;
and when the TD (TDP-10 ℃) is less than or equal to TD, the processing module 302 is further configured to control the electronic expansion valve to increase the opening TD- (TDP-8) step every second preset time interval.
It should be noted that the apparatus provided in the embodiment shown in fig. 3 may be used to execute the method provided in any of the above embodiments, and the specific implementation manner and the technical effect are similar and will not be described herein again.
The above processing module 302 may be configured as one or more integrated circuits implementing the above methods, such as: one or more Application Specific Integrated Circuits (ASICs), or one or more microprocessors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs), among others. For another example, when one of the above modules is implemented in the form of a Processing element scheduler code, the Processing element may be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. For another example, the modules may be integrated together and implemented in the form of a system on a chip.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
Fig. 4 is a schematic diagram of a heat pump unit according to an exemplary embodiment of the present invention. As shown in fig. 4, the heat pump unit 400 provided in this embodiment includes:
a processor 401; and the number of the first and second groups,
a memory 402 for storing executable instructions of the processor, which may also be a flash (flash memory);
wherein the processor 401 is configured to perform the steps of the above-described method via execution of the executable instructions. Reference may be made in particular to the description relating to the preceding method embodiment.
Alternatively, the memory 402 may be separate or integrated with the processor 401.
When the memory 402 is a device independent from the processor 401, the electronic device 40 may further include:
a bus 403 for connecting the processor 401 and the memory 402.
The present embodiment also provides a readable storage medium, in which a computer program is stored, and when at least one processor of the electronic device executes the computer program, the electronic device executes the methods provided by the above various embodiments.
The present embodiment also provides a program product comprising a computer program stored in a readable storage medium. The computer program can be read from a readable storage medium by at least one processor of the electronic device, and the execution of the computer program by the at least one processor causes the electronic device to implement the methods provided by the various embodiments described above.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A control method of an electronic expansion valve is characterized by being applied to a heat pump unit, and comprises the following steps:
acquiring an ambient temperature TA, and determining an initial opening degree of the electronic expansion valve according to the ambient temperature TA and a preset initial opening degree rule;
after the electronic expansion valve operates for a first preset time, calculating the air suction superheat deviation between a theoretical air suction superheat SH and a target air suction superheat SHT and the air suction superheat deviation change rate, wherein the theoretical air suction superheat SH is the difference between the air suction temperature at an air suction pipe of the heat pump unit and the pipe temperature at a coil pipe of the heat pump unit, and the target air suction superheat SHT is determined according to the ambient temperature TA;
and determining the opening degree adjustment quantity of the electronic expansion valve according to the superheat degree deviation, the superheat degree deviation change rate and a preset opening degree change table, so that the electronic expansion valve performs opening degree adjustment according to the opening degree adjustment quantity.
2. The electronic expansion valve control method of claim 1, further comprising, before determining the opening degree adjustment amount for the electronic expansion valve based on the superheat degree deviation, the rate of change in superheat degree deviation, and a preset opening degree change table:
determining a target air suction superheat correction value according to the exhaust protection temperature TDP and the exhaust temperature TD of the heat pump unit;
and correcting the target suction superheat according to the target suction superheat correction value, wherein the suction superheat deviation is the difference between the theoretical suction superheat SH and the corrected target suction superheat.
3. The electronic expansion valve control method of claim 2, wherein the preset opening degree rule is that the initial opening degree increases as the TA increases.
4. The method of claim 3, wherein determining an initial opening degree of the electronic expansion valve according to the ambient temperature TA and a preset initial opening degree rule comprises:
when the temperature is-15 ℃ and is more than or equal to TA, the initial opening degree is a first opening degree;
when the temperature is minus 15 ℃ and TA is less than or equal to 5 ℃, the initial opening degree is a second opening degree;
when the temperature is 5 ℃ and TA is less than or equal to 25 ℃, the initial opening is a third opening;
when the temperature is 25 ℃ and is less than TA, the initial opening degree is a fourth opening degree;
wherein the first opening degree, the second opening degree, the third opening degree and the fourth opening degree are sequentially increased.
5. An electronic expansion valve control method according to any of claims 2-4, wherein the target suction superheat correction value increases with increasing TDP.
6. The electronic expansion valve control method of claim 5, further comprising, prior to said obtaining an ambient temperature:
and controlling the electronic expansion valve to close a first preset step number, wherein the first preset step number is greater than the step number corresponding to the maximum opening degree of the electronic expansion valve.
7. The method for controlling an electronic expansion valve according to claim 6, wherein when the heat pump unit is in a standby state or a shutdown state, the opening degree of the electronic expansion valve is controlled to be kept open for a second preset number of steps, and the second preset number of steps is smaller than the first preset number of steps.
8. The electronic expansion valve control method of claim 7, further comprising, after determining an opening degree adjustment amount for the electronic expansion valve based on the superheat degree deviation, the rate of change in superheat degree deviation, and a preset opening degree change table:
when the temperature is not more than (TDP-6 ℃) and TD < (TDP-10 ℃), if the opening adjustment amount corresponds to opening operation, the electronic expansion valve is opened according to the opening adjustment amount, and if the opening adjustment amount corresponds to closing operation, the opening of the electronic expansion valve is kept unchanged;
and when the temperature (TDP-10 ℃) is less than or equal to TD, controlling the electronic expansion valve to increase the opening TD- (TDP-8) step every second preset time interval.
9. An electronic expansion valve control apparatus, comprising:
the electronic expansion valve control system comprises an acquisition module, a control module and a control module, wherein the acquisition module is used for acquiring an ambient temperature TA and determining an initial opening of the electronic expansion valve according to the ambient temperature TA and a preset initial opening rule;
the processing module is used for calculating the air suction superheat deviation between a theoretical air suction superheat SH and a target air suction superheat SHT and the air suction superheat deviation change rate after the electronic expansion valve operates for a first preset time, wherein the theoretical air suction superheat SH is the difference value between the air suction temperature at an air suction pipe of a heat pump unit and the pipe temperature at a coil pipe of the heat pump unit, and the target air suction superheat SHT is determined according to the ambient temperature TA;
the processing module is further used for determining the opening degree adjustment quantity of the electronic expansion valve according to the superheat degree deviation, the superheat degree deviation change rate and a preset opening degree change table, so that the electronic expansion valve can adjust the opening degree according to the opening degree adjustment quantity.
10. A heat pump unit, comprising:
a processor; and the number of the first and second groups,
a memory for storing executable instructions of the processor;
wherein the processor is configured to perform the electronic expansion valve control method of any of claims 1-8 via execution of the executable instructions.
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