CN112437893A - Optical filter and ambient light sensor - Google Patents
Optical filter and ambient light sensor Download PDFInfo
- Publication number
- CN112437893A CN112437893A CN201980047984.XA CN201980047984A CN112437893A CN 112437893 A CN112437893 A CN 112437893A CN 201980047984 A CN201980047984 A CN 201980047984A CN 112437893 A CN112437893 A CN 112437893A
- Authority
- CN
- China
- Prior art keywords
- optical filter
- light
- compound
- resin
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 245
- 238000000149 argon plasma sintering Methods 0.000 claims abstract description 77
- 239000000463 material Substances 0.000 claims abstract description 69
- 150000001875 compounds Chemical class 0.000 claims description 88
- 239000000758 substrate Substances 0.000 claims description 79
- 238000010521 absorption reaction Methods 0.000 claims description 16
- 238000005259 measurement Methods 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 claims description 12
- -1 salt compound Chemical class 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 4
- LKKPNUDVOYAOBB-UHFFFAOYSA-N naphthalocyanine Chemical compound N1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)N3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 LKKPNUDVOYAOBB-UHFFFAOYSA-N 0.000 claims description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 claims description 3
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 claims description 2
- RQGPLDBZHMVWCH-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole Chemical compound C1=NC2=CC=NC2=C1 RQGPLDBZHMVWCH-UHFFFAOYSA-N 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 181
- 229920005989 resin Polymers 0.000 description 174
- 239000011347 resin Substances 0.000 description 174
- 239000010408 film Substances 0.000 description 82
- 238000002834 transmittance Methods 0.000 description 42
- 238000006243 chemical reaction Methods 0.000 description 40
- 239000000243 solution Substances 0.000 description 38
- 239000011521 glass Substances 0.000 description 37
- 230000035945 sensitivity Effects 0.000 description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 27
- 238000000034 method Methods 0.000 description 27
- 238000009792 diffusion process Methods 0.000 description 25
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 21
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 20
- 239000000203 mixture Substances 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 17
- 230000003595 spectral effect Effects 0.000 description 17
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- 238000000465 moulding Methods 0.000 description 13
- 239000000377 silicon dioxide Substances 0.000 description 13
- 239000002904 solvent Substances 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 12
- 238000000576 coating method Methods 0.000 description 11
- 239000000047 product Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 9
- 229920005672 polyolefin resin Polymers 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 229920001225 polyester resin Polymers 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 229920000178 Acrylic resin Polymers 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 7
- 239000006096 absorbing agent Substances 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- 239000004645 polyester resin Substances 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000007257 malfunction Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 229920005668 polycarbonate resin Polymers 0.000 description 5
- 239000004431 polycarbonate resin Substances 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- 239000004695 Polyether sulfone Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920006393 polyether sulfone Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 150000003505 terpenes Chemical class 0.000 description 4
- 235000007586 terpenes Nutrition 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000005395 methacrylic acid group Chemical group 0.000 description 3
- 239000011859 microparticle Substances 0.000 description 3
- 125000002950 monocyclic group Chemical group 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 239000013557 residual solvent Substances 0.000 description 3
- 238000003980 solgel method Methods 0.000 description 3
- 229920003051 synthetic elastomer Polymers 0.000 description 3
- 239000005061 synthetic rubber Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000005365 phosphate glass Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- HXHCOXPZCUFAJI-UHFFFAOYSA-N prop-2-enoic acid;styrene Chemical compound OC(=O)C=C.C=CC1=CC=CC=C1 HXHCOXPZCUFAJI-UHFFFAOYSA-N 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 1
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 1
- WLTSXAIICPDFKI-FNORWQNLSA-N (E)-3-dodecene Chemical compound CCCCCCCC\C=C\CC WLTSXAIICPDFKI-FNORWQNLSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- JRLTTZUODKEYDH-UHFFFAOYSA-N 8-methylquinoline Chemical group C1=CN=C2C(C)=CC=CC2=C1 JRLTTZUODKEYDH-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- DBPRUZCKPFOVDV-UHFFFAOYSA-N Clorprenaline hydrochloride Chemical compound O.Cl.CC(C)NCC(O)C1=CC=CC=C1Cl DBPRUZCKPFOVDV-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 241000735527 Eupatorium Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- RUFZJUYWZZUTJE-UHFFFAOYSA-J [F-].[F-].[F-].[F-].F.F.[Na+].[Al+3] Chemical compound [F-].[F-].[F-].[F-].F.F.[Na+].[Al+3] RUFZJUYWZZUTJE-UHFFFAOYSA-J 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 101150059062 apln gene Proteins 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 229930006722 beta-pinene Natural products 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- VGWJKDPTLUDSJT-UHFFFAOYSA-N diethyl dimethyl silicate Chemical compound CCO[Si](OC)(OC)OCC VGWJKDPTLUDSJT-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000005303 fluorophosphate glass Substances 0.000 description 1
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000000869 ion-assisted deposition Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 125000004665 trialkylsilyl group Chemical group 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- QYBKVVRRGQSGDC-UHFFFAOYSA-N triethyl methyl silicate Chemical compound CCO[Si](OC)(OCC)OCC QYBKVVRRGQSGDC-UHFFFAOYSA-N 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical class Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 230000016776 visual perception Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/26—Reflecting filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B11/00—Filters or other obturators specially adapted for photographic purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Filters (AREA)
- Optical Elements Other Than Lenses (AREA)
- Light Receiving Elements (AREA)
Abstract
The present invention addresses the problem of providing an optical filter that can improve the detection accuracy of an ambient light sensor even when a system for authenticating a biometric characteristic is disposed in close proximity to the ambient light sensor. An optical filter of the present invention is an optical filter including a base material (i) and a light scattering layer formed on at least one surface of the base material (i), characterized in that: and an OD value measured in a direction perpendicular to the optical filter at a wavelength of 940nm is 3 or more.
Description
Technical Field
The present invention relates to an optical filter and an ambient light sensor using the same.
Background
In recent years, ambient light sensors have been developed as applications to information terminal devices such as smartphones and tablet terminals. An ambient light sensor in an information terminal device is used as an illuminance sensor for sensing illuminance of an environment in which the information terminal device is placed and adjusting brightness of a display, a color sensor for sensing color tone of the environment in which the information terminal device is placed and adjusting color tone of the display, or the like.
In order to adapt the human visual perception to the brightness or color tone of the display in a natural manner, it is important that only visible light reaches the ambient light sensor. For example, the ambient light sensor can have spectral sensitivity characteristics close to near-eye sensitivity by providing an optical filter such as a near-infrared cut filter.
On the other hand, in response to a request for placing importance on the design of an information terminal device, there is a demand for reducing the transmittance (blackened appearance) of a transmission window through which light is incident on an ambient light sensor, but there are problems as follows: the amount of incident visible light with respect to infrared light is reduced, and it is difficult to detect accurate illuminance or color tone, which causes malfunction. Further, the information terminal device is being made thinner (low profile), and the distance from the entrance window to the ambient light sensor is becoming shorter. Therefore, for example, the proportion of incident light having a high incident angle such as 60 ° from the incident angle increases, and it is required that the spectral characteristic (particularly, the intensity of near infrared rays) of light reaching the ambient light sensor does not change even with respect to the incident light having a high incident angle.
As a means for matching the spectral characteristics of an ambient light sensor to the human visual sensitivity, a device provided with a near infrared cut filter in which a metal multilayer film is formed on a glass plate is disclosed (for example, see patent document 1). However, the near-infrared cut filter formed by forming a metal multilayer thin film on a glass plate has a problem that the detection accuracy of the ambient light sensor is lowered because the optical characteristics thereof greatly change depending on the incident angle of incident light.
As a material capable of cutting a wide range of near infrared rays regardless of an incident angle, various near infrared absorbing particles are known (for example, see patent documents 2 and 3). In order to achieve sufficient near infrared ray cut-off performance for applications as an ambient light sensor using such near infrared ray absorbing particles, it is necessary to increase the amount of the near infrared ray absorbing particles added. However, in the near infrared ray cut filter, if the amount of the near infrared ray absorbing particles added is increased, there is a problem that the visible light transmittance is decreased.
On the other hand, a near infrared ray cut filter including a substrate made of a norbornene resin, a near infrared ray absorbing dye having a maximum absorption at a specific wavelength, and a near infrared ray reflective film has a characteristic that a change in transmittance in a visible region when light is incident from an oblique direction is small (for example, see patent document 4). When the near-infrared cut filter is used for an ambient light sensor, it is considered desirable to further improve the infrared cut performance at high incident angles such as an incident angle of 60 °.
In addition, for the purpose of controlling display luminance according to ambient illuminance that does not depend on the arrangement of the illumination source, an ambient light sensor using a light guide member in which a light incident surface is formed of a light diffusion surface and the position of the light incident surface is located above the position of a light exit surface with respect to the vertical direction has been proposed (see, for example, patent document 5).
On the other hand, it is known to use actinic rays that can emit electromagnetic radiation having a peak emission wavelength of about 700nm to 1200nm in order to authenticate a person or user using biometric features. Furthermore, it is also known that in order to reduce the amount of background light incident from the spectrum of the sun, it is particularly advantageous to use light having a wavelength around 940 nm. The wavelength of light of 940nm is filtered to some extent from the solar spectrum by moisture in the atmosphere, and background noise in the wavelength region is reduced when ambient light includes sunlight (see, for example, patent document 6).
Information terminal devices such as smartphones, tablet terminals, and personal computers, home appliances such as televisions, and machines such as automated teller machines are required to have both a function of authenticating individuals or users and a function of displaying images on a display, and ambient light sensors are used as an illuminance sensor, a color sensor, and the like as described above.
However, in a device equipped with both the biometric authentication system and the ambient light sensor as described above, 940nm light used in the biometric authentication system may adversely affect the detection accuracy of the ambient light sensor.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2011-060788
Patent document 2: international publication No. 2005/037932 specification
Patent document 3: japanese patent laid-open publication No. 2011-118255
Patent document 4: japanese patent laid-open publication No. 2011-100084
Patent document 5: japanese patent laid-open No. 2014-109701
Patent document 6: japanese patent laid-open publication No. 2016-510467
Disclosure of Invention
Problems to be solved by the invention
An object of the present invention is to provide an optical filter capable of improving the detection accuracy of an ambient light sensor in a device equipped with both a system for authenticating a biometric characteristic and the ambient light sensor, and an ambient light sensor using the optical filter.
Means for solving the problems
The present inventors have made diligent studies to solve the above problems. As a result, the present inventors have found that the above-mentioned problems can be solved by introducing visible light rays having a light quantity as high as possible into an ambient light sensor through a light scattering layer and cutting off near infrared rays (particularly light rays having a wavelength of 940 nm) without limitation, and have completed the present invention. That is, the present invention preferably has the following configuration, for example.
[1] An optical filter having: a substrate (i), and a light scattering layer formed on at least one surface of the substrate (i), the optical filter being characterized in that:
and an Optical Density (OD) value of 3 or more measured from a direction perpendicular to the optical filter at a wavelength of 940 nm.
[2] The optical filter according to the item [1], wherein an average OD value measured from a direction perpendicular to the optical filter in a region of a wavelength of 850nm to 1050nm is 2 or more.
[3] The optical filter according to the item [1] or the item [2], wherein a light source, a condenser lens, a pinhole, a collimator lens, and a beam stop are arranged at a position perpendicular to the optical filter, a position on a straight line connecting the light source and the optical filter perpendicularly and on the opposite side of the light source is set to 0 °, outgoing light from the light source is converted into parallel light having an effective diameter Φ 20mm through the condenser lens, the pinhole, the collimator lens, and the beam stop, and illuminance of light which is incident on the optical filter and is emitted to the opposite side of the light source is measured under the following conditions,
an angle at which the illuminance at the position of 0 ° is halved is 15 ° or more and 60 ° or less.
Light source: halogen light source (12V, 50W)
Thickness of the optical filter: 100-400 mu m
Illumination measurement position: a position 270mm to 290mm from the surface (position 0 DEG) of the optical filter opposite to the light source
[4] The optical filter according to any one of items [1] to [3], wherein a surface roughness Ra of the light scattering layer is 0.1 μm to 4.5 μm.
[5] The optical filter according to any one of the items [1] to [4], wherein the light scattering layer is closely bonded to the base material (i) via an adhesion layer.
[6] The optical filter according to any one of the items [1] to [5], wherein the substrate (i) comprises a light absorption layer containing a compound (S) having a maximum absorption wavelength in a region of a wavelength of 750nm to 1150 nm.
[7] The optical filter according to the item [6], wherein the compound (S) is at least one compound selected from the group consisting of a squarylium salt-based compound, a phthalocyanine-based compound, a naphthalocyanine-based compound, a ketanium-based compound, a cyanine-based compound, a diimmonium-based compound, a metal dithiolate-based compound, a copper phosphate complex-based compound, and a pyrrolopyrrole-based compound.
[8] The optical filter according to item [6] or item [7], wherein the light absorbing layer further comprises a compound (A) having a maximum absorption wavelength in a region of a wavelength of 650nm or more and less than 750 nm.
[9] The optical filter according to the item [8], wherein the compound (A) is at least one compound selected from the group consisting of a squarylium salt-based compound, a phthalocyanine-based compound, a naphthalocyanine-based compound, a ketanium-based compound and a cyanine-based compound.
[10] The optical filter according to any one of the items [1] to [9], for an ambient light sensor.
[11] An ambient light sensor provided with the optical filter according to any one of the items [1] to [10 ].
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide an optical filter capable of improving the detection accuracy of an ambient light sensor in a device in which both a system for authenticating a biometric characteristic and the ambient light sensor are mounted. In particular, by forming the light scattering layer having the most preferable diffusion ratio and high transmittance, high visible light transmittance and a high OD value of 940nm can be realized, external light can be uniformly introduced, and infrared ray cut-off performance which differs depending on the incident angle of light can be most preferable.
Drawings
Fig. 1 is a diagram illustrating a configuration of an ambient light sensor according to an embodiment of the present invention.
Fig. 2 is a diagram illustrating a configuration of an ambient light sensor according to an embodiment of the present invention.
Fig. 3 is a diagram illustrating a configuration of an ambient light sensor according to an embodiment of the present invention.
Fig. 4 is a schematic view showing a schematic view of measuring an angle at which the illuminance of light transmitted through the optical filter is halved.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like as necessary. The present invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. To explain more clearly, the width, thickness, shape, and the like of each part are schematically shown in the drawings in comparison with the actual form, and the drawings are merely examples and do not limit the explanation of the present invention. In the present specification and the drawings, the same or similar elements as those described above are denoted by the same reference numerals (only the reference numeral such as A, B is denoted by the reference numeral) in the illustrated drawings, and detailed description thereof may be omitted as appropriate.
In the present specification, the term "up" refers to a relative position with reference to a main surface of the support substrate (a light receiving surface of the sensor), and the direction away from the main surface of the support substrate is "up". In the drawings of the present application, the upper side is "upper" when facing the paper surface. In addition, "on" includes a case of being attached to an object (i.e., a case of "on.. upper (on)") and a case of being located above the object (i.e., a case of "over.. upper (over)"). Conversely, the term "lower" means a relative position with respect to the main surface of the support substrate, and the direction toward the main surface of the support substrate is "lower". In the drawings of the present application, the lower side is "lower" when facing the paper.
The optical filter of the present invention has the following configuration, and its application is not particularly limited, but it is preferably used as an ambient light sensor. The ambient light sensor of the present invention is not particularly limited as long as it includes an optical filter described later, but a specific configuration includes a photoelectric conversion element that generates a photocurrent by light incident on a light receiving surface and measures illuminance or color temperature, and an optical filter disposed on the light receiving surface side of the photoelectric conversion element.
[ optical Filter ]
The optical filter of the present invention is characterized by having: the OD value of the base material (i) and the light scattering layer formed on at least one surface of the base material (i) when measured from the direction perpendicular to the optical filter at a wavelength of 940nm is 3 or more, preferably 4 or more, and more preferably 5 or more and 8 or less. By setting the OD value to the range, it is possible to prevent malfunction of the optical sensor due to laser light used in a system for authenticating a biometric characteristic.
In the optical filter of the present invention, the average OD value measured from the direction perpendicular to the optical filter in the region of a wavelength of 850nm to 1050nm is preferably 2 or more, more preferably 3 or more, and still more preferably 4 or more and 8 or less. If the average OD value is in the range, the near infrared ray can be sufficiently cut off.
The OD value is a common logarithmic value of transmittance, and the average OD value can be calculated by the following formula (1). If the average OD value in the predetermined wavelength range is high, it indicates that the cutoff characteristic of the optical filter for light in the wavelength range is high.
Average OD value-Log in a certain wavelength region10(average transmittance (%) in a certain wavelength region/100.) equation (1)
As shown in fig. 4, in the optical filter of the present invention, a light source 1, a condenser lens 2, a pinhole 3, a collimator lens 4 and a beam stop 5 are arranged at a position perpendicular to an optical filter 7, a position on a straight line connecting the light source 1 and the optical filter 7 perpendicularly and on the opposite side of the light source 1 is set to 0 °, outgoing light from the light source 1 is converted into parallel light having an effective diameter of Φ 20mm via the condenser lens 2, the pinhole 3, the collimator lens 4 and the beam stop 5, when the illuminance of light entering the optical filter 7 and emitted to the opposite side of the light source 1 from the collimated light is measured under the following conditions, the angle (half-value angle) at which the illuminance at the position of 0 ° is halved is preferably 15 ° or more and 60 ° or less, more preferably 15 ° or more and 45 ° or less, and further preferably 20 ° or more and 30 ° or less.
(measurement conditions)
Light source: halogen light source (12V, 50W)
Thickness of the optical filter: 100-400 mu m
Illuminance measurement position: a position 270mm to 290mm from the surface (position 0 DEG) of the optical filter opposite to the light source
When the half-value angle is in the above range, the near-infrared ray cut-off performance can be improved by reducing the light component at a large incident angle generated by the light passing through the light scattering layer, and uniform light introduction can be realized. The half-value angle can be measured using, for example, an automatic goniophotometer GP-200 manufactured by murata color technology research institute.
In the optical filter of the present invention, the haze (Japanese Industrial standard (JIS) K7136) when light enters from the upper side (light scattering layer side) is preferably 90% or more, and more preferably 95% or more. When the haze is in the above range, the component of light having a large incident angle due to the passage of light through the light scattering layer can be reduced, high near infrared ray cut-off performance can be exhibited, and uniform introduction of light can be realized.
When such an optical filter is used for an ambient light sensor of a mobile phone or a tablet, it is easy to correct the luminance or color of a screen, and therefore, it is possible to eliminate such problems that the luminance of a display is insufficient in a bright environment and is difficult to recognize, or a specific color cannot be normally displayed on the screen.
The optical filter of the present invention has a transmittance measured in a region having a wavelength of 430nm to 580nm in a direction perpendicular to the optical filterAverage value of (2) (hereinafter also referred to as "TA") is preferably 30% or more and 80% or less, more preferably 30% or more and 75% or less, and still more preferably 33% or more and 70% or less.
Average value of transmittance (T) in the wavelength region of 430nm to 580nmA) Too high, there are the following situations: the intensity of light incident on the light receiving portion of the photosensor becomes too strong, and the photosensor is saturated (saturation) and thus cannot function normally. In addition, as the average value (T) of the transmittanceA) Too low, the following is the case: the intensity of light incident on the light-receiving portion of the photosensor becomes weak, and the intensity of light passing through the filter is not sufficiently ensured and cannot be preferably used for the above-described purpose.
The thickness of the optical filter of the present invention is not particularly limited, but is preferably 10 μm to 1000 μm, more preferably 20 μm to 800 μm, further preferably 30 μm to 600 μm, and particularly preferably 40 μm to 500 μm. When the thickness of the optical filter is within the above range, the optical filter can be reduced in size and weight, and can be preferably used for various applications such as an ambient light sensor. In particular, when the light receiving portion is used for the upper surface of the light receiving portion of the ambient light sensor, the light sensor module can be preferably thinned.
< substrate (i) >
The substrate (i) may be a single layer or a plurality of layers, and preferably includes a light absorption layer having a maximum absorption in a wavelength region of 750nm to 1150 nm. The light-absorbing layer preferably contains a compound (S) having a maximum absorption in a wavelength region of 750nm to 1150 nm. When the substrate (i) is a single layer, examples thereof include: a base material comprising a resin substrate (ii) containing a compound (S), and a base material comprising a near-infrared-absorbing glass substrate (iii) containing a copper component, wherein the resin substrate (ii) or the glass substrate (iii) serves as the light-absorbing layer. When the substrate (i) is a multilayer, for example, there may be mentioned: a substrate in which a resin layer such as an overcoat layer containing a curable resin or the like containing the compound (S) is laminated on a support such as a glass support or a resin support serving as a base, a substrate in which a resin layer such as an overcoat layer containing a curable resin or the like is laminated on a resin substrate (ii) containing the compound (S), and the like. In particular, a substrate in which a resin layer such as an overcoat layer containing a curable resin is laminated on the resin substrate (ii) containing the compound (S) is preferable in terms of manufacturing cost, easiness of adjustment of optical characteristics, and further, effects of removing scratches of the resin support or the resin substrate (ii), improvement of scratch resistance of the substrate (i), and the like.
< light absorbing layer >
The light-absorbing layer is not particularly limited as long as it has a maximum absorption in a wavelength region of 750nm to 1150nm, but in a wavelength region of 850nm to 1050nm, the average OD value measured from the perpendicular direction of the substrate (i) is preferably 0.5 or more, more preferably 1 or more, and still more preferably 2 or more and 5 or less.
In addition, when an optical filter using such a light absorbing layer is used for the ambient light sensor or the illuminance sensor, since multiple reflected light in the light sensor module can be absorbed, malfunction of the ambient light sensor or the illuminance sensor can be suppressed, and a high-performance ambient light sensor or illuminance sensor can be obtained.
The thickness of the light-absorbing layer is not particularly limited, but is preferably 10 to 500 μm, more preferably 20 to 300 μm, and still more preferably 30 to 200 μm. When the thickness of the light-absorbing layer is within the above range, an optical filter using the light-absorbing layer can be reduced in size and weight, and can be preferably used for various applications such as an ambient light sensor.
< Compound (S) >
As the compound (S), a metal complex compound, a dye or a pigment which functions as a near-infrared-absorbing dye can be used, and particularly, the compound (S) described in the specification of international publication No. 2017/094672 can be preferably used.
The amount of the compound (S) to be used is appropriately selected depending on the desired characteristics, and is preferably 0.1 to 50.0 parts by mass, more preferably 0.2 to 10.0 parts by mass, and still more preferably 0.3 to 1.0 part by mass, based on 100 parts by mass of the resin used in the light absorbing layer.
If the amount of the compound (S) used is larger than the above range, an optical filter which more strongly expresses the characteristics of the compound (S) may be obtained, but if the transmittance in the range of 430nm to 580nm is lower than a value preferable for the optical sensor or the intensity of the light absorbing layer or the optical filter is reduced, if the amount of the compound (S) used is smaller than the above range, an optical filter having too high transmittance may be obtained, and it may be difficult to limit the amount of light incident on the optical sensor.
< Compound (A) >
The light absorbing layer may further include a compound (a) having maximum absorption in a region having a wavelength of 650nm or more and less than 750 nm. The light-absorbing layer containing the compound (S) and the light-absorbing layer containing the compound (a) may be the same layer or different layers. The compound (a) contained in the light-absorbing layer may be one kind alone, or two or more kinds thereof.
The compound (a) is not particularly limited as long as it has a maximum absorption in a wavelength region of 650nm or more and less than 750nm, and the compound (a) described in international publication No. 2017/094672 can be preferably used.
The amount of the compound (a) to be added is appropriately selected depending on the desired characteristics, and is preferably 0.01 to 20.0 parts by mass, more preferably 0.02 to 15.0 parts by mass, and still more preferably 0.03 to 10.0 parts by mass, based on 100 parts by mass of the resin used in the light absorbing layer.
< resin >
The resin used for the light absorbing layer is not particularly limited as long as it does not impair the effects of the present invention, and for example, in order to ensure thermal stability and film formability and to produce a film in which a dielectric multilayer film can be formed by high-temperature vapor deposition at a vapor deposition temperature of 100 ℃ or higher, a resin having a glass transition temperature (Tg) of preferably 110 to 380 ℃, more preferably 110 to 370 ℃, and still more preferably 120 to 360 ℃ may be used. Further, the glass transition temperature of the resin is preferably 140 ℃ or higher, because a film in which a dielectric multilayer film can be formed by vapor deposition at a higher temperature can be obtained.
When a resin sheet having a thickness of 0.1mm containing the resin is formed, a resin having a total light transmittance (JIS K7105) of 75% to 95%, preferably 78% to 95%, and particularly preferably 80% to 95% of the resin sheet can be used. When a resin having a total light transmittance in such a range is used, the obtained substrate exhibits good transparency as an optical film.
The resin has a weight average molecular weight (Mw) of usually 15,000 to 350,000, preferably 30,000 to 250,000, and a number average molecular weight (Mn) of usually 10,000 to 150,000, preferably 20,000 to 100,000, in terms of polystyrene, as measured by Gel Permeation Chromatography (GPC).
Examples of the resin include: a cyclic polyolefin-based resin, an aromatic polyether-based resin, a polyimide-based resin, a fluorene polycarbonate-based resin, a fluorene polyester-based resin, a polycarbonate-based resin, a polyamide (aramid) -based resin, a polyarylate-based resin, a polysulfone-based resin, a polyethersulfone-based resin, a polyphenylene-based resin, a polyamideimide-based resin, a Polyethylene naphthalate (PEN) -based resin, a fluorinated aromatic polymer-based resin, (modified) acrylic-based resin, an epoxy-based resin, an allyl-based resin, a silsesquioxane-based ultraviolet-curable resin, an acrylic-based ultraviolet-curable resin, a vinyl-based ultraviolet-curable resin, and a resin containing silica as a main component formed by a sol-gel method. Among these, the use of a cyclic polyolefin resin, an aromatic polyether resin, a fluorene polycarbonate resin, a fluorene polyester resin, a polycarbonate resin, and a polyarylate resin is preferable in that an optical filter having an excellent balance of transparency (optical characteristics), heat resistance, and the like can be obtained.
Cyclic polyolefin resin
The cyclic polyolefin resin is preferably a cyclic polyolefin resin selected from the group consisting of the following formulae (x)0) A monomer represented by the formula (Y)0) Is shown inA resin obtained from at least one monomer of the group consisting of monomers, and a resin obtained by hydrogenating the resin.
[ solution 1]
Formula (x)0) In, Rx1～Rx4Each independently represents an atom or a group selected from the following (i ') to (ix'), kx、mxAnd pxEach independently represents an integer of 0 to 4.
(i') a hydrogen atom
(ii') a halogen atom
(iii') Trialkylsilyl group
(iv') a substituted or unsubstituted hydrocarbon group having 1 to 30 carbon atoms and having a linking group containing an oxygen atom, a sulfur atom, a nitrogen atom or a silicon atom
(v') a substituted or unsubstituted hydrocarbon group having 1 to 30 carbon atoms
(vi ') a polar group (wherein, (ii ') and (iv ') are excluded)
(vii′)Rx1And Rx2Or Rx3And Rx4Alkylene groups formed by bonding to each other (wherein R not participating in the bonding isx1～Rx4Each independently represents an atom or a group selected from the above (i ') to (vi')
(viii′)Rx1And Rx2Or Rx3And Rx4A monocyclic or polycyclic hydrocarbon ring or heterocycle formed by bonding to each other (wherein R not participating in the bonding isx1～Rx4Each independently represents an atom or a group selected from the above (i ') to (vi')
(ix′)Rx2And Rx3A monocyclic hydrocarbon ring or heterocyclic ring which is bonded to each other to form a monocyclic ring (wherein R which does not participate in the bonding is present)x1And Rx4Each independently represents an atom or a group selected from the above (i ') to (vi')
[ solution 2]
Formula (Y)0) In, Ry1And Ry2Each independently represents an atom or a group selected from the above-mentioned groups (i ') to (vi'), or Ry1And Ry2Monocyclic or polycyclic, alicyclic, aromatic, or heterocyclic rings formed by bonding to each other, kyAnd pyEach independently represents an integer of 0 to 4.
Aromatic polyether resin
The aromatic polyether resin preferably has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2).
[ solution 3]
In the formula (1), R1～R4Each independently represents a monovalent organic group having 1 to 12 carbon atoms, and a to d each independently represents an integer of 0 to 4.
[ solution 4]
In the formula (2), R1～R4And a to d are each independently of R in the formula (1)1～R4And a to d are the same, Y represents a single bond, -SO2-or-CO-, R7And R8Each independently represents a halogen atom, a monovalent organic group having 1 to 12 carbon atoms or a nitro group, g and h each independently represent an integer of 0 to 4, and m represents 0 or 1. Wherein, when m is 0, R7Is not cyano.
The aromatic polyether resin preferably further has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (3) and a structural unit represented by the following formula (4).
[ solution 5]
In the formula (3), R5And R6Each independently represents a C1-12 monovalent organic group, and Z represents a single bond, -O-, -S-, -SO2-, -CO-, -CONH-, -COO-or a divalent organic group having 1 to 12 carbon atoms, e and f each independently represent an integer of 0 to 4, and n represents 0 or 1.
[ solution 6]
In the formula (4), R7、R8Y, m, g and h are each independently of R in the formula (2)7、R8Y, m, g and h are the same, R5、R6Z, n, e and f are each independently R in the formula (3)5、R6Z, n, e and f are the same.
Polyimide-based resin
The polyimide-based resin is not particularly limited as long as it is a polymer compound having an imide bond in a repeating unit, and can be synthesized, for example, by the method described in Japanese patent laid-open Nos. 2006-199945 and 2008-163107.
Fluorene polycarbonate-based resin
The fluorene polycarbonate-based resin is not particularly limited as long as it is a polycarbonate resin containing a fluorene moiety, and can be synthesized, for example, by the method described in japanese patent application laid-open No. 2008-163194.
Fluorene polyester resin
The fluorene polyester resin is not particularly limited as long as it is a polyester resin containing a fluorene moiety, and can be synthesized, for example, by the methods described in japanese patent application laid-open No. 2010-285505 or japanese patent laid-open No. 2011-197450.
Fluorinated aromatic polymer-based resin
The fluorinated aromatic polymer resin is not particularly limited, but is preferably a polymer containing an aromatic ring having at least one fluorine atom and a repeating unit containing at least one bond selected from the group consisting of an ether bond, a ketone bond, a sulfone bond, an amide bond, an imide bond and an ester bond, and can be synthesized, for example, by the method described in japanese patent laid-open No. 2008-181121.
Acrylic ultraviolet-curing resin
The acrylic ultraviolet-curable resin is not particularly limited, and examples thereof include: an acrylic ultraviolet-curable resin synthesized from a resin composition containing a compound having one or more acrylic groups or methacrylic groups in the molecule and a compound which is decomposed by ultraviolet rays and generates active radicals. When a substrate in which a resin layer (light absorbing layer) containing a compound (S) and a curable resin is laminated on a glass support or a resin support as a base or a substrate in which a resin layer such as an overcoat layer containing a curable resin is laminated on a resin substrate (ii) containing a compound (S) is used as the substrate (i), an acrylic ultraviolet curable resin is particularly preferably used as the curable resin.
Resin containing silica as a main component formed by sol-gel method
As the resin containing silica as a main component obtained by the sol-gel method, a compound obtained by the following sol-gel reaction can be used as the resin: the sol-gel reaction is performed by using tetraalkoxysilane selected from tetramethoxysilane, tetraethoxysilane, dimethoxydiethoxysilane, methoxytriethoxysilane, etc.; hydrolysis of one or more silanes such as phenylalkoxysilanes including phenyltrimethoxysilane, phenyltriethoxysilane, diphenyldimethoxysilane, and diphenyldiethoxysilane.
(commercially available products)
Examples of the commercially available products of the resin include the following commercially available products. Examples of commercially available products of the cyclic polyolefin resin include: atton (Arton) manufactured by Japan Synthetic Rubber (JSR) (stock), renoor (Zeonor) manufactured by nippon (Zeon) (stock), Apler (APEL) manufactured by mitsui chemical (stock), TOPAS (TOPAS) manufactured by polyplasics (stock), and the like. Commercially available products of polyethersulfone resin include smikaikecel (Sumikaexcel) PES manufactured by sumitomo chemical (stock). Examples of commercially available polyimide resins include Nippopim (Neopulim) L manufactured by Mitsubishi gas chemical (Strand). As a commercially available product of the polycarbonate-based resin, there can be mentioned Pures (PURE-ACE) manufactured by Dichen (R). As a commercial product of the fluorene polycarbonate-based resin, there can be mentioned Eupatorium (Ifpita) EP-5000 manufactured by Mitsubishi gas chemical (Strand). Examples of commercially available fluorene polyester resins include OKP4HT manufactured by Osaka Gas Chemicals (Osaka Gas Chemicals). Examples of commercially available acrylic resins include akulivera (Acryviewa) manufactured by japan catalyst (japan). Commercially available silsesquioxane-based ultraviolet curable resins include light curable SQ series products manufactured by east asia synthesis (stock).
< other ingredients >
The light absorbing layer may further contain additives such as an antioxidant, a near-ultraviolet absorber, and a fluorescent matting agent, as long as the effects of the present invention are not impaired. These other components may be used alone or in combination of two or more.
Examples of the near-ultraviolet absorber include: azomethine compounds, indole compounds, benzotriazole compounds, triazine compounds, and the like.
Examples of the antioxidant include: 2, 6-di-tert-butyl-4-methylphenol, 2 ' -dioxy-3, 3 ' -di-tert-butyl-5, 5 ' -dimethyldiphenylmethane, tetrakis [ methylene-3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ] methane, tris (2, 4-di-tert-butylphenyl) phosphite, and the like.
These additives may be mixed with the resin or the like at the time of producing the resin, or may be added at the time of synthesizing the resin. The amount of addition is appropriately selected depending on the desired properties, but is usually 0.01 to 5.0 parts by mass, preferably 0.05 to 2.0 parts by mass, based on 100 parts by mass of the resin.
< support >
Support made of resin
The resin used for the resin substrate or the resin support may be the same resin as the resin layer.
Glass support
The glass support is not particularly limited, and examples thereof include: borosilicate glass, silicate glass, soda-lime glass, near-infrared absorbing glass, and the like. The near infrared ray absorbing glass is preferable in that the near infrared cut-off characteristics can be improved and the incident angle dependency can be reduced, and specific examples thereof include a fluorophosphate glass containing a copper component, a phosphate glass, and the like.
< method for producing base Material (i) >
When the base material (i) is a base material including the resin substrate (ii), the resin substrate (ii) may be formed by, for example, melt molding or cast molding, and further, if necessary, a coating agent such as an antireflective agent, a hard coating agent, and/or an antistatic agent may be applied after the molding, thereby producing a base material on which an overcoat layer is laminated.
When the substrate (i) is a substrate in which a resin layer (light-absorbing layer) such as an overcoat layer containing a curable resin or the like containing the compound (S) is laminated on a glass support or a resin support serving as a base, for example, a resin solution containing the compound (S) is melt-molded or cast-molded on the glass support or the resin support serving as a base, and the substrate having the resin layer formed on the glass support or the resin support serving as a base can be produced by preferably applying the resin solution by a method such as spin coating, slit coating, or ink jet, then drying and removing the solvent, and optionally, further irradiating light or heating.
Melt forming
Specific examples of the melt molding include: a method of melt-molding pellets obtained by melt-kneading a resin and a compound (S) or the like; a method of melt-molding a resin composition containing a resin and a compound (S); or a method of melt-molding pellets obtained by removing the solvent from a resin composition containing the compound (S), the resin and the solvent. Examples of the melt molding method include: injection molding, melt extrusion molding, blow molding, or the like.
Casting and Forming
The cast molding may be produced by the following method or the like: a method of casting a resin composition containing the compound (S), a resin and a solvent on a suitable support and removing the solvent; or a method in which a curable composition containing the compound (S) and a photocurable resin and/or a thermosetting resin is cast on a suitable support, the solvent is removed, and then the composition is cured by a suitable method such as ultraviolet irradiation or heating.
In the case where the substrate (i) is a substrate including a resin substrate (ii) containing a compound (S), the substrate (i) can be obtained by peeling off the coating film from a support after cast molding, and in the case where the substrate (i) is a substrate in which a resin layer such as an overcoat layer containing a curable resin or the like containing a compound (S) is laminated on a support such as a glass support or a resin support as a base, the substrate (i) can be obtained by not peeling off the coating film after cast molding.
Examples of the support include: examples of the Glass plate include a near-infrared absorbing Glass plate (e.g., a phosphate Glass plate containing a copper component such as "BS-11" manufactured by Songa Glass industries or "NF-50T" manufactured by AGC technology Glass), a transparent Glass plate (e.g., "OA-10G" manufactured by Japan electric Glass Co., Ltd., AN alkali-free Glass plate such as "AN 100" manufactured by Asahi Glass Co., Ltd.), a steel belt, a steel drum, and a support made of a resin (e.g., a polyester film or a cyclic olefin resin film).
Further, the resin layer may be formed on the optical component by the following method or the like: a method of applying the resin composition to an optical component made of glass plate, quartz, transparent plastic, or the like and drying the solvent, or a method of applying the curable composition, curing the composition, and drying the composition.
The amount of the residual solvent in the resin layer (resin substrate (ii)) obtained by the method is preferably as small as possible. Specifically, the amount of the residual solvent is preferably 3% by mass or less, more preferably 1% by mass or less, and still more preferably 0.5% by mass or less, based on the weight of the resin layer (resin substrate (ii)). When the amount of the residual solvent is within the above range, a resin layer (resin substrate (ii)) which is less likely to be deformed or to change in properties and which can easily exhibit desired functions can be obtained.
< light scattering layer >
The light scattering layer is formed on at least one surface of the substrate (i), and is a layer that increases the amount of visible light and transmits the visible light by scattering or diffusing incident light. Examples of such a light scattering layer include: a resin layer containing a light scattering agent such as fine particles that scatter light, a resin layer having a surface with a concavo-convex shape, a resin layer containing a light scattering agent and having a surface with a concavo-convex shape, and the like.
Examples of the resin constituting the light scattering layer include: (meth) acrylic resins, polystyrene resins, polyolefin resins, polycarbonate resins, polyvinyl chloride resins, polyester resins, and (meth) acrylate-styrene resins. Among these, (meth) acrylic resins are preferable. The resin may be used alone or in combination of two or more.
Examples of the light scattering agent include: organic microparticles such as acrylic crosslinked beads, methyl (meth) acrylate-styrene copolymer crosslinked beads, styrene crosslinked beads, and silicone beads, or inorganic microparticles such as silica, titanium oxide, barium sulfate, and zirconium oxide, and preferably inorganic microparticles. The light scattering agent may be used alone or in combination of two or more.
The surface roughness Ra of the light scattering layer is preferably 0.1 to 4.5. mu.m, more preferably 0.5 to 3.0. mu.m, and still more preferably 1.0 to 2.0. mu.m. When the surface roughness Ra is within the above range, the incident light can be most preferably diffused and introduced with a high light amount, and the near infrared ray cut-off performance which differs depending on the incident angle of the light can be most preferably optimized.
The thickness of the light scattering layer is preferably 1 to 100. mu.m, more preferably 1 to 50 μm, and still more preferably 1 to 30 μm.
The total light transmittance (JIS K7361-1) of the light scattering layer is preferably 90% or more, more preferably 93% or more, and still more preferably 95% or more. The total light transmittance through the light scattering layer is in the above range, and the OD value at 940nm and the average value (T) of the transmittances at wavelengths of 430nm to 580nm of the optical filter of the present inventionA) The design of (2) becomes easy.
The haze (JIS K7136) of the light-scattering layer is preferably 86% or more, and more preferably 91% or more. When the haze of the light scattering layer is in the above range, the component of light having a large incident angle generated by the light passing through the light scattering layer can be reduced, and a high near infrared ray cut-off performance can be exhibited, and uniform introduction of light can be realized.
The light scattering layer may be formed alone, for example, on a transparent substrate comprising a (meth) acrylic resin, a polystyrene resin, a polyolefin resin, a polycarbonate resin, a polyvinyl chloride resin, a polyester resin, a (meth) acrylate-styrene resin, glass, or the like.
The light scattering layer can be formed by the method described in japanese patent laid-open No. 2009-223135, for example. Further, as the light scattering layer, for example, commercially available light scattering films such as "leitup (Lightup) NSH", "leitup (Lightup) SDW", "leitup (Lightup) SXE", "leitup (Lightup) MXE" manufactured by woody (KIMOTO) corporation, and "D120P", "D121 UPZ", "D121 UP" and "D171" manufactured by smart battery (Tsujiden) corporation can be used.
< adhesion layer >
The light scattering layer is preferably adhered to the substrate (i) through a transparent adhesive layer having a refractive index of preferably 1.2 or more and 1.8 or less, more preferably 1.3 or more and 1.7 or less, and even more preferably 1.4 or more and 1.6 or less. By thus closely adhering the light scattering layer to the base material (i) via the transparent adhesion layer having the refractive index in the above range, the loss of the amount of light due to the interface reflection can be reduced, and therefore, an optical filter which transmits visible light rays having a high amount of light can be obtained. The adhesion in the present invention means a state in which the light scattering layer and the base material are integrated by a material without an air layer.
The type of the adhesion layer is not particularly limited, and examples thereof include: rubber-based adhesives, (meth) acrylic adhesives, silicone-based adhesives, urethane-based adhesives, and the like. Among them, a (meth) acrylic pressure-sensitive adhesive is preferable from the viewpoint of excellent transparency. The (meth) acrylic pressure-sensitive adhesive refers to an acrylic pressure-sensitive adhesive and/or a methacrylic pressure-sensitive adhesive (methacrylic pressure-sensitive adhesive).
The (meth) acrylic adhesive contains the (meth) acrylic polymer as a base polymer, but may contain other components such as an adhesion-imparting agent and a rubber component.
As the adhesion imparting agent, any adhesion imparting agent known in the art of using a patch or a patch preparation may be suitably selected and used. Examples thereof include: petroleum resins (e.g., aromatic petroleum resins, aliphatic petroleum resins, C9 fraction resins, etc.), terpene resins (e.g., α pinene resins, β pinene resins, terpene phenol copolymers, hydrogenated terpene phenol resins, aromatic modified hydrogenated terpene resins, rosinate ester resins), rosin resins (e.g., partially hydrogenated gum rosin resins, erythritol modified wood rosin resins, pine oil rosin resins, wood rosin resins), coumarone-indene resins (e.g., coumarone-indene-styrene copolymers), styrene resins (e.g., polystyrene, copolymers of styrene and α -methylstyrene, etc.), and the like.
< dielectric multilayer film >
The optical filter of the present invention is preferably a laminate comprising the substrate (i) and a dielectric multilayer film provided on at least one surface of the substrate (i) (hereinafter, the laminate before the light scattering layer is formed is also referred to as "laminate for optical filter"). The dielectric multilayer film in the present invention is a film having a near infrared ray reflecting ability or a film having an antireflection effect in the visible region, and by having the dielectric multilayer film, more excellent visible light transmittance and near infrared ray cut-off characteristics can be realized.
The OD value measured from the direction perpendicular to the optical filter laminate at a wavelength of 940nm is preferably 3 or more, more preferably 4 or more, and still more preferably 5 or more and 8 or less. By setting the OD value to the range, it is possible to prevent malfunction of the optical sensor due to laser light used in a system for authenticating a biometric characteristic.
In addition, in the region of a wavelength of 850nm to 1050nm, the average OD value measured from the perpendicular direction of the optical filter laminate is preferably 2 or more, more preferably 3 or more, and still more preferably 4 or more and 8 or less. If the average OD value is in the range, the near infrared ray can be sufficiently cut off.
In the present invention, the dielectric multilayer film may be provided on one side or both sides of the substrate. When the optical filter is provided on one surface, the optical filter is excellent in manufacturing cost and manufacturing easiness, and when the optical filter is provided on both surfaces, the optical filter has high strength and is less likely to warp or twist. When the optical filter is applied to a solid-state imaging device, the optical filter is preferably small in warpage or distortion, and therefore, the dielectric multilayer film is preferably provided on both surfaces of the resin substrate.
In the case where the dielectric multilayer film and the light scattering layer are formed on the same surface side of the substrate (i), the light scattering layer is preferably formed on the dielectric multilayer film.
The dielectric multilayer film preferably has a reflection characteristic over the entire range of a wavelength of preferably 700nm to 1100nm, more preferably 700nm to 1150nm, and even more preferably 700nm to 1200 nm.
As the dielectric multilayer film, a dielectric multilayer film in which high refractive index material layers and low refractive index material layers are alternately stacked may be mentioned. As the material constituting the high refractive index material layer, a material having a refractive index of 1.7 or more can be used, and a material having a refractive index of usually 1.7 to 2.5 is selected. Examples of such a material include a material containing titanium oxide, zirconium oxide, tantalum pentoxide, niobium pentoxide, lanthanum oxide, yttrium oxide, zinc sulfide, indium oxide, or the like as a main component, and a small amount (for example, 0 to 10 mass% based on the main component) of titanium oxide, tin oxide, cerium oxide, or the like.
As the material constituting the low refractive index material layer, a material having a refractive index of 1.6 or less can be used, and a material having a refractive index of usually 1.2 to 1.6 is selected. Examples of such materials include: silicon dioxide, aluminum oxide, lanthanum fluoride, magnesium fluoride and sodium aluminum hexafluoride.
The method of laminating the high refractive index material layer and the low refractive index material layer is not particularly limited as long as a dielectric multilayer film in which these material layers are laminated is formed. For example, a dielectric multilayer film in which high refractive index material layers and low refractive index material layers are alternately stacked can be directly formed on the substrate (i) by a Chemical Vapor Deposition (CVD) method, a sputtering method, a vacuum Deposition method, an ion-assisted Deposition method, an ion plating method, or the like.
When the wavelength of the near infrared ray to be blocked is λ (nm), the thickness of each of the high refractive index material layer and the low refractive index material layer is preferably 0.1 λ to 0.5 λ. The value of λ (nm) is, for example, 700nm to 1400nm, preferably 750nm to 1300 nm. When the thickness is in the above range, the product (n × d) of the refractive index (n) and the film thickness (d) becomes substantially the same value as the optical film thickness calculated by λ/4 and the thickness of each of the high refractive index material layer and the low refractive index material layer, and there is a tendency that the blocking/transmission of a specific wavelength can be easily controlled in accordance with the relationship between the optical characteristics of reflection and refraction.
The total number of layers of the high refractive index material layer and the low refractive index material layer in the dielectric multilayer film is preferably 16 to 70 layers, and more preferably 20 to 60 layers in the entire optical filter. If the thickness of each layer, the thickness of the dielectric multilayer film as the whole optical filter, or the total number of stacked layers falls within the above range, sufficient manufacturing margin can be secured, and warpage of the optical filter or cracks in the dielectric multilayer film can be reduced.
In the present invention, by appropriately selecting the types of materials constituting the high refractive index material layer and the low refractive index material layer, the thicknesses of the respective layers of the high refractive index material layer and the low refractive index material layer, the order of lamination, and the number of lamination in combination with the absorption characteristics of the compound (S) or the compound (a), it is possible to ensure a sufficient transmittance in the visible region, have a sufficient light cut-off characteristic in the near infrared wavelength region, and reduce the reflectance when near infrared rays enter from an oblique direction.
In order to optimize the conditions, for example, parameters may be set so as to achieve both the antireflection effect in the visible region and the light-blocking effect in the near-infrared region using optical Film design software (e.g., manufactured by core metal machine, Thin Film Center, inc.). In the case of the software, for example, there may be mentioned: in designing the first optical layer, a parameter setting method is used, for example, in which the Target transmittance at a wavelength of 400 to 700nm is set to 100%, the Target Tolerance (Target Tolerance) value is set to 1, the Target transmittance at a wavelength of 705 to 950nm is set to 0%, and the Target Tolerance value is set to 0.5. These parameters may also be used to change the value of the target tolerance by dividing the wavelength range more finely in conjunction with various characteristics of the substrate (i) and the like.
The average value of the transmittances measured in the perpendicular direction of the optical filter laminate in the region having a wavelength of 430nm to 580nm (hereinafter also referred to as "TA' ") is preferably 40% or more and 80% or less, more preferably 40% or more and 70% or less, and still more preferably 40% or more and 60% or less. Average value of transmittance (T)A') too high, the following exists: the intensity of light incident on the light receiving portion of the optical sensor having the optical filter of the present invention becomes too strong, and the optical sensor is saturated and thus cannot function normally. In addition, as the average value (T) of the transmittanceA') too low, the following exists: light incident on the photosensor having the optical filter of the present inventionThe intensity of light at the receiving portion becomes weak, and the intensity of light passing through the filter is not sufficiently secured, and thus the light cannot be preferably used for the above-mentioned purpose.
The laminate for an optical filter preferably has a haze (JIS K7136) of 0.2% or more and 1% or less, more preferably 0.5% or more and 1% or less. When the haze is in the above range, the optical filter laminate can be produced without reducing the yield in the production of the optical filter laminate.
< other functional films >
For the purpose of enhancing the surface hardness, enhancing the chemical resistance, antistatic property, removing damage, and the like of the base material (i) or the dielectric multilayer film, the optical filter of the present invention may be provided with a functional film such as an antireflection film, a hard coat film, or an antistatic film between the base material (i) and the dielectric multilayer film, on the surface of the base material (i) opposite to the surface provided with the dielectric multilayer film, or on the surface of the dielectric multilayer film opposite to the surface provided with the base material (i), as appropriate, within a range not to impair the effects of the present invention.
The optical filter of the present invention may contain one layer including the functional film, or may contain two or more layers. When the optical filter of the present invention includes two or more layers including the functional film, the optical filter may include two or more layers of the same kind or two or more layers of different kinds.
The method of laminating the functional film is not particularly limited, and examples thereof include: a method of melt molding or cast molding a coating agent such as an antireflective agent, a hard coat agent, and/or an antistatic agent on the substrate (i) or the dielectric multilayer film, as described above.
The dielectric multilayer film can also be produced by applying a curable composition containing the above-mentioned coating agent or the like onto the substrate (i) or the dielectric multilayer film using a bar coater or the like, and then curing the composition by ultraviolet irradiation or the like.
Examples of the coating agent include Ultraviolet (UV)/Electron Beam (EB) curable resins and thermosetting resins, and specifically include: vinyl compounds, urethane resins, urethane acrylate resins, epoxy resins, and epoxy acrylate resins. The curable composition containing these coating agents includes: and curable compositions of vinyl, urethane acrylate, epoxy, and epoxy acrylate.
In addition, the curable composition may also contain a polymerization initiator. As the polymerization initiator, a known photopolymerization initiator or thermal polymerization initiator may be used, or a photopolymerization initiator and a thermal polymerization initiator may be used in combination. One kind of the polymerization initiator may be used alone, or two or more kinds may be used in combination.
In the curable composition, the proportion of the polymerization initiator to be blended is preferably 0.1 to 10% by mass, more preferably 0.5 to 10% by mass, and still more preferably 1 to 5% by mass, based on 100% by mass of the total amount of the curable composition. When the blending ratio of the polymerization initiator is in the above range, the curable composition is excellent in curing properties and handling properties, and a functional film such as an antireflection film, a hard coat film, or an antistatic film having a desired hardness can be obtained.
Further, an organic solvent may be added to the curable composition as a solvent, and a known organic solvent may be used as the organic solvent. Specific examples of the organic solvent include: alcohols such as methanol, ethanol, isopropanol, butanol, and octanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; esters such as ethyl acetate, butyl acetate, ethyl lactate, γ -butyrolactone, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, and the like; ethers such as ethylene glycol monomethyl ether and diethylene glycol monobutyl ether; aromatic hydrocarbons such as benzene, toluene, and xylene; amides such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone. These solvents may be used alone or in combination of two or more.
The thickness of the functional film is preferably 0.1 to 30 μm, more preferably 0.5 to 20 μm, and particularly preferably 0.7 to 5 μm.
In addition, for the purpose of improving the adhesion between the substrate (i) and the functional film and/or the dielectric multilayer film or the adhesion between the functional film and the dielectric multilayer film, the surface of the substrate (i), the functional film, or the dielectric multilayer film may be subjected to surface treatment such as corona treatment or plasma treatment.
[ use of optical Filter ]
The optical filter of the present invention uniformly guides light to an ambient light sensor, and has excellent visible transmittance and near infrared ray cut-off capability. Further, when the optical filter of the present invention is used, the detection accuracy of the ambient light sensor can be improved in a device in which both a system for authenticating a biometric characteristic and the ambient light sensor are mounted. Therefore, the optical filter of the present invention can be effectively used for various applications of ambient light sensors such as an illuminance sensor and a color correction sensor. In particular, the present invention is useful for applications of an ambient light sensor mounted in a digital still camera, a smart phone, a tablet terminal, a mobile phone, a wearable device, an automobile, a television, a game machine, and the like. Further, the present invention is also effective as a heat ray cut filter or the like to be attached to a glazing panel or the like of an automobile, a building or the like.
[ ambient light sensor ]
The optical filter of the present invention can be used as an ambient light sensor in combination with a photoelectric conversion element. Here, the ambient light sensor is a sensor that can sense brightness or color tone (e.g., red intensity in the evening) of the surroundings, such as an illuminance sensor or a color correction sensor, and can control the illuminance or color of a display mounted on the device based on information sensed by the ambient light sensor.
Fig. 1 shows an example of an ambient light sensor 200a for detecting ambient brightness. The ambient light sensor 200a includes an optical filter 100 and a photoelectric conversion element 202. When light is incident on the light receiving portion, the photoelectric conversion element 202 generates current or voltage by a photovoltaic effect (photovoltaic effect). The optical filter 100 is provided on the light receiving surface side of the photoelectric conversion element 202. The light entering the light receiving surface of the photoelectric conversion element 202 is converted into light in the visible light range and light in the near infrared range (800nm to 2500nm) is blocked by the optical filter 100. The ambient light sensor 200a senses visible light and outputs a signal.
In the ambient light sensor 200a, another light-transmitting layer may be interposed between the optical filter 100 and the photoelectric conversion element 202. For example, a light-transmitting resin layer may be provided as a sealing material between the optical filter 100 and the photoelectric conversion element 202.
The photoelectric conversion element 202 has a first electrode 206, a photoelectric conversion layer 208, and a second electrode 210. Further, a passivation film 216 is provided on the light receiving surface side. The photoelectric conversion layer 208 is formed of a semiconductor exhibiting a photoelectric effect. For example, the photoelectric conversion layer 208 is formed using a silicon semiconductor. The photoelectric conversion layer 208 is a diode-type element, and exhibits photovoltaic by a built-in electric field. The photoelectric conversion element 202 is not limited to a diode-type element, and may be a photoconductive-type element (also referred to as a photoresistor, a photoconductor, or a photovoltaic cell), or a phototransistor-type element.
The photoelectric conversion layer 208 may be formed using a germanium semiconductor or a silicon germanium semiconductor, in addition to a silicon semiconductor. In addition, GaP, GaAsP, CdS, CdTe, CuInSe may also be used as the photoelectric conversion layer 2082And the like. The photoelectric conversion element 202 formed of a semiconductor material has sensitivity to light from the visible ray range to the near infrared ray range. For example, when the photoelectric conversion layer 208 is formed of a silicon semiconductor, the band gap energy of the silicon semiconductor is 1.12eV, and thus light having a wavelength of 700nm to 1100nm, which is near-infrared light, can be absorbed in principle. However, by including the optical filter 100, the ambient light sensor 200a does not sense near infrared light and has sensitivity to light in the visible light region. The photoelectric conversion element 202 is preferably surrounded by a light-shielding frame 204 so that light transmitted through the optical filter 100 is selectively irradiated. The ambient light sensor 200a may block near infrared light and detect ambient light by including the optical filter 100. Thus, the ambient light sensor 200a can eliminate the inconvenience of erroneous operation due to the sensing of near infrared light.
Fig. 2 shows an example of an ambient light sensor 200b that detects not only the brightness of the surroundings but also the color tone. The ambient light sensor 200b includes the optical filter 100, the photoelectric conversion elements 202a to 202c, and the color filters 212a to 212 c. A color filter 212a that transmits light in the red light range is provided on the light receiving surface of the photoelectric conversion element 202a, a color filter 212b that transmits light in the green light range is provided on the light receiving surface of the photoelectric conversion element 202b, and a color filter 212c that transmits light in the blue light range is provided on the light receiving surface of the photoelectric conversion element 202 c. The photoelectric conversion elements 202a to 202c have the same configuration as that shown in fig. 1, except that they are insulated by the element isolation insulating layer 214. With the above configuration, the photoelectric conversion elements 202a to 202c can independently detect illuminance. The passivation film 216 may be provided between the color filters 212a to 212c and the photoelectric conversion elements 202a to 202 c.
The photoelectric conversion elements 202a to 202c have sensitivity over a wide range from the visible light wavelength region to the near infrared wavelength region. Therefore, the ambient light sensor 200b can block near infrared light and prevent malfunction of the sensor by providing the color filters 212a to 212c corresponding to the photoelectric conversion elements 202a to 202c in addition to the optical filter 100, and can detect light corresponding to each color. The ambient light sensor 200b includes the optical filter 100 and the color filters 212a to 212c that block light in the near infrared region, and thus can be applied not only to the case where ambient light is split into light in a plurality of wavelength ranges and detected, but also to the case where the ambient light cannot be accurately detected due to the influence of near infrared rays in the conventional color sensor.
Fig. 3 shows an example of a cross-sectional structure of an ambient light sensor 200c including an illuminance sensor light-receiving element 112a and an optical filter 100. The ambient light sensor 200c functions as an illuminance sensor by detecting the intensity of external light by the illuminance sensor light receiving element 112 a. An optical filter 100 is provided on the upper surface of the illuminance sensor light-receiving element 112 a. The optical filter 100 blocks light in the near infrared wavelength region of light incident on the light receiving surface of the illuminance sensor light-receiving element 112a, and allows detection of the intensity of external light corresponding to the sensitivity characteristics of the illuminance sensor light-receiving element. By using the optical filter 100 including the base material 102 including the light absorbing layer, the dielectric multilayer film 104, and the light scattering layer 106, a high-light-amount visible light is introduced into the ambient light sensor, and light in a visible light region in which a change due to an incident angle is small in accordance with the visibility characteristics of the illuminance sensor is incident on the illuminance sensor light receiving element, so that the illuminance sensor with less malfunction can be obtained.
When the optical filter of the present invention is used in an ambient light sensor, as shown in fig. 3, the light scattering layer 106 is preferably provided on the upper side (the side on which light enters), and particularly preferably provided as the uppermost layer of the optical filter.
Examples
The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, "parts" and "%" mean "parts by mass" and "% by mass". In the measurement and evaluation using an optical filter, the light scattering layer is generally positioned on the upper side (for example, the light incident surface).
< molecular weight >
The molecular weight of the resin is measured by the following method (a) or (b) in consideration of the solubility of each resin in a solvent and the like.
(a) The weight-average molecular weight (Mw) and the number-average molecular weight (Mn) in terms of standard polystyrene were measured using a Gel Permeation Chromatography (GPC) apparatus (model 150C, column: H column manufactured by Tosoh corporation, developing solvent: o-dichlorobenzene).
(b) The weight average molecular weight (Mw) and the number average molecular weight (Mn) in terms of standard polystyrene were measured using a GPC apparatus (HLC-8220 type, column: TSKgel. alpha. -M, developing solvent: Tetrahydrofuran (THF)).
< glass transition temperature (Tg) >
Using a differential Scanning calorimeter (dsc) (differential Scanning calorimeter)6200 manufactured by SII Nano Technologies, ltd, under a flow of nitrogen gas, at a temperature rise rate: the measurement was carried out at 20 ℃ per minute.
< spectral transmittance >
Various transmittances, wavelengths, and the like were measured using a spectrophotometer (V-7200) manufactured by Japan Spectroscopy, Inc.
< haze >
The haze was measured by an ISO measurement method (JIS K7136) using a haze tester II manufactured by Toyo Seiki Seisaku-Sho Ltd.
< sensitivity characteristics of illuminance sensor >
The optical characteristics of the optical filter (optical characteristics of light transmitted through the optical filter) were compared with the illuminance sensor and the human visual sensitivity characteristics, and the illuminance sensor sensitivity characteristics were evaluated when an illuminance sensor having the same or similar configuration to that of fig. 3 was produced. The evaluation was performed based on the following criteria.
Very good: irradiating with 940nm laser light (illuminance: 10 mW/mm)2) In the environment of (2), the incident light to the illuminance sensor can be made to have a characteristic close to human visibility, and high sensor sensitivity can be obtained.
O: light emitted from a Light Emitting Diode (LED) at 940nm (illuminance: 10 mW/cm)2) In the environment of (2), the incident light to the illuminance sensor can be made to have a characteristic close to human visibility, and high sensor sensitivity can be obtained.
And (delta): in an environment where light of 940nm is not irradiated, incident light to the illuminance sensor can be made light having a characteristic close to human visibility, and high sensor sensitivity can be obtained.
X: the difference between the incident light to the illuminance sensor and the human visual sensitivity characteristic is large, and the difference between the incident light and the human visual sensitivity characteristic is large, so that only the low sensor sensitivity characteristic is obtained.
< light scattering properties; measurement of illuminance halved Angle (half-value Angle) >
The light scattering properties were measured using an automated variable angle photometer GP-200 manufactured by village color technology research institute. As shown in fig. 4, as a main configuration of the automatic variable angle photometer 10, a light source 1, a condenser lens 2, a pinhole 3, a collimator lens 4, and a beam stop 5 are arranged at positions perpendicular to an optical filter 7. Here, the position on the straight line connecting the light source 1 and the optical filter 7 and on the opposite side of the light source 1 is set to 0 °, and the position perpendicular to the straight line connecting the light source 1 and the optical filter 7 from the position of the optical filter 7 is set to 90 °. Then, the light emitted from the light source 1 is converted into parallel light having an effective diameter of Φ 20mm through the condenser lens 2, the pinhole 3, the collimator lens 4, and the beam stop 5, and the light receiver 8 is moved at a position of 0 ° to 90 ° under the following conditions with respect to the illuminance of the light which enters the optical filter 7 and is emitted to the opposite side of the light source 1, and the ratio of the illuminance is measured in units of 1 °. An angle at which the illuminance is halved from the illuminance at the position of 0 ° is set as a half-value angle.
(measurement conditions)
Light source: halogen light source (12V, 50W)
Illumination measurement position: a position 270mm away from the surface (position of 0 °) of the optical filter opposite to the light source
< measurement of surface roughness Ra >
The arithmetic mean roughness (Ra) of the surface was measured using a laser microscope (LEXT OLS4000) manufactured by Olympus and a 20-fold objective lens.
< measurement of refractive index of transparent adhesive >
A multi-wavelength Abbe refractometer DR-M2 (measurement light source sodium lamp: 589.3nm) manufactured by Atago (Atago) Ltd was used and measured at 25 ℃.
[ Synthesis examples ]
The compound (a) used in the following examples and comparative examples was synthesized by a generally known method. Examples of a general synthesis method include those described in japanese patent No. 4740631 and the like.
< example 1 of resin Synthesis >
An 8-methyl group represented by the following formula (2)-8-methoxycarbonyltetracyclo [4.4.0.12，5.17，10]100 parts of dodec-3-ene (hereinafter also referred to as "DNM"), 18 parts of 1-hexene (molecular weight modifier), and 300 parts of toluene (solvent for ring-opening polymerization) were charged in a reaction vessel purged with nitrogen, and the solution was heated to 80 ℃. Then, 0.2 part of a toluene solution of triethylaluminum (0.6mol/L) and 0.9 part of a toluene solution of methanol-modified tungsten hexachloride (concentration: 0.025mol/L) were added to the solution in the reaction vessel as polymerization catalysts, and the solution was heated and stirred at 80 ℃ for 3 hours to perform a ring-opening polymerization reaction, thereby obtaining a ring-opening polymer solution. The polymerization conversion in the polymerization reaction was 97%.
[ solution 7]
1,000 parts of the ring-opened polymer solution obtained in the manner described were charged into an autoclave, and 0.12 part of RuHCl (CO) [ P (C) was added to the ring-opened polymer solution6H5)3]3At a hydrogen pressure of 100kg/cm2And the reaction temperature was 165 ℃ and the mixture was stirred with heating for 3 hours to effect hydrogenation.
After the obtained reaction solution (hydrogenated polymer solution) was cooled, hydrogen gas was depressurized. The reaction solution was poured into a large amount of methanol to separate and recover a solidified product, and the solidified product was dried to obtain a hydrogenated polymer (hereinafter also referred to as "resin a"). Regarding the molecular weight of the resin A, the number average molecular weight (Mn) was 32,000, the weight average molecular weight (Mw) was 137,000, and the glass transition temperature (Tg) was 165 ℃.
[ example 1]
To 100 parts by mass of resin A obtained in resin Synthesis example 1 were added 0.050 part by mass of compound (x) having the following structure (maximum absorption wavelength: 704nm), 0.056 part by mass of compound (y) having the following structure (maximum absorption wavelength: 737nm), and 0.7 part by mass of light absorber "CIR-RL" (maximum absorption wavelength: 1095nm) manufactured by Karit (Carlit) of Japan, and further methylene chloride was added to dissolve the mixture, thereby obtaining a solution having a solid content of 30%. The solution was then cast onto a smooth glass plate, dried at room temperature for 8 hours, and after drying at 100 ℃ for 8 hours, peeled from the glass plate. The peeled resin was dried at 100 ℃ for 8 hours under reduced pressure to obtain a substrate having a thickness of 0.1mm and a side of 60 mm.
[ solution 8]
[ solution 9]
The average OD value of the substrate obtained was 2.3 at 850nm to 1050 nm. The results are shown in table 2.
Then, a dielectric multilayer film (III) was formed on one surface of the obtained substrate, and a dielectric multilayer film (IV) was formed on the other surface of the substrate, thereby obtaining a laminate (1') for an optical filter having a thickness of about 0.10 mm.
The dielectric multilayer film (III) is formed by depositing silicon dioxide (SiO) at a deposition temperature of 100 DEG C2) Layer with titanium dioxide (TiO)2) The layers were alternately stacked (total number of layers 26). The dielectric multilayer film (IV) is formed by depositing silicon dioxide (SiO) at a deposition temperature of 100 deg.C2) Layer with titanium dioxide (TiO)2) The layers were alternately stacked (total number of layers 26). In any of the dielectric multilayer films (III) and (IV), the silica layer and the titania layer are alternately laminated in the order of the titania layer, the silica layer, the titania layer, and the silica layer from the base material side, and the outermost layer of the laminate (1') for an optical filter is the silica layer.
The dielectric multilayer film (III) and the dielectric multilayer film (IV) are designed as follows.
The thickness and number of layers of each layer are most preferably selected using optical thin film design software (manufactured by film center, core mclaud) in combination with the wavelength dependence of the refractive index of the substrate and the absorption characteristics of the compound (S) to be used so that the antireflection effect in the visible region and the selective transmission and reflection performance in the near infrared region can be achieved. In the case of optimization, in the present embodiment, the input parameters (Target values) for the software are set as shown in table 1 below.
[ Table 1]
TABLE 1
The average value (T) of the transmittances at wavelengths of 430nm to 580nm of the obtained laminate (1') for an optical filterA') 57%, an average OD between 850nm and 1050nm of 5.4, an OD at 940nm of 5.5, and a haze of 0.6%.
Then, a light diffusion layer was produced in the following order. A coating liquid for a light diffusion layer containing titanium oxide fine particles, a thermosetting acrylic resin, a thermoplastic resin, and a curing agent was applied onto one surface of a transparent polymer film (Cosmoshine A4100: manufactured by Toyo Boseki) having a thickness of 100 μm by bar coating, and heat-cured to form a light diffusion layer having a thickness of about 10 μm, thereby producing a light diffusion film.
A transparent Adhesive "3M optical Clear Adhesive (optical Clear Adhesive) 8146-1" (refractive index: 1.474) of 3M company was bonded to the diffusion layer-unformed surface of the obtained diffusion film (thickness: 0.1mm, surface roughness Ra: 1.8 μ M) using a laminator "Lamiman IKO-360 EII" manufactured by Youbon corporation. Further, a light diffusion film having an adhesive layer containing the transparent adhesive was bonded to one surface (the side of the dielectric multilayer film (III)) of the obtained laminate (1') for an optical filter via the adhesive layer using the laminator, thereby obtaining an optical filter (1) (thickness: about 0.25mm) having a light scattering layer.
The average value (T) of the transmittances at wavelengths of 430nm to 580nm of the obtained optical filter (1)A) 48%, the average OD value at 850-1050 nm was 5.1, the OD value at 940nm was 5.3, and the haze was 95.3%. The obtained optical filter (1) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 2]
To 100 parts by mass of the resin a obtained in resin synthesis example 1 were added 0.050 parts by mass of the compound (x), 0.056 parts by mass of the compound (y), and 0.4 parts by mass of a pigment "S2058" (maximum absorption wavelength: 980nm) manufactured by dachang huajia (DKSH) corporation, and further dichloromethane was added to dissolve the mixture, thereby obtaining a solution having a solid content of 20%. The solution was then cast onto a smooth glass plate, dried at room temperature for 8 hours, and after drying at 100 ℃ for 8 hours, peeled from the glass plate. The peeled resin was dried at 100 ℃ for 8 hours under reduced pressure to obtain a substrate having a thickness of 0.1mm and a side of 60 mm. A laminate (2') for an optical filter and an optical filter (2) having a light scattering layer (thickness: about 0.25mm) were obtained in the same manner as in example 1 except that the obtained base material was used. The spectral transmittances of the obtained base material, laminate (2') for an optical filter, and optical filter (2) were measured in the same manner as in example 1. The haze of the obtained laminate (2') for an optical filter and the haze of the optical filter (2) were measured in the same manner as in example 1. The obtained optical filter (2) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 3]
To 100 parts by mass of norbornene-based resin "aton (Arton) G" manufactured by Japan Synthetic Rubber (JSR) corporation, 0.050 parts by mass of the compound (x), 0.056 parts by mass of the compound (y), and 0.7 parts by mass of light absorber "CIR-RL" manufactured by japan Carlit corporation were added, and further methylene chloride was added to dissolve the mixture, thereby obtaining a solution having a solid content of 20%. Subsequently, the solution was cast onto a smooth glass plate, dried at 20 ℃ for 8 hours, and then peeled from the glass plate. The peeled resin was dried at 100 ℃ for 8 hours under reduced pressure to obtain a substrate having a thickness of 0.1mm and a side of 60 mm. A laminate (3') for an optical filter and an optical filter (3) having a light scattering layer (thickness: about 0.25mm) were obtained in the same manner as in example 1 except that the obtained base material was used. The spectral transmittances of the obtained base material, laminate (3') for optical filter, and optical filter (3) were measured in the same manner as in example 1. The haze of the obtained laminate (3') for an optical filter and the haze of the optical filter (3) were measured in the same manner as in example 1. The obtained optical filter (3) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 4]
To 100 parts by mass of polyethersulfone "FS-1300" manufactured by Sumitomo Bakelite gmbh, 0.050 parts by mass of the compound (x), 0.056 parts by mass of the compound (y), and 0.7 parts by mass of light absorber "CIR-RL" manufactured by Carlit, japan, were added, and N-methyl-2-pyrrolidone was further added to dissolve them, thereby obtaining a solution having a solid content of 20%. The solution was then cast onto a smooth glass plate, dried at 60 ℃ for 4 hours, and dried at 80 ℃ for 4 hours, and then peeled from the glass plate. The peeled resin was dried at 120 ℃ for 8 hours under reduced pressure to obtain a substrate having a thickness of 0.1mm and a side of 60 mm. A laminate (4') for an optical filter and an optical filter (4) having a light scattering layer (thickness: about 0.25mm) were obtained in the same manner as in example 1 except that the obtained base material was used. The spectral transmittances of the obtained base material, the laminate (4') for an optical filter, and the optical filter (4) were measured in the same manner as in example 1. The haze of the obtained laminate (4') for an optical filter and the haze of the optical filter (4) were measured in the same manner as in example 1. The obtained optical filter (4) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 5]
To a container were added 100 parts by mass of the resin a obtained in resin synthesis example 1, 0.5 parts by mass of the compound (x), 0.28 parts by mass of the compound (y), 3.5 parts by mass of a light absorber "CIR-RL" manufactured by Carlit, japan, and methylene chloride was added to prepare a solution having a resin concentration of 20% by mass. The obtained solution was cast onto a transparent glass substrate "OA-10G" (thickness: 0.20mm) made of Japanese electric glass (strand) cut into a size of 60mm in length and 60mm in width. After drying at 20 ℃ for 8 hours, the substrate was further dried at 100 ℃ for 8 hours under reduced pressure to obtain a substrate having a resin layer with a thickness of 0.21mm, a length of 60mm and a width of 60mm and a glass support. A laminate (5') for an optical filter and an optical filter (5) having a light scattering layer (thickness: about 0.36mm) were obtained in the same manner as in example 1 except that the obtained base material was used. The spectral transmittances of the obtained base material, laminate (5') for optical filter, and optical filter (5) were measured in the same manner as in example 1. The haze of the obtained laminate (5') for an optical filter and the haze of the optical filter (5) were measured in the same manner as in example 1. The obtained optical filter (5) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 6]
To a vessel were added 100 parts by mass of the resin a obtained in resin synthesis example 1, 3 parts by mass of a light absorber "CIR-RL" manufactured by Carlit, japan, and methylene chloride to prepare a solution having a resin concentration of 20% by mass. The obtained solution was cast onto a blue plate glass substrate "BS-6" (thickness: 0.21mm) manufactured by Sonlang Nitri industry (strand) cut into a size of 60mm in length and 60mm in width. At this time, the casting conditions were adjusted so that the thickness of the dried coating film became 10 μm. After drying at 20 ℃ for 8 hours, the substrate was further dried at 100 ℃ for 8 hours under reduced pressure to obtain a substrate having a resin layer with a thickness of 0.22mm, a length of 60mm and a width of 60mm and a glass support. A laminate (6') for an optical filter and an optical filter (6) having a light scattering layer (thickness: about 0.37mm) were obtained in the same manner as in example 1 except that the obtained base material was used. The spectral transmittances of the obtained base material, the laminate (6') for an optical filter, and the optical filter (6) were measured in the same manner as in example 1. The haze of the obtained laminate (6') for an optical filter and the haze of the optical filter (6) were measured in the same manner as in example 1. The obtained optical filter (6) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 7]
To 100 parts by mass of norbornene-based resin "aton (Arton) G" manufactured by Japan Synthetic Rubber (JSR) corporation, 0.05 parts by mass of the compound (x), 0.058 parts by mass of the compound (y), and 1.2 parts by mass of light absorber "CIR-RL" manufactured by japan Carlit corporation were added, and further, methylene chloride was added to dissolve them, thereby obtaining a solution having a solid content of 20 mass%. Subsequently, the solution was cast onto a smooth glass plate, dried at 20 ℃ for 8 hours, and then peeled from the glass plate. The peeled resin was dried at 100 ℃ for 8 hours under reduced pressure to obtain a substrate having a thickness of 0.1mm and a side of 60 mm. A laminate (7') for an optical filter was obtained in the same manner as in example 1, except that the obtained base material was used.
Then, a light diffusion film was produced in the same manner as in example 1, and a transparent Adhesive "3M optical Clear Adhesive (optical Clear Adhesive) 8146-1" (refractive index: 1.474) of 3M company was laminated on the diffusion layer-non-formed surface of the obtained diffusion film (thickness: 0.1mm, surface roughness Ra: 1.8 μ M) using a laminator "Lamiman IKO-360 EII" manufactured by Youbang corporation. Further, a light diffusion film having an adhesion layer containing the transparent adhesive was bonded to one surface of the obtained laminate (7') for an optical filter via the adhesion layer using a laminator (Lamman IKO-360EII) manufactured by Youbao corporation, thereby obtaining an optical filter (7) having a light scattering layer (thickness: about 0.25 mm). The spectral transmittances of the obtained base material, the laminate (7') for an optical filter, and the optical filter (7) were measured in the same manner as in example 1. The haze of the obtained laminate (7') for an optical filter and the haze of the optical filter (7) were measured in the same manner as in example 1. The obtained optical filter (7) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 8]
The light diffusion layer was produced in the following order. A coating liquid for a light diffusion layer containing barium sulfate fine particles, a thermosetting acrylic resin, a thermoplastic resin, and a curing agent was applied by bar coating onto one surface of a transparent polymer film (Cosmoshine a4100, manufactured by toyobo) having a thickness of 100 μm, and heat-cured to form a light diffusion layer having a thickness of about 10 μm, thereby producing a light diffusion film.
An optical filter (8) (thickness: about 0.25mm) having a light scattering layer was obtained in the same manner as in example 1 except that the obtained light diffusion film (thickness: 0.1mm, surface roughness Ra: 0.5 μm) was used as the light scattering layer. The spectral transmittance of the obtained optical filter (8) was measured in the same manner as in example 1. The haze of the obtained optical filter (8) was measured in the same manner as in example 1. The obtained optical filter (8) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 9]
The light diffusion layer was produced in the following order. A coating liquid for a light diffusion layer containing zirconia fine particles, a thermosetting acrylic resin, a thermoplastic resin, and a curing agent was applied onto one surface of a transparent polymer film (cosmoline a4100, manufactured by toyobo) having a thickness of 100 μm by bar coating, and heat-cured to form a light diffusion layer having a thickness of about 10 μm, thereby producing a light diffusion film.
An optical filter (9) having a light scattering layer (thickness: about 0.25mm) was obtained in the same manner as in example 1, except that the obtained light diffusion film (thickness: 0.1mm, surface roughness Ra: 3.9 μm) was used as the light scattering layer. The spectral transmittance of the obtained optical filter (9) was measured in the same manner as in example 1. The haze of the obtained optical filter (9) was measured in the same manner as in example 1. The obtained optical filter (9) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 10]
An optical filter (10) (thickness: about 0.35mm) having a light scattering layer was obtained in the same manner as in example 6 except that the light scattering layer obtained in example 8 was used (thickness: 0.1mm, surface roughness Ra: 0.5 μm). The spectral transmittance of the obtained optical filter (10) was measured in the same manner as in example 1. The haze of the obtained optical filter (10) was measured in the same manner as in example 1. The obtained optical filter (10) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ example 11]
An optical filter (11) (thickness: about 0.36mm) having a light scattering layer was obtained in the same manner as in example 6 except that the light scattering layer obtained in example 9 (thickness: 0.1mm, surface roughness Ra: 3.9 μm) was used as the light scattering layer. The spectral transmittance of the obtained optical filter (11) was measured in the same manner as in example 1, and the optical characteristics were evaluated. The haze of the obtained optical filter (11) was measured in the same manner as in example 1. The obtained optical filter (11) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
Comparative example 1
To a vessel, 100 parts of resin a obtained in resin synthesis example 1 and methylene chloride were added to prepare a solution having a resin concentration of 20 mass%. The solution obtained was cast onto a smooth glass plate and, after drying at 20 ℃ for 8 hours, peeled off from the glass plate. The peeled coating film was dried at 100 ℃ under reduced pressure for 8 hours to obtain a substrate having a thickness of 0.1mm, a length of 60mm and a width of 60 mm. A laminate (12') for an optical filter and an optical filter (12) having a light diffusion layer (thickness: about 0.25mm) were obtained in the same manner as in example 1, except that the obtained base material was used. The spectral transmittances of the obtained base material, the laminate (12') for an optical filter, and the optical filter (12) were measured in the same manner as in example 1. The haze of the obtained laminate (12') for an optical filter and the haze of the optical filter (12) were measured in the same manner as in example 1. The obtained optical filter (12) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
Comparative example 2
A substrate having a thickness of 0.1mm and a side of 60mm was obtained in the same manner as in example 1 except that the light absorber "CIR-RL" manufactured by Karit (Carlit) of Japan was not used. An optical filter laminate (13') and an optical filter (13) having a light scattering layer (thickness: about 0.24mm) were obtained in the same manner as in example 1 except that the obtained base material was used as the light scattering layer and the light diffusion film (thickness: 0.1mm, surface roughness Ra: 0.5 μm) obtained in example 8 was used. The spectral transmittances of the obtained base material, the laminate (13') for an optical filter, and the optical filter (13) were measured in the same manner as in example 1. The haze of the obtained laminate (13') for an optical filter and the haze of the optical filter (13) were measured in the same manner as in example 1. The obtained optical filter (13) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
Comparative example 3
A laminate (1') for an optical filter was obtained in the same manner as in example 1, and the laminate was used as an optical filter (14) (thickness: about 0.10mm) without forming a light scattering layer. The spectral transmittance of the obtained optical filter (14) was measured in the same manner as in example 1, and the optical characteristics were evaluated. The obtained optical filter (14) was used to evaluate the light scattering performance (half-value angle) and the sensitivity characteristics of the illuminance sensor. The results are shown in table 2.
[ Table 2]
Description of the symbols
1: light source
2: condensing lens
3: pinhole
4: collimating lens
5: light beam aperture
6: light (es)
7: optical filter
8: optical receiver
10: automatic angle-changing photometer
100: optical filter
102: base material
104: dielectric multilayer film
106: light scattering layer
112: light receiving element of illuminance sensor
132: light shielding member
200: ambient light sensor
202: photoelectric conversion element
204: frame body
206: a first electrode
208: photoelectric conversion layer
210: second electrode
212: color filter
214: element isolation insulating layer
216: passivation film
Claims (11)
1. An optical filter, comprising: a substrate (i) and a light scattering layer formed on at least one surface of the substrate (i), wherein
And an optical density value measured from a direction perpendicular to the optical filter at a wavelength of 940nm of 3 or more.
2. The optical filter according to claim 1, wherein an average optical density value measured from a vertical direction of the optical filter in a region of wavelengths of 850nm to 1050nm is 2 or more.
3. The optical filter according to claim 1 or 2, wherein a light source, a condenser lens, a pinhole, a collimator lens, and a beam stop are arranged at a position perpendicular to the optical filter, a position on a straight line connecting the light source and the optical filter and on the opposite side of the light source is set to 0 °, light emitted from the light source is converted into parallel light having an effective diameter Φ 20mm through the condenser lens, the pinhole, the collimator lens, and the beam stop, and illuminance of light emitted from the opposite side of the light source after the parallel light is incident on the optical filter is measured under the following conditions,
an angle at which the illuminance at the position of 0 ° is halved is 15 ° or more and 60 ° or less.
Light source: halogen light source (12V, 50W)
Thickness of the optical filter: 100-400 mu m
Illumination measurement position: a position 270mm to 290mm from the surface (position 0 DEG) of the optical filter opposite to the light source
4. The optical filter according to any one of claims 1 to 3, wherein the surface roughness Ra of the light scattering layer is 0.1 μm to 4.5 μm.
5. The optical filter according to any one of claims 1 to 4, wherein the light scattering layer is closely bonded to the base material (i) via an adhesion layer.
6. The optical filter according to any one of claims 1 to 5, wherein the substrate (i) comprises a light-absorbing layer containing a compound (S) having a maximum absorption wavelength in a region of 750nm to 1150nm in wavelength.
7. The optical filter according to claim 6, wherein the compound (S) is at least one compound selected from the group consisting of a squarylium salt-based compound, a phthalocyanine-based compound, a naphthalocyanine-based compound, a ketanium-based compound, a cyanine-based compound, a diimmonium-based compound, a metal dithiolate-based compound, a copper phosphate complex-based compound, and a pyrrolopyrrole-based compound.
8. The optical filter according to claim 6 or 7, wherein the light absorbing layer further comprises a compound (A) having a maximum absorption wavelength in a region having a wavelength of 650nm or more and less than 750 nm.
9. The optical filter according to claim 8, wherein the compound (A) is at least one compound selected from the group consisting of a squarylium salt compound, a phthalocyanine compound, a naphthalocyanine compound, a ketanium compound, and a cyanine compound.
10. The optical filter of any one of claims 1 to 9, for use in an ambient light sensor.
11. An ambient light sensor provided with the optical filter according to any one of claims 1 to 10.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-154639 | 2018-08-21 | ||
| JP2018154639 | 2018-08-21 | ||
| PCT/JP2019/032397 WO2020040123A1 (en) | 2018-08-21 | 2019-08-20 | Optical filter and ambient light sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112437893A true CN112437893A (en) | 2021-03-02 |
Family
ID=69592647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980047984.XA Pending CN112437893A (en) | 2018-08-21 | 2019-08-20 | Optical filter and ambient light sensor |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7251551B2 (en) |
| CN (1) | CN112437893A (en) |
| TW (1) | TWI799634B (en) |
| WO (1) | WO2020040123A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022205206A1 (en) * | 2021-03-31 | 2022-10-06 | 华为技术有限公司 | Color temperature sensor and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1120370A (en) * | 1993-04-01 | 1996-04-10 | 明尼苏达矿产制造公司 | Layered imaging stack for minimizing interference fringes in an imaging device |
| JP2002350228A (en) * | 2001-05-25 | 2002-12-04 | Fuji Xerox Co Ltd | Ultraviolet sensor |
| CN101852872A (en) * | 2009-03-30 | 2010-10-06 | 富士胶片株式会社 | The production method of light-diffusing films, light-diffusing films, polarizing plate, image display device and transmissive/semi-transmissive liquid crystal display device |
| CN105308626A (en) * | 2013-01-17 | 2016-02-03 | 西奥尼克斯股份有限公司 | Biometric imaging devices and associated methods |
| WO2017094672A1 (en) * | 2015-11-30 | 2017-06-08 | Jsr株式会社 | Optical filter, ambient light sensor and sensor module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6317875B2 (en) * | 2012-09-06 | 2018-04-25 | 日本板硝子株式会社 | Infrared cut filter, imaging device, and method of manufacturing infrared cut filter |
| WO2018180116A1 (en) * | 2017-03-29 | 2018-10-04 | 富士フイルム株式会社 | Structure and optical sensor |
| CN110832852A (en) * | 2017-07-31 | 2020-02-21 | Jsr株式会社 | Photoelectric conversion element and adhesive |
-
2019
- 2019-08-20 TW TW108129678A patent/TWI799634B/en active
- 2019-08-20 JP JP2020538396A patent/JP7251551B2/en active Active
- 2019-08-20 CN CN201980047984.XA patent/CN112437893A/en active Pending
- 2019-08-20 WO PCT/JP2019/032397 patent/WO2020040123A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1120370A (en) * | 1993-04-01 | 1996-04-10 | 明尼苏达矿产制造公司 | Layered imaging stack for minimizing interference fringes in an imaging device |
| JP2002350228A (en) * | 2001-05-25 | 2002-12-04 | Fuji Xerox Co Ltd | Ultraviolet sensor |
| CN101852872A (en) * | 2009-03-30 | 2010-10-06 | 富士胶片株式会社 | The production method of light-diffusing films, light-diffusing films, polarizing plate, image display device and transmissive/semi-transmissive liquid crystal display device |
| CN105308626A (en) * | 2013-01-17 | 2016-02-03 | 西奥尼克斯股份有限公司 | Biometric imaging devices and associated methods |
| WO2017094672A1 (en) * | 2015-11-30 | 2017-06-08 | Jsr株式会社 | Optical filter, ambient light sensor and sensor module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022205206A1 (en) * | 2021-03-31 | 2022-10-06 | 华为技术有限公司 | Color temperature sensor and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020040123A1 (en) | 2021-08-26 |
| WO2020040123A1 (en) | 2020-02-27 |
| JP7251551B2 (en) | 2023-04-04 |
| TW202032164A (en) | 2020-09-01 |
| TWI799634B (en) | 2023-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11029457B2 (en) | Optical filter | |
| CN112946804B (en) | Optical filter and device using the same | |
| CN106662686B (en) | Optical filter, ambient light sensor, and electronic device | |
| KR102547262B1 (en) | Optical filters and devices using optical filters | |
| CN110873914B (en) | Optical filter, method for manufacturing the same, solid-state imaging device, and camera module | |
| JP7251423B2 (en) | Optical components and camera modules | |
| CN112585508B (en) | Optical filter, solid-state imaging device, and camera module | |
| CN113474714A (en) | Light guide plate for image display | |
| JP2013205634A (en) | Optical film and method for manufacturing the same | |
| CN112180487A (en) | Camera module and electronic device | |
| CN112437893A (en) | Optical filter and ambient light sensor | |
| KR20180075592A (en) | OPTICAL FILM, POLARIZING FILM, POLARIZING FILM, AND IMAGE DISPLAY | |
| TWI397760B (en) | Lens module and camera module | |
| CN112543881B (en) | Optical filter | |
| KR20220146334A (en) | Substrate, optical filter, solid state image pickup device, and camera module | |
| JP7331635B2 (en) | Optical filter and its use | |
| JP7347145B2 (en) | Optical element and fingerprint detection device | |
| KR20210112651A (en) | Anti-glare film, polarizing plate and display apparatus | |
| TWI789460B (en) | Covering member and electronic device with authentication function | |
| JP2022026478A (en) | Image detection device and information apparatus using the same | |
| JP2021018285A (en) | Lens and imaging device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210302 |