CN112420912B - 一种微型热电器件的制造方法 - Google Patents
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Abstract
本发明公开了一种微型热电器件的制造方法,具体步骤为:1)根据微型热电器件的电极基板尺寸和图案设计钢制模具;2)将点胶好的电极基板1置于步骤2所得钢制模具的凹槽内,使得电极基板1的胶点与钢制模具的限位板通孔相对应;3)将切割好的热电粒子摆入钢制模具的限位板通孔中;4)将连同电极基板1和热电粒子在内的整个钢制模具进行焊接,得到微型热电器件的半成品;5)将微型热电器件的半成品脱模后,焊接另一面的电极基板2,得到微型热电器件。本发明实现了微型粒子的精确排布,同时在焊接过程中,粒子位置被固定,保证了微型热电器件基板与粒子的焊接精度,最终制造出高精度的微型热电器件,整个过程快速高效,有利于大规模生产使用。
Description
技术领域
本发明涉及热电器件制造领域,尤其涉及一种微型热电器件的制造方法。
背景技术
热电器件作为一种可实现电能与热能之间直接相互转换的新能源器件,越来越受到人们的广泛关注。常规热电器件主要用于红酒柜、半导体冰箱、冰淇淋机等民用领域,而目前热电器件的发展朝着微型化进行,主要用于可穿戴设备的供能、微区精确控温,比如热电手表、5G光通信模块的激光器控温等。微型热电器件的制造与常规热电器件相比,难点之一在于高精度的组装焊接。
传统常规热电器件的摆模用具主要由橡胶制成,通过人工手动将热电粒子填进摆模用具孔中,随用利用聚酰亚胺膜将热电粒子粘出,手工对位在丝网印刷锡膏完毕的热电器件基板上,利用接触压力焊方式进行焊接。整个制造过程依靠手工完成,橡胶摆模用具由于具有一定的弹性,因此粘出的热电粒子排布并不精确,且由于使用聚酰亚胺膜粘出,粒子表面的金属化层被粘胶污染,并且聚酰亚胺膜也具有弹性,影响粒子与基板锡膏的对位精度,后续不利于焊接工艺的进行。因此,这种方式也制造不出对精度要求极高的微型热电器件。
发明内容
本发明所要解决的技术问题是针对上述现有技术存在的不足而提供一种微型热电器件的制造方法,可使微型热电粒子精确排布,确保器件基板与微型热电粒子的焊接精度,且对微型热电粒子表面不造成污染。
本发明为解决上述提出的问题所采用的技术方案为:
一种微型热电器件的制造方法,包括以下步骤:
1)根据微型热电器件的电极基板尺寸和图案设计钢制模具图纸;
2)按照步骤1)所述的图纸加工钢制模具;所述钢制模具包括限位板和设于限位板四周的外框,限位板的顶面和外框内侧面形成凹槽以容纳电极基板,限位板上开设有多个通孔以限定热电粒子的位置;
3)将点胶好的电极基板1置于步骤2所得钢制模具的凹槽内,使得电极基板1的胶点与钢制模具的限位板通孔相对应;
4)将切割好的热电粒子摆入步骤3)所述钢制模具的限位板通孔中;
5)将连同电极基板1和热电粒子在内的整个钢制模具进行焊接,得到微型热电器件的半成品;
6)将步骤5)所述微型热电器件的半成品脱模后,焊接另一面的电极基板2,得到微型热电器件。
按上述方案,所述钢制模具的凹槽大小与电极基板1的大小一致,凹槽深度比电极基板1厚度多0.1~0.5mm。
按上述方案,步骤2)中利用连续激光按照图纸加工钢制模具。所述钢制模具的通孔为方形或者圆形,优选方形,更易于加工。
按上述方案,步骤5)中将连同电极基板1和热电粒子在内的整个钢制模具放入真空焊接炉中进行焊接。
按上述方案,步骤6)中,电极基板2和电极基板1大小、材质等一般都相同。电极基板均为陶瓷基覆铜板(DCB板),一般为氧化铝陶瓷或氮化铝陶瓷上进行覆铜所得。
按上述方案,微型热电器件的横截面积不超过100mm2(即电极基板的面积一般不超过100mm2);热电粒子的体积不大于1mm3,横截面不超过1mm2。优选地,微型热电器件的横截面一般为四边形(如长方形或者正方形),长和宽均在1~10mm范围内;热电粒子为圆柱体或长方体或正方体,优选长方体,长宽高均在0.2~1mm范围内。
以上述内容为基础,在不脱离本发明基本技术思想的前提下,根据本领域的普通技术知识和手段,对其内容还可以有多种形式的修改、替换或变更。
在微型热电器件中,微型热电粒子与电极基板间的对位不佳会造成器件短路、虚焊等现象发生,增大了微型热电器件的失效率,同时也影响微型热电器件的美观性。与现有技术相比,本发明的有益效果是:
1.本发明利用钢制模具网孔对微型热电粒子进行固定,直接将点胶锡膏的基板置于网孔下方,确保微型热电粒子与锡膏的接触精度,避免了因传统橡胶模具弹性变形影响微型热电粒子排布精度,进而造成短路、虚焊等现象发生。通过该方式制造出的微型热电器件的性能一致性得到提高;
2.本发明制造微型热电器件过程中,钢制模具与微型热电粒子一同送入回流焊炉中,实现高精度组装焊接;而橡胶模具只能在空气中采用压力接触焊方式,锡膏有轻微氧化,焊接质量没有回流焊高。
3.本发明所述微型热电器件的制造方法,无需利用聚酰亚胺膜将微型热电粒子粘出,使得微型热电粒子表面不受粘胶污染,减少工艺环节,且微型热电粒子的摆模采用自动化贴片方式进行,适合规模化生产。
附图说明
图1为钢制模具的限位板的俯视图;
图2为钢制模具的剖视图;
图3为实施例1中步骤2)所加工出的摆模用具实际图;
图4为实施例1中步骤3)步骤4)所进行的热电粒子摆模效果;
图5为实施例1中步骤5)所得微型热电器件的半成品的照片;
图6为实施例1中步骤6)所制造出的微型热电器件成品的照片。
具体实施方式
为了更好地理解本发明,下面结合实施例进一步阐明本发明的内容,但本发明不仅仅局限于下面的实施例。
下述实施例中,钢制模具可采用304不锈钢和316不锈钢等;电极基板选用陶瓷基覆铜板(DCB板),尺寸具体为8×8mm2;热电粒子为长方体,尺寸为0.45×0.45×0.5mm3,具体采用等离子活化烧结制备出的p型和n型碲化铋热电材料粒子。
实施例1
一种用于微型热电器件制造的摆模用具设计方法,它包括以下步骤:
1)本实施例需制造的微型热电器件的尺寸为8×8mm2,共97对微型热电粒子;根据微型热电器件的电极基板的要求设计钢制模具图纸,如图1和图2所示;
2)利用连续激光按照步骤1)所述图纸加工钢制模具;所述钢制模具包括限位板和设于限位板四周的外框,限位板的顶面和外框内侧面形成凹槽以容纳电极基板,限位板上开设有多个方形通孔以限定热电粒子的位置;凹槽大小与电极基板1的大小相匹配,凹槽深度比电极基板1厚度多0.1~0.5mm,凹槽深度为0.35mm;每个方形通孔的内径尺寸为0.47mm*0.47mm,外径为0.57mm*0.57mm,深度为0.25mm;
3)将点胶好的电极基板1置于步骤2所得钢制模具的凹槽内,使得电极基板1的胶点与钢制模具的限位板通孔相对应;
4)将切割好的热电粒子摆入步骤3)所述钢制模具的限位板通孔中;其中,如图1所示,钢制模具的限位板上共有196个通孔,左上角和右上角的通孔中不摆入热电粒子,其他通孔按照P-N-P-N-P(或者N-P-N-P-N)交替摆放p型和n型碲化铋热电材料粒子,只要确保n型粒子与p型粒子不相邻即可;
5)将步骤4)所得连同电极基板1和热电粒子在内的整个钢制模具放入真空焊接炉中进行焊接,得到微型热电器件的半成品;
6)将步骤5)所述微型热电器件的半成品脱模后,焊接另一面的电极基板2,得到微型热电器件;其中,电极基板2与电极基板1完全相同。
其中,步骤5)、步骤6)中真空焊接的具体工艺依据锡膏型号而定,比如本实施例中点胶使用SAC305锡膏,熔点217℃,则采用60s升到150℃,随后90s从150℃升到260℃,在260℃保温2min,随后随炉冷却降至室温。若点胶使用Au22Sn焊料,则60s升到180℃,随后100s从180℃升到320℃,320℃保温3min,随后随炉冷却。
如图5和图6所示,该实施例所述方法制造的微型热电器件,各微型热电粒子排布精度高。
依照实施例1所述方法制造了10个8×8微型热电器件(序号分别为1-10),下面为微型热电器件制冷性能测试值,如表1所示,平均最大制冷温差56.97℃;平均最大制冷电流1.94A;平均最大工作电压11.68V;平均最大制冷量12.82W;平均器件内阻5.43Ω,微型热电器件一致性较好。
表1
以上所述仅是本发明的优选实施方式,应当指出,对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出若干改进和变换,这些都属于本发明的保护范围。
Claims (7)
1.一种微型热电器件的制造方法,其特征在于,包括以下步骤:
1)根据微型热电器件的电极基板尺寸和图案设计钢制模具;所述钢制模具包括限位板和设于限位板四周的外框,限位板的顶面和外框内侧面形成凹槽以容纳电极基板,限位板上开设有多个通孔以限定热电粒子的位置;
2)将点胶好的电极基板1置于步骤2所得钢制模具的凹槽内,使得电极基板1的胶点与钢制模具的限位板通孔相对应;
3)将切割好的热电粒子摆入步骤2)所述钢制模具的限位板通孔中;
4)将连同电极基板1和热电粒子在内的整个钢制模具进行焊接,得到微型热电器件的半成品;
5)将步骤4)所述微型热电器件的半成品脱模后,在热电粒子的表面焊接电极基板2,得到微型热电器件。
2.根据权利要求1所述的微型热电器件的制造方法,其特征在于,所述钢制模具的凹槽大小与电极基板大小相匹配,凹槽深度比电极基板厚度多0.1~0.5 mm。
3.根据权利要求1所述的微型热电器件的制造方法,其特征在于,所述通孔为方形通孔。
4.根据权利要求1所述的微型热电器件的制造方法,其特征在于,步骤1)中利用连续激光加工钢制模具。
5.根据权利要求1所述的微型热电器件的制造方法,其特征在于,步骤5)中将连同电极基板1和热电粒子在内的整个钢制模具放入真空焊接炉中进行焊接。
6. 根据权利要求1所述的微型热电器件的制造方法,其特征在于微型热电器件的电极基板的面积不超过100 mm2;热电粒子的体积不大于1 mm3。
7. 根据权利要求1所述的微型热电器件的制造方法,其特征在于微型热电器件的电极基板为长方形或者正方形,长和宽均在1~10 mm范围内;热电粒子为长方体或正方体,长宽高均在0.2 ~1mm范围内。
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