CN112417191A

CN112417191A - Defect scanning result processing method, device and system and storage medium

Info

Publication number: CN112417191A
Application number: CN201910769377.6A
Authority: CN
Inventors: 丁涌芥; 杜丽; 黄盛境
Original assignee: China Resources Microelectronics Chongqing Ltd
Current assignee: China Resources Microelectronics Chongqing Ltd
Priority date: 2019-08-20
Filing date: 2019-08-20
Publication date: 2021-02-26
Anticipated expiration: 2039-08-20
Also published as: CN112417191B

Abstract

The application provides a method, a device and a system for processing defect scanning results and a storage medium, wherein a scanning result file containing defect information of one or more wafers is obtained; and converting the scanning result file into a text file, and correcting the defect information in the text file. The problem of manual error rate and the timeliness and the storage limit of paper book record are solved, the problem that the paper book record is slow in query speed and complex in process is solved, in addition, the wafer defect distribution and the defect size can be completely recorded and restored, and the problem of specific distribution or directional defect is analyzed.

Description

Defect scanning result processing method, device and system and storage medium

Technical Field

The present invention relates to the field of semiconductor manufacturing, and in particular, to a method, an apparatus, a system, and a storage medium for processing a defect scan result.

Background

In the conventional defect scanning machine for non-patterned wafers, the result of scanning the wafer defects can be recorded by a technician book or received by an EAP system due to different operation modes. The error condition of manual recording is inevitable, and the timeliness and the storage place of the paper book record are limited. The defect scanning results received by the current EAP system can only be checked on a machine and cannot be stored, so that the process is complicated and the speed is low when the results are inquired. In addition, according to the two methods, when the scanning result is abnormal, an engineer can only inquire the particle value of the wafer and cannot check the distribution of the defects on the wafer and the sizes of the defects, and at the moment, the wafer needs to be rescanned and screenshot or photographing records are made, but the abnormal wafer is often recovered, so that the situation that the abnormal wafer cannot be redetected is caused. If the defect scanning result can be stored and the defect distribution and the real size on the wafer can be restored, the defect source can be conveniently judged by an engineer through the real-time query of the system, so that an abnormal machine table can be found in time, and the working efficiency of wafer production and processing is improved.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, it is an object of the present application to provide a method, an apparatus, a system and a storage medium for processing defect scan results, so as to solve the problems in the prior art.

To achieve the above and other related objects, the present application provides a defect scan result processing method, including: acquiring a scanning result file containing defect information of one or more wafers; and converting the scanning result file into a text file, and correcting the defect information in the text file.

In an embodiment of the present application, the defect information includes: and any one or more of defect size information, defect coordinate information and defect number information are combined.

In an embodiment of the present application, the method for converting the scan result file into the text file further includes: adding ID information corresponding to each wafer aiming at the scanning result file so as to match the defect information corresponding to each wafer; the ID information includes: wafer Lot ID information and wafer ID information.

In an embodiment of the present application, the method for acquiring ID information includes: extracting timestamp information scanned corresponding to each wafer in the scanning result file, and obtaining ID information corresponding to each wafer according to the arrangement sequence or the scanning sequence of each wafer; or, directly providing the ID information corresponding to the wafer according to manual work.

In an embodiment of the present application, the method further includes: setting the obtained scanning result file as a shared file for real-time capture and processing; and/or uploading the corrected text file for real-time query.

In an embodiment of the present application, the method for correcting the defect information in the text file includes: determining whether each defect in the defect information is a large-particle defect or a small-particle defect according to the converted numerical information in the text file; converting the defect size information corresponding to each defect in the text file into a real size according to a conversion formula; the conversion formula includes: (XSIZE 10-32768)/100.

In an embodiment of the present application, the method for correcting the defect information in the text file further includes: detecting the notch condition of each wafer before defect scanning is carried out on each wafer; searching whether the scanning result file formed after defect scanning contains notch detection information corresponding to each wafer; if yes, judging the direction followed by the defect information according to the notch detection information; and if not, judging that the direction followed by the defect information is uncertain.

To achieve the above and other related objects, the present application provides an electronic device, comprising: the system comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring a scanning result file containing defect information of one or more wafers; and the processing module is used for converting the scanning result file into a text file and correcting the defect information in the text file.

To achieve the above and other related objects, the present application provides a computer system comprising: a memory, a processor, and a communicator; the memory is to store computer instructions; the processor executes computer instructions to implement the method as described above; the communicator is used for communicating with an external device.

To achieve the above and other related objects, the present application provides a non-transitory computer-readable storage medium storing computer instructions which, when executed, perform the method as described above.

In summary, the defect scan result processing method, apparatus, system and storage medium of the present application obtain a scan result file containing defect information of one or more wafers; and converting the scanning result file into a text file, and correcting the defect information in the text file.

Has the following beneficial effects:

1. the system automatically processes in real time to solve the problem of artificial error rate;

2. the database records the scanning result, and solves the problems of timeliness and storage limitation of the paper book record;

3. the webpage system queries in real time and historically, and solves the problems of low speed and complex process of querying paper records;

4. the defect distribution and the defect size of the wafer are completely recorded and restored, and the analysis of the problem of the specific distribution or the directional defects is facilitated.

Drawings

Fig. 1 is a flowchart illustrating a defect scan result processing method according to an embodiment of the present disclosure.

Fig. 2 is a schematic distribution diagram of defect scanning results according to an embodiment of the present application.

Fig. 3 is a block diagram of an electronic device according to an embodiment of the present disclosure.

Fig. 4 is a schematic structural diagram of a computer system according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

Embodiments of the present application will be described in detail below with reference to the accompanying drawings so that those skilled in the art to which the present application pertains can easily carry out the present application. The present application may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly explain the present application, components that are not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.

Throughout the specification, when a component is referred to as being "connected" to another component, this includes not only the case of being "directly connected" but also the case of being "indirectly connected" with another element interposed therebetween. In addition, when a component is referred to as "including" a certain constituent element, unless otherwise stated, it means that the component may include other constituent elements, without excluding other constituent elements.

When an element is referred to as being "on" another element, it can be directly on the other element, or intervening elements may also be present. When a component is referred to as being "directly on" another component, there are no intervening components present.

Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first interface and the second interface, etc. are described. Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" include plural forms as long as the words do not expressly indicate a contrary meaning. The term "comprises/comprising" when used in this specification is taken to specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but does not exclude the presence or addition of other features, regions, integers, steps, operations, elements, and/or components.

Terms indicating "lower", "upper", and the like relative to space may be used to more easily describe a relationship of one component with respect to another component illustrated in the drawings. Such terms are intended to include not only the meanings indicated in the drawings, but also other meanings or operations of the device in use. For example, if the device in the figures is turned over, elements described as "below" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "under" and "beneath" all include above and below. The device may be rotated 90 or other angles and the terminology representing relative space is also to be interpreted accordingly.

Although defined differently, including technical and scientific terms used herein, all have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Terms defined in commonly used dictionaries are to be additionally interpreted as having meanings consistent with those of related art documents and the contents of the present prompts, and must not be excessively interpreted as having ideal or very formulaic meanings unless defined.

The method is mainly provided for solving the problems of the existing scanning result of the non-pattern wafer.

For example, a KLA-Tencor defect scanner of the american co-pending company scans a wafer to form a particle map, which can see defect information such as defect size, defect coordinates, defect number, etc., such as the number of small particle defects (which can be divided into several size intervals, such as 0.2-0.3 um, 0.3-0.4 um), and the number of large particle defects (such as 0.5um or more). However, the file containing the defect information is exported to be a tff format file, but the file cannot be effectively opened, that is, the opened file cannot obtain all defect information, for example, only the defect number information can be seen, and other information such as defect coordinate information or defect size (defect size) information is lost, so that the scanning result file cannot be exported and stored truly and completely.

In the conventional method, the defect information presented on the machine is recorded by manual recording or photographing, but the scanning result cannot be queried in real time, and when an engineer needs to query or restore the scanning result when judging the source of the defect, or when the defect scanning machine accumulates more files or fails, the query process is often troublesome, so that the efficiency of searching for an abnormal machine is affected.

In summary, the present application provides a method, an apparatus, a system and a storage medium for processing defect scan results to solve the above-mentioned problems.

Fig. 1 shows a defect scan result processing method according to an embodiment of the present application. As shown, the method includes:

step S101: a scan result file including defect information for one or more wafers is obtained.

In this embodiment, the scan result file containing defect information of one or more wafers is an original defect scan result file obtained by scanning a wafer by a defect scanner station for a non-pattern wafer.

For example, the KLA-Tencor defect scanner of the national Lei company scans the wafer to form a particle map. And exporting the particle map to obtain the scanning result file.

The scan result file may include defect scan results for one or more wafers. The defect scanner scans one or more wafers at a time to form one or more scanning results, and forms a scanning result file for one scanning result or for all wafers of a Lot of Lot.

In the embodiment, the defect information may be presented in a defect MAP (MAP) manner. Fig. 2 is a schematic diagram showing a distribution of defect scanning results according to an embodiment of the present application. The number of defects, the size of the defects, and the location of the defects can be read from the defect MAP (MAP) in the figure. For example, common defects include large particle defects, small particle defects, and the like.

In the actual production and processing process, the wafer scanning results are analyzed, so that the problems of corresponding machines for processing the wafers can be known, and the existing problems can be solved quickly.

Because the original defect scanning result file is only stored locally in the defect scanning machine, when the defect scanning machine accumulates more files or fails, the scanning result file is searched with great trouble.

In an embodiment of the present application, the step S101 further includes: and setting the obtained scanning result file as a shared file for real-time capture and processing.

In this embodiment, by setting the shared file, other terminals or remote servers can capture the file in real time, so as to achieve the purpose of real-time processing.

It should be noted that the processing here is mainly a simple operation processing in an earlier stage, for example, by looking up a scanning result file, it is determined in advance whether the scanning result is normal or not, and whether the content of the file is normal or not, so as to prompt to re-perform defect scanning in time. For example, there are cases where display is not possible, problems arise during scanning, scanning result files cannot be read, and the like.

In this embodiment, the method of the present application may set automatic loop operation, capture and process the defect scan result file in real time, and store the defect scan result file in the database for a long time, so as to achieve the purpose of querying the current scan result and the historical scan result in real time.

Step S102: and converting the scanning result file into a text file, and correcting the defect information in the text file.

It should be noted that the obtained scan result file cannot completely read out the defect information, even an unreadable file, and in order to store the file containing the defect information, the file needs to be converted into a readable text file. The converted result file is, for example, a txt format file, the content of which is similar to excel, the first row is the column name, and each row displays one piece of defect information.

Simply speaking, it is backed up, but the backup will necessarily occupy extra memory, so it is converted into a text file with smaller memory.

In this embodiment, the conversion of the scan result file can be performed by using a file conversion software applied in the field of defect scanning for patterned wafers, such as a file conversion software designed by KLA series of u.s.a. of the science and technology corporation for defect scanning for patterned wafers. Alternatively, the conversion can be performed through file software which is designed autonomously based on a defect scanning machine.

However, the defect information contained in the text file converted in the above manner is not complete or erroneous, and there is no software or technology for converting the scan result file of the non-pattern wafer. Therefore, the defect information in the converted text file needs to be supplemented, modified or restored.

In an embodiment of the present application, the converted text file includes defect coordinate information, but lacks defect size information and defect number information, and lacks ID information of a corresponding wafer.

In order to facilitate subsequent inquiry of the scanning result of any wafer, the information of each wafer needs to be matched with the wafer in the scanning result in the method.

In an embodiment of the present application, step S102 includes, for the lack of ID information of a corresponding wafer:

adding ID information corresponding to each wafer aiming at the scanning result file so as to match the defect information corresponding to each wafer; the ID information includes: wafer Lot ID information and wafer ID information.

Specifically, before conversion, ID information corresponding to each wafer is added to the scan result file.

The wafer Lot is a batch of wafers, for example, a wafer Lot includes 25 wafers.

In an embodiment of the present application, the method for acquiring ID information includes:

A. and extracting the time stamp information scanned corresponding to each wafer in the scanning result file, and obtaining the ID information corresponding to each wafer according to the arrangement sequence or the scanning sequence of each wafer.

In an embodiment, the obtaining method is based on an EAP operation mode, and the obtained scanning result file includes timestamp information corresponding to each wafer to be scanned. For example, at 9: 00 scans for the first time, 9: 05 scans the list of secondary equal-time information. Correspondingly, the ID information of each wafer corresponding to the scanning result file can be matched by recording the scanning sequence or the scanning sequence of each wafer.

Or B, directly providing the ID information corresponding to the wafer according to manual work.

In another embodiment, the acquisition method is based on a manual operation mode, wherein a technician enters wafer lot ID and wafer ID information.

When the scanning result is abnormal, an engineer can only inquire the particle value of the wafer and cannot check the distribution and specific size of the defects on the wafer, so that the defect information of each wafer corresponding to the scanning result file needs to be processed to a certain extent.

In an embodiment, the method of the application needs to extract and restore required information from a scanning result file, and the scanning result file is stored in a specific manner after being converted into a readable text; therefore, it needs to be judged and processed according to the rule.

In an embodiment of the present application, for the lack of ID information of the corresponding wafer, step S102 further includes:

A. and determining each defect in the defect information as a large-particle defect or a small-particle defect according to the converted numerical information in the text file.

In one embodiment, whether the converted CLASSNUMBER column value in this document is 1 or not is used to determine whether the converted CLASSNUMBER column value is a small particle defect, wherein 1 is a small particle, and 1 is not a large particle.

B. Converting the defect size information corresponding to each defect in the text file into a real size according to a conversion formula; the conversion formula includes: (XSIZE 10-32768)/100.

In one embodiment, the transformation file contains Xsize, Ysize, DEFECTAREA and Dsize columns, but the values are not actual defect sizes, but instead a transformation using Xsize column values via a fixed formula is required to obtain the actual defect size, specifically, the transformation formula includes: (XSIZE 10-32768)/100. In the method, the real value is written into a DSIZE column (diameter size) for subsequent systems to use.

In addition, the large particle defects in the scanning result of the machine have only particle number and no specific defect size, so that a specific numerical value cannot be obtained in the method, and the size of the large particle defects is fixedly defined as 999, which represents the numerical value.

For example, the conversion formula includes two ways, a way one and a way two, which are two methods for two different machines, and are not two conversion ways for the same file:

the first method is as follows: and counting the defects with the value of 1 in the CLASSNUMBER column according to the text file, namely confirming that the corresponding defects are small-particle defects and obtaining the number of the small-particle defects. Correspondingly, the DSIZE (defect diameter) value in the text file is converted by calculation of a formula (XSIZE 10-32768)/1000 to obtain the real small-particle defect size; and counting the defects with the value not 1 in the CLASSNUMBER column, namely confirming that the corresponding defects are large-grain defects and obtaining the number of the large-grain defects. Since there is no specific defect size value for large-sized defects in the original scan result file, their DSIZE (defect diameter) is uniformly rewritten to 999.

The second method comprises the following steps: calculating DSIZE (defect diameter) in the text file through a formula (XSIZE x 10-32768)/1000, and when the converted value is not 0, confirming that the corresponding defect is a small-particle defect and obtaining the number of the small-particle defects, and the converted value is the defect size; and the number of terms with a calculated value of 0 is rewritten to 999, which corresponds to the number of large particle defects.

In some cases, because the unpatterned wafer has no pattern, the correspondence between the defect distribution map and the wafer direction cannot be determined in some cases, and therefore, a method for accurately determining the correspondence between the defect distribution map and the wafer direction is also needed. The specific method comprises the following steps:

in an embodiment of the present application, the step S102 further includes:

A. detecting the notch condition of each wafer before scanning the defects of each wafer;

B. searching whether the scanning result file contains notch detection information corresponding to each wafer;

C. if yes, judging the direction followed by the defect information according to the notch detection information; and if not, judging that the direction followed by the defect information is uncertain.

Specifically, most wafers have a small notch or straight boundary on the wafer to facilitate the orientation of the wafer.

For example, a notch (notch) is set before each scan, and a save option is set as a scan result file of an extended mode, and a path is a machine local folder or is saved in association with a defect scan result file.

After defect scanning is finished, detecting whether a [ Sample organization Mark Type NOTCH exists in a scanning result file; recording, if existing, the wafer MAP (profile) direction can be judged to be downward; if not, the wafer gap is not detected before scanning, and the direction of the defect MAP is uncertain.

In an embodiment of the present application, the modified text file is uploaded for real-time query.

And finally, importing the corrected result file into the existing defect management system database to realize webpage end query.

In some embodiments, the method described in this application may be implemented by performing corresponding program settings on an existing defect management system: storing each wafer scanning result file to a machine hard disk, capturing the scanning result file by a remote server, inquiring a wafer lot ID and a wafer ID corresponding to the wafer scanning time by using the uniqueness of the wafer scanning time in the file, writing the two IDs into the wafer scanning result file, converting the wafer scanning result file into a text format file, converting the data value of the defect size according to a fixed condition formula, and finally storing the converted data value into a defect management system database to realize real-time inquiry of a webpage end and completely restore the wafer scanning result information (defect distribution and size).

In summary, the method can automatically process in real time, and solve the problem of artificial error rate; the database records the scanning result, and solves the problems of timeliness and storage limitation of the paper book record; the webpage system queries in real time and historically, and solves the problems of low speed and complex process of querying paper records; the defect distribution and the defect size of the wafer are completely recorded and restored, and the analysis of the problem of the specific distribution or the directional defects is facilitated.

Fig. 3 is a block diagram of an electronic device according to an embodiment of the present invention. As shown, the apparatus 300 includes:

an obtaining module 301, configured to obtain a scan result file including defect information of one or more wafers;

the processing module 302 is configured to convert the scan result file into a text file, and correct the defect information in the text file.

It should be noted that, because the contents of information interaction, execution process, and the like between the modules/units of the apparatus are based on the same concept as the method embodiment described in the present application, the technical effect brought by the contents is the same as the method embodiment of the present application, and specific contents may refer to the description in the foregoing method embodiment of the present application, and are not described herein again.

It should be further noted that the division of the modules of the above apparatus is only a logical division, and the actual implementation may be wholly or partially integrated into one physical entity, or may be physically separated. And these units can be implemented entirely in software, invoked by a processing element; or may be implemented entirely in hardware; and part of the modules can be realized in the form of calling software by the processing element, and part of the modules can be realized in the form of hardware. For example, the processing module 302 may be a separate processing element, or may be integrated into a chip of the apparatus, or may be stored in a memory of the apparatus in the form of program code, and a processing element of the apparatus calls and executes the functions of the processing module 302. Other modules are implemented similarly. In addition, all or part of the modules can be integrated together or can be independently realized. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, each step of the above method or each module above may be implemented by an integrated logic circuit of hardware in a processor element or an instruction in the form of software.

For example, the above modules may be one or more integrated circuits configured to implement the above methods, such as: one or more Application Specific Integrated Circuits (ASICs), or one or more microprocessors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs), among others. For another example, when one of the above modules is implemented in the form of a Processing element scheduler code, the Processing element may be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. For another example, these modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).

Fig. 4 is a schematic diagram of a computer system according to an embodiment of the present invention. As shown, the computer system 400 includes: a memory 401, a processor 402, and a communicator 403; the memory 401 is used for storing computer instructions; the processor 402 executes computer instructions to implement the method described in fig. 1. The communicator 403 communicates with an external device.

For example, the external device may be a defect scanning tool. The computer system 400 may be a defect scan management system.

In some embodiments, the number of the memories 401 in the computer system 400 may be one or more, the number of the processors 402 may be one or more, the number of the communicators 403 may be one or more, and fig. 4 illustrates one example.

In an embodiment of the present application, the processor 402 in the computer system 400 loads one or more instructions corresponding to processes of an application program into the memory 401 according to the steps described in fig. 1, and the processor 402 executes the application program stored in the memory 401, thereby implementing the method described in fig. 1.

The Memory 401 may include a Random Access Memory (RAM), and may also include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. The memory 401 stores an operating system and operating instructions, executable modules or data structures, or a subset thereof, or an expanded set thereof, wherein the operating instructions may include various operating instructions for implementing various operations. The operating system may include various system programs for implementing various basic services and for handling hardware-based tasks.

The Processor 402 may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the Integrated Circuit may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, or a discrete hardware component.

The communicator 403 is used to implement communication connection between the database access device and other devices (such as a client, a read-write library, and a read-only library). The communicator 303 may include one or more sets of modules for different communication modes, for example, a CAN communication module communicatively connected to a CAN bus. The communication connection may be one or more wired/wireless communication means and combinations thereof. The communication method comprises the following steps: any one or more of the internet, CAN, intranet, Wide Area Network (WAN), Local Area Network (LAN), wireless network, Digital Subscriber Line (DSL) network, frame relay network, Asynchronous Transfer Mode (ATM) network, Virtual Private Network (VPN), and/or any other suitable communication network. For example: any one or a plurality of combinations of WIFI, Bluetooth, NFC, GPRS, GSM and Ethernet.

In some specific applications, the various components of the computer system 400 are coupled together by a bus system that may include a power bus, a control bus, a status signal bus, etc., in addition to a data bus. But for clarity of explanation the various busses are shown in fig. 4 as a bus system.

In an embodiment of the present application, a non-transitory computer-readable storage medium is provided, on which a computer program is stored, which when executed by a processor implements the method described in fig. 1.

The computer-readable storage medium, as will be appreciated by one of ordinary skill in the art: the embodiment for realizing the functions of the system and each unit can be realized by hardware related to computer programs. The aforementioned computer program may be stored in a computer readable storage medium. When the program is executed, the embodiment including the functions of the system and the units is executed; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.

In summary, the defect scan result processing method, apparatus, system and storage medium provided by the present application obtain a scan result file containing defect information of one or more wafers; and converting the scanning result file into a text file, and correcting the defect information in the text file.

The application effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the invention. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present application.

Claims

1. A method for processing defect scan results, the method comprising:

acquiring a scanning result file containing defect information of one or more wafers;

and converting the scanning result file into a text file, and correcting the defect information in the text file.

2. The method of claim 1, wherein the defect information comprises: and any one or more of defect size information, defect coordinate information and defect number information are combined.

3. The method of claim 1, wherein the method of converting the scan result file into a text file further comprises: adding ID information corresponding to each wafer aiming at the scanning result file so as to match the defect information corresponding to each wafer; the ID information includes: wafer Lot ID information and wafer ID information.

4. The method according to claim 3, wherein the method for acquiring the ID information comprises:

extracting timestamp information scanned corresponding to each wafer in the scanning result file, and obtaining ID information corresponding to each wafer according to the arrangement sequence or the scanning sequence of each wafer;

or, directly providing the ID information corresponding to the wafer according to manual work.

5. The method of claim 1, further comprising: setting the obtained scanning result file as a shared file for real-time capture and processing; and/or uploading the corrected text file for real-time query.

6. The method according to claim 2, wherein the method of modifying the defect information in the text file comprises:

determining whether each defect in the defect information is a large-particle defect or a small-particle defect according to the converted numerical information in the text file;

converting the defect size information corresponding to each defect in the text file into a real size according to a conversion formula; the conversion formula includes: (XSIZE 10-32768)/100.

7. The method of claim 1, wherein the method of modifying the defect information in the text file further comprises:

detecting the notch condition of each wafer before defect scanning is carried out on each wafer;

searching whether the scanning result file formed after defect scanning contains notch detection information corresponding to each wafer;

if yes, judging the direction followed by the defect information according to the notch detection information; and if not, judging that the direction followed by the defect information is uncertain.

8. An electronic device, the device comprising:

the system comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring a scanning result file containing defect information of one or more wafers;

and the processing module is used for converting the scanning result file into a text file and correcting the defect information in the text file.

9. A computer system, the system comprising: a memory, a processor, and a communicator; the memory is to store computer instructions; the processor executes computer instructions to implement the method of any one of claims 1 to 7; the communicator is used for communicating with the outside.

10. A non-transitory computer-readable storage medium having stored thereon computer instructions which, when executed, perform the method of any one of claims 1 to 7.