CN112416098A - Computer heat abstractor and control system thereof - Google Patents
Computer heat abstractor and control system thereof Download PDFInfo
- Publication number
- CN112416098A CN112416098A CN202011273407.3A CN202011273407A CN112416098A CN 112416098 A CN112416098 A CN 112416098A CN 202011273407 A CN202011273407 A CN 202011273407A CN 112416098 A CN112416098 A CN 112416098A
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- Prior art keywords
- frame
- fixedly connected
- heat dissipation
- inner cavity
- computer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a computer heat dissipation device and a control system thereof, and the computer heat dissipation device comprises a mounting plate, wherein the surface of the mounting plate is fixedly connected with a semiconductor refrigeration sheet, the top of the mounting plate is fixedly connected with an upper sealing frame, the bottom of the mounting plate is fixedly connected with an air cooling bin, the bottom of the inner cavity of the air cooling bin is fixedly connected with a second temperature sensor, the two sides of the bottom of the inner cavity of the air cooling bin are communicated with air outlet frames, and the inner cavity of the air outlet frame is fixedly connected with the. According to the invention, through the use of the upper sealing frame, the communicating pipe, the copper heat dissipation frame, the water inlet pipe, the driving frame, the guide pipe and the water pump, the equipment can achieve a function of good cooling effect, so that the heat dissipation effect of the equipment on the CPU of the computer is better, and the problems that the computer heat dissipation device and the control system thereof in the existing market do not have a function with high intelligent degree, the heat dissipation cannot be accurately controlled, the use effect of the computer is influenced, the normal use of the computer is influenced due to overhigh temperature, and the energy consumption of the equipment is increased due to overlow temperature are solved.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a computer heat dissipation device and a control system thereof.
Background
The evolution of the computing tool goes through different stages from simple to complex and from low level to high level, such as from knotting in' knotting and recording to calculating, abacus calculating rule, mechanical computer, etc., which play their respective historical roles in different historical periods and inspire the development idea of modern electronic computers, commonly called computers, which are modern electronic computing machines for high-speed computing, can perform numerical computation and logic computation, also have memory function, can be operated according to programs, are modern intelligent electronic devices for automatically and high-speed processing mass data, are composed of hardware systems and software systems, and the computer without any software is called a bare computer, and can be divided into five types, namely a super computer, an industrial control computer, a network computer, a personal computer and an embedded computer, and the more advanced computer has a biological computer, Photon computer, quantum computer, etc., the computer is one of the most advanced scientific technology inventions of 20 th century, have produced the very important influence to human production activity and social activity, and develop rapidly with powerful vitality, its application field expands from the first military scientific research application to each field of society, have formed the computer industry of enormous scale, has brought the technological progress of the global scale, have initiated the profound social transformation, the computer has spread over general school, enterprise and public institution, enter the ordinary family, become the indispensable tool in the information society.
Along with the progress of times and the development of science and technology, computers gradually enter thousands of households, the important use performance of the computer as heat dissipation of the computer is valued by people, the computer heat dissipation device and the control system thereof in the existing market do not have the function with high intelligent degree, the heat dissipation cannot be accurately controlled, the use effect of the computer is influenced, the normal use of the computer is influenced due to overhigh temperature, and the energy consumption of equipment is increased due to overlow temperature.
Disclosure of Invention
The invention aims to provide a computer heat dissipation device and a control system thereof, which have the advantage of high intelligent degree, and solve the problems that the computer heat dissipation device and the control system thereof in the existing market do not have the function of high intelligent degree, the heat dissipation can not be accurately controlled, the use effect of a computer is influenced, the normal use of the computer is influenced due to overhigh temperature, and the energy consumption of equipment is increased due to overlow temperature.
In order to achieve the purpose, the invention provides the following technical scheme: a computer heat dissipation device comprises a mounting plate, wherein a semiconductor refrigeration sheet is fixedly connected to the surface of the mounting plate, an upper sealing frame is fixedly connected to the top of the mounting plate, an air cooling bin is fixedly connected to the bottom of the mounting plate, a second temperature sensor is fixedly connected to the bottom of an inner cavity of the air cooling bin, air outlet frames are communicated with two sides of the bottom of the inner cavity of the air cooling bin, an inner cavity of the air outlet frame is fixedly connected with a mounting frame, a motor is fixedly connected to the inner cavity of the mounting frame, a rotary rod is fixedly connected to the output end of the motor, a fan blade is fixedly connected to the bottom of the rotary rod, a frequency converter is fixedly connected to the top of the right side of the inner cavity of the air outlet frame, mounting rods are fixedly connected to two sides of the top of the upper sealing frame, a copper heat dissipation frame is fixedly, the left side of the upper sealing frame is communicated with a communicating pipe, the top of the communicating pipe is communicated with the joint of the copper heat dissipation frame, the right side of the upper sealing frame is fixedly connected with a driving frame, the left side of the inner cavity of the driving frame is fixedly connected with a water pump, the top of the water pump is communicated with a water inlet pipe, the top of the water inlet pipe penetrates through the driving frame and is communicated with the joint of the copper heat dissipation frame, the bottom of the water pump is communicated with a guide pipe, one side, away from the water pump, of the guide pipe is communicated with the joint of the upper sealing frame, the top of the right side of the inner cavity of the driving frame is fixedly connected with a controller, and the bottom of the inner.
Preferably, the two sides of the copper heat dissipation frame are fixedly connected with mounting pieces, and mounting holes are formed in the surfaces of the mounting pieces.
Preferably, air inlets are formed in two sides of an inner cavity of the air cooling bin, and a protective net is fixedly connected to the inner cavity of each air inlet.
Preferably, a wiring hole is formed in the right side of the inner cavity of the driving frame, and a protective ring is fixedly connected to the inner cavity of the wiring hole.
Preferably, the surfaces of the mounting plate, the upper sealing frame and the air cooling bin are coated with antirust coatings, and the antirust coatings are aluminum-containing compound coatings.
Preferably, the inner cavities of the upper sealing frame and the copper radiating frame are filled with cooling water, the upper sealing frame and the copper radiating frame are both in a sealing design, an opening is formed in the back face of the upper sealing frame, and the inner cavity of the opening is in threaded connection with a sealing cover.
Preferably, the number of the semiconductor refrigeration pieces is seven, and the semiconductor refrigeration pieces are rectangular pieces.
Preferably, the output end of the first temperature sensor is electrically connected with the input end of the controller in a one-way mode, the output end of the second temperature sensor is electrically connected with the input end of the controller in a one-way mode, the output end of the controller is electrically connected with the input end of the rheostat in a two-way mode, the output end of the rheostat is electrically connected with the input end of the semiconductor refrigeration piece in a one-way mode, the output end of the controller is electrically connected with the input end of the frequency converter in a two-way mode, and the output end of the frequency converter is electrically connected with the input end of the motor in a one-way mode.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention can make the equipment achieve the function of good cooling effect through the use of the upper sealing frame, the communicating pipe, the copper heat dissipation frame, the water inlet pipe, the driving frame, the guide pipe and the water pump, and make the equipment have better heat dissipation effect on the CPU of the computer.
2. Through the use of the mounting pieces and the arrangement of the mounting holes, a user can mount and fix the equipment more conveniently, and the equipment and the CPU are convenient to be attached and radiate;
through the use of the protective net, the danger caused by the mistaken collision of a user can be effectively avoided, meanwhile, sundries are prevented from entering the inner cavity of the equipment, and the safety of the equipment in use is guaranteed;
through the arrangement of the wiring hole and the use of the protective ring, the power utilization of the equipment can be more convenient, and the electrical connection operation of a user is facilitated;
by using the antirust coating, the phenomenon that the equipment is corroded to influence the use when in use can be effectively avoided, and the service life of the equipment is prolonged;
by the opening and the sealing cover, a user can replace the cooling water in the inner cavity of the equipment conveniently at regular intervals, the operation and the use of the user are facilitated, and the service life of the equipment is prolonged;
the refrigerating contact surface of the semiconductor refrigerating pieces can be larger by determining the using number and the using shape of the semiconductor refrigerating pieces, and the refrigerating efficiency of the equipment is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of a drive frame of the present invention;
FIG. 3 is a sectional view of an air outlet frame according to the present invention;
fig. 4 is a schematic diagram of the system of the present invention.
In the figure: 1. mounting a plate; 2. an upper sealing frame; 3. a communicating pipe; 4. mounting a rod; 5. a first temperature sensor; 6. a copper heat dissipation frame; 7. mounting a sheet; 8. a water inlet pipe; 9. a drive frame; 10. a conduit; 11. an antirust coating; 12. a protective net; 13. air cooling; 14. a second temperature sensor; 15. a semiconductor refrigeration sheet; 16. an air outlet frame; 17. an air inlet; 18. a water pump; 19. a controller; 20. a wiring hole; 21. a varistor; 22. a motor; 23. installing a frame; 24. a frequency converter; 25. rotating the rod; 26. a fan blade.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The mounting plate 1, the upper sealing frame 2, the communicating pipe 3, the mounting rod 4, the first temperature sensor 5, the copper heat dissipation frame 6, the mounting plate 7, the water inlet pipe 8, the driving frame 9, the guide pipe 10, the antirust coating 11, the protective net 12, the air cooling bin 13, the second temperature sensor 14, the semiconductor refrigeration sheet 15, the air outlet frame 16, the air inlet 17, the water pump 18, the controller 19, the wiring hole 20, the rheostat 21, the motor 22, the mounting frame 23, the frequency converter 24, the rotating rod 25 and the fan blade 26 are all universal standard parts or parts known by those skilled in the art, and the structure and principle of the mounting plate are known by the technical manual or known by the conventional experimental method.
Referring to fig. 1-4, a computer heat dissipation device comprises a mounting plate 1, a semiconductor refrigeration sheet 15 fixedly connected to the surface of the mounting plate 1, an upper sealing frame 2 fixedly connected to the top of the mounting plate 1, an air cooling chamber 13 fixedly connected to the bottom of the mounting plate 1, a second temperature sensor 14 fixedly connected to the bottom of the inner chamber of the air cooling chamber 13, air outlet frames 16 respectively communicated with the two sides of the bottom of the inner chamber of the air cooling chamber 13, a mounting frame 23 fixedly connected to the inner chamber of the air outlet frame 16, a motor 22 fixedly connected to the inner chamber of the mounting frame 23, a rotary rod 25 fixedly connected to the output end of the motor 22, a fan blade 26 fixedly connected to the bottom of the rotary rod 25, a frequency converter 24 fixedly connected to the top of the right side of the inner chamber of the air outlet frame 16, mounting rods 4 fixedly connected to the two sides of the top of the upper sealing frame 2, a copper heat dissipation frame 6, go up the left side intercommunication of sealed frame 2 and have communicating pipe 3, the top of communicating pipe 3 is linked together with the junction of copper heat dissipation frame 6, the right side fixedly connected with drive frame 9 of going up sealed frame 2, the left side fixedly connected with water pump 18 of drive frame 9 inner chamber, the top intercommunication of water pump 18 has inlet tube 8, the top of inlet tube 8 is run through drive frame 9 and is linked together with the junction of copper heat dissipation frame 6, the bottom intercommunication of water pump 18 has pipe 10, one side that water pump 18 was kept away from to pipe 10 is linked together with the junction of last sealed frame 2, the top fixedly connected with controller 19 on drive frame 9 inner chamber right side, the bottom fixedly connected with rheostat 21 of drive frame 9 inner chamber.
In this embodiment, specifically, the equal fixedly connected with installation piece 7 in both sides of copper heat dissipation frame 6, the mounting hole has been seted up on the surface of installation piece 7, through the use of installation piece 7 and the seting up of mounting hole, can make things convenient for the user to install equipment more fixedly, and the equipment of being convenient for is laminated with CPU and is dispeled the heat.
In this embodiment, specifically, air intake 17 has all been seted up to the both sides of air-cooled storehouse 13 inner chamber, and air intake 17's inner chamber fixedly connected with protection network 12 through the use of protection network 12, can effectively avoid the user mistake to bump and take place danger, also avoids debris to get into the equipment inner chamber simultaneously, has ensured the security when equipment uses.
In this embodiment, specifically, the right side of the inner cavity of the driving frame 9 is provided with the wiring hole 20, the inner cavity fixedly connected with guard ring of the wiring hole 20, and the wiring hole 20 is provided and the guard ring is used, so that the power utilization of the equipment and the electric connection operation of the user can be more convenient.
In this embodiment, it is concrete, the surface of mounting panel 1, last sealing frame 2 and forced air cooling storehouse 13 has all been scribbled and has been smeared antirust coating 11, and antirust coating 11 is aluminiferous compound cladding material, through antirust coating 11's use, can effectively avoid equipment the phenomenon that the rust appears and influence the use when using, has promoted the life of equipment.
In this embodiment, it is concrete, the inner chamber of going up sealed frame 2 and copper heat dissipation frame 6 all fills there is the cooling water, it is sealed design to go up sealed frame 2 and copper heat dissipation frame 6, the opening mouth has been seted up at the back of going up sealed frame 2, and the inner chamber threaded connection of opening mouth has sealed lid, through opening the mouth and the use of seting up of sealed lid, can more the person of facilitating the use regularly change the cooling water of equipment inner chamber, convenient to use person's operation is used, the life of equipment has been promoted.
In this embodiment, specifically, the number of the semiconductor refrigeration pieces 15 is seven, the shape of the semiconductor refrigeration pieces 15 is a rectangular sheet, and the refrigeration contact surface of the semiconductor refrigeration pieces 15 can be larger by determining the number and the shape of the semiconductor refrigeration pieces 15, so that the refrigeration efficiency of the equipment is improved.
The output end of a first temperature sensor 5 is unidirectionally and electrically connected with the input end of a controller 19, the output end of a second temperature sensor 14 is unidirectionally and electrically connected with the input end of the controller 19, the output end of the controller 19 is bidirectionally and electrically connected with the input end of a rheostat 21, the output end of the rheostat 21 is unidirectionally and electrically connected with the input end of a semiconductor refrigerating sheet 15, the output end of the controller 19 is bidirectionally and electrically connected with the input end of a frequency converter 24, and the output end of the frequency converter 24 is unidirectionally and electrically connected with the input end of a motor 22.
When the device is used, the copper heat dissipation frame 6 is tightly attached to a CPU to complete installation, the CPU is subjected to heat dissipation operation through cooling water in the inner cavity of the copper heat dissipation frame 6, the temperature of the cooling water is increased after the cooling water absorbs heat generated by the CPU, the water with the increased temperature is pumped into the inner cavity of the upper sealing frame 2 along the water inlet pipe 8 and the guide pipe 10 by starting the water pump 18, the heat in the water is absorbed by refrigeration of the refrigeration end of the semiconductor refrigeration sheet 15 to complete cooling, the water enters the inner cavity of the copper heat dissipation frame 6 along the communicating pipe 3 to carry out circulating refrigeration, the rotating rod 25 is driven to rotate by starting the motor 22, the air fan blade 26 is driven to rotate by rotation of the rotating rod 25, wind energy generated by rotation of the fan blade 26 is discharged from the heating end of the semiconductor refrigeration sheet 15 in the inner cavity of the air cooling bin 13, outside air enters the inner cavity of the air cooling bin 13 along the air inlet 17 to complete circulation, and the surface temperature of, the temperature of the surface of the copper heat dissipation frame 6 exceeds the preset temperature, which means that the refrigeration of the refrigeration end of the semiconductor refrigeration piece 15 can not meet the heat dissipation use of the CPU, the rheostat 21 is adjusted by the controller 19, the current in the circuit is increased, the refrigeration capacity of the semiconductor refrigeration piece 15 is improved, the cooling effect of water is better, the refrigeration efficiency of the copper heat dissipation frame 6 on the CPU is further improved, the temperature of the inner cavity of the air cooling bin 13 is sensed by the second temperature sensor 14, the temperature exceeds the preset value, which means that the heat dissipation of the refrigeration end of the semiconductor refrigeration piece 15 is slower, which affects the normal use of the semiconductor refrigeration piece 15, the frequency converter 24 is adjusted by the controller 19, the rotating speed of the motor 22 is improved, the rotating speed of the fan blade 26 is improved, the heat dissipation capacity of the fan blade 26 on the semiconductor refrigeration piece 15 is improved, otherwise, if the temperature sensed by the first temperature sensor 5 is lower than, the refrigeration resource is in an excess state at the moment, the rheostat 21 is adjusted through the controller 19, so that the current in the circuit is reduced, the refrigeration capacity of the semiconductor refrigeration piece 15 is reduced, the energy consumption of the equipment during operation is reduced, if the temperature sensed by the second temperature sensor 14 is lower than a preset value, the situation that the heat dissipation is too fast due to the too fast rotating speed of the motor 22 at the moment is represented, so that the resource waste exists, the rotating speed of the motor 22 is reduced through the frequency converter 24, the energy consumption of the equipment during operation is reduced, the refrigeration and the heat dissipation of the equipment are more intelligent through the cooperation between the sensors, the phenomenon that the monitoring cannot be carried out in the operation process is avoided, the resource is reasonably distributed and utilized, the intelligent use of the equipment is ensured, and through the cooperation of the structures, the problem that the existing computer heat dissipation device and the control system thereof in the market do, the unable accurate control of heat dissipation influences the result of use of computer, and the normal use of high temperature influence computer, the temperature crosses lowly and causes the problem of equipment energy consumption increase, is fit for using widely.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A computer heat sink, comprising a mounting plate (1), characterized in that: the surface fixed connection of mounting panel (1) has semiconductor refrigeration piece (15), the top fixedly connected with of mounting panel (1) goes up seal frame (2), the bottom fixedly connected with of mounting panel (1) wind storehouse (13), the bottom fixedly connected with second temperature sensor (14) of wind storehouse (13) inner chamber, the both sides of wind storehouse (13) inner chamber bottom all communicate out fan frame (16), the inner chamber fixedly connected with installing frame (23) of going out fan frame (16), the inner chamber fixedly connected with motor (22) of installing frame (23), the output fixedly connected with rotary rod (25) of motor (22), the bottom fixedly connected with fan leaf (26) of rotary rod (25), the top fixedly connected with converter (24) on play fan frame (16) inner chamber right side, the equal fixedly connected with erection rod (4) in both sides at last seal frame (2) top, the top fixedly connected with copper heat dissipation frame (6) of installation pole (4), the bottom fixedly connected with first temperature sensor (5) of copper heat dissipation frame (6), the left side intercommunication of going up sealed frame (2) has communicating pipe (3), the top of communicating pipe (3) is linked together with the junction of copper heat dissipation frame (6), the right side fixedly connected with drive frame (9) of going up sealed frame (2), the left side fixedly connected with water pump (18) of drive frame (9) inner chamber, the top intercommunication of water pump (18) has inlet tube (8), the top of inlet tube (8) runs through drive frame (9) and is linked together with the junction of copper heat dissipation frame (6), the bottom intercommunication of water pump (18) has pipe (10), one side that water pump (18) was kept away from to pipe (10) is linked together with the junction of last sealed frame (2), the top on the right side of the inner cavity of the driving frame (9) is fixedly connected with a controller (19), and the bottom of the inner cavity of the driving frame (9) is fixedly connected with a rheostat (21).
2. The heat dissipation device of claim 1, wherein: the copper heat dissipation frame is characterized in that mounting pieces (7) are fixedly connected to the two sides of the copper heat dissipation frame (6), and mounting holes are formed in the surfaces of the mounting pieces (7).
3. The heat dissipation device of claim 1, wherein: air inlets (17) are formed in two sides of the inner cavity of the air cooling bin (13), and protective nets (12) are fixedly connected to the inner cavities of the air inlets (17).
4. The heat dissipation device of claim 1, wherein: a wiring hole (20) is formed in the right side of the inner cavity of the driving frame (9), and a protective ring is fixedly connected to the inner cavity of the wiring hole (20).
5. The heat dissipation device of claim 1, wherein: the surface of the mounting plate (1), the upper sealing frame (2) and the air cooling bin (13) is coated with an antirust coating (11), and the antirust coating (11) is an aluminum-containing compound coating.
6. The heat dissipation device of claim 1, wherein: the cooling water is filled in the inner cavities of the upper sealing frame (2) and the copper heat dissipation frame (6), the upper sealing frame (2) and the copper heat dissipation frame (6) are both in a sealing design, an opening is formed in the back face of the upper sealing frame (2), and the inner cavity of the opening is in threaded connection with a sealing cover.
7. The heat dissipation device of claim 1, wherein: the number of the semiconductor refrigeration pieces (15) is seven, and the shape of the semiconductor refrigeration pieces (15) is a rectangular sheet shape.
8. A control system of a computer heat dissipation device is characterized in that: the output end of the first temperature sensor (5) is unidirectionally and electrically connected with the input end of the controller (19), the output end of the second temperature sensor (14) is unidirectionally and electrically connected with the input end of the controller (19), the output end of the controller (19) is bidirectionally and electrically connected with the input end of the rheostat (21), the output end of the rheostat (21) is unidirectionally and electrically connected with the input end of the semiconductor refrigeration piece (15), the output end of the controller (19) is bidirectionally and electrically connected with the input end of the frequency converter (24), and the output end of the frequency converter (24) is unidirectionally and electrically connected with the input end of the motor (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011273407.3A CN112416098A (en) | 2020-11-13 | 2020-11-13 | Computer heat abstractor and control system thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011273407.3A CN112416098A (en) | 2020-11-13 | 2020-11-13 | Computer heat abstractor and control system thereof |
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| Publication Number | Publication Date |
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| CN112416098A true CN112416098A (en) | 2021-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011273407.3A Pending CN112416098A (en) | 2020-11-13 | 2020-11-13 | Computer heat abstractor and control system thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205376028U (en) * | 2016-01-12 | 2016-07-06 | 深圳Tcl数字技术有限公司 | Display |
| CN205960941U (en) * | 2016-08-24 | 2017-02-15 | 新疆奇电东升电子科技有限公司 | Heat dissipation intelligent regulation converter |
| WO2017036283A1 (en) * | 2015-09-02 | 2017-03-09 | 柳熠 | Semiconductor refrigerating device for circulation cooling system |
| CN206470744U (en) * | 2017-02-27 | 2017-09-05 | 河南广播电视大学 | A kind of computer safety monitoring device |
| CN207249983U (en) * | 2017-06-27 | 2018-04-17 | 大连海洋大学 | Semiconductor refrigerating experimental system |
| CN209525623U (en) * | 2019-05-14 | 2019-10-22 | 武汉纺织大学 | Computer fast cooling water cooling cabinet |
-
2020
- 2020-11-13 CN CN202011273407.3A patent/CN112416098A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017036283A1 (en) * | 2015-09-02 | 2017-03-09 | 柳熠 | Semiconductor refrigerating device for circulation cooling system |
| CN205376028U (en) * | 2016-01-12 | 2016-07-06 | 深圳Tcl数字技术有限公司 | Display |
| CN205960941U (en) * | 2016-08-24 | 2017-02-15 | 新疆奇电东升电子科技有限公司 | Heat dissipation intelligent regulation converter |
| CN206470744U (en) * | 2017-02-27 | 2017-09-05 | 河南广播电视大学 | A kind of computer safety monitoring device |
| CN207249983U (en) * | 2017-06-27 | 2018-04-17 | 大连海洋大学 | Semiconductor refrigerating experimental system |
| CN209525623U (en) * | 2019-05-14 | 2019-10-22 | 武汉纺织大学 | Computer fast cooling water cooling cabinet |
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