CN112409798B - High-thermal-conductivity gasket and preparation method thereof - Google Patents
High-thermal-conductivity gasket and preparation method thereof Download PDFInfo
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- CN112409798B CN112409798B CN202011205672.8A CN202011205672A CN112409798B CN 112409798 B CN112409798 B CN 112409798B CN 202011205672 A CN202011205672 A CN 202011205672A CN 112409798 B CN112409798 B CN 112409798B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The invention discloses a high-thermal-conductivity gasket with the density of 1.8-2.8g/cm3The composite material comprises a matrix and filling resin, wherein the matrix is selected from carbon fibers or graphite sheets, and the filling resin comprises the following components in parts by weight: 100 parts of vinyl silicone oil, 1200 parts of alumina 300-. The invention adopts a vacuum resin transfer process to inject the mixture of aluminum oxide or zinc oxide and liquid silicon rubber into the carbon fiber or graphite sheet for curing and forming, and reduces the gap between the resin mixture and the carbon fiber or graphite sheet as much as possible, so as to play a role in shaping and reducing the thermal resistance between the gaps of the carbon fiber or graphite sheet, thereby improving the overall thermal conductivity of the material.
Description
Technical Field
The invention relates to the field of heat conduction materials, in particular to a high-heat-conductivity gasket and a preparation method thereof.
Background
The heat conductivity coefficient of the traditional alumina heat-conducting gasket is 3-8W/m.K at present, the heat conductivity coefficient can only be improved to about 10W/m.K even if aluminum nitride with higher heat conductivity is adopted, and the prepared heat-conducting gasket has the defects of higher hardness, high density, lower strength, easy powder falling and the like. Therefore, research on fillers used in high thermal conductivity gaskets has focused on materials having high thermal conductivity in a uniaxial direction, such as carbon fiber, graphene, and boron nitride. Because the disordered accumulation of the fillers causes overlarge thermal contact resistance, the materials and the silica gel are simply blended and rolled to form, and the heat conduction gasket with higher heat conduction coefficient cannot be prepared.
Disclosure of Invention
Aiming at the problem of low heat conductivity coefficient of the conventional heat-conducting gasket, the invention provides a high heat-conducting gasket, and the density of the high heat-conducting gasket is 1.8-2.8g/cm3The composite material comprises a matrix and filling resin, wherein the matrix is selected from carbon fibers or graphite sheets, and the filling resin comprises the following components in parts by weight: 100 parts of vinyl silicone oil, 1200 parts of alumina 300-.
The catalyst used in the filled resin of the present invention is selected from platinum catalysts; the inhibitor is selected from alkynol inhibitor; the coupling agent is selected from hexadecyl trimethoxy silane.
The preparation of the high-thermal-conductivity gasket adopts a vacuum resin transfer process, the used equipment comprises a mould and vacuumizing equipment matched with a grinding tool, a plurality of groups of parallel grooves are arranged in the mould, a feed inlet is arranged at the bottom of the mould, a vacuumizing opening is arranged at the top of the mould, and the mould is matched with a cover plate to realize internal sealing. The preparation method comprises the following steps: 1) weighing the components of the filling resin according to the parts by weight, mixing and stirring for 0.5-2h at 15-50rpm to obtain the filling resin for later use; 2) processing the substrate into a shape matched with the groove, inserting the substrate into the groove, closing the cover plate, opening the vacuumizing equipment, pumping the filling resin obtained in the step 1) into the mold from the feeding hole, continuously vacuumizing for 15-90min, heating the mold to the temperature of 120-150 ℃, preserving heat for 15-45min, and taking out to obtain a gasket blank; 3) cutting the gasket blank material obtained in the step 2) into a required shape by a circular high-speed rotating blade which is vertical to the direction of the matrix fiber to obtain the gasket.
The carbon fiber used in the invention is long fiber continuous fiber, the heat conductivity coefficient is 450-800W/m.K, when the carbon fiber is arranged in an oriented mode, the carbon fiber is cut to be a proper length and is horizontally placed into a single groove in a mold, and the carbon fiber is horizontally stacked from the bottom of the single groove to be slightly lower than a vacuum pumping opening of the mold. The graphite flake is artificial graphite flake or natural graphite flake, the plane heat conductivity coefficient is 500-.
The high-thermal-conductivity gasket is characterized in that carbon fibers or graphite sheets with ultrahigh thermal conductivity in a uniaxial direction are orderly and directionally arranged in a die, and the filling amount of the carbon fibers or the graphite sheets is controlled by adjusting the gap of grooves of the die so as to adjust the thermal conductivity of a product and the hardness of the thermal-conductivity gasket; simultaneously, a mixture of aluminum oxide or zinc oxide and liquid silicone rubber is injected into carbon fibers or graphite flakes for curing and forming by adopting a vacuum resin transfer process, gaps between resin mixture and the carbon fibers or the graphite flakes are reduced as much as possible, so that the effects of sizing and reducing thermal resistance between gaps of the carbon fibers or the graphite flakes are achieved, the overall heat conductivity coefficient of the material is improved, finally, a circular high-speed rotating blade is adopted for cutting according to the required thickness along the direction perpendicular to the orientation direction, the material deformation and surface unevenness are avoided, the contact thermal resistance between the material and a heating element is reduced, and the circular knife cutting process can cut thin and thick sheets.
Drawings
Fig. 1 is a device for preparing a high thermal conductivity gasket according to the present invention, and each part is:
1. the mold comprises a mold body, 2, a cover plate, 3, a groove, 4, a feeding hole, 5 and a vacuumizing hole.
Detailed Description
The present invention is described below with reference to examples, which are provided for illustration only and are not intended to limit the scope of the present invention.
Example 1
A preparation method of a high thermal conductivity gasket comprises the following steps: shearing carbon fibers with the thermal conductivity of 800W/m.K to a proper length, horizontally putting the carbon fibers into a single groove in a mold, horizontally stacking the carbon fibers from the bottom of the single groove to a position slightly lower than a vacuumizing opening of the mold, and adding vinyl with the vinyl content of 1.20% of 50 mPa.s100 parts of silicone oil, 1 part of hydrogen-containing silicone oil with the hydrogen content of 50 mPa.s of 0.1%, 1 part of platinum catalyst, 0.5 part of alkynol inhibitor, 3 parts of hexadecyl trimethoxy silane coupling agent, 300 parts of aluminum oxide and 300 parts of zinc oxide, and mixing for 0.5h at 15rpm to obtain mixed resin; covering a mould cover plate, immersing the mixed resin into a feed inlet, vacuumizing through a vacuumizing port above the mould, vacuumizing until the resin is parallel to the vacuumizing port, closing a feed inlet valve, continuously vacuumizing for 15min, then closing the vacuum, heating to 120 ℃, curing and forming for 15min, taking out a cured and formed product, cutting by adopting a circular high-speed rotating blade according to the required thickness along the directional direction vertical to the carbon fiber, wherein the diameter of the circular high-speed rotating blade is 3mm, the thickness of the blade is 0.1mm, the rotating speed is 60rpm, and the density is 1.8g/cm3The high thermal conductivity gasket of (2) has a thermal conductivity of 20W/m.K.
Example 2
A preparation method of a high thermal conductivity gasket comprises the following steps: inserting a natural graphite sheet with a heat conductivity coefficient of 500W/m.K into a single groove, and mixing 100 parts of vinyl silicone oil with the vinyl content of 100 mPa.s of 0.8%, 10 parts of hydrogen silicone oil with the hydrogen content of 50 mPa.s of 0.1%, 5 parts of platinum catalyst, 2 parts of alkynol inhibitor, 8 parts of hexadecyl trimethoxy silane coupling agent, 1200 parts of alumina, 100 parts of zinc oxide at 15rpm for 2 hours to obtain mixed resin; covering a cover plate of the mold, immersing the mixed resin into the feed inlet, vacuumizing through a vacuumizing port above the mold, vacuumizing until the resin is parallel to the vacuumizing port, closing a valve of the feed inlet, continuously vacuumizing for 90min, then closing the vacuum, heating to 150 ℃, curing and molding for 45min, taking out a cured and molded product, cutting by adopting a circular high-speed rotating blade according to the required thickness along the direction vertical to the graphite sheet, wherein the diameter of the circular high-speed rotating blade is 10mm, the thickness of the blade is 0.2mm, the rotating speed is 200rpm, and the density is 2.8g/cm3The high thermal conductivity gasket of (2) has a thermal conductivity of 50W/m.K.
Example 3
A preparation method of a high thermal conductivity gasket comprises the following steps: inserting artificial graphite sheet with heat conductivity coefficient of 2300W/m.K into single groove, and adding resin with vinyl content of 0.5% of 500 mPa.s100 parts of vinyl silicone oil, 5 parts of hydrogen-containing silicone oil with the hydrogen content of 100mPa & s of 0.4%, 2 parts of platinum catalyst, 1 part of alkynol inhibitor, 5 parts of hexadecyl trimethoxy silane coupling agent, 800 parts of aluminum oxide, 200 parts of zinc oxide and mixed for 1h at 40rpm to obtain mixed resin; covering a cover plate of the mold, immersing the mixed resin into the feed inlet, vacuumizing through a vacuumizing port above the mold, vacuumizing until the resin is parallel to the vacuumizing port, closing a valve of the feed inlet, continuously vacuumizing for 45min, then closing the vacuum, heating to 130 ℃, curing and molding for 30min, taking out a cured and molded product, cutting by using a circular high-speed rotating blade according to the required thickness along the orientation direction perpendicular to the graphite flakes, wherein the diameter of the circular high-speed rotating blade is 15mm, the thickness of the blade is 0.15mm, the rotating speed is 100rpm, and the density is 2.3g/cm3The high thermal conductivity gasket of (2) has a thermal conductivity of 34W/m.K.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, which is intended to cover any modifications, equivalents, improvements, etc. within the spirit and scope of the present invention.
Claims (1)
1. A high thermal conductivity gasket with density of 1.8-2.8g/cm3The mold comprises a base body and filling resin, and is characterized in that the preparation method comprises a mold and a vacuumizing device matched with the mold, a plurality of parallel grooves are arranged in the mold, a feed inlet is arranged at the bottom of the mold, a vacuumizing hole is arranged at the top of the mold, and a cover plate matched with the mold is used for realizing internal sealing, and the mold comprises the following steps:
1) weighing 100 parts of vinyl silicone oil, 1200 parts of alumina 300-containing materials, 300 parts of zinc oxide 100-containing materials, 1-10 parts of hydrogen-containing silicone oil, 1-5 parts of catalyst, 0.5-2 parts of inhibitor and 3-8 parts of coupling agent according to parts by weight, mixing, and stirring at 15-50rpm for 0.5-2h to obtain filling resin for later use;
2) processing a matrix into a shape matched with the groove, when the matrix is carbon fiber, cutting the matrix into a proper length, horizontally placing the matrix into a single groove in a die, when the matrix is graphite flake, inserting the matrix into the single groove, closing a cover plate, opening a vacuumizing device, pumping the filling resin obtained in the step 1) into the die from a feed inlet, continuously vacuumizing for 15-90min, heating the die to 150 ℃ after continuously vacuumizing, preserving heat for 15-45min, and taking out to obtain a gasket blank;
3) cutting the gasket blank obtained in the step 2), and when the matrix is carbon fibers, cutting the gasket blank by using a circular high-speed rotating blade according to the required thickness along the direction vertical to the orientation direction of the carbon fibers, and when the matrix is graphite flakes, cutting the gasket blank by using a circular high-speed rotating blade according to the required thickness along the direction vertical to the graphite flakes to obtain the gasket blank;
the matrix is selected from carbon fibers or graphite flakes, the carbon fibers are long fiber continuous fibers, the heat conductivity coefficient is 450-800W/m.K, the graphite flakes are artificial graphite flakes or natural graphite flakes, and the planar heat conductivity coefficient is 500-2300W/m.K; the vinyl silicone oil has a vinyl content of 0.05-1.20% and a viscosity of 50-2000mPa & s; the hydrogen content of the hydrogen-containing silicone oil is 0.01-8%, and the viscosity is 10-500mPa & s; the catalyst is a platinum catalyst; the inhibitor is an alkynol inhibitor; the coupling agent is hexadecyl trimethoxy silane.
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Families Citing this family (5)
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CN113636853B (en) * | 2021-08-30 | 2022-08-19 | 江西宁新新材料股份有限公司 | Carbon fiber composite brake pad and preparation method thereof |
CN113851755B (en) * | 2021-09-18 | 2023-09-22 | 东软睿驰汽车技术(沈阳)有限公司 | Battery pack heat conduction pad coefficient determination method and device and electronic equipment |
CN114539779A (en) * | 2022-03-18 | 2022-05-27 | 东莞市盛元新材料科技有限公司 | Ultrahigh-temperature-resistant high-thermal-conductivity carbon fiber silica gel gasket and preparation method thereof |
CN114426774B (en) * | 2022-03-19 | 2023-06-20 | 南京冠旭新材料科技有限公司 | High-heat-conductivity gasket and preparation method thereof |
CN114940828A (en) * | 2022-06-30 | 2022-08-26 | 深圳市傲川科技有限公司 | Insulating high-thermal-conductivity film and preparation method thereof |
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CN110358302A (en) * | 2019-08-27 | 2019-10-22 | 宁波石墨烯创新中心有限公司 | A kind of heat-conducting silica gel sheet and preparation method thereof |
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CN102558876B (en) * | 2011-12-29 | 2013-09-25 | 深圳德邦界面材料有限公司 | Low-cost radiating silica gel sheet and preparation method thereof |
CN103113846B (en) * | 2013-03-12 | 2014-12-31 | 深圳市博恩实业有限公司 | Heat-conducting silica gel sheet and manufacturing method thereof |
CN108129847A (en) * | 2017-12-25 | 2018-06-08 | 广州旭川合成材料有限公司 | A kind of lightweight thermally-conductive sheet and its preparation method and application |
CN108690355B (en) * | 2018-06-26 | 2021-05-14 | 浙江三元电子科技有限公司 | Flexible heat conduction sheet and preparation method thereof |
CN111777994B (en) * | 2020-07-14 | 2022-08-26 | 广东陆祥新材料科技有限公司 | Heat-conducting gel and preparation method thereof |
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CN108504016A (en) * | 2016-06-14 | 2018-09-07 | 络派模切(北京)有限公司 | A kind of heat-conducting pad and preparation method thereof |
CN108068360A (en) * | 2018-01-26 | 2018-05-25 | 山东星火科学技术研究院 | A kind of preparation method of ultralight Graphene helmet |
CN110358302A (en) * | 2019-08-27 | 2019-10-22 | 宁波石墨烯创新中心有限公司 | A kind of heat-conducting silica gel sheet and preparation method thereof |
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