CN112389683B - Method for maintaining prestress of film of solar sail spacecraft - Google Patents
Method for maintaining prestress of film of solar sail spacecraft Download PDFInfo
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Abstract
The invention discloses a method for maintaining the membrane prestress of a solar sail spacecraft, and aims to solve the problem that the membrane prestress is changed due to a high-temperature and low-temperature alternating environment. The invention is realized by the following steps: s1, determining the tension mode of the film; s2, establishing a thermal analysis model and a mechanical analysis model of the film and the supporting rod; s3, calculating the temperature fields of the film and the supporting rod under the high-temperature working condition and the low-temperature working condition; s4, calculating the thermal deformation of the film and the supporting rod under high-temperature and low-temperature fields; and S5, determining the parameters of the connecting device of the film and the supporting rod according to the difference of the deformation of the film and the deformation of the supporting rod under the two working conditions. The method provided by the invention can keep the membrane prestress basically constant and the membrane profile does not change when the solar sail spacecraft is subjected to high-low temperature alternation.
Description
Technical Field
The invention relates to the field of spacecraft design research, and particularly provides a film prestress maintaining method for a solar sail spacecraft.
Background
The solar sail spacecraft utilizes sunlight pressure as a driving force to realize space navigation, is an advanced working medium-free propulsion spacecraft, and has remarkable superiority in tasks with long-endurance characteristics such as deep space exploration.
The solar sail spacecraft accelerates the spacecraft by utilizing momentum obtained by reflecting solar photons by the sail surface, and in order to obtain larger acceleration as far as possible, the sail surface adopts a light film and needs to be as large as possible so as to improve the surface-to-mass ratio of the spacecraft. Due to the limitation of rocket envelope during launching, two types of solar sail spacecrafts in an unfolding mode are mainly proposed and developed at home and abroad. One type is that a light support rod is used for supporting a large-area film, and the support rod is driven to unfold by a motor, inflation or strain energy during orbit so as to form a flight configuration of the spacecraft. One type is self-spinning unfolding, concentrated mass is arranged at the top end of a film, the film is pulled to be unfolded by using centrifugal force, and the spacecraft keeps a plane through self-spinning during orbit.
In order to obtain a large light pressure as much as possible, the film needs to be prevented from deformation such as wrinkles as much as possible, and therefore, the inside of the film needs to have a certain prestress after being unfolded. However, for the support rod type solar sail, when the rail undergoes high-low temperature alternation, the internal prestress of the film changes due to the inconsistency of the thermal expansion coefficients of the film and the support rod, which causes the profile of the film to displace and the light pressure to change on one hand; on the other hand, the film may be loosened or the internal prestress may be too large, so that the service life of the spacecraft is damaged due to the tearing of the film, the buckling of the supporting rod and the like.
The film structures in the existing solar sail spacecraft are mostly connected by Kevlar strings, and the influence of temperature change on prestress is not considered. Therefore, the method for maintaining the membrane prestress of the solar sail spacecraft under the high and low temperature interactive load becomes an urgent problem to be solved in the field.
Disclosure of Invention
The invention aims to provide a method for maintaining the membrane prestress of a solar sail spacecraft, which aims to solve the technical problem that the membrane prestress is changed due to a high-temperature and low-temperature alternating environment.
The purpose of the invention is realized by the following technical scheme: a method for maintaining the membrane prestress of a solar sail spacecraft comprises the following steps:
s1, determining a tensioning mode of the film, fixing the root of the film by adopting a constant force spring, and connecting the top end of the film with a support rod by adopting a shape memory alloy spring;
s2, establishing a thermal analysis model and a mechanical analysis model of the film and the supporting rod respectively based on a finite volume method and a finite element method;
s3, determining the high-temperature working condition and the low-temperature working condition of the spacecraft, and calculating the temperature fields under the high-temperature working condition and the low-temperature working condition based on the thermal analysis model;
s4, calculating the thermal deformation of the film and the support rod under high-temperature and low-temperature fields based on the mechanical analysis model;
and S5, determining parameters of the connecting device of the film and the supporting rod according to the difference of the thermal deformation of the film and the supporting rod under the high and low temperature working conditions, wherein the parameters comprise the parameters of the shape memory alloy spring and the constant force spring.
Alternatively, the constant force spring used for the root of the film in step S1 may have a variable length and a constant tension.
Alternatively, the shape memory alloy spring used for the tip of the film in the step S1 has an increased stiffness and a shortened length at a high temperature and an decreased stiffness and an extended length at a low temperature.
Optionally, the step S3 includes the following sub-steps:
s31: determining a high-temperature working condition and a low-temperature working condition;
for a solar sail spacecraft running on an earth orbit, when the solar sail spacecraft is in an illumination area and the sun incident angle of a film array surface is 0 degree, the high-temperature working condition is adopted; when the solar sail spacecraft is in a ground shadow area, the low-temperature working condition is that the solar incident angle of the film array surface is 90 degrees;
s32: calculating the temperature fields of the film and the supporting rod under the high-temperature working condition and the low-temperature working condition;
and applying thermal load to the film and the support rod structure based on the established thermal analysis model, wherein the thermal load comprises solar thermal radiation, earth albedo radiation and space environment thermal radiation, and the temperature fields of the film and the support rod under the high-temperature working condition and the low-temperature working condition are obtained.
Optionally, the step S5 includes the following sub-steps:
s51, determining the configuration of the shape memory alloy spring, and determining the parameters of the shape memory alloy spring by using a tangential elastic modulus method: the shape memory alloy spring is obtained by connecting a metal spring wire and a shape memory alloy spring wire in parallel and packaging the metal spring wire and the shape memory alloy spring wire by using a shell;
s52: determining the parameters of the constant force spring: determining the constant tension of the constant-force spring according to the magnitude of the membrane prestress and the critical buckling load of the support rod; and after the numerical value of the constant tension is determined, determining to obtain the size, the diameter and the stroke parameters of the constant tension spring.
Further, the detailed steps of determining the parameters of the shape memory alloy spring in the step S51 are as follows:
determining the elastic modulus of the shape memory alloy material under the high and low temperature working conditions, wherein the high temperature elastic modulus of the shape memory alloy material is GHLow-temperature modulus of elasticity of GL；
Determining the tensile force P borne by the shape memory alloy spring according to the result of the static analysis of the film; determining the stroke difference delta of the shape memory alloy spring wire under the conditions of high-temperature working condition and low-temperature working condition according to the thermal deformation analysis results of the support rod and the film;
taking the maximum shear strain gamma under the working condition of low temperature according to the design lifeLObtaining the maximum shear strain gamma under the high-temperature working conditionHComprises the following steps:
γH＝γLGL/GH，
maximum shear stress tau under high temperature conditionsHComprises the following steps:
τH＝γH·GH，
the diameter d of the shape memory alloy spring wire is designed as follows:
in the above formula, C is a spring wire index for describing the ratio of the pitch diameter to the wire diameter of the shape memory alloy spring wire;
the pitch diameter D of the shape memory alloy spring wire is as follows:
D＝πτHd3/(8Pk)，
in the above formula, k is the curvature coefficient of the shape memory alloy spring wire, and has:
the number of turns n of the shape memory alloy spring wire is as follows:
n＝δd/πD(γL-γH)，
in the above formula, δ is the stroke difference of the shape memory alloy spring wire under the conditions of high temperature and low temperature;
the rigidity coefficients of the shape memory alloy spring wire under the working conditions of high temperature and low temperature are respectively as follows:
in the above formula, KHIs the rigidity coefficient of the shape memory alloy spring wire at high temperature, KLThe rigidity coefficient of the shape memory alloy spring wire at low temperature.
Compared with the prior art, the invention has the beneficial effects that: when the solar sail spacecraft is subjected to high-temperature and low-temperature alternation, the prestress of the film structure designed based on the invention is basically kept constant, and the shape of the film surface is not changed.
Drawings
FIG. 1 is a flow chart of a method of the present invention;
FIG. 2 is a schematic view of a film tensioning arrangement;
FIG. 3 is a schematic view of a shape memory alloy spring configuration and loading: a) a spring configuration; b) loading a schematic diagram;
FIG. 4 is a schematic illustration of a constant force spring configuration and installation: a) a constant force spring; b) a constant force spring mounting mode;
FIG. 5 is a film and support rod analysis model;
FIG. 6 is a schematic diagram of the solar sail spacecraft operating in orbit;
FIG. 7 is a schematic view of the attitude of a solar sail spacecraft;
FIG. 8 is a cloud of film and support bar temperatures: a) high temperature working condition; b) low-temperature working conditions;
FIG. 9 is a schematic diagram of film thermal deformation;
FIG. 10 is a schematic view of the thermal deformation of the support rods: a) high temperature working condition; b) low-temperature working conditions;
FIG. 11 is a cloud of internal pre-stress in the film: a) high temperature working condition; b) and (5) low-temperature working conditions.
The reference numbers in the present invention are as follows:
1-solar sail spacecraft body; 11-support bar fixing structure; 2-supporting rod; 3-a film; 31-metal snap ring; 4-Kevlar rope; 5-constant force spring; 6-shape memory alloy spring; 61-metal spring wire; 62-shape memory alloy wire; 7-fixed ring mechanism.
Detailed Description
The following description of the embodiments refers to the accompanying drawings.
The design method mainly comprises five steps, and the flow is shown in figure 1:
step S1: determining the stretching mode of the film 3, fixing the film at the root by adopting a constant force spring 5, and connecting the film at the top by adopting a shape memory alloy spring 6 with the support rod 2;
fig. 2 is a schematic view of the film stretching method of the present invention, which shows two support rods 2 and a film 3, and the film 3 is an isosceles trapezoid structure, which can be regarded as a truncated triangle structure. In fig. 2, the body side of the solar sail spacecraft body 1 is connected with a support rod 2 through a support rod fixing structure 11, the top end of the support rod 2 is further provided with a fixing ring mechanism 7 for firmly clamping the support rod 2, and the film 3 needs to be connected to the support rod fixing structure 11 and the fixing ring mechanism 7 through a certain tensioning mode. At the four corner points A, B, C and D of the film 3, 4 metal buckles 31 are also arranged, wherein points a and D are located at the root of the film 3 and points B and C are located at the tip of the film 3.
In the embodiment, the points A and D at the root part of the film 3 are connected with a support rod fixing structure 11 on the solar sail spacecraft body 1 through a connecting device consisting of Kevlar ropes 4 and constant force springs 5; at points B and C on the top end of the film 3, the film is connected with a fixing ring mechanism 7 on the support rod 2 through a connecting device consisting of a Kevlar rope 4 and a shape memory alloy spring 6.
Due to the fact that the thermal expansion coefficients of the film 3 and the supporting rod 2 are different, when the film 3 enters high temperature from low temperature, the gap between the film 3 and the supporting rod 2 is reduced.
The shape memory alloy spring 6 has a non-linear characteristic, and its configuration and loading are schematically shown in fig. 3. The shape memory alloy spring 6 includes two core members, i.e., a metal wire 61 and a shape memory alloy wire 62. The shape memory alloy wire 62 has a higher stiffness coefficient and a lower compression amount at high temperature (when irradiated by the sun), and the shape memory alloy wire 62 has a lower stiffness coefficient and an higher compression amount at low temperature. Due to the non-linearity of the shape memory alloy spring 6, the gap between the membrane 3 and the support rod 2 can be effectively compensated.
The configuration and installation method of the constant force spring 5 are shown in fig. 4a and 4b, respectively, and two functions are shown: firstly, when the film 3 undergoes high and low temperature changes, the temperature change rate of the shape memory alloy spring 6 is slow, so that the temperature change is slow, the change of the gap between the supporting rod 2 and the film 3 cannot be compensated in time, and the inconsistency of the thermal expansion between the supporting rod 2 and the film 3 can be effectively balanced by the constant force spring 5; and secondly, the support rod 2 is protected to prevent the buckling caused by overlarge bearing pressure. The Kevlar ropes 4 are mainly used to achieve a high strength connection of the constant force spring 5 with the membrane 3 for compensating the length of the connection means.
Step S2: establishing a thermal analysis model and a mechanical analysis model of the film 3 and the support rod 2 respectively based on a finite volume method and a finite element method;
for the thermal and mechanical analysis of the structure, a thermal analysis model of the membrane 3 and the support rods 2 in the solar sail spacecraft is established.
Substep S21: establishing a thermal analysis model of the film 3 and the support rod 2;
finite element analysis models of the film 3 and the support rod 2 are established by using finite element software, and as shown in fig. 5, the element types are linear triangular elements, and the number of the elements is 7871 nodes and 9433 elements.
Substep S22: establishing a mechanical analysis model of the film 3 and the support rod 2;
a mechanical analysis model of the structure is built by adopting the quadrilateral shell units, and the mechanical analysis model has 941 nodes and 876 units.
Step S3: determining the high-temperature working condition and the low-temperature working condition of the spacecraft according to the configuration and the orbital attitude characteristics of the solar sail spacecraft, and calculating temperature fields under the two working conditions based on a thermal analysis model;
substep S31: determining a high-temperature working condition and a low-temperature working condition;
taking a solar sail spacecraft running on earth orbit as an example, the spacecraft can be divided into an illumination area and a shadow area in the in-orbit running process, as shown in fig. 6. The solar incident angle of the film 3 array surface is in the range of 0-90 degrees, and when the solar incident angle is 0 degree, the film 3 is always kept in a sun-facing state, namely ZiThe direction is towards the sun, see fig. 7; when the incident angle of the sun is 90 degrees, the normal of the front surface of the film 3 is vertical to the direction of the sunlight. Therefore, when the solar sail spacecraft is in an illumination area, and the solar incident angle of the film 3 array surface is 0 degrees, the high-temperature working condition is adopted; when the solar sail spacecraft is in the shadow zone of the ground and the solar incident angle of the film 3 array surface is 90 degrees, the low-temperature working condition is adopted。
Substep S32: calculating the temperature fields of the film 3 and the support rod 2 under the high-temperature working condition and the low-temperature working condition;
based on the established thermal analysis model, thermal load is applied to the structure, wherein the thermal load comprises solar thermal radiation, earth albedo radiation and space environment thermal radiation, and then the temperature fields of the film 3 and the support rod 2 under high-temperature working conditions and low-temperature working conditions can be obtained, as shown in fig. 8. The temperature of the film 3 under the high-temperature working condition is-14.75 ℃, and the temperature range of the support rod 2 is-52.4-34.9 ℃; the temperature of the film 3 is-224.42 ℃ under the low-temperature working condition, and the temperature range of the support rod 2 is-183.0 to-186.2 ℃.
Step S4: calculating the thermal deformation of the film 3 and the support rod 2 under high-temperature and low-temperature fields based on a mechanical analysis model;
substep S41: calculating the thermal deformation of the film 3 under the high-temperature working condition and the low-temperature working condition;
the film 3 enters the illumination area (high temperature working condition) from the shadow area (low temperature working condition), and the angular point in-plane displacement of the film 3 reaches 42.58mm, as shown in fig. 9.
Substep S42: calculating the thermal deformation of the support rod 2 under the working conditions of low temperature and high temperature;
under the low-temperature working condition, the supporting rod 2 is shortened by 9.1mm, and the transverse displacement of the top end is 3.6 mm; under the high-temperature working condition, the supporting rod 2 is shortened by 2.8mm, and the transverse displacement of the top end is 94.3mm, as shown in figure 10.
Step S5: according to the difference between the deformation of the membrane 3 and the deformation of the support rod 2 under the two working conditions, the parameters of the connecting device of the membrane 3 and the support rod 2 are determined, wherein the parameters comprise the parameters of the shape memory alloy spring 6 and the constant force spring 5.
Substep S51: determining the configuration of the shape memory alloy spring 6, and determining the parameters of the shape memory alloy spring 6 by adopting a cut elastic modulus method;
the shape memory alloy spring 6 is formed by connecting a metal spring wire 61 and a shape memory alloy spring wire 62 in parallel and packaging the metal spring wire 61 and the shape memory alloy spring wire 62 by a shell, wherein the metal spring wire 61 and the shape memory alloy spring wire 62 are both in a spiral structure similar to a spring, and the spring is shown in figure 3. The shape memory alloy spring 6 utilizes the compression performance of the shape memory alloy spring wire 62, delays the hysteresis effect of the shape memory alloy and prolongs the service life. The shell is adopted for packaging, and is mainly used for limiting, so that structural damage caused by breakage of the metal spring wire 61 is avoided, and the metal spring wire 61 and the shape memory alloy spring wire 62 are protected from the influence of a space effect.
The method for determining the parameters of the shape memory alloy spring 6 mainly comprises the following steps of:
1) determining the elastic modulus of the shape memory alloy material under the high and low temperature working conditions, wherein the high temperature elastic modulus of the shape memory alloy material is GHLow-temperature modulus of elasticity of GL；
2) Determining the tensile force P borne by the shape memory alloy spring 6 according to the result of the static analysis of the film; determining the stroke difference delta of the shape memory alloy spring wire 62 under the conditions of high temperature and low temperature according to the thermal deformation analysis results of the support rod 2 and the film 3;
3) taking the maximum shear strain gamma under the working condition of low temperature according to the design lifeLObtaining the maximum shear strain gamma under the high-temperature working conditionHComprises the following steps:
γH＝γLGL/GH，
maximum shear stress tau under high temperature working conditionHComprises the following steps:
τH＝γH·GH，
4) the diameter d of the shape memory alloy wire 62 is designed to be:
in the above formula, C is a spring wire index for describing the ratio of the pitch diameter to the wire diameter of the shape memory alloy spring wire 62;
the pitch diameter D of the shape memory alloy wire 62 is:
D＝πτHd3/(8Pk)，
in the above formula, k is the curvature coefficient of the shape memory alloy wire 62, and has:
the number of turns n of the shape memory alloy wire 62 is:
n＝δd/πD(γL-γH)，
in the above formula, δ is the stroke difference of the shape memory alloy wire 62 under the high-temperature working condition and the low-temperature working condition;
the stiffness coefficients of the shape memory alloy wire 62 under the high and low temperature conditions are respectively:
in the above formula, KHIs the stiffness coefficient, K, of the shape memory alloy wire 62 at high temperatureLIs the stiffness coefficient of the shape memory alloy wire 62 at low temperatures.
All the parameters of the shape memory alloy spring 6 are obtained.
Substep S52: determining parameters of the constant force spring 5;
the constant force spring 5 is in a structure shown in figure 4 and is mounted on a star body by adopting a box type. And determining the constant tension of the constant-force spring 5 according to the prestress of the film 3 and the critical buckling load of the support rod 2. In general, the constant tension value of the constant force spring 5 is designed according to the critical load when the support rod 2 reaches buckling, and the safety margin is designed to be 2. After the constant tension value is determined, the size, the diameter and the stroke parameters of the spring can be determined.
As shown in fig. 11, after the method for maintaining constant prestress of the film 3 is adopted, the prestress distribution of the film 3 under the high-temperature working condition and the low-temperature working condition is changed slightly, and the technical problem that the prestress of the film 3 is changed due to the high-temperature and low-temperature alternating environment can be effectively solved.
Although the present invention has been described in detail by the above embodiments, it is not limited thereto. Various modifications and alterations may be made by those skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is accordingly to be determined by the appended claims.
Claims (6)
1. A method for maintaining the membrane prestress of a solar sail spacecraft is characterized by comprising the following steps:
s1, determining a tensioning mode of the film (3), fixing the root of the film (3) by using a constant force spring (5), and connecting the top end of the film (3) with the support rod (2) by using a shape memory alloy spring (6);
s2, establishing a thermal analysis model and a mechanical analysis model of the film (3) and the supporting rod (2) based on a finite volume method and a finite element method respectively;
s3, determining the high-temperature working condition and the low-temperature working condition of the spacecraft, and calculating the temperature fields under the high-temperature working condition and the low-temperature working condition based on the thermal analysis model;
s4, calculating the thermal deformation of the film (3) and the supporting rod (2) under high-temperature and low-temperature fields based on the mechanical analysis model;
s5, determining parameters of a connecting device of the film (3) and the support rod (2) according to the difference of thermal deformation of the film (3) and the support rod (2) under high and low temperature working conditions, wherein the parameters comprise parameters of a shape memory alloy spring (6) and a constant force spring (5), and the shape memory alloy spring (6) comprises a metal spring wire (61) and a shape memory alloy spring wire (62) which are connected in parallel.
2. The method for maintaining the membrane prestress of the solar sail spacecraft as claimed in claim 1, wherein the constant force spring (5) used for the root of the membrane (3) in the step S1 has a variable length and a constant tension.
3. The method for maintaining the membrane prestress of the solar sail spacecraft as claimed in claim 1, wherein the shape memory alloy wire (62) of the shape memory alloy spring (6) used at the top end of the membrane (3) in the step S1 has a higher stiffness coefficient and a lower compression amount at high temperature and a lower stiffness coefficient and an higher compression amount at low temperature.
4. The method for maintaining the membrane prestress of a solar sail spacecraft as claimed in claim 1, wherein said step S3 comprises the following substeps:
s31: determining a high-temperature working condition and a low-temperature working condition;
for a solar sail spacecraft running on an earth orbit, when the solar sail spacecraft is in an illumination area and the sun incident angle of a film array surface is 0 degree, the high-temperature working condition is adopted; when the solar sail spacecraft is in a ground shadow area, the low-temperature working condition is that the solar incident angle of the film array surface is 90 degrees;
s32: calculating the temperature fields of the film and the supporting rod under the high-temperature working condition and the low-temperature working condition;
and applying thermal load to the film (3) and the support rod (2) structure based on the established thermal analysis model, wherein the thermal load comprises solar thermal radiation, earth albedo radiation and space environment thermal radiation, and obtaining the temperature fields of the film (3) and the support rod (2) under high-temperature working conditions and low-temperature working conditions.
5. The method for maintaining the membrane prestress of a solar sail spacecraft as claimed in claim 1, wherein said step S5 includes the following sub-steps:
s51, determining the configuration of the shape memory alloy spring (6), and determining the parameters of the shape memory alloy spring by using a tangential elastic modulus method: the shape memory alloy spring (6) is obtained by connecting a metal spring wire (61) and a shape memory alloy spring wire (62) in parallel and packaging the metal spring wire and the shape memory alloy spring wire by using a shell;
s52: determining the parameters of the constant force spring (5): determining the constant tension of the constant force spring (5) according to the magnitude of the membrane prestress and the critical buckling load of the support rod; after the numerical value of the constant tension is determined, the size, the diameter and the stroke parameters of the constant tension spring (5) are determined and obtained.
6. The method for maintaining the membrane prestress of a solar sail spacecraft of claim 5, wherein the step S51 for determining the parameters of the shape memory alloy spring (6) is detailed as follows:
determining shape memoryThe elastic modulus of the alloy material under the high and low temperature working conditions is recorded as GHLow-temperature modulus of elasticity of GL；
Determining the tensile force P borne by the shape memory alloy spring (6) according to the result of the static analysis of the film; determining the stroke difference delta of the shape memory alloy spring wire (62) under the conditions of high temperature and low temperature according to the thermal deformation analysis results of the support rod (2) and the film (3);
taking the maximum shear strain gamma under the working condition of low temperature according to the design lifeLObtaining the maximum shear strain gamma under the high-temperature working conditionHComprises the following steps:
γH＝γLGL/GH，
maximum shear stress tau under high temperature conditionsHComprises the following steps:
τH＝γH·GH，
the diameter d of the shape memory alloy spring wire (62) is designed as follows:
in the above formula, C is a spring wire index for describing the ratio of the pitch diameter to the wire diameter of the shape memory alloy spring wire (62);
the pitch diameter D of the shape memory alloy spring wire (62) is as follows:
D＝πτHd3/(8Pk)，
in the above formula, k is the curvature coefficient of the shape memory alloy wire (62) and has:
the number n of turns of the shape memory alloy spring wire (62) is as follows:
n＝δd/πD(γL-γH)，
in the above formula, δ is the stroke difference of the shape memory alloy spring wire (62) under the conditions of high temperature and low temperature;
the rigidity coefficients of the shape memory alloy spring wire (62) under the working conditions of high temperature and low temperature are respectively as follows:
in the above formula, KHIs the stiffness coefficient, K, of the shape memory alloy wire (62) at high temperatureLIs the stiffness coefficient of the shape memory alloy spring wire (62) at low temperature.
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