CN112388511A - Control method and device of polishing robot, electronic equipment and storage medium - Google Patents
Control method and device of polishing robot, electronic equipment and storage medium Download PDFInfo
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- CN112388511A CN112388511A CN202011006020.1A CN202011006020A CN112388511A CN 112388511 A CN112388511 A CN 112388511A CN 202011006020 A CN202011006020 A CN 202011006020A CN 112388511 A CN112388511 A CN 112388511A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/005—Manipulators for mechanical processing tasks
- B25J11/0065—Polishing or grinding
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- Mechanical Engineering (AREA)
- Robotics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The application discloses grinding robot's control method, device, electronic equipment and storage medium, grinding robot has a plurality of range finding sensors, wherein, the method includes following step: detecting first distance data between the polishing robot and a polishing area when the polishing robot executes a current polishing action; calculating a sanding depth value based on the first distance data and second distance data between the non-sanding area; and correcting the current polishing action according to the polishing depth value until the polishing depth of the polishing robot reaches the target polishing depth. The control method of the polishing robot in the embodiment of the application can realize detection of the depth of a single polishing operation of the polishing robot, improve the measurement speed and stability, reduce the requirements of a measurement element on the motion precision and the positioning precision of the tail end of the polishing robot, further effectively reduce the requirements on the type selection of the transmission mechanism of the polishing robot and reduce the manufacturing cost of the robot.
Description
Technical Field
The application relates to the technical field of building construction, in particular to a polishing robot control method and device, electronic equipment and a storage medium.
Background
Robots for full-automatic grinding, milling or polishing and the like all need to have an automatic detection function so as to realize full-automatic operation, the automatic detection grinding and removing operation amount can effectively improve the operation precision, the operation efficiency is improved, unnecessary grinding operation is reduced, and meanwhile, the operation quality can also be improved.
In the related technology, most of grinding robots or other similar mobile operation equipment are semi-automatic operation equipment, the amount of work is mostly judged by manual assistance, full-automatic operation cannot be realized, and related equipment with high degree of automation generally adopts a 3D camera or linear laser to detect the operation depth.
However, the linear laser detection requires a detection range larger than the operation area, which results in a large required linear laser size, and the installation space requirement of the equipment with the structural size requirement is difficult to realize; the 3D camera has large data processing amount and relatively low processing speed during continuous operation detection, and has higher requirement on ambient light; a solution is needed.
Content of application
The present application is directed to solving, at least to some extent, one of the technical problems in the related art.
Therefore, a first objective of the present application is to provide a method for controlling a polishing robot, which can detect the depth of a single polishing operation of the polishing robot, improve the measurement speed and stability, and reduce the requirements of a measurement element on the accuracy of executing end motion and the positioning accuracy of the polishing robot, thereby effectively reducing the requirements on the type selection of a transmission mechanism of the polishing robot and reducing the manufacturing cost of the robot.
A second object of the present application is to provide a control device of a polishing robot.
A third object of the present application is to provide an electronic device.
A fourth object of the present application is to propose a computer readable storage medium.
In order to achieve the above object, a first embodiment of the present application provides a control method for a grinding robot having a plurality of distance measuring sensors, wherein the method includes the following steps:
detecting first distance data between the polishing robot and a polishing area when the polishing robot executes a current polishing action;
calculating a sanding depth value based on the first distance data and second distance data between a non-sanding area; and
and correcting the current polishing action according to the polishing depth value until the polishing depth of the polishing robot reaches a target polishing depth.
Optionally, the plurality of distance measuring sensors include a first distance measuring sensor disposed on a bottom surface of a polishing device of the polishing robot and a second distance measuring sensor disposed on any side surface of the polishing assembly, and further include:
detecting the polishing direction of the polishing robot;
when the polishing direction is the longitudinal moving direction of the polishing device, the first distance data are obtained by the detection of the first distance measuring sensor;
and when the polishing direction is the direction of the transverse movement of the polishing device, the second distance data is obtained by the detection of the second distance measuring sensor.
Optionally, the method further comprises:
dividing the polishing area and the non-polishing area into a sub-polishing area and a sub-non-polishing area of a plurality of specifications respectively;
and determining the target polishing depth of the corresponding sub-polishing area according to the second distance data of each sub-non-polishing area.
Optionally, the calculating the sanding depth value based on the first distance data and second distance data between the non-sanding area further comprises:
denoising the first distance data by using a random sampling consistency algorithm to obtain processed first distance data;
calculating final first distance data from the first distance data and the processed first distance data;
and calculating the polishing depth value based on the final first distance data and second distance data between the final first distance data and the corresponding sub non-polishing area.
In order to achieve the above object, a second aspect of the present invention provides a control device for a grinding robot, the grinding robot having a plurality of distance measuring sensors, wherein the device includes:
the first detection module is used for detecting first distance data between the polishing robot and a polishing area when the polishing robot executes a current polishing action;
a calculation module for calculating a burnishing depth value based on the first distance data and second distance data between a non-burnishing area; and
and the correcting module is used for correcting the current polishing action according to the polishing depth value until the polishing depth of the polishing robot reaches the target polishing depth.
Optionally, the plurality of distance measuring sensors include a first distance measuring sensor disposed on a bottom surface of a polishing device of the polishing robot and a second distance measuring sensor disposed on any side surface of the polishing assembly, and further include:
the second detection module is used for detecting the polishing direction of the polishing robot;
the third detection module is used for detecting the first distance data by the first distance measuring sensor when the grinding direction is the longitudinal moving direction of the grinding device;
and the fourth detection module is used for detecting the second distance data by the second distance measuring sensor when the grinding direction is the transverse moving direction of the grinding device.
Optionally, the method further comprises:
the dividing module is used for dividing the polishing area and the non-polishing area into a plurality of specifications of sub-polishing areas and sub-non-polishing areas respectively;
and the determining module is used for determining the target polishing depth of the corresponding sub-polishing area according to the second distance data of each sub-non-polishing area.
Optionally, the calculation module further includes:
the processing unit is used for carrying out denoising processing on the first distance data by utilizing a random sampling consistency algorithm to obtain processed first distance data;
a first calculation unit configured to calculate final first distance data from the first distance data and the processed first distance data;
and the second calculation unit is used for calculating the polishing depth value based on the final first distance data and second distance data between the final first distance data and the corresponding sub non-polishing area.
To achieve the above object, an embodiment of a third aspect of the present application provides an electronic device, including: at least one processor; and a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being arranged to perform a method of controlling a grinding robot as described in the above embodiments.
In order to achieve the above object, a fourth aspect of the present application provides a computer-readable storage medium storing computer instructions for causing a computer to execute the control method of the polishing robot according to the above embodiment.
Therefore, when the polishing robot executes the current polishing action, first distance data between the polishing robot and the polishing area are detected, the polishing depth value is calculated based on the first distance data and second distance data between the polishing robot and the non-polishing area, and the current polishing action is corrected according to the polishing depth value until the polishing depth of the polishing robot reaches the target polishing depth. Therefore, the detection of the single grinding operation depth of the grinding robot can be realized, the measurement speed and the stability are improved, the requirements of a measurement element on the execution terminal motion precision and the positioning precision of the grinding robot are reduced, the requirement on the type selection of a transmission mechanism of the grinding robot is further effectively reduced, and the manufacturing cost of the robot is reduced. .
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a flowchart of a control method of a polishing robot according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a grinding robot in accordance with one embodiment of the present application;
FIG. 3 is a schematic diagram of a grinding device of a grinding robot according to one embodiment of the present application;
FIG. 4 is a schematic diagram of a polishing area corresponding position information and robot configuration according to an embodiment of the present application;
FIG. 5 is a data processing reference schematic according to an embodiment of the present application;
FIG. 6 is a flow chart of calculating a buff depth value according to one embodiment of the present application;
FIG. 7 is a flow diagram of collected data processing logic according to one embodiment of the present application;
FIG. 8 is a flow diagram of data computation processing logic according to one embodiment of the present application;
fig. 9 is an exemplary diagram of a control device of a grinding robot according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
A method and apparatus for controlling a polishing robot, an electronic device, and a storage medium according to embodiments of the present application will be described below with reference to the accompanying drawings.
Specifically, fig. 1 is a schematic flowchart of a control method of a polishing robot according to an embodiment of the present disclosure.
Before describing the method of controlling the polishing robot according to the embodiment of the present application, the polishing robot according to the embodiment of the present application will be briefly described. In this embodiment, the grinding robot has a plurality of ranging sensors.
Specifically, the layout of the polishing depth measurement element on the polishing robot is shown in fig. 2, the configuration of the polishing depth detection hardware is shown in fig. 3, and the polishing depth detection hardware mainly comprises a polishing area detection sensor and a reference area sensor, wherein the polishing area sensor detects and collects distance data between a polishing area and a polishing device before and after polishing, and the reference area sensor detects and collects distance data between the reference area and the polishing device. The functions of the grinding areas and the reference area detection sensors are interchanged according to different grinding directions, the names of the sensors in the drawing are named according to upper grinding and lower grinding, and the robot controller finally calculates the depth values before and after grinding through a data processing algorithm of the detection system.
As shown in fig. 1, the method for controlling the grinding robot includes the steps of:
in step S101, first distance data with a polishing area is detected while the polishing robot performs a current polishing motion.
It can be understood that, as shown in fig. 4, before starting the polishing operation, the polishing robot in the embodiment of the present application may drive the polishing device to move rapidly through the traverse device and the lifting device according to the path of the polishing area, collect original data before polishing (i.e. first distance data of the polishing area), and use the data as reference data for detecting the polishing depth in the polishing process.
Optionally, in some embodiments, the plurality of distance measuring sensors includes a first distance measuring sensor disposed on a bottom surface of the grinding device of the grinding robot and a second distance measuring sensor disposed on either side surface of the grinding assembly, and further includes: detecting the polishing direction of the polishing robot; when the polishing direction is the longitudinal moving direction of the polishing device, first distance data are obtained by detecting through a first distance measuring sensor; and when the grinding direction is the transverse moving direction of the grinding device, detecting by the second distance measuring sensor to obtain second distance data. That is to say, the grinding robot of the embodiment of the present application grinds the orbit and has two kinds: the polishing is carried out from top to bottom and from left to right, and in the embodiment of the application, when the polishing direction is the longitudinal moving direction of the polishing device, first distance data can be obtained by detection of the first distance measuring sensor; and when the grinding direction is the transverse moving direction of the grinding device, detecting by the second distance measuring sensor to obtain second distance data.
In step S102, a buff depth value is calculated based on the first distance data and the second distance data between the non-buff region.
In some embodiments, the polishing area and the non-polishing area can be divided into sub-polishing areas and sub-non-polishing areas of multiple specifications respectively; and determining the target polishing depth of the corresponding sub-polishing area according to the second distance data of each sub-non-polishing area.
Optionally, in some embodiments, calculating the buffed depth value based on the first distance data and the second distance data between the non-buffed region further comprises: denoising the first distance data by using a random sampling consistency algorithm to obtain processed first distance data; calculating final first distance data from the first distance data and the processed first distance data; and calculating the polishing depth value based on the final first distance data and the second distance data between the corresponding sub non-polishing area and the polishing depth value.
Specifically, the polishing area is divided into a plurality of 100mm × 100mm square areas before the polishing robot operates, and each square area may correspond to a specific polishing depth value according to the front-end input operation information. As shown in fig. 5, in each square of the polishing area and the corresponding reference area, the depth sensor collects a plurality of sets of distance information, the controller filters information noise points such as pit foreign matter protrusions and the like through a Random Sample Consensus (RANSAC) algorithm, calculates the distance information of the two areas through an averaging method, engages out a depth reference before polishing, collects depth information again after polishing is completed, processes data through the RANSAC algorithm, and calculates the polishing depth value.
It should be noted that the main purpose of processing the acquired data by the RANSAC algorithm in the embodiment of the present application is to filter out the influence of local fine gravel bumps, pits, and the like on the flatness reference, reduce the measurement error, and improve the measurement accuracy.
Further, assuming that the height of the job is consistent with the height of N sets of 100mm × 100mm squares, the calculated depth data before polishing for each polished area square is stored as follows: a11, a12, a13 … … An; b11, B12, B13 … … B1n, the grinding area corresponds to the position information, as shown in fig. 4, the grinding device continuously collects the distance information between the grinding device and the reference area during the reciprocal grinding process, and the distance information data between the grinding area and the reference area after the nth grinding is as follows: an1, An2, An3 … … AnN; bn1, Bn2 and Bn3 … … BnN, wherein the grinding depth value H in each grinding grid area after n times of grinding is as follows: h1 ═ Bn1-B11, H2 ═ Bn2-B12, H3 ═ Bn3-B13, … … HN ═ BnN-B1N.
For example, as shown in fig. 6, fig. 6 is a flowchart of calculating a polishing depth value according to an embodiment of the present disclosure.
S601, starting polishing, and collecting original data before polishing through a sensor.
And S602, calculating the average depth of the grinding area before grinding.
And S603, driving the polishing disc to be compressed by the feeding device to perform polishing operation.
And S604, separating the polished polishing disc and collecting polished data.
And S605, performing data analysis to remove noise points according to a RANSAC algorithm and calculating a mean value.
And S606, h is the accumulated operation depth of the n operations.
S607, judging whether the grinding depth value is larger than the target depth value, if so, executing the step S608, otherwise, executing the step S603.
And S608, moving the grinding device to the next target operation area.
As shown in fig. 7, fig. 7 is a schematic diagram of collected data processing logic according to an embodiment of the present application.
And S701, extracting the polished points in the current grid by utilizing grid information.
S702, extracting the inner points of the polished points by using a RANSAC algorithm.
S703, calculating the depth mean value depthA of the polished inner points.
And S704, extracting the polished points in the current grid by utilizing the grid information.
S705, extracting the inner points of the polished points by using a RANSAC algorithm.
S706, calculating the depth mean value depthB of the polished inner points.
S707, depthhA-depthB is calculated as a depth correction amount and saved to the network correction value array girdDepth.
S708, judging whether all grids are processed, if so, executing step S709, otherwise, executing step S701.
S709, outputting the girdDepth.
It should be noted that, the more dense and dense the data acquisition in the grid area, the more accurate the distance and depth information, i.e. the higher the measurement accuracy, and the current data acquisition interval density is less than 10mm, i.e. the minimum 10 sets of data are acquired in each grid area, and the accuracy of the data which changes slowly relative to the data meets the use requirement.
In step S103, the current polishing action is corrected according to the polishing depth value until the polishing depth of the polishing robot reaches the target polishing depth.
It can be understood that, because the distance of the measuring sensor relative to the wall surface can be measured by the polishing device in the process of reciprocating motion before and after polishing due to the influence of assembly clearance among the robot mechanisms, the fit clearance of the guide rail and the slide block of the motion mechanism (a lifting device, a transverse moving device and the like), deformation of the motion mechanism device before and after stress and the like, the measurement error is caused. To eliminate the measurement deviation caused by the above factors, the present depth sounding technique introduces the measured value of the reference area as compensation for the measurement error.
Specifically, on this application embodiment error compensation realization principle for on reference regional detection sensor and the regional measurement sensor installation grinding device's of polishing bottom plate and curb plate, bottom plate and curb plate rigid connection do not have relative displacement, two detection sensor distance are fixed unchangeable promptly in the course of the work. The external dimension data of the reference area of the wall surface is not changed before and after the polishing operation, and the measurement depth difference before and after the operation of the reference area is the measurement error caused by external factors such as the self mechanism of the robot and the like before and after polishing, and can be used as the compensation quantity of the error of the polishing area. Namely, the compensation quantity delta H of each grid polishing area before and after polishing is as follows: Δ H1 ═ An1-a11, Δ H2 ═ An2-a12, Δ H3 ═ An3-a13, … … Δ HN ═ AnN-A1N; the sanding depth value H- Δ H in each sanding grid region, i.e., H1-H1- Δ H1 (B11-a11) - (Bn1-An1), H2-H2- Δ H2 (B12-a12) - (Bn2-An2), and H3-H3- Δ H3 (B13-a13) - (Bn3-An3) … … hN- Δ hN (BnN-AnN) - (BnN-AnN).
In addition, data calculation processing logic in the following embodiments of the present application is introduced. As shown in fig. 8, the data calculation processing logic includes the steps of:
and S801, acquiring a grid depth reference calculation mode.
S802, judging the current mode, and if the current mode is the local reference mode, executing the step S803; if the current mode is the local reference mode, step S812 is performed.
And S803, fitting a reference line by using the polished laser points through an RANSAC algorithm.
S804, extracting the points before polishing in the current mesh by using the BIM (Building Information Modeling) mesh Information.
And S805, the Y projection distance from the point before polishing to the reference line.
S806, removing the points with the distance smaller than the invalid point criterion.
S807, judging whether depth correction is used, if so, executing step S808, otherwise, executing step S809.
S808, extracting an offset from the position corresponding to the calibration array.
S809, offset 0.
S810, calculating the distance mean value depth of the effective points, subtracting depth from the BIM depth of the grid and adding offset to obtain the residual polishing amount, and storing the residual polishing amount in a grid depth array girdDepth
S811, judge whether process all the grid, if yes, carry out step S824, otherwise, carry out step S804.
And S812, extracting the polished points in the current grid by using the BIM grid information.
And S813, fitting a datum line by using the polished laser points through a RANSAC algorithm.
S814, extracting points before grinding in the current grid by using the BIM grid information.
And S815, the Y projection distance from the point before polishing to the datum line.
S816, removing the points with the distance smaller than the invalid point criterion.
And S817, judging whether the depth correction is used, if so, executing the step S818, otherwise, executing the step S819.
S818, extracting offset from the corresponding position of the correction array
S819 with offset of 0
S820, calculating the distance mean value depth of the effective points, subtracting depth and offset from the BIM depth of the grid to obtain the residual polishing amount, and storing the residual polishing amount in a grid depth array girdDepth.
S821, judge whether all the grids are processed, if yes, execute step S822, otherwise, execute step S812.
S822, outputting a grid depth array girdDepth.
That is to say, this application embodiment can be before polishing after the degree of depth information acquisition is accomplished, grinding device distance remains unchanged, and the last feeding electric cylinder of the last feeding device of grinding device stretches out and compresses tightly the operation with the dish of polishing, starts the operation of polishing by the grinding motor simultaneously. Under the drive of the lifting device and the transverse moving device, the polishing device performs polishing operation in a polishing area. After the system finishes the preset polishing times according to the polishing information, the feeding electric cylinder of the feeding device retracts to pull back the polishing disc to separate from the operation, and the moving mechanism drives the polishing device to perform polishing and then acquire the depth information. Because the polishing depth of the polishing area is different, the large polishing amount cannot be polished in place once, and repeated polishing is needed, so that the control system can automatically judge whether depth information acquisition is carried out after single polishing or depth information acquisition is carried out after repeated polishing according to the polishing amount information system for improving the working efficiency. If the polishing depth meets the polishing requirement, the polishing device moves to the next polishing area to perform operation, if the polishing depth does not meet the polishing depth requirement, the polishing device performs polishing operation again according to the required polishing amount, and the reciprocating polishing is judged until the polishing operation depth meets the requirement.
According to the control method of the polishing robot provided by the embodiment of the application, when the polishing robot executes the current polishing action, first distance data between the polishing robot and a polishing area is detected, a polishing depth value is calculated based on the first distance data and second distance data between the polishing robot and a non-polishing area, and the current polishing action is corrected according to the polishing depth value until the polishing depth of the polishing robot reaches a target polishing depth. Therefore, the detection of the single grinding operation depth of the grinding robot can be realized, the measurement speed and the stability are improved, the requirements of a measurement element on the execution terminal motion precision and the positioning precision of the grinding robot are reduced, the requirement on the type selection of a transmission mechanism of the grinding robot is further effectively reduced, and the manufacturing cost of the robot is reduced.
Next, a control device of a grinding robot according to an embodiment of the present application will be described with reference to the drawings.
Fig. 9 is a block diagram schematically illustrating a control device of the polishing robot according to the embodiment of the present application. In this embodiment, the grinding robot has a plurality of ranging sensors.
As shown in fig. 9, the control device 10 of the polishing robot includes: a first detection module 100, a calculation module 200 and a correction module 300.
The first detection module 100 is configured to detect first distance data between the polishing robot and a polishing area when the polishing robot performs a current polishing action;
the calculation module 200 is configured to calculate a sanding depth value based on the first distance data and second distance data between the non-sanding area; and
the correcting module 300 is configured to correct the current polishing action according to the polishing depth value until the polishing depth of the polishing robot reaches the target polishing depth.
Optionally, in some embodiments, the plurality of distance measuring sensors includes a first distance measuring sensor disposed on a bottom surface of the grinding device of the grinding robot and a second distance measuring sensor disposed on either side surface of the grinding assembly, and further includes:
the second detection module is used for detecting the polishing direction of the polishing robot;
the third detection module is used for detecting and obtaining first distance data by the first distance measuring sensor when the polishing direction is the longitudinal moving direction of the polishing device;
and the fourth detection module is used for detecting second distance data by the second distance measuring sensor when the polishing direction is the direction of the transverse movement of the polishing device.
Optionally, in some embodiments, the control device of the polishing robot further includes:
the dividing module is used for dividing the polishing area and the non-polishing area into a plurality of specifications of sub-polishing areas and sub-non-polishing areas respectively;
and the determining module is used for determining the target polishing depth of the corresponding sub-polishing area according to the second distance data of each sub-non-polishing area.
Optionally, in some embodiments, the calculation module further comprises:
the processing unit is used for carrying out denoising processing on the first distance data by utilizing a random sampling consistency algorithm to obtain processed first distance data;
a first calculation unit for calculating final first distance data from the first distance data and the processed first distance data;
and a second calculation unit for calculating the sanding depth value based on the final first distance data and second distance data between the corresponding sub non-sanding region.
According to the control device of the polishing robot provided by the embodiment of the application, when the polishing robot executes the current polishing action, the first distance data between the polishing robot and the polishing area is detected, the polishing depth value is calculated based on the first distance data and the second distance data between the non-polishing area, and the current polishing action is corrected according to the polishing depth value until the polishing depth of the polishing robot reaches the target polishing depth. Therefore, the detection of the single grinding operation depth of the grinding robot can be realized, the measurement speed and the stability are improved, the requirements of a measurement element on the execution terminal motion precision and the positioning precision of the grinding robot are reduced, the requirement on the type selection of a transmission mechanism of the grinding robot is further effectively reduced, and the manufacturing cost of the robot is reduced.
Fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device may include:
a memory 1201, a processor 1202, and a computer program stored on the memory 1201 and executable on the processor 1202.
The processor 1202, when executing the program, implements the method of controlling the polishing robot provided in the above-described embodiments.
Further, the electronic device further includes:
a communication interface 1203 for communication between the memory 1201 and the processor 1202.
A memory 1201 for storing computer programs executable on the processor 1202.
The memory 1201 may comprise high-speed RAM memory, and may also include non-volatile memory (non-volatile memory), such as at least one disk memory.
If the memory 1201, the processor 1202 and the communication interface 1203 are implemented independently, the communication interface 1203, the memory 1201 and the processor 1202 may be connected to each other through a bus and perform communication with each other. The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended ISA (EISA) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is shown in FIG. 10, but this is not intended to represent only one bus or type of bus.
Optionally, in a specific implementation, if the memory 1201, the processor 1202, and the communication interface 1203 are integrated on a chip, the memory 1201, the processor 1202, and the communication interface 1203 may complete mutual communication through an internal interface.
The present embodiment also provides a computer-readable storage medium having stored thereon a computer program, characterized in that the program, when executed by a processor, implements the above control method of a polishing robot.
In the description herein, references to the description of the terms "embodiment," "example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or N embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "N" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more N executable instructions for implementing steps of a custom logic function or process, and alternate implementations are included within the scope of the preferred embodiment of the present application in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of implementing the embodiments of the present application.
The logic and/or steps represented in the flowcharts or otherwise described herein, e.g., an ordered listing of executable instructions that can be considered to implement logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or N wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
It should be understood that portions of the present application may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods may be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. If implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.
In addition, functional units in the embodiments of the present application may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.
The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc. Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A method of controlling a grinding robot having a plurality of ranging sensors, wherein the method comprises the steps of:
detecting first distance data between the polishing robot and a polishing area when the polishing robot executes a current polishing action;
calculating a sanding depth value based on the first distance data and second distance data between a non-sanding area; and
and correcting the current polishing action according to the polishing depth value until the polishing depth of the polishing robot reaches a target polishing depth.
2. The method of claim 1, wherein the plurality of ranging sensors includes a first ranging sensor disposed on a bottom surface of a grinding device of the grinding robot and a second ranging sensor disposed on either side of the grinding assembly, further comprising:
detecting the polishing direction of the polishing robot;
when the polishing direction is the longitudinal moving direction of the polishing device, the first distance data are obtained by the detection of the first distance measuring sensor;
and when the polishing direction is the direction of the transverse movement of the polishing device, the second distance data is obtained by the detection of the second distance measuring sensor.
3. The method of claim 1, further comprising:
dividing the polishing area and the non-polishing area into a sub-polishing area and a sub-non-polishing area of a plurality of specifications respectively;
and determining the target polishing depth of the corresponding sub-polishing area according to the second distance data of each sub-non-polishing area.
4. The method of claim 3, wherein calculating a sanding depth value based on the first distance data and second distance data between a non-sanding region further comprises:
denoising the first distance data by using a random sampling consistency algorithm to obtain processed first distance data;
calculating final first distance data from the first distance data and the processed first distance data;
and calculating the polishing depth value based on the final first distance data and second distance data between the final first distance data and the corresponding sub non-polishing area.
5. A control apparatus of a grinding robot, the grinding robot having a plurality of distance measuring sensors, wherein the apparatus comprises:
the first detection module is used for detecting first distance data between the polishing robot and a polishing area when the polishing robot executes a current polishing action;
a calculation module for calculating a burnishing depth value based on the first distance data and second distance data between a non-burnishing area; and
and the correcting module is used for correcting the current polishing action according to the polishing depth value until the polishing depth of the polishing robot reaches the target polishing depth.
6. The apparatus of claim 5, wherein the plurality of ranging sensors includes a first ranging sensor disposed at a bottom surface of a sanding device of the sanding robot and a second ranging sensor disposed at either side of the sanding assembly, further comprising:
the second detection module is used for detecting the polishing direction of the polishing robot;
the third detection module is used for detecting the first distance data by the first distance measuring sensor when the grinding direction is the longitudinal moving direction of the grinding device;
and the fourth detection module is used for detecting the second distance data by the second distance measuring sensor when the grinding direction is the transverse moving direction of the grinding device.
7. The apparatus of claim 5, further comprising:
the dividing module is used for dividing the polishing area and the non-polishing area into a plurality of specifications of sub-polishing areas and sub-non-polishing areas respectively;
and the determining module is used for determining the target polishing depth of the corresponding sub-polishing area according to the second distance data of each sub-non-polishing area.
8. The apparatus of claim 7, wherein the computing module further comprises:
the processing unit is used for carrying out denoising processing on the first distance data by utilizing a random sampling consistency algorithm to obtain processed first distance data;
a first calculation unit configured to calculate final first distance data from the first distance data and the processed first distance data;
and the second calculation unit is used for calculating the polishing depth value based on the final first distance data and second distance data between the final first distance data and the corresponding sub non-polishing area.
9. An electronic device, comprising: a memory, a processor and a computer program stored on the memory and executable on the processor, the processor executing the program to implement the method of controlling a grinding robot according to any one of claims 1-5.
10. A computer-readable storage medium, on which a computer program is stored, characterized in that the program is executed by a processor for implementing a method of controlling a grinding robot according to any one of claims 1-5.
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| CN202011006020.1A CN112388511B (en) | 2020-09-23 | 2020-09-23 | Control method and device of polishing robot, electronic equipment and storage medium |
| PCT/CN2021/117582 WO2022062915A1 (en) | 2020-09-23 | 2021-09-10 | Method and apparatus for controlling grinding robot, electronic device, and storage medium |
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| CN202011006020.1A CN112388511B (en) | 2020-09-23 | 2020-09-23 | Control method and device of polishing robot, electronic equipment and storage medium |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113263511A (en) * | 2021-06-01 | 2021-08-17 | 重庆工程职业技术学院 | High-precision multifunctional robot for equipment manufacturing |
| CN113705590A (en) * | 2021-10-28 | 2021-11-26 | 江苏南通元辰钢结构制造有限公司 | Steel structure intelligent polishing control method based on artificial intelligence |
| WO2022062915A1 (en) * | 2020-09-23 | 2022-03-31 | 广东博智林机器人有限公司 | Method and apparatus for controlling grinding robot, electronic device, and storage medium |
| CN114571326A (en) * | 2022-01-20 | 2022-06-03 | 上海交通大学 | Method, device and system for grinding deformed curved surface based on computer vision |
| CN114800247A (en) * | 2022-04-08 | 2022-07-29 | 东莞市鸿仁自动化设备科技有限公司 | Brush grinding control method and device, computer equipment and storage medium |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114905515B (en) * | 2022-05-26 | 2023-05-12 | 无锡斯帝尔科技有限公司 | Robot control method and system based on flexible perception neural network |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752036A (en) * | 1993-08-10 | 1995-02-28 | Nippon Steel Corp | Grinding method by grinding robot |
| JPH08300250A (en) * | 1995-05-02 | 1996-11-19 | Nkk Corp | Flaw scraping grinder with flaw check mechanism |
| CN108000250A (en) * | 2017-12-07 | 2018-05-08 | 长沙长泰机器人有限公司 | A kind of method and system of casting grinding |
| CN108436650A (en) * | 2018-03-08 | 2018-08-24 | 北京铂阳顶荣光伏科技有限公司 | Edging method and device |
| CN109366492A (en) * | 2018-10-24 | 2019-02-22 | 武汉理工大学 | Casting grinding track online compensation system and method based on robot |
| CN109514571A (en) * | 2018-12-05 | 2019-03-26 | 上海发那科机器人有限公司 | It is a kind of to utilize robot vision and force snesor to the pinpoint method of car body polishing point |
| CN110900343A (en) * | 2019-12-10 | 2020-03-24 | 苏州嘉睦碧晟建筑装饰有限公司 | Stone plate polishing processing control system |
| CN111085902A (en) * | 2019-12-31 | 2020-05-01 | 芜湖哈特机器人产业技术研究院有限公司 | Workpiece polishing system for visual online detection and correction |
| CN111203766A (en) * | 2020-04-20 | 2020-05-29 | 广东博智林机器人有限公司 | Wall surface polishing path planning method, device, equipment and medium |
| WO2020150932A1 (en) * | 2019-01-23 | 2020-07-30 | 深圳市阿列夫图科技有限公司 | Method and device for ground grinding, robot and computer readable storage medium |
| CN111496579A (en) * | 2020-04-15 | 2020-08-07 | 广东博智林机器人有限公司 | Mechanical arm, wall surface processing method, electronic device and storage medium |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8602845B2 (en) * | 2011-09-23 | 2013-12-10 | United Technologies Corporation | Strengthening by machining |
| CN108544349A (en) * | 2018-04-23 | 2018-09-18 | 宁波汇智恒动自动化科技有限公司 | A kind of flexible polishing self compensating system |
| CN109290855B (en) * | 2018-10-18 | 2021-10-01 | 埃华路（芜湖）机器人工程有限公司 | Compensation method for dynamically monitoring grinding wheel loss in industrial robot grinding process |
| CN112388511B (en) * | 2020-09-23 | 2021-11-12 | 广东博智林机器人有限公司 | Control method and device of polishing robot, electronic equipment and storage medium |
-
2020
- 2020-09-23 CN CN202011006020.1A patent/CN112388511B/en active Active
-
2021
- 2021-09-10 WO PCT/CN2021/117582 patent/WO2022062915A1/en active Application Filing
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752036A (en) * | 1993-08-10 | 1995-02-28 | Nippon Steel Corp | Grinding method by grinding robot |
| JPH08300250A (en) * | 1995-05-02 | 1996-11-19 | Nkk Corp | Flaw scraping grinder with flaw check mechanism |
| CN108000250A (en) * | 2017-12-07 | 2018-05-08 | 长沙长泰机器人有限公司 | A kind of method and system of casting grinding |
| CN108436650A (en) * | 2018-03-08 | 2018-08-24 | 北京铂阳顶荣光伏科技有限公司 | Edging method and device |
| CN109366492A (en) * | 2018-10-24 | 2019-02-22 | 武汉理工大学 | Casting grinding track online compensation system and method based on robot |
| CN109514571A (en) * | 2018-12-05 | 2019-03-26 | 上海发那科机器人有限公司 | It is a kind of to utilize robot vision and force snesor to the pinpoint method of car body polishing point |
| WO2020150932A1 (en) * | 2019-01-23 | 2020-07-30 | 深圳市阿列夫图科技有限公司 | Method and device for ground grinding, robot and computer readable storage medium |
| CN110900343A (en) * | 2019-12-10 | 2020-03-24 | 苏州嘉睦碧晟建筑装饰有限公司 | Stone plate polishing processing control system |
| CN111085902A (en) * | 2019-12-31 | 2020-05-01 | 芜湖哈特机器人产业技术研究院有限公司 | Workpiece polishing system for visual online detection and correction |
| CN111496579A (en) * | 2020-04-15 | 2020-08-07 | 广东博智林机器人有限公司 | Mechanical arm, wall surface processing method, electronic device and storage medium |
| CN111203766A (en) * | 2020-04-20 | 2020-05-29 | 广东博智林机器人有限公司 | Wall surface polishing path planning method, device, equipment and medium |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022062915A1 (en) * | 2020-09-23 | 2022-03-31 | 广东博智林机器人有限公司 | Method and apparatus for controlling grinding robot, electronic device, and storage medium |
| CN113263511A (en) * | 2021-06-01 | 2021-08-17 | 重庆工程职业技术学院 | High-precision multifunctional robot for equipment manufacturing |
| CN113705590A (en) * | 2021-10-28 | 2021-11-26 | 江苏南通元辰钢结构制造有限公司 | Steel structure intelligent polishing control method based on artificial intelligence |
| CN113705590B (en) * | 2021-10-28 | 2022-02-22 | 江苏南通元辰钢结构制造有限公司 | Steel structure intelligent polishing control method based on artificial intelligence |
| CN114571326A (en) * | 2022-01-20 | 2022-06-03 | 上海交通大学 | Method, device and system for grinding deformed curved surface based on computer vision |
| CN114800247A (en) * | 2022-04-08 | 2022-07-29 | 东莞市鸿仁自动化设备科技有限公司 | Brush grinding control method and device, computer equipment and storage medium |
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| Publication number | Publication date |
|---|---|
| WO2022062915A1 (en) | 2022-03-31 |
| CN112388511B (en) | 2021-11-12 |
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