CN112388496B - Material management method and system applied to double-sided polishing equipment and storage medium - Google Patents
Material management method and system applied to double-sided polishing equipment and storage medium Download PDFInfo
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- CN112388496B CN112388496B CN202011344635.5A CN202011344635A CN112388496B CN 112388496 B CN112388496 B CN 112388496B CN 202011344635 A CN202011344635 A CN 202011344635A CN 112388496 B CN112388496 B CN 112388496B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
- G06K17/0022—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations arrangements or provisious for transferring data to distant stations, e.g. from a sensing device
Abstract
The embodiment of the invention discloses a material management method, a material management system and a storage medium applied to double-sided polishing equipment; the system comprises: the device comprises an infrared tag reader, a controller and a tag which is arranged on a bearing disc and can be detected by infrared, wherein the infrared tag reader and the controller are fixedly arranged on the periphery of a fixed disc of the double-sided polishing equipment; the infrared tag reader is configured to detect whether a target tag exists in a detection range when the double-sided polishing equipment stops feeding, and transmit a detection result to the controller; the controller is configured to send a reset instruction to the double-sided polishing device corresponding to the detection result representing that the target label is not detected; wherein the reset instruction is used for instructing the double-side polishing equipment to initialize aiming at the position of the bearing plate so as to restore the bearing plate to the correct position.
Description
Technical Field
The embodiment of the invention relates to the technical field of wafer manufacturing, in particular to a material management method and system applied to double-sided polishing equipment and a storage medium.
Background
In the current silicon wafer manufacturing process, the double-side polishing equipment used for performing the double-side polishing process generally includes an upper fixed plate, a lower fixed plate and a Carrier plate (Carrier) for carrying silicon wafers. For the bearing disc, the design structure takes stainless steel as a base, a Diamond-Like Carbon (DLC) film coating is coated on the surface, and polyvinylidene fluoride PVDF high molecular materials are embedded in the inner circle part of the part, which is in contact with a silicon wafer, of the inner circle part. In the double-side polishing apparatus, a carrier plate is generally placed on a lower fixed plate, and the carrier plate can rotate on its own axis and revolve around the center of the lower fixed plate to realize movement relative to the upper and lower fixed plates; the upper and lower fixed plates are both provided with polishing pads. The upper and lower fixed plates simultaneously apply pressure and polish the silicon wafers carried on the carrier plate in combination with the relative movement.
In the polishing process, based on the pressure exerted by the upper and lower fixed plates and the relative motion of the polishing pad, the PVDF polymer material embedded in the carrier plate is usually worn, and in order to ensure the quality of silicon wafer products, the service life of the carrier plate needs to be managed for periodic replacement; in addition, since occasionally a quality problem arises with some carrier trays, they need to be replaced individually. Therefore, the problem of inconsistent service life of the bearing discs in the same equipment can occur after the bearing discs are replaced, and the difficulty of material management is increased. In addition, the double-side polishing equipment can stop to feed after finishing processing, and at the moment, the position of a silicon wafer is mistaken due to the position deviation of the bearing plate during stopping occasionally.
Disclosure of Invention
In view of the above, embodiments of the present invention are intended to provide a material management method, system and storage medium for a double-side polishing apparatus; the service life of the bearing disc can be managed, the position of the bearing disc is monitored, and the phenomenon that the position of a silicon wafer is wrong due to the fact that the position of the bearing disc deviates when the machine is stopped is avoided.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a material management system applied to a double-side polishing apparatus, where the system includes: the device comprises an infrared tag reader, a controller and a tag which is arranged on a bearing disc and can be detected by infrared, wherein the infrared tag reader and the controller are fixedly arranged on the periphery of a fixed disc of the double-sided polishing equipment; wherein the content of the first and second substances,
the infrared tag reader is configured to detect whether a target tag exists in a detection range when the double-sided polishing equipment stops feeding, and transmit a detection result to the controller;
the controller is configured to send a reset instruction to the double-sided polishing device corresponding to the detection result representing that the target label is not detected; wherein the reset instruction is used for instructing the double-side polishing equipment to initialize aiming at the position of the bearing plate so as to restore the bearing plate to the correct position.
In a second aspect, an embodiment of the present invention provides a material management method applied to a double-side polishing apparatus, where the method is applied to the material management system applied to the double-side polishing apparatus in the first aspect, and the method includes:
when the double-sided polishing equipment stops to perform blanking, detecting whether a target label exists in a detection range through an infrared label reader;
corresponding to the detection result representation that the target label is not detected, sending a reset instruction to the double-sided polishing equipment through a controller; wherein the reset instruction is used for instructing the double-side polishing equipment to initialize aiming at the position of the bearing plate so as to restore the bearing plate to the correct position.
In a third aspect, an embodiment of the present invention provides a computer storage medium, where a material management program applied to a double-side polishing apparatus is stored, and when being executed by at least one processor, the material management program applied to the double-side polishing apparatus implements the material management method steps applied to the double-side polishing apparatus in the second aspect.
The embodiment of the invention provides a material management method, a material management system and a storage medium applied to double-sided polishing equipment; when the double-sided polishing equipment stops to discharge, if the infrared tag reader does not detect any tag in the detection range of the infrared tag reader or does not detect a target tag arranged on the target bearing plate, the situation that the target bearing plate is not located at the theoretical position of the target bearing plate when the double-sided polishing equipment stops to discharge is shown, and the position of the target bearing plate is abnormal. Therefore, when the controller receives the detection result representing the detection result, the controller can determine that the position of the target bearing disc has deviation, so that the controller can send a reset instruction to the double-side polishing equipment, the double-side polishing equipment can initialize the position of the bearing disc again, and the phenomenon that the position of a silicon wafer is wrong due to the deviation of the position of the bearing disc is avoided.
Drawings
FIG. 1 is a schematic top view of a double-side polishing apparatus to which embodiments of the present invention can be applied;
FIG. 2 is a schematic diagram of a material management system applied to a double-side polishing apparatus according to an embodiment of the present invention;
fig. 3 is a schematic flow chart of a material management method applied to a double-side polishing apparatus according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
At present, a schematic top view of the structure of a double-side polishing apparatus 1 is shown in fig. 1, and includes: a fixed plate 11 and a plurality of loading plates 12 filled with oblique lines; the fixed plate 11 is a ring, and includes an inner pin ring 111 and an outer pin ring 112, each of the carrier plates 12 carries a plurality of silicon wafers 2, and in the embodiment of the present invention, each of the carrier plates 12 shown in fig. 1 carries 3 silicon wafers 2 as an example. The carrier plate 12 rotates on its own axis in the range between the inner pin ring 111 and the outer pin ring 112 and also revolves around the center of the fixed plate 11. The above-described double-side polishing apparatus 1 not only needs to manage the life of the carrier tray for periodic replacement during polishing. In addition, when the double-side polishing device 1 is stopped and fed after finishing processing, the position of the silicon wafer is mistaken due to the position deviation of the bearing plate during the stop occasionally. In view of the above explanation, the embodiment of the present invention is expected to provide a material management scheme applied to a double-side polishing apparatus, which can manage the lifetime of a carrier plate, monitor the position of the carrier plate, and avoid the phenomenon of silicon wafer position error caused by the position deviation of the carrier plate during shutdown.
Based on this, referring to fig. 2, a material management system 20 applied to a double-sided polishing apparatus according to an embodiment of the present invention is shown, where the system 20 includes: the double-side polishing device comprises infrared tag readers 21, a controller 22 and infrared detectable tags 23, wherein the infrared tag readers 21 and the controller 22 are arranged on the periphery of a fixed disc 11 of the double-side polishing device 1 at equal intervals; wherein the content of the first and second substances,
the infrared tag reader 21 is configured to detect whether a target tag exists in a detection range when the double-sided polishing device 1 stops feeding, and transmit a detection result to the controller 22;
the controller is configured to send a reset instruction to the double-sided polishing device 1 corresponding to the detection result representing that the target label is not detected; wherein the reset instruction is used for instructing the double-side polishing apparatus 1 to initialize the position of the carrier tray 12 so as to restore the carrier tray 12 to the correct position.
In particular, in practice, the label 23 may comprise a laser label, a bar code label or a two-dimensional code label. These types of tags are all capable of being detected by the infrared tag reader 21 when they are within the detection range of the infrared tag reader 21 as shown by the dashed lines in fig. 2; in addition, since the infrared tag reader 21 is disposed in a fixed position, that is, its detection range is also fixed accordingly, when the tag 23 is present in the detection range, the position of the carrier tray 12 on which the tag 23 is disposed can be determined accordingly. When the double-sided polishing device 1 is stopped and discharged, if the infrared tag reader 21 does not detect any tag in the detection range of the double-sided polishing device, or does not detect a target tag arranged on a target bearing disc, it indicates that the target bearing disc is not located at the theoretical position of the target bearing disc when the double-sided polishing device is stopped and discharged, and the position of the target bearing disc is abnormal. Therefore, when the controller 22 receives the detection result representing the above, it can determine that the position of the target carrier tray has a deviation, so that the controller 22 can send a reset instruction to the double-side polishing apparatus 1, so that the double-side polishing apparatus 1 can initialize the position of the carrier tray 12 again, thereby avoiding the occurrence of mixed material abnormality.
For the system 20 shown in fig. 2, the label 23 may specifically include a laser label, a barcode label, or a two-dimensional code label. Taking a laser label as an example, specifically, when the double-sided polishing device 1 is set to stop feeding, the bearing disc 12 should theoretically stay at a fixed position, based on which, the detection range of the infrared label reader 21 can be set in a fixed direction corresponding to the fixed position, when the double-sided polishing device 1 stops feeding, the label of the target bearing disc can be detected by the infrared label reader 21, which indicates that the target bearing disc is at the fixed position, and the position of the target bearing disc has no deviation; if the tag of the target carrier tray is not detected by the infrared tag reader 21, for example, the infrared tag reader 21 does not detect any tag or the infrared tag reader 21 detects tags of other carrier trays except the target carrier tray, it can be shown that the target carrier tray is not located at the fixed position, and the position of the target carrier tray is deviated, so that the position of the silicon wafer is wrong, at this time, the controller 22 can send an instruction to the double-side polishing apparatus 1 to initialize the position of the carrier tray 12, so that the carrier tray 12 is restored to the correct position, and the situation that the material of the silicon wafer 2 is disordered due to the position deviation of the carrier tray 12 is avoided. In detail, the controller 22 may be a control unit in the double-side polishing apparatus 1, or may be an external factory system connected to the double-side polishing apparatus 1, which is not limited in the embodiment of the present invention.
With the system shown in fig. 2, since the fixed platen 11 is usually provided with a plurality of carrier platens 12, and there is a fixed order between the carrier platens 12, in order to detect and manage the order of the carrier platens 12, in some examples, a plurality of carrier platens 12 provided with tags 23 are provided in a set order in correspondence with the double-side polishing apparatus 1, and the infrared tag reader 21 is further configured to obtain the detected tag order based on the detection in the detection range; and sequentially transmitting the detected tags to the controller;
the controller is further configured to determine whether the detected tag order is correct in the set order. In the above example, preferably, the labels 23 of the plurality of carrier trays 12 are all disposed at the same position in the respective carrier tray 12.
Specifically, the number of the carrier trays 12 placed in the fixed tray 11 is set to 5 as shown in fig. 2, and the carrier trays are marked as a, b, c, d, and e; the placement order is also a, b, c, d, e. As the polishing process proceeds, the infrared tag reader 21 may sequentially detect the tags on each carrier tray 12 within its detection range, thereby obtaining a detected tag sequence. The controller 22 may compare the detected tag sequence with the placement sequence during placement, and if the detected tag sequence is consistent with the placement sequence, the current sequence is correct; otherwise, it may be determined that the current order is abnormal. Meanwhile, when the infrared tag reader 21 cannot identify the carrier tray 12, it indicates whether the relative positions of the plurality of silicon wafers 2 carried by the carrier tray 12 and the fixed tray 11 are changed, and determines whether the current sequence is abnormal. When the controller 22 determines that the current order is abnormal, the controller 22 may initialize the positions of all the carrier trays 12 by sending a command to the double-side polishing apparatus 1, similarly to the foregoing example, so that the order of all the carrier trays 12 is restored to the correct order.
For the system 20 shown in fig. 2, the label 23 may specifically comprise a laser label, a bar code label, or a two-dimensional code label. Therefore, the label 23 may also store therein an identification of the carrier tray 12 on which the label is set, and in some examples, the infrared label reader 21 is further configured to read the identification of the carrier tray 12 stored in the label 23 by detecting the label 23 when the carrier tray 12 is placed on the lower surface plate 11 of the double-side polishing apparatus 1; and, transmitting the identity of the carrier platter 12 to the controller 22;
the controller 22 is further configured to record the working life of the carrier tray 12 corresponding to the identification of the carrier tray 12 based on the processing times of the double-side polishing device 1; and when the working life of the bearing disc 12 corresponding to the bearing disc 12 identifier meets the set working life, sending a reminding instruction for indicating to replace the bearing disc 12 corresponding to the bearing disc 12 identifier.
Specifically, since the carrier trays 12 are consumables in the double-side polishing process and need to be replaced periodically, the working life of each carrier tray 12 needs to be managed so that the carrier tray can be replaced in time. When the carrier tray 12 is placed on the lower fixed tray 11, the carrier tray 12 may be considered as belonging to a new carrier tray, and at this time, the infrared tag reader 21 may read the identifier of the carrier tray 12 stored in the tag 23 by detecting the tag 23, and transmit the identifier of the carrier tray 12 to the controller 22; the controller 22 may establish a working life table for the identifier of the carrier tray 12, and calculate the working time of the carrier tray 12 according to the processing times of the double-side polishing apparatus 1, where the working time may be characterized by the running times, or by a specific length of the running period, which is not limited in the embodiment of the present invention. The working time of the carrier tray 12 can be recorded in the corresponding established working life table, and when the working time recorded in the working life table meets the set working life required to be replaced by the carrier tray, it indicates that the carrier tray 12 needs to be replaced, and at this time, the controller 22 can send a reminding instruction for reminding to replace the carrier tray 12. Therefore, the service life of a single bearing disc is controlled.
For the above technical solutions and examples thereof, in the implementation process, the specific setting positions and the number of the infrared tag readers 21 may be set according to actual operation requirements of a factory or equipment, for example, one double-sided polishing device may be matched with one infrared tag reader, or one double-sided polishing device may be matched with a plurality of infrared tag readers, which is not specifically limited in the embodiment of the present invention.
Based on the same inventive concept of the foregoing technical solution, referring to fig. 3, a material management method applied to a double-sided polishing apparatus is shown, where the method is applied to a material management system applied to a double-sided polishing apparatus in the foregoing technical solution, and the method includes:
s301: when the double-sided polishing equipment stops to perform blanking, detecting whether a target label exists in a detection range through an infrared label reader;
s302: corresponding to the detection result representation that the target label is not detected, sending a reset instruction to the double-sided polishing equipment through a controller; wherein the reset instruction is used for instructing the double-side polishing equipment to initialize aiming at the position of the bearing plate so as to restore the bearing plate to the correct position.
For the solution shown in fig. 3, in some examples, the label comprises a laser label, a barcode label, or a two-dimensional code label.
With respect to the solution shown in fig. 3, in some examples, a plurality of carrier trays provided with the labels are placed in a set order in correspondence to the double-side polishing apparatus, and the method further includes:
detecting in a detection range through the infrared tag reader to obtain a detected tag sequence;
and judging whether the detected label sequence is correct or not according to the set sequence through the controller.
For the technical solution shown in fig. 3, in some examples, the label stores therein an identifier of the carrier tray; the method further comprises the following steps:
when the bearing disc is placed on a lower fixed disc of the double-sided polishing device, the label is detected through the infrared label reader so as to read the identification of the bearing disc stored in the label;
recording the working life of the bearing disc corresponding to the bearing disc identification based on the processing times of the double-sided polishing equipment through the controller; and sending a reminding instruction for indicating to replace the bearing disc corresponding to the bearing disc identification when the working life of the bearing disc corresponding to the bearing disc identification meets the set working life.
It can be understood that for the technical solution and the example thereof shown in fig. 3, the specific description and explanation thereof can refer to the corresponding explanation of the content of each component of the material management system 20 for a double-sided polishing apparatus in the foregoing technical solution, and the embodiment of the present invention is not repeated here.
In addition, the steps in the present embodiment may be implemented in the form of hardware components in the system 20 shown in fig. 2, or in the form of software functional modules. If the software module is implemented as a software functional module and is not sold or used as a standalone product, the software module may be stored in a computer readable storage medium, and based on the understanding, a part of the technical solution of the present embodiment or all or part of the technical solution may be embodied in a software product stored in a storage medium, and include several instructions to enable a computer device (which may be a personal computer, a server, or a network device) or a processor to execute all or part of the steps of the method of the present embodiment. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Therefore, the present embodiment provides a computer storage medium, which stores a material management program applied to a double-side polishing apparatus, and when the material management program applied to the double-side polishing apparatus is executed by at least one processor, the method for managing materials applied to the double-side polishing apparatus in the above technical solution is implemented.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. A material management system for use with a double-side polishing apparatus, the system comprising: the device comprises an infrared tag reader, a controller and a tag which is arranged on a bearing disc and can be detected by infrared, wherein the infrared tag reader and the controller are fixedly arranged on the periphery of a fixed disc of the double-sided polishing equipment; wherein the content of the first and second substances,
the infrared tag reader is configured to detect whether a target tag exists in a detection range when the double-sided polishing equipment stops feeding, and transmit a detection result to the controller;
the controller is configured to send a reset instruction to the double-sided polishing device corresponding to the detection result representing that the target label is not detected; wherein the reset instruction is used for instructing the double-sided polishing equipment to initialize aiming at the position of the carrier plate so as to restore the carrier plate to the correct position,
wherein a plurality of carrier trays provided with the tags are placed in a set order in correspondence to the double-side polishing apparatus, and the infrared tag reader is further configured to obtain a detected tag order based on detection within a detection range; and sequentially transmitting the detected tags to the controller;
the controller is further configured to determine whether the detected tag order is correct in the set order.
2. The system of claim 1, wherein the label comprises a laser label, a barcode label, or a two-dimensional code label.
3. The system of claim 1, wherein the labels of the plurality of carrier trays are all disposed at the same location in the respective carrier tray.
4. The system of claim 1, wherein the tag has stored therein an identification of the carrier platter; the infrared tag reader is also configured to read the identification of the carrier disc stored in the tag by detecting the tag when the carrier disc is placed on the lower fixed disc of the double-sided polishing device; and transmitting the identification of the bearing disc to the controller;
the controller is also configured to record the working life of the carrier disc corresponding to the carrier disc identification based on the processing times of the double-sided polishing equipment; and sending a reminding instruction for indicating to replace the bearing disc corresponding to the bearing disc identification when the working life of the bearing disc corresponding to the bearing disc identification meets the set working life.
5. A material management method applied to a double-side polishing apparatus, characterized in that the method is applied to the material management system applied to the double-side polishing apparatus of any one of claims 1 to 4, the method comprising:
when the double-sided polishing equipment stops to perform blanking, detecting whether a target label exists in a detection range through an infrared label reader;
corresponding to the detection result representation that the target label is not detected, sending a reset instruction to the double-sided polishing equipment through a controller; wherein the reset instruction is used for instructing the double-side polishing equipment to initialize aiming at the position of the bearing plate so as to restore the bearing plate to the correct position.
6. The method of claim 5, wherein the label comprises a laser label, a barcode label, or a two-dimensional code label.
7. The method of claim 5, wherein a plurality of carrier trays provided with the labels are placed in a set order corresponding to the double-side polishing apparatus, the method further comprising:
detecting in a detection range through the infrared tag reader to obtain a detected tag sequence;
and judging whether the detected label sequence is correct or not according to the set sequence through the controller.
8. The method of claim 5, wherein the tag has stored therein an identification of the carrier platter; the method further comprises the following steps:
when the bearing disc is placed on a lower fixed disc of the double-sided polishing device, the label is detected through the infrared label reader so as to read the identification of the bearing disc stored in the label;
recording the working life of the bearing disc corresponding to the bearing disc identification based on the processing times of the double-sided polishing equipment through the controller; and sending a reminding instruction for indicating to replace the bearing disc corresponding to the bearing disc identification when the working life of the bearing disc corresponding to the bearing disc identification meets the set working life.
9. A computer storage medium storing a material management program applied to a double-side polishing apparatus, wherein the material management program applied to the double-side polishing apparatus, when executed by at least one processor, implements the material management method steps applied to the double-side polishing apparatus according to any one of claims 5 to 8.
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| CN110752169A (en) * | 2019-10-21 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Wafer processing device and loading and unloading method |
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| JP2001053039A (en) * | 1999-08-05 | 2001-02-23 | Okamoto Machine Tool Works Ltd | Method and device for detecting polishing end point of wafer |
| JP2004158559A (en) * | 2002-11-05 | 2004-06-03 | Nikon Corp | Fiducial mark and aligner having it |
| CN2588528Y (en) * | 2002-12-17 | 2003-11-26 | 桦塑企业股份有限公司 | Identifier for semiconductor carried tray |
| JP4376116B2 (en) * | 2003-06-03 | 2009-12-02 | 東京エレクトロン株式会社 | How to adjust the board delivery position |
| TWI501341B (en) * | 2012-03-07 | 2015-09-21 | Advanced Semiconductor Eng | System for automatically identifying positions of trays of semiconductor products and method therefor |
| CN104078402B (en) * | 2014-06-30 | 2017-01-18 | 武汉新芯集成电路制造有限公司 | Auxiliary device for mechanical arm position adjusting |
| KR102493014B1 (en) * | 2018-07-03 | 2023-01-31 | 주식회사 케이씨텍 | Substrate processing apparatus |
| CN110767587B (en) * | 2019-10-21 | 2022-04-01 | 西安奕斯伟材料科技有限公司 | Wafer processing device and loading and unloading method |
| CN211376594U (en) * | 2019-10-30 | 2020-08-28 | 武汉盛为芯科技有限公司 | High-precision strip swinging device |
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| EP0145007A2 (en) * | 1983-12-10 | 1985-06-19 | Aida Engineering Ltd. | Playback system grinding robot |
| CN110752169A (en) * | 2019-10-21 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Wafer processing device and loading and unloading method |
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