CN112385928A - Semi-coated shoes and manufacturing mold thereof - Google Patents

Abstract

The invention discloses a semi-coated shoe and a manufacturing mold thereof, wherein the semi-coated shoe comprises a midsole, a film layer, an outsole and a vamp; the insole is formed by foaming injection molding materials; the film layer covers the lower surface of the whole insole, extends towards the side surface of the insole and wraps the lower surface of the insole to a first preset height position of the side surface of the insole; the outsole is connected to the lower surface of the film layer; the vamp is connected on the insole through injection molding material an organic whole. According to the semi-coated shoes provided by the invention, the structure of the semi-coated shoes is adjusted through improvement of a mold and a process, so that upper-connecting injection molding of the coated soles and the vamps is realized, the vamps are connected to the insole through injection molding material foaming, the soles and the vamps are prevented from being bonded by glue, further, the environment pollution is avoided, the vamps and the soles are prevented from being bonded by manual gluing, and the quality and the production efficiency of the semi-coated shoes are improved.

Description

Semi-coated shoes and manufacturing mold thereof

Technical Field

The invention relates to the technical field of shoemaking, in particular to a semi-coated shoe and a manufacturing mold thereof.

Background

At present, in order to protect the shoe insole material, a layer of film is wrapped outside the shoe insole material while the shoe insole material is foamed and molded, and in addition, the film can cover bubble flaws generated by the foaming of the shoe insole material, so that the appearance of the shoe sole is optimized. However, the traditional coated sole is limited by a mold and a process at present, the whole insole is wrapped and then subjected to injection molding, then, redundant films at the top end of the insole are cut off, and then, the vamp is pasted on the sole through glue brushing in a cold bonding process. Because the envelope is trimmed after injection molding is finished, if the envelope is a full envelope, the vamp is easily cut during trimming, so the full envelope outsole is trimmed firstly and then is stuck on the vamp by a cold bonding process, and the continuous upper injection molding cannot be realized.

In summary, how to realize the upper-connecting injection molding of the coated shoes is a problem to be solved by the technical personnel in the field at present.

Disclosure of Invention

In view of the above, the first object of the present invention is to provide a semi-enveloped shoe, which can realize upper-connecting injection molding of the enveloped shoe.

The second purpose of the invention is to provide a mold for manufacturing the semi-enveloped shoes.

In order to achieve the first object, the invention provides the following technical scheme:

a semi-coated shoe comprises a midsole, a film layer, an outsole and a vamp;

the middle sole is formed by foaming injection molding materials;

the film layer covers the lower surface of the whole insole, extends towards the side surface of the insole and wraps the lower surface of the insole to a first preset height position of the side surface of the insole;

the outsole is connected to the lower surface of the film layer;

the vamp is integrally connected to the insole through the injection molding material.

In a specific embodiment, the film layer is integrally attached to the midsole by the injection molding compound;

and/or

The thickness of the thin film layer is greater than or equal to 0.1mm and less than or equal to 0.8 mm.

In another embodiment, the film layer is heat softened to adhere to the large substrate;

and/or

The upper surface of the outsole is coated with an adhesive layer, and the thin film layer is adhered to the adhesive layer to be connected with the outsole.

In another specific embodiment, the film layer is a TPU film layer, the film layer having a melting point of 130 ℃ to 140 ℃;

and/or

The injection molding material is a PU material, and the temperature of the injection molding material is 100-120 ℃;

and/or

The hardness of the material of the middle sole is less than that of the material of the film layer.

In another specific embodiment, the lower surface of the midsole is provided with a groove, the outsole is provided with a hollow part, the groove can be exposed out of the sole through the hollow part, and the film layer covers the inner surface of the groove;

and/or

The heel part of the insole extends upwards to form a heel covering capable of covering the heel of a human body;

and/or

The outer wall of the film layer is provided with a plurality of concave grooves, the concave grooves are obliquely arranged, and the top ends of the concave grooves are close to the toe caps;

and/or

The lower surface of the outsole is provided with a plurality of anti-skidding lugs.

The various embodiments according to the invention can be combined as desired, and the embodiments obtained after these combinations are also within the scope of the invention and are part of the specific embodiments of the invention.

According to the technical scheme, the insole is formed by injection molding and foaming of injection molding materials, the thin film layer is connected to the lower surface of the insole and extends to the side face of the insole, and the thin film layer wraps the insole to the preset height of the insole. Because traditional diolame sole need cut the limit and decorate to the film layer after moulding plastics and form the insole, cut off unnecessary film layer, carry out the deburring to the sole. The traditional coated sole is limited by an injection molding technology and a mold, a thin layer is completely coated on the insole, if the vamp and the traditional coated sole are subjected to combined upper injection molding, the vamp can be inevitably scratched to achieve the trimming standard when the edge of the vamp is cut and the thin layer is modified, and the whole pair of shoes are scrapped. The structure of the semi-coated shoe is adjusted through improvement of a mold and a process, so that upper-connecting injection molding of the coated sole and the vamp is realized, the vamp is connected to the insole through injection molding material in a foaming mode, the sole and the vamp are prevented from being bonded by glue, environment pollution is further avoided, manual gluing for bonding the vamp and the sole is avoided, and quality and production efficiency of the semi-coated shoe are improved.

In order to achieve the second object, the invention further provides a manufacturing mold of the semi-coated shoe, which is used for connecting the vamp to the midsole, the outer surface of the midsole is wrapped by the film layer, and the manufacturing mold comprises a bottom mold, a middle frame and an upper mold;

a bottom die cavity is formed in the bottom die, and the thin film layer can be attached to the bottom die cavity;

the middle frame abuts against the upper surface of the bottom die and is used for pressing the periphery of the thin film layer;

go up the mould with the die block can open and shut, the bottom of going up the mould is provided with the shaping arch, works as go up the mould with during the die block compound die, the protruding cover of shaping is established in the center and with the top of die block supports and holds, upward be fixed with the shoe tree on the mould, the vamp cover is established on the shoe tree, it is protruding to be provided with the compound die on the mould inner wall, the protruding butt of compound die is in on the vamp, go up the inner chamber of mould the bottom die cavity with the vamp constitutes and seals the cavity, and the injection molding material can foam in the closed cavity, form the insole, just the thin layer parcel the lower surface of insole extremely the first predetermined high department of insole side.

In a specific embodiment, the bottom surface of the bottom cavity is matched with the lower surface of the outsole in shape, the bottom cavity can be directly positioned and used for containing the outsole, and the lower surface of the film layer is attached to the upper surface of the outsole;

or

The bottom surface of the bottom die cavity is in a shape of a profiling plane, and the lower surface of the film layer is attached to the bottom surface of the bottom die cavity.

In another specific embodiment, the manufacturing mold further comprises a vacuum;

a through hole communicated with the vacuumizing device is formed in the bottom die cavity;

when the bottom die cavity is used for directly containing a large bottom, the vacuumizing device can vacuumize the bottom die cavity through the through hole so as to adsorb and attach the film layer to the large bottom;

when the bottom die cavity is used for directly containing the thin film layer, the vacuumizing device can vacuumize the bottom die cavity through the through hole so as to adsorb and attach the thin film layer to the bottom die cavity;

and/or

The manufacturing mold further comprises a heating device for heating the thin film layer so that the thin film layer is softened.

In another specific embodiment, the manufacturing mold further comprises a sealing bar;

the sealing strip is sealed to be set up the upper surface of die block, the lower surface correspondence of center is provided with sealed arch, the thin layer is located the center with between the die block, sealed arch supports and holds on the sealing strip, so that the sealed laminating of thin layer is in on the die block.

In another specific embodiment, a first protrusion is arranged in the bottom mold cavity of the bottom mold, the film layer covers the outer surface of the first protrusion, and the first protrusion extends to a second preset height of the midsole, so that a groove is formed in the lower surface of the midsole.

In another embodiment, the sidewall of the bottom mold cavity is provided with a second protrusion, the second protrusion is obliquely arranged, and the top end of the second protrusion is close to the toe cap.

In another specific embodiment, the lower surface of the middle frame is a molding surface, the upper surface of the bottom mold is a molding surface complementary to the lower surface of the middle frame, and the middle frame and the bottom mold cooperate to press the film layer to mold the edge of the film layer.

In another specific embodiment, the upper mold comprises a first mold half and a second mold half;

the utility model discloses a shoe last, including first half mould, second half mould, last half mould, first half mould and second half mould, the one end of first half mould and second half mould is articulated, the joint can be opened and shut to the other end of first half mould and second half mould, when first half mould and second half mould were opened, the shoe tree that the cover was equipped with the vamp can be put into in the upper die, when first half mould and second half mould were closed, protruding butt of compound die was in.

In another specific embodiment, the upper mold further comprises an upper frame;

the upper frame is in an inverted U shape;

the upper frame is fixed on the first half mould or the second half mould;

the shoe tree is fixed on the upper frame, the upper frame is used for pressing the shoe tree on the upper die.

The various embodiments according to the invention can be combined as desired, and the embodiments obtained after these combinations are also within the scope of the invention and are part of the specific embodiments of the invention.

According to the technical scheme, when the manufacturing mold of the semi-coated shoe is used, the thin film layer is attached to the bottom mold cavity; then, compress tightly thin layer and die block with the center, after injecting liquid injection molding material into the bottom die cavity, will be fixed with the last mould and the die block compound die of shoe tree rapidly, at this moment, the vamp that the shoe tree overcoat was established and the protruding butt of compound die on the die block, the shaping arch of going up the mould bottom supports with the top of die block and holds, goes up mould, compound die arch, bottom die cavity and vamp and constitutes sealed cavity, liquid injection molding material foaming forms the insole, and the first high department of predetermineeing of the lower surface to the insole side of thin layer parcel insole. According to the invention, through improvement of a mold and a process, the structure of the semi-coated shoe is adjusted, so that upper-connecting injection molding of the coated sole and the shoe upper is realized, the shoe upper is connected to the insole through injection molding material foaming, the sole and the shoe upper are prevented from being bonded by glue, further, the environment pollution is avoided, the shoe upper and the sole are prevented from being bonded by manual gluing, and the quality and the production efficiency of the semi-coated shoe are improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural view of a semi-enveloped shoe provided by the present invention;

FIG. 2 is a schematic structural view of a sole of a semi-enveloped shoe provided by the present invention;

FIG. 3 is another schematic structural view of the sole of the semi-enveloped shoe provided by the invention;

FIG. 4 is a schematic structural view of an outsole of a semi-enveloped shoe provided by the invention;

FIG. 5 is a schematic structural view of a mold for manufacturing semi-enveloped shoes provided by the present invention;

FIG. 6 is a schematic cross-sectional view of a mold for manufacturing semi-enveloped shoes according to the present invention;

FIG. 7 is a schematic structural diagram of an upper mold of the manufacturing mold provided by the present invention;

FIG. 8 is a schematic partial structural view of an upper mold of the manufacturing mold according to the present invention;

FIG. 9 is a partial structural view of a middle frame of a manufacturing mold according to the present invention;

fig. 10 is a partial structural schematic view of a bottom mold for manufacturing a mold according to the present invention.

In fig. 1-10:

semi-enveloped shoe 100, outsole 103, film layer 102, midsole 101, upper 104, concave groove 105, groove 106, hollowed-out portion 107, anti-slip bump 108, manufacturing mold 200, bottom mold 201, bottom mold cavity 2011, middle frame 202, upper mold 203, sealing strip 204, first protrusion 205, vacuumizing device 206, mold closing protrusion 207, second protrusion 208, first half mold 2031, second half mold 2032, upper frame 2033, shoe tree 209 and molding protrusion 210.

Detailed Description

The invention aims to provide a semi-coated shoe, wherein the lower half part of a midsole is wrapped with a thin film, the upper half part of the midsole is connected with a vamp through injection molding, the semi-coated shoe covers bubble flaws generated by foaming of a midsole material, so that the appearance of the sole is optimized, the vamp is prevented from being scratched during trimming, the rejection rate and the return rate of injection molded shoes are reduced, in addition, the vamp is connected to the midsole of the semi-coated shoe through foaming of an injection molding material, the sole and the vamp are prevented from being bonded by glue, the environment pollution is avoided, the quality of the semi-coated shoe is improved, and the production efficiency of the semi-coated shoe is improved.

The second purpose of the invention is to provide a mold for manufacturing the semi-enveloped shoes.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the position or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Referring to fig. 1-4, the present invention provides a semi-enveloped shoe 100, wherein the semi-enveloped shoe 100 comprises a midsole 101, a film layer 102, an outsole 103 and an upper 104.

The insole 101 is formed by the foaming of injection molding material, and the film layer 102 covers the lower surface of whole insole 101, and extends to the side of insole 102, wraps up the lower surface of insole 101 to the predetermined height department of the side of insole 101. In order to increase the color and beauty of the sole of semi-enveloped shoe 100, the color of the injection molding material may be different from the color of film layer 102.

The preset height means that the thin film layer 102 is higher than the lowest end of the midsole 101 and lower than the highest end of the midsole 101, so that at least a part of the side surface of the midsole 101 is exposed out of the thin film layer 102, and the specific height can be set within the above range according to needs.

The film layer 102 is attached to the outer surface of the midsole 101, and in particular, the periphery of the film layer 102 extends upwardly such that the film layer 102 forms a receiving cavity therein to partially receive the midsole 101, it being understood that the shape of the film layer 102 conforms to the contour of the midsole 101 of the semi-envelope shoe 100.

The outsole 103 is connected to the lower surface of the film layer 102, and plays a role in resisting abrasion and slip. In order to further increase the color sense and the aesthetic degree of the sole of the semi-enveloped shoe 100, the color of the outsole 103 can be different from the color of the midsole 101 and the color of the thin film layer 102, and the three colors of the midsole 101, the thin film layer 102 and the outsole 103 are changed, so that the semi-enveloped shoe 100 is more fashionable.

Vamp 104 is connected on insole 101 through the injection molding material, and vamp 104 and insole 101 are through moulding plastics an organic whole and be connected. Upper 104 may be cut and sewn from leather, cloth, fabric, or the like.

In the semi-enveloped shoe 100 provided by the invention, the insole 101 is formed by injection molding and foaming of injection molding materials, the thin film layer 102 is connected to the lower surface of the insole 101, and the thin film layer 102 wraps the insole 101 to the preset height of the insole 101. After the traditional coated sole is injected to form a midsole, the thin film layer 102 needs to be trimmed, so that the redundant thin film layer 102 is cut off, and the sole is trimmed. The traditional coated sole is limited by an injection molding technology and a mold, the insole is completely coated by the thin film layer 102, and if the vamp 104 and the traditional coated sole are subjected to combined injection molding, the vamp 104 is inevitably scratched to achieve the trimming standard when the thin film layer 102 is trimmed by cutting edges, so that the whole pair of shoes is scrapped. According to the semi-enveloped shoe 100 provided by the invention, the structure of the semi-enveloped shoe 100 is adjusted through the improvement of a mold and a process, and the lower surface and part of the side wall of the midsole 101 are wrapped by the thin film layer 102, so that the midsole 101 is protected; at least one part of the side surface of the insole 101 is exposed out of the thin film layer 102, so that the upper connection injection molding of the coated sole and the vamp 104 is realized, the vamp 104 is connected to the insole 101 through injection molding material in a foaming manner, the vamp 104 is not damaged when the thin film layer 102 is trimmed, the vamp 104 and the insole 101 are subjected to the upper connection injection molding, the sole and the vamp 104 are prevented from being bonded by glue, and the environment pollution is further avoided; meanwhile, the vamp 104 and the sole are prevented from being bonded by manual gluing, and the quality and the production efficiency of the semi-enveloped shoe 100 are improved.

In some embodiments, the film layer 102 is integrally connected to the midsole 101 by injection molding, which improves the connection strength between the film layer 102 and the midsole 101.

Further, the invention specifically discloses that the film layer 102 is a TPU film layer, and it should be noted that the film layer 102 is not limited to be made of TPU material, and may be made of other materials.

Further, the present invention discloses that the thickness of the film layer 102 is greater than or equal to 0.1mm and less than or equal to 0.8mm, preferably, the thickness of the film layer 102 may be 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, or 0.7mm, etc. The thickness of the thin film layer 102 is not limited to the above range, and may be set according to specific needs.

Further, the present invention discloses that the film layer 102 is adhered to the outsole 103 by softening with heat. The film layer 102 is not limited to the above connection method, and may be another connection method. The manner of softening the film layer 102 by heating to adhere it to the outsole 103 improves the degree of adherence of the film layer 102 to the outsole 103.

Further, the invention discloses that the injection molding material is PU material, and the temperature of the injection molding material reaches 100-120 ℃ during injection molding foaming, preferably 110 ℃; the melting point of the film layer 102 is 130 c to 140 c, preferably 130 c. During injection molding, the injection molding material can be heated to soften the thin film layer 102 to the maximum extent, but not to melt the thin film layer 102.

In order to further improve the connection strength of the film layer 102 and the outsole 103, the invention discloses that the semi-enveloped shoe 100 further comprises an adhesive layer, wherein the adhesive layer is coated on the upper surface of the outsole 103, and the film layer 102 is adhered to the adhesive layer to be connected with the outsole 103.

Specifically, the invention discloses a bonding layer which is a water-based polyurethane bonding layer. The waterborne polyurethane adhesive layer has strong activity, so the waterborne polyurethane adhesive layer has good adhesive property to various materials, is environment-friendly and harmless, and can well adhere the film layer 102 and the outsole 103. In addition, the middle sole 101 and the big sole 103 do not need to be brushed with glue when being combined. Use film layer 102 to take the example in through vacuum adsorption in die block 201, when forming the sole, at first place the big end 103 that has the brush adhesive linkage in injection mold's die block 201, later adsorb film layer 102 in die block 201 through vacuum adsorption, viscidity through vacuum suction and adhesive linkage, connect the lower surface at film layer 102 with big end 103, later pour into liquid injection molding material into in the die block 201, form insole 101 after injection molding material foaming and cooling, viscidity through injection molding material itself makes insole 101 and film layer 102 body coupling, thereby, big end 103 and insole 101 are connected through film layer 102, and do not need insole 101 to brush again and glue and be connected with big end 103. Only the outsole 103 is glued, so that the environmental pollution can be reduced, in addition, the outsole 103 is tightly attached to the insole 101 through the thin film layer 102 under the combined action of the water-based polyurethane adhesive layer and the vacuum adsorption force of the mold, the glue is not easy to be broken, and the service life of the shoe is prolonged.

In some embodiments, the bottom surface of the midsole 101 defines a groove 106, and the groove 106 is substantially spoon-shaped. Correspondingly, the outsole 103 is provided with a hollow portion 107, the shape of the hollow portion 107 is the same as the shape of the top end of the groove 106, as shown in fig. 3 and 4, the groove 106 is exposed out of the sole through the hollow portion 107, and the inner surface of the groove 106 is covered by the film layer 102. The grooves 106 reduce the weight of the midsole 101 on one hand, so that the semi-enveloped shoe 100 is lighter; on the other hand, the modeling of the whole sole is enhanced. The thin film layer 102 covers the inner surface of the groove 106, and when the thin film layer 102 is integrally poured, injection molding materials are contained in the thin film layer 102, so that the injection molding materials can be effectively prevented from overflowing from the hollow part 107, and the rejection rate is reduced. In some embodiments, the lower surface of the outsole 103 is provided with a plurality of non-slip bumps 108, as shown in fig. 3 and 4. The anti-slip bumps 108 are generally trapezoidal with the sides of the trapezoid being curved. The number of the anti-skid lugs 108 arranged on the outsole 103 is multiple, and the anti-skid lugs are uniformly arranged on the lower surface of the outsole 103 in an array manner, so that an anti-skid effect is achieved.

It should be noted that the anti-slip bumps 108 may be strip-shaped bumps disposed on the lower surface of the outsole 103, for example, the anti-slip bumps 108 are long bumps extending transversely to both sides of the shoe, and may also be a plurality of rectangular bumps arranged along the transverse direction or the longitudinal direction of the shoe, and the like.

In some embodiments, the heel portion of the midsole 101 extends upward to form a heel pack 109, the heel pack 109 can wrap the heel of the human body, when the human body moves forward, the heel tends to move backward, and at this time, the heel pack 109 can support the heel of the human body, providing sufficient reverse acting force to hold forward.

The outer wall of the film layer 102 is provided with a plurality of concave grooves 105, the concave grooves 105 are obliquely arranged, and the top ends of the concave grooves 105 are closer to the toe caps. The shape of the concave groove 105 is not limited, and may be a long groove, a rectangular groove, a diamond groove, or the like. The concave groove 105 can be used for bending the sole when the heel is lifted, so that stress generated when the sole is bent is offset. Further, concave groove 105 can further enhance the appearance of semi-enveloped shoe 100.

As shown in fig. 5 to 10, according to another aspect of the present invention, there is provided a manufacturing mold 200 for a semi-enveloped shoe 100, wherein the manufacturing mold 200 includes a bottom mold 201, a middle mold 202 and an upper mold 203.

Bottom die 201 is provided with bottom die cavity 2011 in, and bottom die cavity 2011 is used for shaping insole 101, and thin layer 102 can be attached in bottom die cavity 2011, and this embodiment uses thin layer 102 to adopt vacuum adsorption to take the example in bottom die cavity 2011.

The bottom surface of the bottom cavity 2011 and the outsole 103 are arranged in a copying manner, that is, the shape of the bottom surface of the bottom cavity 2011 matches with the shape of the lower surface of the outsole 103, so that the outsole 103 can be stably positioned at the lower part of the bottom cavity 2011, and the lower surface of the film layer 102 is attached to the upper surface of the outsole 101. It will be appreciated that in other embodiments, the bottom surface of bottom mold cavity 2011 is a contoured surface, and the bottom surface of film layer 102 is attached to the bottom surface of bottom mold cavity 2011, and after injection molding is completed, outsole 103 is attached to the bottom surface of film layer 102.

The middle frame 202 is supported on the upper surface of the bottom mold 201, and the film layer 102 is placed between the bottom mold 201 and the middle frame 202. The middle frame 202 is used for pressing the film layer 102 on the upper surface of the bottom mold 201. When the film layer is used, the lower surface of the film layer 102 is attached to the upper surface of the outsole 103, the middle frame 202 is connected with the bottom die 201 in a propping manner, and the middle frame 202 is used for pressing the periphery of the film layer 102. Specifically, one end of the middle frame 202 is hinged to the bottom mold 201, the other end is openably and closably clamped on the bottom mold 201, and the middle frame 202 is located above the bottom mold 201.

The lower surface of the upper die 203 is matched with the upper surface of the middle frame 202 in shape, the upper die 203 and the bottom die 201 can be opened and closed, the bottom end of the upper die 203 is provided with a forming protrusion 210, when the upper die 203 and the bottom die 201 are closed, the forming protrusion 210 is sleeved in the middle frame 202 and abuts against the top end of the bottom die 201, a shoe tree 209 is fixed on the upper die 203, a shoe upper 104 is sleeved on the shoe tree 209, a die closing protrusion 207 is arranged on the inner wall of the upper die 203, the die closing protrusion 207 abuts against the shoe upper 104, an inner cavity of the upper die 203, the die closing protrusion 207, a bottom die cavity 2011 and the shoe upper 104 form a closed cavity, injection molding materials can be foamed in the closed cavity to form a midsole, and the thin film layer 102.

When the manufacturing mold 200 of the semi-enveloped shoe 100 provided by the invention is used, the thin film layer 102 is attached to the bottom mold cavity 2011; then, compress tightly thin layer 102 and die block 201 with center 202, after injecting liquid injection molding material into bottom die cavity 2011, will be fixed with last mould 203 and the die block 201 compound die of shoe tree 209 fast, at this moment, vamp 104 that the shoe tree 209 overcoat was established and the protruding 207 butt of compound die on last mould 203, the protruding 210 of shaping of going up the mould 203 bottom supports with the top of die block 201 and holds, go up mould 203, compound die arch 201, bottom die cavity 2011 and vamp 104 constitute sealed cavity, the foaming of liquid injection molding material forms insole 101, and the first predetermined height department of the lower surface of thin layer 102 parcel insole 101 to insole 101 side. According to the invention, through improvement of a mold and a process, the structure of the semi-enveloped shoe 100 is adjusted, so that upper connection injection molding of the enveloped sole and the vamp 104 is realized, the vamp 104 is connected to the insole 101 through injection molding material foaming, the sole and the vamp 104 are prevented from being bonded by glue, further, the environment pollution is avoided, the vamp 104 and the sole are prevented from being bonded by manual gluing, and the quality and the production efficiency of the semi-enveloped shoe 100 are improved.

In some embodiments, the manufacturing tool 200 further comprises a heating device for heating the thin film layer 102 such that the thin film layer 102 softens. When the bottom cavity 2011 is used for directly containing the outsole 103, the lower surface of the film layer 102 is attached to the upper surface of the outsole 103; when the bottom mold cavity 2011 is used to directly hold the film layer 102, the film layer 102 is attached to the inner wall of the bottom mold cavity 2011.

Specifically, the invention discloses that the heating device is an infrared baking lamp, and it should be noted that the heating device is not limited to the infrared baking lamp, and can be other devices capable of generating heat. In this embodiment, the heating device is an infrared baking lamp.

Further, the present invention discloses that the manufacturing mold 200 further includes a vacuum-pumping device 206, and a through hole communicated with the vacuum-pumping device 206 is formed in the bottom mold cavity 2011. When the bottom mold cavity 2011 is used for directly containing the outsole 103, the vacuum-pumping device 206 can vacuum the bottom mold cavity 2011 through the through hole to suck and attach the film layer 102 to the outsole 103; when the bottom mold cavity 2011 is used to directly hold the thin film layer 102, the vacuum pumping device 206 can evacuate the bottom mold cavity 2011 through the through hole to adsorb the thin film layer 102 on the bottom mold cavity 2011. Specifically, the vacuum-pumping device 206 is a vacuum pump or the like. In order to further improve the bonding strength between the film layer 102 and the outsole 103, the upper surface of the outsole 103 is coated with glue and bonded to the film layer 102 with the glue.

In order to further improve the sealing performance between the film layer 102 and the bottom mold 201, the manufacturing mold 200 further includes a sealing strip 204, as shown in fig. 10, the sealing strip 204 is disposed on the upper surface of the bottom mold 201 in a sealing manner, a sealing protrusion is correspondingly disposed on the lower surface of the middle frame 202, the film layer 102 is located between the middle frame 202 and the bottom mold 201, and the sealing protrusion abuts against the sealing strip 204, so that the film layer 102 is attached to the bottom mold 201 in a sealing manner. When the middle frame 202 presses the bottom mold 201, the sealing strip 204 can be well sealed with the film layer 102 and the bottom mold 201, so that the film layer 102 can be adsorbed on the outsole 103 by vacuumizing through the vacuumizing device 206.

Further, the invention discloses that the first protrusion 205 is arranged in the bottom mold cavity of the bottom mold 201, the film layer 102 covers the outer surface of the first protrusion 205, and the first protrusion 205 extends to a second preset height of the midsole 101, so that the groove 106 is formed on the lower surface of the midsole 101. When the bottom mold cavity 2011 is used for directly accommodating the outsole 103, the outer wall of the first protrusion 205 is attached to the inner wall of the hollow part 107 arranged on the outsole 103, as shown in fig. 10; when the bottom mold cavity 2011 is used to directly hold the film layer 102, the outer wall of the first protrusion 205 conforms to the film layer 102.

In some embodiments, second protrusions 208 are disposed on the sidewalls of bottom mold cavity 2011, second protrusions 208 are disposed at an angle, and the tips of second protrusions 208 are near the toe of the shoe. The second protrusion 208 is disposed to form a concave groove 105 in the film layer 102 toward the middle sole 101, and the concave groove 105 can generate bending of the sole when the heel is raised, so as to counteract the stress generated when the sole is bent. Further, concave groove 105 can further enhance the appearance of semi-enveloped shoe 100.

In some embodiments, the lower surface of the middle frame 202 is a molding surface, the upper surface of the bottom mold 201 is a molding surface complementary to the lower surface of the middle frame 202, and the middle frame 202 and the bottom mold 201 cooperate to press the film layer 102 to shape the edge of the film layer 102, so that the top end of the film layer 102 presents a corresponding line to meet different appearance requirements of the sole.

In some embodiments, the present invention discloses that the upper mold 203 includes a first mold half 2031 and a second mold half 2032, the first mold half 2031 is hinged to one end of the second mold half 2032, the other ends of the first mold half 2031 and the second mold half 2032 can be clamped and opened, when the first mold half 2031 and the second mold half 2032 are opened, the shoe tree 209 sleeved with the upper 104 can be placed into the upper mold 203, and when the first mold half 2031 and the second mold half 2032 are closed, the mold closing protrusion 207 abuts on the upper 104.

Further, the present invention discloses that the upper mold 203 further includes an upper frame 2033, the upper frame 2033 is in an inverted U shape, the upper frame 2033 is fixed on the first half mold 2031 or the second half mold 2032, the shoe tree 209 is fixed on the upper frame 2033, and the upper frame 2033 is used for pressing the shoe tree 209 on the upper mold 203. This embodiment is exemplified by the case 2033 being fixed to the first mold half 2031.

When the bottom mold cavity 2011 is used for directly accommodating the outsole 103, firstly, glue is applied to the upper surface of the outsole 103 and the outsole 103 is placed in the bottom mold cavity of the bottom mold 201; then, opening the middle frame 202, laying the thin film layer 102 on the upper surface of the bottom die 201, then closing the middle frame 202, pressing the thin film layer 102 on the bottom die 201 by using the middle frame 202, and heating the thin film layer 102 by using an infrared baking lamp at the temperature of 100-120 ℃ to soften the thin film layer 102; then, starting a vacuumizing device 206, vacuumizing the bottom of the heated thin film layer 102, and combining the softened thin film layer 102 with the outsole 103; then, the first half mold 2031 and the second half mold 2032 are opened, the last 209 sleeved with the shoe upper 104 is fixed on the upper frame 2033, the shoe upper 104 on the last 209 is abutted to the mold closing protrusion 207 on the first half mold 2031, and then the second half mold 2032 and the first half mold 2031 are closed and locked, so that the mold closing protrusion 207 on the second half mold 2032 is also abutted to the shoe upper 104 on the last 209; then, injecting an injection molding material into the bottom mold 201, abutting the upper mold 203 against the bottom mold 201 to realize mold closing, foaming the injection molding material to form the midsole 101, and connecting the midsole 101 with the vamp 104; finally, the entire shoe is removed, trimmed, and the excess portions of the film layer 102 are cut off.

When the bottom mold cavity is used for directly containing the film layer 102, firstly, the middle frame 202 is opened, and the film layer 102 is laid on the upper surface of the bottom mold 201; then, closing the middle frame 202, pressing the film layer 102 on the bottom die 201 by the middle frame 202, and heating the film layer 102 by an infrared baking lamp to soften the film layer 102; then, the vacuumizing device 206 on the bottom die 201 is started to tightly adsorb the film layer 102 on the bottom die 201 and the outsole 103; then, the first half mold 2031 and the second half mold 2032 are opened, the last 209 sleeved with the shoe upper 104 is fixed on the upper frame 2033, the shoe upper 104 on the last 209 is abutted to the mold closing protrusion 207 on the first half mold 2031, and then the second half mold 2032 and the first half mold 2031 are closed and locked, so that the mold closing protrusion 207 on the second half mold 2032 is also abutted to the shoe upper 104 on the last 209; then, injecting an injection molding material into the bottom mold 201, abutting the upper mold 203 against the bottom mold 201 to realize mold closing, foaming the injection molding material to form the midsole 101, and connecting the midsole 101 with the vamp 104; then, brushing glue on the outsole 103, heating and attaching to the lower surface of the film layer 102; finally, trimming is performed to cut off excess portions of the film layer 102.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and inventive features disclosed herein.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims (14)

1. A semi-coated shoe is characterized by comprising a midsole, a film layer, an outsole and a vamp;

the middle sole is formed by foaming injection molding materials;

the film layer covers the lower surface of the whole insole, extends towards the side surface of the insole and wraps the lower surface of the insole to a first preset height position of the side surface of the insole;

the outsole is connected to the lower surface of the film layer;

the vamp is integrally connected to the insole through the injection molding material.

2. The semi-encapsulated shoe of claim 1, wherein the film layer is integrally attached to the midsole by the injection molding compound;

and/or

The thickness of the thin film layer is greater than or equal to 0.1mm and less than or equal to 0.8 mm.

3. The semi-encapsulated shoe of claim 1, wherein the film layer is heat softened and adhered to the outsole;

and/or

The upper surface of the outsole is coated with an adhesive layer, and the thin film layer is adhered to the adhesive layer to be connected with the outsole.

4. The semi-encapsulated shoe of claim 1, wherein the film layer is a TPU film layer, the film layer having a melting point of 130 ℃ to 140 ℃;

and/or

The injection molding material is a PU material, and the temperature of the injection molding material is 100-120 ℃;

and/or

The hardness of the material of the middle sole is less than that of the material of the film layer.

5. The semi-coated shoe according to any one of claims 1 to 4, wherein a groove is formed in the lower surface of the midsole, a hollow portion is formed in the outsole, the groove can be exposed out of the sole through the hollow portion, and the film layer covers the inner surface of the groove;

and/or

The heel part of the insole extends upwards to form a heel covering capable of covering the heel of a human body;

and/or

The outer wall of the film layer is provided with a plurality of concave grooves, the concave grooves are obliquely arranged, and the top ends of the concave grooves are close to the toe caps.

6. A manufacturing mold of a semi-coated shoe is used for connecting a vamp to a midsole, and the outer surface of the midsole is wrapped with a film layer;

a bottom die cavity is formed in the bottom die, and the thin film layer can be attached to the bottom die cavity;

the middle frame abuts against the upper surface of the bottom die and is used for pressing the periphery of the thin film layer;

go up the mould with the die block can open and shut, the bottom of going up the mould is provided with the shaping arch, works as go up the mould with during the die block compound die, the protruding cover of shaping is established in the center and with the top of die block supports and holds, upward be fixed with the shoe tree on the mould, the vamp cover is established on the shoe tree, it is protruding to be provided with the compound die on the mould inner wall, the protruding butt of compound die is in on the vamp, go up the inner chamber of mould the bottom die cavity with the vamp constitutes and seals the cavity, and the injection molding material can foam in the closed cavity, form the insole, just the thin layer parcel the lower surface of insole extremely the first predetermined high department of insole side.

7. The manufacturing mold as claimed in claim 6, wherein the bottom surface of the bottom cavity is matched with the bottom surface of the outsole, the bottom cavity can be directly positioned and used for containing the outsole, and the lower surface of the film layer is attached to the upper surface of the outsole;

or

The bottom surface of the bottom die cavity is in a shape of a profiling plane, and the lower surface of the film layer is attached to the bottom surface of the bottom die cavity.

8. The manufacturing mold according to claim 6, further comprising a vacuum evacuation device;

a through hole communicated with the vacuumizing device is formed in the bottom die cavity;

when the bottom die cavity is used for directly containing a large bottom, the vacuumizing device can vacuumize the bottom die cavity through the through hole so as to adsorb and attach the film layer to the large bottom;

when the bottom die cavity is used for directly containing the thin film layer, the vacuumizing device can vacuumize the bottom die cavity through the through hole so as to adsorb and attach the thin film layer to the bottom die cavity;

and/or

The manufacturing mold further comprises a heating device for heating the thin film layer so that the thin film layer is softened.

9. The manufacturing mold according to claim 8, further comprising a sealing strip;

the sealing strip is sealed to be set up the upper surface of die block, the lower surface correspondence of center is provided with sealed arch, the thin layer is located the center with between the die block, sealed arch supports and holds on the sealing strip, so that the sealed laminating of thin layer is in on the die block.

10. The manufacturing mold as claimed in claim 6, wherein a first protrusion is disposed in the bottom mold cavity of the bottom mold, the film layer covers an outer surface of the first protrusion, and the first protrusion extends to a second predetermined height of the midsole so as to form a groove on a lower surface of the midsole.

11. The manufacturing mold according to claim 6, wherein the sidewall of the bottom cavity is provided with a second protrusion, the second protrusion is obliquely arranged, and the top end of the second protrusion is close to the toe cap.

12. The manufacturing mold as claimed in claim 6, wherein the lower surface of the middle frame is a molding surface, the upper surface of the bottom mold is a molding surface complementary to the lower surface of the middle frame, and the middle frame and the bottom mold cooperate to press the film layer to mold the edge of the film layer.

13. The manufacturing mold defined in any one of claims 6-12, wherein the upper mold comprises a first mold half and a second mold half;

the utility model discloses a shoe last, including first half mould, second half mould, last half mould, first half mould and second half mould, the one end of first half mould and second half mould is articulated, the joint can be opened and shut to the other end of first half mould and second half mould, when first half mould and second half mould were opened, the shoe tree that the cover was equipped with the vamp can be put into in the upper die, when first half mould and second half mould were closed, protruding butt of compound die was in.

14. The manufacturing mold as set forth in claim 13, wherein the upper mold further comprises an upper frame;

the upper frame is in an inverted U shape;

the upper frame is fixed on the first half mould or the second half mould;

the shoe tree is fixed on the upper frame, the upper frame is used for pressing the shoe tree on the upper die.

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