CN112382552A - Wafer loading platform device and disassembling tool - Google Patents
Wafer loading platform device and disassembling tool Download PDFInfo
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- CN112382552A CN112382552A CN202011265303.8A CN202011265303A CN112382552A CN 112382552 A CN112382552 A CN 112382552A CN 202011265303 A CN202011265303 A CN 202011265303A CN 112382552 A CN112382552 A CN 112382552A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/02—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/14—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for assembling objects other than by press fit or detaching same
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A wafer loading platform apparatus, comprising: the electrostatic chuck plate is provided with a first mounting hole and a counter bore; the cooling plate is provided with a second mounting hole, and the first mounting hole, the counter bore and the second mounting hole are coaxially arranged; the bolt is arranged at the first mounting hole, and after the electrostatic chuck plate and the cooling plate are connected by the bolt, the head of the bolt is accommodated in the counter bore; and the protective cover is arranged at the counter sink. The dismounting tool comprises a suction head, and the suction head adsorbs the protective cover through vacuum. The disassembling tool is characterized in that the disassembling hole is formed in the protective cover, the disassembling tool comprises a disassembling head, and the disassembling head and the disassembling hole are embedded. Therefore, the defect that products accumulated in a slit are difficult to clean in an electrostatic chuck connecting structure in the prior art can be overcome, a structure which is easier to clean can be provided, the maintenance period of a cavity is prolonged, the defects of wafers are reduced, and the productivity of a factory is improved.
Description
Technical Field
The present invention relates to the field of integrated circuit manufacturing, and more particularly to a wafer loading platform apparatus and a mounting/dismounting tool.
Background
One important process step in the field of integrated circuit fabrication is etching. The wafer is held on an Electrostatic Chuck (ESC). Referring to fig. 1, in the prior art, an electrostatic chuck is generally formed by connecting a chuck 01 and a cooling plate 02 together by a hexagon countersunk head bolt 03. In the reaction chamber 08, a Dry etch Process (Dry etch Process) is performed, and the wafer 05 is etched by the energy bombardment or chemical reaction of the plasma 04 to generate a large amount of the product 06, a large amount of the product 06 is pumped out of the reaction chamber 08 by the Dry pump 07, and a small amount of the product 06 remains in the reaction chamber 08. On the other hand, the residual product 06 is accumulated to some extent, and then particles are generated. However, the cleanliness of the wafer 05 is high during the processing, and the accumulated particles of the products 06 fall onto the surface of the wafer 05 after being lifted, which may cause product defects.
In the prior art, during the maintenance of the reaction chamber, the parts in the chamber need to be cleaned or replaced. However, the product 06 deposited in the gap 09 between the hexagon countersunk head bolt 03 and the chuck 01 and the hexagon hole of the hexagon countersunk head bolt 03 is difficult to clean, and the product 06 deposited therein falls onto the surface of the wafer again, resulting in product defects. Furthermore, as feature sizes move from μm to nm technology nodes, the requirements for defect control during dry etching are becoming increasingly stringent. Moreover, the amount of the uncleaned product 06 that can cause defects is also getting smaller, in other words, the product 06 is required to be cleaned more cleanly. Aiming at parts which are difficult to clean, the scheme adopted in the prior art is to prolong the cleaning time, clean after disassembly, replace after disassembly and clean in time by shortening the maintenance period of the cavity.
The problem existing in the prior art is that the connecting structure in the electrostatic chuck is difficult to clean the product after dry etching, so that product impurities are introduced into the reaction cavity, defects can be generated in the subsequent wafer processing process, the production efficiency is reduced, the qualification rate of products is reduced, and the capacity of a factory is influenced.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the build-up of products resulting from the attachment structure of the electrostatic chuck is difficult to clean.
In order to solve the technical problems, the invention provides a wafer loading platform device and a disassembling tool, which aims to avoid the accumulation of products at the structure which is difficult to clean, reduce the cleaning difficulty, improve the cleaning efficiency, prolong the cleaning period and increase the productivity of a factory; moreover, the structure for preventing accumulation and easy cleaning can be disassembled, and is provided with a disassembling tool.
In order to achieve the above object, the present invention provides a wafer loading platform device, comprising:
the electrostatic chuck plate is provided with a first mounting hole and a counter bore;
the cooling plate is provided with a second mounting hole, and the first mounting hole, the counter bore and the second mounting hole are coaxially arranged;
the bolt is arranged at the first mounting hole, and after the electrostatic chuck plate and the cooling plate are connected by the bolt, the head of the bolt is accommodated in the counter bore;
and the protective cover is arranged at the counter sink.
Preferably, the electrostatic chuck plate has a first plane and a second plane at the first mounting hole and the counter bore, the first mounting hole and the counter bore are disposed adjacent to each other and penetrate through the first plane and the second plane, one surface of the counter bore is a portion of the first plane, one surface of the first mounting hole is a portion of the second plane, the protective cover is coupled with the counter bore, and the protective cover is not higher than the first plane.
Preferably, the protective cover is cylindrical in shape, and comprises a cover outer end face and an outer side face, and the outer side face is provided with an external thread;
the counter bore is a cylindrical hole and comprises an inner side face, and the inner side face is provided with an internal thread;
the external thread and the internal thread are arranged in a coupling mode, and the outer end face of the cover is not higher than the first plane.
Preferably, two dismounting holes are arranged on the outer end face of the cover.
Preferably, the depth of the counter bore is greater than or equal to the sum of the height of the protective cover and the height of the head of the bolt.
Preferably, an opening is formed in one end of the protective cover, an accommodating hole is formed in the protective cover, the accommodating hole is aligned with the head of the bolt, the accommodating hole completely covers the head area of the bolt, and at least part of the head of the bolt is located in the accommodating hole.
Preferably, the depth of the counter bore is greater than or equal to the height of the protective cover, and the depth of the counter bore is greater than or equal to the sum of the thickness of the protective cover accommodating hole and the height of the head of the bolt.
Preferably, the protective cover comprises an outer end face of the cover, the protective cover is made of aluminum, and the outer end face of the cover is coated with an aluminum oxide plating layer.
In order to achieve the above object, the present invention further provides a disassembling tool for the wafer loading platform device, wherein the disassembling tool comprises a suction head, and the suction head sucks the protective cover through vacuum.
In order to achieve the above object, the present invention further provides a disassembling tool for the wafer loading platform device, wherein the protective cover is provided with a disassembling hole, the disassembling tool comprises a disassembling head, and the disassembling head is embedded in the disassembling hole.
Compared with the prior art, the invention provides a wafer loading platform device, which comprises: the electrostatic chuck plate is provided with a first mounting hole and a counter bore; the cooling plate is provided with a second mounting hole, and the first mounting hole, the counter bore and the second mounting hole are coaxially arranged; the bolt is arranged at the first mounting hole, and after the electrostatic chuck plate and the cooling plate are connected by the bolt, the head of the bolt is accommodated in the counter bore; and the protective cover is arranged at the counter sink. The invention also provides a disassembling tool which comprises a suction head, wherein the suction head adsorbs the protective cover through vacuum. The invention also provides a disassembling tool, wherein the protective cover is provided with a disassembling hole, the disassembling tool comprises a disassembling head, and the disassembling head is embedded with the disassembling hole. Therefore, the electrostatic chuck connecting structure has the technical effects that the defect that products accumulated in the slit in the electrostatic chuck connecting structure in the prior art are difficult to clean can be overcome, the structure which is easier to clean can be provided, the maintenance period of the cavity is prolonged, the defects of wafers are reduced, and the productivity of a factory is improved. And you can dismantle corresponding structure, provide corresponding extracting tool.
Drawings
Fig. 1 shows a schematic diagram of a structure of an electrostatic chuck in the prior art, and a schematic diagram of a product accumulation defect.
Fig. 2A is a schematic view illustrating a connection structure of a wafer stage apparatus according to a first embodiment of the present invention.
Fig. 2B is a schematic view illustrating a connection structure of a wafer stage apparatus according to a second embodiment of the present invention.
Fig. 3A is a schematic cross-sectional view illustrating a protective cover structure of a second embodiment of a wafer stage apparatus according to the present invention.
Fig. 3B is a top view of a protective cover of a second embodiment of a wafer stage apparatus according to the present invention.
Fig. 4A is a schematic structural diagram illustrating a first embodiment of a mounting/dismounting tool for a wafer stage apparatus according to the present invention.
Figure 4B is a schematic diagram of a first embodiment of a disassembly tool for a wafer stage apparatus according to the present invention.
Reference numerals indicate the same.
The prior art is as follows:
01 suction cup
02 cooling plate
03 hexagonal countersunk head bolt
04 plasma
05 wafer
06 products
07 dry pump
08 reaction cavity
09 gap;
the invention comprises the following steps:
1 Electrostatic chuck plate
11 first mounting hole
12 counter bore
13 first plane
14 second plane
15 inner side surface
16 internal screw thread
2 Cooling plate
21 second mounting hole
3 bolt
31 head of bolt
4 protective cover
41 cover outer end face
42 lateral surface
43 external screw thread
44 disassembly hole
45 opening
46 containing hole
5 disassembling tool
51 suction head
52 detaching head
6-membered ring
7 edge ring
8 wafers.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings.
Referring to fig. 2A and 2B, the present invention provides a wafer loading platform device, comprising: the electrostatic chuck plate 1 is provided with a first mounting hole 11 and a counter bore 12 on the electrostatic chuck plate 1. The cooling plate 2 is provided with a second mounting hole 21 on the cooling plate 2. The first mounting hole 11, the counter bore 12 and the second mounting hole 21 are coaxially arranged. The bolt 3 is arranged at the first mounting hole 11, and after the electrostatic chuck plate 1 and the cooling plate 2 are connected by the bolt 3, the head 31 of the bolt is accommodated in the counter bore 12. And the protective cover 4, wherein the protective cover 4 is arranged at the counter bore 12. In view of the above, the visor 4 can give the closure with the gap in the bolted connection structure of electrostatic chuck board 1 and cooling plate 2, and the gap no longer exposes in the reaction chamber to the resultant can not accumulate in gap department, no longer has such abluent position of being difficult to of gap, and moreover, original connection structure does not change, can guarantee original connection performance requirement. Therefore, the chamber maintenance period can be prolonged, the chamber maintenance time is shortened, all products are easier to clean, parts which are difficult to clean are avoided, the defects of the wafer caused by the lifting of the products are reduced, and the productivity of a factory is improved.
Referring to fig. 2A and 2B, the present invention provides a wafer stage apparatus, in which an electrostatic chuck plate 1 has a first plane 13 and a second plane 14 at a first mounting hole 11 and a counterbore 12. The first mounting hole 11 and the counter bore 12 are arranged adjacently and penetrate through the first plane 13 and the second plane 14, one surface of the counter bore 12 is a part of the first plane 13, one surface of the first mounting hole 11 is a part of the second plane 14, the protective cover 4 is coupled with the counter bore 12, and the protective cover 4 is not higher than the first plane 13. The step surfaces are present in both the first embodiment and the second embodiment shown in fig. 2A and 2B. The first plane 13 is an annular extension plane at the step surface. The protective cap 4 is coupled with the counter bore 12, and can adopt a plugging mode, a clamping mode or a threaded connection mode. In fig. 2A and 2B, the cover outer end face 41 of the protective cover 4 is disposed flush with the first plane 13. And the pit is flush arranged, so that a new pit is prevented from being generated.
In the embodiment shown in fig. 2A and 2B, the protective cap 4 is threadably connected to the counterbore 12. The protective cover 4 is cylindrical in shape, and the protective cover 4 includes a cover outer end surface 41 and an outer side surface 42, which is provided with an external thread 43. The counterbore 12 is a cylindrical bore, and the counterbore 12 includes an inner side surface 15, the inner side surface 15 being provided with an internal thread 16. The external thread 43 and the internal thread 16 are coupled, and the cap outer end surface 41 is disposed not higher than the first plane 13. In fig. 2A and 2B, the cover outer end face 41 of the protective cover 4 is disposed flush with the first plane 13.
Referring to fig. 2A and 2B, a base ring 6 is further disposed on the step surface of the electrostatic chuck plate 1 above the electrostatic chuck plate 1, and the base ring 6 is a circular cylinder with a cylindrical hole, i.e., a non-through hole, dug in the middle. An edge ring 7 is also arranged above the base ring 6. The edge ring 7 is in the shape of a circular cylinder. And adsorbing the wafer 8 to be processed at the middle boss of the electrostatic chuck plate 1.
In the embodiment of the wafer stage apparatus of the present invention shown in fig. 2A and 2B, two detachment holes 44 are provided on the cover outer end surface 41. The removal hole 44 is cylindrical. The removal holes 44 are symmetrically distributed about the axis of the protective cover 4.
The number of the removal holes 44 is one. The removal hole 44 has a triangular shape, a hexagonal shape, a quadrangular shape, etc.
A removal hole 44 is provided to facilitate removal of the protective cover 4.
The protective cover 4 may not be provided with the removal hole 44.
Referring to fig. 2A, the protective cover 4 is completely above the head 31 of the bolt, below the first plane 13, or flush. The depth D of the counter bore 12 is greater than or equal to the height H1 of the protective cover 4 and the height H2 of the head 31 of the bolt, i.e., D ≧ H1+ H2. Hereby, it can be achieved that the protective cover 4 is flush or below the first plane 13.
Referring to fig. 2B and fig. 3A and 3B, an opening 45 is provided at one end of the protective cover 4, a receiving hole 46 is provided inside the protective cover 4, the receiving hole 46 is aligned with the head 31 of the bolt, the receiving hole 46 completely covers the head 31 area of the bolt, and the head 31 of the bolt is at least partially located in the receiving hole 46. When the protective cap 4 is screwed until the cap outer end face 41 is flush with the first plane 13, the head 31 of the partial bolt is located in the receiving hole 46.
Referring to fig. 2B and fig. 3A and 3B, the depth D of the counter bore is greater than or equal to the height H1 of the protective cover, and the depth D of the counter bore is greater than or equal to the sum of the thickness T of the accommodating hole of the protective cover and the height H2 of the head of the bolt; namely, D.gtoreq.H 1, D.gtoreq.T + H2. The thickness T over the receiving hole is equal to the height H1 of the protective cover minus the depth D1 of the receiving hole 46, i.e. T = H1-D1.
In the embodiment shown in fig. 2A and 2B, the protective cover 4 includes a cover outer end surface 41, the material of the protective cover 4 is aluminum, and the cover outer end surface 41 is coated with an aluminum oxide plating layer. The alumina coating can prevent the protective cover 4 from reacting with the plasma in the reaction cavity.
Referring to fig. 4A, in a first embodiment of the present invention, the dismounting tool 5 comprises a suction head 51, and the suction head 51 sucks the protection cover 4 by vacuum. After the protective cover 4 is sucked, if the protective cover is plugged in, the protective cover can be directly pulled out; if the clamping is carried out, the clamping buckle is rotated and loosened and then pulled out; if the screw is connected, the screw can be unscrewed. The attaching and detaching tool 5 of the present embodiment can be used for the protective cover 4 where the detaching hole 44 is not provided.
Referring to fig. 4B, in the second embodiment of the present invention, the protective cover 4 is provided with a detachment hole 44, the detachment tool 5 includes a detachment head 52, and the detachment head 52 is engaged with the detachment hole 44. Referring to fig. 2A and 2B, 4B, the first way of providing the removal hole is to provide the removal hole 44 as two cylindrical holes, and then the removal head 52 is provided with a cylindrical post at the same position, which can be inserted into the cylindrical holes to unscrew the screw connection.
The dismounting holes can be arranged into other embodiments, the dismounting holes are triangular, hexagonal, quadrangular and other prism holes with edges, only one dismounting head is needed, the dismounting head is arranged into a prism with the same shape as the dismounting holes, and the dismounting head can utilize the edges to transmit torque so as to unscrew the threaded connection.
The above is the specific structural composition and connection relationship of the wafer loading platform device and the disassembling tool provided by the invention. Therefore, the electrostatic chuck connecting structure has the technical effects that the defect that products accumulated in the slit in the electrostatic chuck connecting structure in the prior art are difficult to clean can be overcome, the structure which is easier to clean can be provided, the maintenance period of the cavity is prolonged, the defects of wafers are reduced, and the productivity of a factory is improved. And you can dismantle corresponding structure, provide corresponding extracting tool.
The above-mentioned embodiments and the accompanying drawings are only for illustrating the technical solutions and effects of the present invention, and are not to be construed as limiting the present invention. It is to be understood that those skilled in the art can modify and change the above-described embodiments without departing from the technical spirit and scope of the present invention as defined in the appended claims.
Claims (10)
1. A wafer loading platform apparatus, comprising:
the electrostatic chuck plate is provided with a first mounting hole and a counter bore;
the cooling plate is provided with a second mounting hole, and the first mounting hole, the counter bore and the second mounting hole are coaxially arranged;
the bolt is arranged at the first mounting hole, and after the electrostatic chuck plate and the cooling plate are connected by the bolt, the head of the bolt is accommodated in the counter bore;
and the protective cover is arranged at the counter sink.
2. The wafer loading platform assembly of claim 1, wherein the electrostatic chuck plate has a first plane and a second plane at the first mounting hole and the counterbore, the first mounting hole and the counterbore are disposed adjacent to each other and extend through the first plane and the second plane, one surface of the counterbore is a portion of the first plane, one surface of the first mounting hole is a portion of the second plane, the protective cap is coupled to the counterbore, and the protective cap is disposed no higher than the first plane.
3. The wafer load platform device of claim 2,
the protective cover is cylindrical in shape and comprises a cover outer end face and an outer side face, and the outer side face is provided with an external thread;
the counter bore is a cylindrical hole and comprises an inner side face, and the inner side face is provided with an internal thread;
the external thread and the internal thread are arranged in a coupling mode, and the outer end face of the cover is not higher than the first plane.
4. The wafer loading platform assembly of claim 3, wherein the outer end face of the cover is provided with two removal holes.
5. The wafer load platform device of claim 1, wherein the depth of the counterbore is greater than or equal to the sum of the height of the protective cap and the height of the head of the bolt.
6. The wafer loading platform device according to claim 1, wherein the protective cover has an opening at one end, and a receiving hole is formed inside the protective cover, the receiving hole is aligned with the head of the bolt, the receiving hole completely covers the head area of the bolt, and the head of the bolt is at least partially located in the receiving hole.
7. The wafer loading platform assembly of claim 6 wherein the depth of the counterbore is greater than or equal to the height of the protective cap, the depth of the counterbore being greater than or equal to the sum of the thickness of the cap receiving hole and the height of the head of the bolt.
8. The wafer loading platform device of claim 1, wherein the protective cover comprises a cover outer end surface, the protective cover is made of aluminum, and the cover outer end surface is coated with an aluminum oxide plating layer.
9. The pick-and-place tool for a wafer loading platform assembly as recited in claim 1, wherein the pick-and-place tool comprises a suction head that sucks the protective cover by vacuum.
10. A loading/unloading tool for a wafer loading platform device according to claim 1, wherein the protective cover is provided with a removal hole, the loading/unloading tool comprises a removal head, and the removal head is engaged with the removal hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011265303.8A CN112382552A (en) | 2020-11-13 | 2020-11-13 | Wafer loading platform device and disassembling tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011265303.8A CN112382552A (en) | 2020-11-13 | 2020-11-13 | Wafer loading platform device and disassembling tool |
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| Publication Number | Publication Date |
|---|---|
| CN112382552A true CN112382552A (en) | 2021-02-19 |
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|---|---|---|---|
| CN202011265303.8A Pending CN112382552A (en) | 2020-11-13 | 2020-11-13 | Wafer loading platform device and disassembling tool |
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| CN103140913A (en) * | 2010-10-29 | 2013-06-05 | 应用材料公司 | Deposition ring and electrostatic chuck for physical vapor deposition chamber |
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| CN207068810U (en) * | 2017-08-01 | 2018-03-02 | 武汉新芯集成电路制造有限公司 | A kind of extracting tool |
| CN108711546A (en) * | 2018-04-28 | 2018-10-26 | 武汉华星光电技术有限公司 | Lower electrode and dry etcher |
| CN110473759A (en) * | 2018-05-10 | 2019-11-19 | 东京毅力科创株式会社 | Mounting table and plasma processing apparatus |
| CN111801787A (en) * | 2018-09-13 | 2020-10-20 | 日本碍子株式会社 | Wafer carrying device |
| CN210443520U (en) * | 2019-10-25 | 2020-05-01 | 上海华力微电子有限公司 | Adsorption device and semiconductor equipment |
| CN211728996U (en) * | 2020-01-14 | 2020-10-23 | 中国建筑第八工程局有限公司 | A assembly and disassembly tools for fire alarm equipment protection casing |
| CN211867663U (en) * | 2020-02-27 | 2020-11-06 | 深圳市壮志科技有限公司 | A extracting tool for automatic foaming machine gun nozzle belt cleaning device |
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